JPH0529503A - Heat dissipation equipment - Google Patents

Abstract

PURPOSE:To obtain a pin type heat dissipation equipment capable of effective heat dissipation wherein thermal conduction efficiency as far as a heat dissipation region from a heat generation source to the outside (in the air) is not damaged, and heat dissipation characteristics are not deteriorated by convection reduction of air between pins on account of the decrease of arrangement pitch of pins. CONSTITUTION:A plurality of columnar protrusions which are main heat dissipation regions of a pin type heat dissipation equipment are constituted as cylindrical hollow structures. Penetrating holes linked with hollow parts inside the protrusions are formed in the lower parts of the columnar protrusions. When sent cooling wind 32 collides against a plurality of the columnar protrusions which are main heat dissipation regions of the pin type heat dissipation equipment, the air in hollow parts 24 inside the columnar protrusions 23 is conducted and discharged by air flow as the result of the Venturi effect. Cooled air from penetrating holes 25 in the lower part is sent into the hollow parts 24 inside the columnar protrusions 23, and active convection and circulation are generated. Thereby the inner walls of the hollow parts are always cooled by the cold air, so that heat dissipation characteristics of a semiconductor device 27 can remarkably be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator used as a means for radiating heat from a semiconductor device.

[0002]

2. Description of the Related Art In recent years, the number of elements in semiconductor integrated circuits has increased and the chip size has tended to increase in size. On the other hand, this causes a large amount of heat generation during the operation of the semiconductor integrated circuit, and the semiconductor device needs to dissipate heat in terms of reliability of the semiconductor element. As a heat dissipation method for semiconductor devices, an air cooling method using a radiator is generally used because it is advantageous in terms of cost and reliability. Although there are various kinds of radiators, FIG. 5 shows a conventional pin-type radiator, in which the pin-type radiator 1 has a plurality of prismatic protrusions 5 in the shape of a prism 3 or a cylinder 4 in the heat radiating portion 2. They are aligned and have a surface area. As shown in FIG. 6, the heat dissipation method by the pin type radiator 1 in the previous period is such that the pin type radiator 1 is provided in the heat generating area 7 of the semiconductor device 6, and the heat 8 generated from the semiconductor device is transmitted to the pin type radiator 1 and the heat dissipation portion 2 The heat is dissipated to the outside (in the atmosphere) from the convex portions 5 of the plurality of prismatic columns 3 or cylindrical columns 4 which are This time there is no wind, that is,
In the case of natural air cooling, as shown in FIG. 1A, air 9 is cooled by the convection 10 of air generated by the heat 9 radiated from the plurality of prisms provided in the heat radiating portion 2 and the cylindrical convex portions 3 and 4. .
On the other hand, during forced air cooling by a fan (not shown), the cooling air 11 blown is touched and cooled by the plurality of prismatic or cylindrical projections 3 and 4 provided on the heat radiation surface 2 of the pin-type radiator 1. It is something. At this time, since the heat radiation surface 2 is a plurality of convex portions of the prismatic shape 3 or the cylindrical shape 4, the wind direction of the pin-type radiator 1 is not limited. Further, since it has characteristics such that it can be used in both cases of no wind and forced air cooling, it has been mainly used for multi-pin LSI packages such as large-scale computers. However, the heat dissipation characteristics of the pin-type radiator 1 depend on the heat dissipation area, and the prism 3 or the cylinder 4
The heat dissipation area is determined by the diameter 12 of the convex portion and the number of arrangements. Therefore, it has been a problem how many pins are provided for the outer dimension 13 to secure a heat radiation area. Therefore, methods such as reducing the pin arrangement pitch 14 or making the pin shape fine are adopted so that a large number of pins can be arranged.

[0003]

However, in the above-mentioned configuration, 1) heat radiation to be dissipated from the heat source to the outside (in the atmosphere) by reducing the pin arrangement pitch of the pin type radiator to increase the heat radiation area The heat transfer efficiency to the area is reduced. 2) By reducing the pin pitch of the pin-type radiator, the convection of air between the pins becomes slower and the heat dissipation characteristics deteriorate, and when the cooling air is extremely weak, the heat dissipation effect significantly decreases. I had a problem. In view of such a point, the present invention does not impair the heat transfer efficiency from the heat source to the heat dissipation area to be dissipated to the outside (in the atmosphere), and reduces the pitch between the pins by reducing the pin arrangement pitch of the pin type radiator. An object of the present invention is to provide a pin-type radiator that radiates effective heat without slowing convection and deteriorating heat radiation characteristics.

[0004]

In order to solve the above-mentioned problems, the radiator of the present invention has a hollow structure in which a plurality of columnar projections, which are the main heat radiation areas of the pin-type radiator, have a cylindrical hollow inside. A structure is provided in which a through hole communicating with a hollow portion inside the protrusion is provided in the lower portion of the columnar protrusion.

[0005]

According to the present invention, since the inside of the plurality of pillar-shaped projections, which are the main heat dissipation areas of the radiator, has a hollow cylindrical shape due to the above-described structure, heat is released from the wall surface of the hollow part to the inside of the hollow part. A hot air flow is generated in the air, and the air heated by the heat from the wall surface of the hollow portion moves to the upper part of the cylindrical hollow portion and is released into the atmosphere. At this time, the outside atmosphere is always circulated through the through hole provided in the lower portion of the columnar protrusion and communicating with the hollow portion inside the protrusion.

