JPH05299472A - Leader tape for tab - Google Patents

Leader tape for tab

Info

Publication number
JPH05299472A
JPH05299472A JP13078491A JP13078491A JPH05299472A JP H05299472 A JPH05299472 A JP H05299472A JP 13078491 A JP13078491 A JP 13078491A JP 13078491 A JP13078491 A JP 13078491A JP H05299472 A JPH05299472 A JP H05299472A
Authority
JP
Japan
Prior art keywords
tape
film
leader
tab
leader tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13078491A
Other languages
Japanese (ja)
Other versions
JP2812813B2 (en
Inventor
Morihiro Ueno
守博 植野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP3130784A priority Critical patent/JP2812813B2/en
Publication of JPH05299472A publication Critical patent/JPH05299472A/en
Application granted granted Critical
Publication of JP2812813B2 publication Critical patent/JP2812813B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a leader tape with good heat resistance, by making a main ingredient of the leader tape by using polymer with a given chemical formula. CONSTITUTION:A leader tape has each sprocket hole on both side edges for connecting front and end parts of a TAB tape. The main component of the leader tape is made of polymer indicated in a given formula. In this case, a tape with a thickness ranging from 50 to 500mum, especially 100 to 300mum, has preferably good film strength and bending elasticity. When an anti-static additive is added to the melted material during an extruding step, or the both faces of the extruded film are coated with additive-added resin, the tape is more preferable in dust-proof characteristics. A material, e.g. General Electric Co. ULTEM-D 5001, is melted and extruded to form a film with a thickness of 150mum, and then the film is slit into pieces of 35mm in width. In a punching step, given sprocket holes are made to the both side edges of the film to form a TAB tape leader.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、耐熱性に優れたテープ
オートメーティッドボンディング(以下TABという)
用リーダーテープに関するものである。
The present invention relates to a tape automated bonding (hereinafter referred to as TAB) having excellent heat resistance.
For leader tapes.

【0002】[0002]

【従来の技術】TAB用リーダーテープはTABを用い
る半導体の製造工程においてTABの前後に継ぎ合わせ
て用いられるものである。TABは各工程においてリー
ルから巻出し、加工後巻き取るといった方法がとられて
いる。この際スタート部、エンド部でのロスを無くすた
めにリーダーテープが使用されている。
2. Description of the Related Art Leader tapes for TAB are used by joining them before and after TAB in a semiconductor manufacturing process using TAB. In each process, TAB is unwound from a reel and wound after processing. At this time, leader tape is used to eliminate loss at the start and end parts.

【0003】従来リーダーテープには2軸延伸ポリエチ
レンテレフタレートフイルム(以下PETフイルムとい
う)が使用されていたが、半導体の封止剤を硬化させる
工程で150〜170℃で1時間程度加熱するためにP
ETフイルムが変形したり、リールに巻き取れないとい
った問題が生じていた。
Conventionally, a biaxially stretched polyethylene terephthalate film (hereinafter referred to as PET film) has been used for the leader tape, but in order to heat the semiconductor encapsulant at 150 to 170 ° C. for about 1 hour, P is used.
There were problems that the ET film was deformed and could not be wound on the reel.

【0004】[0004]

【発明が解決しようとする課題】本発明の目的とすると
ころは、耐熱性に優れたTAB用リーダーテープを提供
するものである。
An object of the present invention is to provide a TAB leader tape having excellent heat resistance.

【0005】[0005]

【課題を解決するための手段】本発明は、TAB用テー
プの前後に継ぎ合わせて用いる両側縁部にスプロケット
ホールを設けたリーダーテープであって、該リーダーテ
ープの主成分が下記式で表されるポリマーであることを
特徴とするTAB用リーダーテープである。
DISCLOSURE OF THE INVENTION The present invention is a leader tape having sprocket holes provided on both side edges of the TAB tape, which are used by being spliced together before and after, and the main component of the leader tape is represented by the following formula. It is a leader tape for TAB, which is a polymer.

【0006】本発明において用いられる組成のテープは
溶融押出し法によりフイルム化した後、TAB用テープ
の幅に合わせてテープ状にスリットし、両側縁部に一定
ピッチのスプロケットホールを打ち抜いて得られる。テ
ープ厚みは50〜150μm、更には100〜300μ
mであることがフイルムの強度、曲げ弾性の面で好まし
い。
The tape of the composition used in the present invention is obtained by forming a film by a melt extrusion method, slitting it into a tape shape according to the width of the TAB tape, and punching out sprocket holes with a constant pitch on both side edges. Tape thickness is 50-150μm, and further 100-300μ
It is preferable that it is m in terms of the strength and bending elasticity of the film.

【0007】また溶融押出しの際、帯電防止剤を添加し
たもの、あるいは溶融押出し後フイルムの両面に帯電防
止剤を添加した樹脂をコーティングしたものは防塵の点
で好ましい。
In addition, during melt extrusion, an antistatic agent added, or a film after melt extrusion coated with a resin containing an antistatic agent on both sides is preferable from the viewpoint of dust prevention.

【0008】スプロケットホールの寸法精度については
スプロケットホール100個分の累積ピッチで見た場
合、その寸法に対して範囲が±0.1%以内であること
が好ましく、更には±0.05以内であることが好まし
い。
Regarding the dimensional accuracy of the sprocket holes, when viewed at the cumulative pitch of 100 sprocket holes, the range is preferably within ± 0.1%, and more preferably within ± 0.05, with respect to the size. Preferably.

