JPH0529757A - Pad for printed board - Google Patents

Pad for printed board

Info

Publication number
JPH0529757A
JPH0529757A JP3181473A JP18147391A JPH0529757A JP H0529757 A JPH0529757 A JP H0529757A JP 3181473 A JP3181473 A JP 3181473A JP 18147391 A JP18147391 A JP 18147391A JP H0529757 A JPH0529757 A JP H0529757A
Authority
JP
Japan
Prior art keywords
pad
reinforcing
printed board
pattern
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3181473A
Other languages
Japanese (ja)
Other versions
JP2943416B2 (en
Inventor
Motomichi Miyata
基道 宮田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP3181473A priority Critical patent/JP2943416B2/en
Publication of JPH0529757A publication Critical patent/JPH0529757A/en
Application granted granted Critical
Publication of JP2943416B2 publication Critical patent/JP2943416B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To guarantee the connection reliability after soldering by installing a reinforcing pattern to a component mounting pad of a printed board and preventing the separation of the pad. CONSTITUTION:Reinforcing patterns 3 are installed and connected with each other at every direction of an octagonal pad 21 mounted on a printed board 1. The pad 21 is connected with a through hole 6 by way of a circuit pattern 5. The rectangular reinforcing patterns 3, which are connected with each other, are installed to patterns 22 and 23 while a U-shaped reinforcing pattern 4 is connected and installed at the same time. The reinforcing patterns 3 and 4 are made of the same material in an attempt to enhance the strength of the pad 21, which makes it possible to prevent the separation of the pad and guarantee the connection reliability after soldering.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、プリント基板に搭載さ
れる電子部品の端子等を固着するためのプリント基板の
パッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board pad for fixing terminals and the like of electronic parts mounted on the printed circuit board.

【０００２】[0002]

【従来の技術】従来、プリント基板のパッドは、それぞ
れが単独でプリント基板上に設けられているか、回路パ
ターンに接続されて設けられている程度で、パッドに接
続する剥離防止用の補強パターンは設けられていなかっ
た。2. Description of the Related Art Conventionally, a pad of a printed circuit board is provided only on the printed circuit board alone or connected to a circuit pattern. It was not provided.

【０００３】[0003]

【発明が解決しようとする課題】上述した様に、従来の
プリント基板のパッドは、補強されていないので、はん
だ付け後のパッドの接続強度が弱く、パッドが簡単に剥
離してしまう為に、接続信頼性を保証することが極めて
困難であるという欠点がある。As described above, since the pad of the conventional printed circuit board is not reinforced, the connection strength of the pad after soldering is weak and the pad easily peels off. The drawback is that it is extremely difficult to guarantee connection reliability.

【０００４】[0004]

【課題を解決するための手段】本発明のプリント基板の
パッドは、パッドの剥離を防止する補強用パターンを周
囲に有している。The pad of the printed circuit board of the present invention has a reinforcing pattern around the pad for preventing the pad from peeling.

【０００５】[0005]

【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

【０００６】１図は、本発明の一実施例の平面図であ
る。FIG. 1 is a plan view of an embodiment of the present invention.

【０００７】プリント基板１上に設けられた八角形のパ
ッド２１の上下左右に長方形の補強用パターン３を連結
して設けてある。またパッド２１は回路パターン５を介
してスルーホール６に接続されている。Rectangular reinforcing patterns 3 are connected to the upper, lower, left and right sides of an octagonal pad 21 provided on the printed circuit board 1. The pad 21 is connected to the through hole 6 via the circuit pattern 5.

【０００８】パッド２２，２３に長方形の補強用パター
ン３を連結して設けるとともに、コの字形の補強用パタ
ーン４を連結して設けてある。A rectangular reinforcing pattern 3 is connected to the pads 22 and 23, and a U-shaped reinforcing pattern 4 is connected to the pads 22 and 23.

【０００９】補強パターン３，４はパッドと同材料で作
成し、パッドの強度を向上させることによってパッドの
剥離防止を果している。The reinforcing patterns 3 and 4 are made of the same material as the pad, and improve the strength of the pad to prevent the pad from peeling.

【００１０】[0010]

【発明の効果】以上説明したように本発明は、プリント
基板の部品実装用パッドに補強用パターンを設け、パッ
ド剥離を防止することにより、はんだ付け後の接続信頼
性を保証することが可能であるといった効果がある。As described above, according to the present invention, it is possible to guarantee the connection reliability after soldering by providing the reinforcing pattern on the component mounting pad of the printed circuit board and preventing the peeling of the pad. There is an effect that there is.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の平面図である。FIG. 1 is a plan view of an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１ プリント基板 ２１，２２，２３ パッド ３ 長方形の補強用パターン ４ コの字形の補強用パターン ５ 回路パターン ６ スルーホール 1 Printed Circuit Board 21, 22, 23 Pad 3 Rectangular Reinforcement Pattern 4 U-Shaped Reinforcement Pattern 5 Circuit Pattern 6 Through Hole

Claims (1)

【特許請求の範囲】 【請求項１】 周囲に補強用パターンを連結して設けた
ことを特徴とするプリント基板のパッド。Claim: What is claimed is: 1. A pad of a printed circuit board, wherein a reinforcing pattern is connected to the periphery of the pad.
JP3181473A 1991-07-23 1991-07-23 Printed circuit board pads Expired - Fee Related JP2943416B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3181473A JP2943416B2 (en) 1991-07-23 1991-07-23 Printed circuit board pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3181473A JP2943416B2 (en) 1991-07-23 1991-07-23 Printed circuit board pads

Publications (2)

Publication Number Publication Date
JPH0529757A true JPH0529757A (en) 1993-02-05
JP2943416B2 JP2943416B2 (en) 1999-08-30

Family

ID=16101373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3181473A Expired - Fee Related JP2943416B2 (en) 1991-07-23 1991-07-23 Printed circuit board pads

Country Status (1)

Country Link
JP (1) JP2943416B2 (en)

Also Published As

Publication number Publication date
JP2943416B2 (en) 1999-08-30

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