[0006]

Embodiments of the radiator of the present invention will be described below with reference to the drawings. (FIG. 1), (FIG. 2) and (FIG. 3) are external views showing the structure of the radiator in the present invention. In FIGS. 1, 2, and 3, the pin type radiator 20
Of the columnar shape 21 and the prismatic shape 22 of the heat dissipation area of
The inside of 3 is a hollow structure 24 having a cylindrical or prismatic shape.
Further, the through hole 25 communicating with the hollow portion 24 inside the convex portion 23 is provided in the lower portion of the convex portion 23,
The pin type radiator 20 and the semiconductor device 27 are bonded to each other on the bonding surface 26 of the pin type radiator 20. Next, an example of the present invention will be described with reference to FIG. (Fig. 4
-A) shows the case of natural air cooling which is the first embodiment. Bonding between the semiconductor device 27 and the pin-type radiator 20 is generally performed with an adhesive resin (not shown).
The heat generated from the semiconductor device 27 is transferred from the heat generating surface 28 of the semiconductor device 27 to the bonding surface 26 of the pin type radiator 20.
The transferred heat is dissipated from the surface of the convex portion 23 of the pin type radiator 20 and the inner wall portion of the hollow portion 24. At this time, air convection 30 is generated by the heat 29 generated from the surface of the convex portion 23 and the inner wall surface of the hollow portion 24 provided inside, and particularly the air 30 heated in the hollow portion 24 inside the convex portion 23.
Rises through the hollow interior 24, which creates a chimney effect of the air flow. Therefore, due to the rising movement of the heated air 30, the hollow portion 2 inside the convex portion 23 is formed below the convex portion 23.
Cool air from outside always through the through hole 25 leading to 4
1 is sent, and air convection and circulation are performed. Due to such a chimney effect of the hot air flow, the inner wall of the hollow portion 24 is constantly cooled by the cooled air 31, and the heat radiation effect is significantly improved. Next (FIG. 4-b) shows a case of forced air cooling which is a second embodiment of the present invention. The cooling air 32 is forcibly blown to the pin type radiator 20 adhered to the semiconductor device 27 by a blower fan or the like (not shown). The blown cooling air 32 hits a plurality of columnar protrusions 21 which are the main heat dissipation areas of the pin-type radiator 21. Since the upper portion of the columnar convex portion 21 is the opening portion of the hollow portion 24 inside, when the blown cooling air 32 hits the opening portion in the vertical direction, the columnar convex portion 21 is generated due to the Benchery effect.
The air 31 in the hollow portion 24 inside is discharged by being guided by the cooling airflow 32. By this action, the columnar convex portion 21
The hollow portion 24 in the inside of the columnar convex portion 2 is in a slight vacuum state, and external air 31 is sucked into the lower portion of the columnar convex portion 21 from the through hole 25 communicating with the hollow portion 24 inside the convex portion to form the columnar convex portion 2.
1. Inside the hollow portion 24 of the inside 1, cold air 31 from the outside
Is sent, and active convection and circulation of the air 31 is performed. As a result, the inner wall of the hollow portion 24 is always cooled by the cooled air 31 of the atmosphere, so that the heat dissipation characteristics of the semiconductor device are significantly improved.

[0007]

As described above, according to the present invention,
According to the present invention, the inside of a plurality of pillar-shaped protrusions, which is the main heat dissipation area of the radiator, has a cylindrical hollow structure, and a through hole is provided in the lower portion of the pillar-shaped protrusion to communicate with the hollow inside the protrusion. As a result, heat is released from the wall surface of the hollow portion inside the convex portion, and the air heated by the heat rises to the upper portion of the cylindrical hollow portion and is released to the outside. As a result, the outside atmosphere is always circulated from the through hole that communicates with the hollow portion inside the convex portion provided at the lower portion of the columnar convex portion, and the inner wall of the hollow portion is always cooled by the cold air of the atmosphere, The heat dissipation characteristics are remarkably improved.

By adopting these structures, the diameter of the pins and the number of pins, which have been used as a method of increasing the heat radiation area in the conventional radiator, are increased, and the pitch between the pins is narrowed to increase the space between the pins. The heat dissipation characteristic does not deteriorate due to the slower convection of the air. Therefore, the semiconductor device can be used as a highly reliable heat dissipation means at a very low cost, and its practical effect is extremely large.

[Brief description of drawings]

FIG. 1 is a perspective view of a radiator according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a radiator according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional structural diagram of a radiator according to an embodiment of the present invention.

FIG. 4 is a structural diagram showing a heat dissipation means of a semiconductor device according to an embodiment of the present invention.

FIG. 5 is a perspective view of a conventional radiator according to the present invention.

FIG. 6 is a structural diagram showing a heat dissipation means of a conventional semiconductor device according to the present invention.

[Explanation of symbols]

20-pin type radiator 21 prism 22 cylinder 23 Convex part 24 Hollow part 25 through holes 27 Semiconductor device 29 fever 30 air convection 31 air 32 cooling air

Claims (2)

[Claims] 1. A radiator in which a plurality of columnar protrusions are provided on a main surface of a base, and the base of the columnar protrusions is a cavity in which a tip end of the columnar protrusions is opened. A radiator characterized in that a through hole communicating with a cavity inside the columnar protrusion is provided on a side surface in the vicinity thereof. 2. The radiator according to claim 1, wherein the semiconductor device is fixed to the base.