【0009】[0009]

【実施例】《実施例1》ゼネラルエレクトリック社UL
TEM−D5001を溶融押出しして、015μmの厚
さにフイルム化した後、35mm幅にスリットし、その
両側縁部に図1に示すようなスプロケットホールを打ち
抜き加工により設けTAB用リーダテープを得た。
[Embodiment] << Embodiment 1 >> UL, General Electric Company
TEM-D5001 was melt extruded to form a film having a thickness of 015 μm, slitted to a width of 35 mm, and sprocket holes as shown in FIG. 1 were punched on both side edges thereof to obtain a TAB leader tape. ..

【0010】《比較例1》厚さ150μmのPETフイ
ルムを実施例1と同じ形状に加工しTAB用リーダテー
プを得た。
Comparative Example 1 A PET film having a thickness of 150 μm was processed into the same shape as in Example 1 to obtain a TAB leader tape.

【0011】上記2種類のサンプルを170℃に調温し
たオーブン内に1時間放置して、その前後でのスプロケ
ットホール100ピッチ分の寸法変化を測定した結果を
表1に示した。
Table 1 shows the results of measuring the dimensional changes of 100 pitches of the sprocket holes before and after leaving the two types of samples in an oven whose temperature was adjusted to 170 ° C. for 1 hour.

【0012】 [0012]

【0013】[0013]

【発明の効果】本発明のTAB用リーダーテープは17
0℃の高温化でも寸法安定性に優れている。
The TAB leader tape of the present invention is 17
Excellent dimensional stability even at high temperatures of 0 ° C.

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成3年9月20日[Submission date] September 20, 1991

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0006[Correction target item name] 0006

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0006】本発明において用いられる組成のテープは
溶融押出し法によりフイルム化した後、TAB用テープ
の幅に合わせてテープ状にスリットし、両側縁部に一定
ピッチのスプロケットホールを打ち抜いて得られる。テ
ープ厚みは50〜 500μm、更には100〜300μmであるこ
とがフイルムの強度、曲げ弾性の面で好ましい。
The tape of the composition used in the present invention is obtained by forming a film by a melt extrusion method, slitting it into a tape shape according to the width of the TAB tape, and punching out sprocket holes with a constant pitch on both side edges. The thickness of the tape is preferably 50 to 500 μm, more preferably 100 to 300 μm from the viewpoint of film strength and bending elasticity.

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0009[Correction target item name] 0009

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0009】[0009]

【実施例】《実施例1》ゼネラルエレクトリック社UL
TEMーD5001を溶融押出しして、 150μmの厚さ
にフイルム化した後、35mm幅にスリットし、その両側
縁部に図1に示すようなスプロケットホールを打ち抜き
加工により設けTAB用リーダテープを得た。
[Embodiment] << Embodiment 1 >> UL, General Electric Company
TEM-D5001 was melt-extruded and formed into a film with a thickness of 150 μm, then slit into a width of 35 mm, and sprocket holes as shown in FIG. 1 were punched on both side edges to obtain a TAB leader tape. ..

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 テープオートメーティッドボンディング
用テープの前後に継ぎ合わせて用いる両側縁部にスプロ
ケットホールを設けたリーダーテープであって、該リー
ダーテープの主成分が下記式で表されるポリマーである
こと特徴とするテープオートメーティッドボンディング
用リーダーテープ。
1. A leader tape having sprocket holes on both side edges, which are used by being spliced together before and after the tape for automated tape bonding, and the main component of the leader tape is a polymer represented by the following formula. Characteristic tape Leader tape for automated bonding.
JP3130784A 1991-03-22 1991-03-22 TAB Leader Tape Expired - Fee Related JP2812813B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3130784A JP2812813B2 (en) 1991-03-22 1991-03-22 TAB Leader Tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3130784A JP2812813B2 (en) 1991-03-22 1991-03-22 TAB Leader Tape

Publications (2)

Publication Number Publication Date
JPH05299472A true JPH05299472A (en) 1993-11-12
JP2812813B2 JP2812813B2 (en) 1998-10-22

Family

ID=15042601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3130784A Expired - Fee Related JP2812813B2 (en) 1991-03-22 1991-03-22 TAB Leader Tape

Country Status (1)

Country Link
JP (1) JP2812813B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100168303A1 (en) * 2004-06-15 2010-07-01 Asahi Kasei Chemicals Corporation TAB leader tape made of polyphenylene ether-based resin

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03222444A (en) * 1990-01-29 1991-10-01 Hitachi Chem Co Ltd Manufacture of two layer film carrier for tab

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03222444A (en) * 1990-01-29 1991-10-01 Hitachi Chem Co Ltd Manufacture of two layer film carrier for tab

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100168303A1 (en) * 2004-06-15 2010-07-01 Asahi Kasei Chemicals Corporation TAB leader tape made of polyphenylene ether-based resin
US8916633B2 (en) * 2004-06-15 2014-12-23 Asahi Kasei Chemicals Corporation TAB leader tape made of polyphenylene ether-based resin

Also Published As

Publication number Publication date
JP2812813B2 (en) 1998-10-22

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