JPH05299213A - Thick film resistance aggregate forming method - Google Patents

Abstract

PURPOSE:To obtain the forming method for a thick film resistance aggregate, in which a resistance film can be arranged in high density and a complicated control of resistrance paste can be prevented, which can be excellently used for tracking of resistance temperature characteristics. CONSTITUTION:A plurality of resistance films 5 are formed using the same resistance paste, a plurality of small area conductance films 4 are dispersively arranged on the surface of at least one of the resistance films 5, and their resistance value is differentiated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a thick film resistor assembly which is formed by forming a plurality of resistance films having different resistance values on a substrate surface.

[0002]

2. Description of the Related Art Conventionally, in order to form such a thick film resistor assembly, the same resistor paste is used, the shape of the resistor film is changed to obtain resistor films having different resistance values, and the resistor film shape is different. There is a method of obtaining a resistance film having different resistance values by changing the resistance value of the resistance paste without changing the resistance value.

[0003]

However, the former method has a problem in that the resistance film cannot be arranged at a high density because the predetermined resistance value cannot be obtained unless the shape is enlarged. It was

Further, in the latter method, since different resistance pastes are used, there is a problem that management of the resistance pastes becomes complicated and tracking of resistance temperature characteristics becomes poor.

Therefore, in the present invention, the resistance film can be arranged at a high density, the management of the resistance paste is not complicated, and the resistance temperature characteristic is excellently tracked. It is intended to provide a method of forming a body.

[0006]

In order to achieve such an object, in the method of forming a thick film resistor assembly of the present invention, a plurality of resistive films are formed using the same resistive paste, and at least one of them is formed. The present invention is characterized in that a plurality of small area conductor films are dispersedly arranged on one resistance film surface to have different resistance values.

[0007]

Since the resistance film in which a plurality of conductor films having small areas are dispersed has a lower resistance value than the resistance film in which the conductor films are not dispersed, a plurality of resistance films are formed by using the same resistance paste. Even if they are formed in the same shape, their resistance values can be made different. Further, the resistance value of the resistance film can be adjusted by changing the area of the conductor film to be dispersed and changing the number of the conductor films to be dispersed.

Therefore, by selecting the resistance paste based on the resistance film having the high resistance value, the resistance film having the low resistance value can be formed by disposing the conductor films having a small area in a dispersed manner. There is no need to significantly change the shape of the film as in the case of using the same resistance paste as in the related art.

[0009]

Embodiments of the present invention will now be described in detail with reference to the drawings.

First, as shown in FIG. 1, a plurality of pairs of electrodes 2 and 3 on a surface of a substrate, and predetermined electrodes 2 on a surface of the substrate 1,
A plurality of small-area conductor films 4 are formed between the three.

The electrodes 2 and 3 and the conductor film 4 are formed by screen-printing a conductor paste, drying it, and then firing it.

Then, as shown in FIG. 2, a resistive film 5 is formed on the surface of the substrate 1 so as to extend over the electrodes 2 and 3 forming a pair.

These resistance films 5 are formed by screen printing using the same resistance paste so as to have the same shape, drying, and then firing.

In this way, the thick film resistance assembly is formed. Of the resistance films 5 in the above embodiment, the conductor film 4 is used.
The resistance value of the resistance film 5 in which the conductive film 4 is dispersed is lower than that of the resistance film 5 in which the conductor film 4 is not dispersed.

The resistance value of the resistance film 5 having a low resistance value can be adjusted by changing the number and area of the conductor films 4 dispersedly arranged. Therefore, when the resistance values of the resistance films 5 in the same thick film resistance assembly are made different, the number and area of the conductor films 4 may be made different according to the required resistance value, and one resistance film 5 is required.
When it is necessary to make only one resistance film 5 different from the other resistance film 5 (specifically, lower its resistance value), the conductor film 4 may be dispersedly arranged only on the one resistance film 5.

In the above embodiment, as is apparent from the drawing, the conductor film 4 is dispersed and arranged in substantially the entire area of the resistance film 5. However, as shown in FIGS.
Alternatively, they may be distributed and arranged only in a specific area of.

Further, in the above embodiment, the electrodes 2, 3
Although the conductor film 4 and the conductor film 4 are formed before the resistance film 5, the resistance film 5 may be formed first, and then the electrodes 2 and 3 and the conductor film 4 may be formed. As a matter of course, when the conductor film 4 is formed first, the conductor film 4 is located on the lower surface of the resistance film 5, and when it is formed later, it is located on the upper surface of the resistance film 5. The same applies to the portions of the electrodes 2 and 3 in contact with the resistance film 5.

Alternatively, the electrodes 2 and 3 and the conductor film 4 may be formed in separate steps, and only the conductor film 4 may be formed on the upper surface of the resistance film 5.

Furthermore, the shape of the resistance film 5 can be arbitrarily changed within a range that does not hinder high-density arrangement.

[0020]

As is apparent from the above description, according to the present invention, a plurality of resistance films are formed by using the same resistance paste, and at least one of the resistance films has a plurality of small areas. Since the conductor films are arranged in a dispersed manner so that the resistance values thereof are different, it is not necessary to change the shape of the resistance film largely as in the case of using the same conventional resistance paste.

Therefore, the resistance films can be arranged at a high density, the management of the resistance paste is not complicated, and the resistance temperature characteristic tracking is also excellent.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of a substrate on which electrodes and conductor films are formed for explaining a method of forming a thick film resistor assembly according to an example of the present invention.

FIG. 2 is a plan view of an essential part of a substrate in which a resistive film is formed on the substrate shown in FIG.

FIG. 3 is a plan view of a resistance film showing a modified example of a dispersed arrangement state of conductor films.

FIG. 4 is a plan view of a resistance film showing another modified example of a dispersed arrangement state of conductor films.

FIG. 5 is a plan view of a resistance film showing still another modified example of a dispersed arrangement state of conductor films.

[Explanation of symbols]

 1 substrate 2, 3 electrode 4 conductor film 5 resistance film

Claims (1)

[Claims] 1. A method of forming a thick film resistor assembly comprising forming a plurality of resistive films having different resistance values by printing the same resistive paste on a substrate surface, the method comprising: 2. A method for forming a thick film resistor assembly, characterized in that a plurality of conductor films having a small area are dispersedly arranged on at least one resistance film surface and the resistance values thereof are made different.