JPH05291085A - Manufacture of solid electrolytic capacitor - Google Patents

Manufacture of solid electrolytic capacitor

Info

Publication number
JPH05291085A
JPH05291085A JP12255692A JP12255692A JPH05291085A JP H05291085 A JPH05291085 A JP H05291085A JP 12255692 A JP12255692 A JP 12255692A JP 12255692 A JP12255692 A JP 12255692A JP H05291085 A JPH05291085 A JP H05291085A
Authority
JP
Japan
Prior art keywords
resin
sealing
electrolytic capacitor
anode body
solid electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12255692A
Other languages
Japanese (ja)
Inventor
Tatsuro Kubonai
達郎 久保内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP12255692A priority Critical patent/JPH05291085A/en
Publication of JPH05291085A publication Critical patent/JPH05291085A/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To provide a method of manufacturing a solid electrolytic capacitor, where the solid-state electrolytic capacitor can be easily sealed up with resin and lessened in manufacturing cost and size. CONSTITUTION:A sealing auxiliary plate 4 composed of a lid 26 and a resin reservoir 28 formed as joined to the lid 26 is provided, the opening face of an anode 6 surrounded with a capacity forming part 8 and an upright wall 10 is blocked by the lid 26 of the sealing auxiliary plate 4, sealing resin 38 is filled into the upright wall 10 through the resin reservoir 28 and hardened, and then an excessive sealing resin 38' left inside the resin reservoir 28 is cut off together with the resin reservoir 28.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電解質に有機導電ポリ
マー等の固体電解質を用いた固体電解コンデンサの製造
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a solid electrolytic capacitor using a solid electrolyte such as an organic conductive polymer as an electrolyte.

【0002】[0002]

【従来の技術】この種の固体電解コンデンサには、容量
形成面の周囲を立壁部で包囲することにより断面C字形
を成す陽極体を用いたものが提案されている。このよう
な陽極体を用いたものでは、その容量形成面に化成酸化
皮膜、固体電解質層、導体層等のコンデンサ素子を形成
するための処理を行なった後、封止処理を行なう。この
封止処理は、封止樹脂を用いて行なわれている。
2. Description of the Related Art A solid electrolytic capacitor of this type has been proposed which uses an anode body having a C-shaped cross section by surrounding a capacity forming surface with a standing wall. In the case of using such an anode body, a sealing treatment is performed after a treatment for forming a capacitor element such as a chemical conversion oxide film, a solid electrolyte layer, a conductor layer is performed on the capacitance forming surface. This sealing process is performed using a sealing resin.

【0003】ところで、このような固体電解コンデンサ
では、混成集積回路を主要な用途としており、その微細
化の要請に伴って小型化、軽量化を余儀なくされてい
る。このため、その構成要素である陽極体も小型化さ
れ、封止樹脂の注入部分も微細化傾向にある。
By the way, in such a solid electrolytic capacitor, a hybrid integrated circuit is mainly used, and miniaturization and weight reduction are unavoidable in accordance with a demand for miniaturization thereof. For this reason, the anode body, which is a component thereof, is also downsized, and the portion where the sealing resin is injected tends to be miniaturized.

【0004】ところが、封止樹脂による封止処理は、デ
ィスペンサでの注入やディップ処理を以て行われている
ことから、封止樹脂の流動性が封止精度や気密保持の信
頼性に大きく影響し、歩留りにも影響を与えている。換
言すれば、この封止樹脂の特性や処理が固体電解コンデ
ンサの形状や小型化に影響を与え、場合によってはその
小型化を妨げる要因になる。さらに、封止樹脂が外装の
処理コストにも大きく影響する。
However, since the sealing process with the sealing resin is performed by injection with a dispenser or dipping process, the fluidity of the sealing resin greatly affects the sealing accuracy and the reliability of airtightness, It also affects the yield. In other words, the characteristics and treatment of this sealing resin affect the shape and size reduction of the solid electrolytic capacitor, and may be a factor that hinders the size reduction in some cases. Furthermore, the encapsulating resin also greatly affects the processing cost of the exterior.

【0005】そこで、本発明は、樹脂封止の容易化を図
り、製造コストの低減とともに製品の小型化をも図った
固体電解コンデンサの製造方法を提供することを目的と
する。
Therefore, an object of the present invention is to provide a method of manufacturing a solid electrolytic capacitor which facilitates resin encapsulation, reduces the manufacturing cost and downsizes the product.

【0006】[0006]

【課題を解決するための手段】本発明の固体電解コンデ
ンサは、蓋部(26)とこの蓋部に連続して樹脂溜部
(28)を形成した封止補助板(4)を形成し、この封
止補助板の前記蓋部を以て容量形成部(8)を立壁部
(10)で包囲した陽極体(6)の開口面を閉塞すると
ともに、前記樹脂溜部から前記立壁部内に封止樹脂(3
8)を充填させ、この封止樹脂を硬化させた後、前記樹
脂溜部とともにその内部に残留する余剰封止樹脂(38
´)を切り離すことを特徴とする。
In the solid electrolytic capacitor of the present invention, a lid portion (26) and a sealing auxiliary plate (4) having a resin reservoir portion (28) continuously formed on the lid portion are formed, The opening surface of the anode body (6) in which the capacity forming portion (8) is surrounded by the standing wall portion (10) with the lid portion of the sealing auxiliary plate is closed, and the sealing resin is filled from the resin reservoir portion into the standing wall portion. (3
8) is filled and the encapsulating resin is cured, and then the excess encapsulating resin (38) that remains inside the resin accumulating portion together with the resin accumulating portion is filled.
´) is separated.

【0007】[0007]

【作用】封止補助板の樹脂溜部は陽極体の封止樹脂を注
入すべき部分に通じており、この樹脂溜部からその注入
すべき部分に封止樹脂の流動性を利用して流し込み、そ
の硬化によって樹脂封止が行なわれる。そして、樹脂溜
部及びその内部の余剰封止樹脂を、蓋部側から切り離す
ことにより、樹脂封止を完了する。
[Function] The resin reservoir portion of the auxiliary sealing plate communicates with the portion of the anode body where the sealing resin is to be injected, and is poured from this resin reservoir portion to the portion where the sealing resin is to be injected utilizing the fluidity of the sealing resin. The resin is sealed by the curing. Then, the resin encapsulation part and the surplus encapsulation resin inside the part are separated from the lid part side to complete the resin encapsulation.

【0008】そして、陽極体の開口面を覆う蓋部は外装
構造の一部を成し、固体電解コンデンサの気密保持に寄
与する。
The lid portion covering the opening surface of the anode body forms a part of the exterior structure and contributes to maintaining the airtightness of the solid electrolytic capacitor.

【0009】[0009]

【実施例】以下、本発明を図面に示した実施例を参照し
て詳細に説明する。
The present invention will be described in detail below with reference to the embodiments shown in the drawings.

【0010】図1は、本発明の固体電解コンデンサの製
造方法の一実施例を示している。図1の(A)に示すよ
うに、コンデンサ素子2に樹脂封止の前処理として封止
補助板4を接合する。コンデンサ素子2は基礎部材であ
る陽極体6を以て形成され、この陽極体6は、矩形の平
板状を成す容量形成部8の三辺部に立壁部10を形成
し、各立壁部10を以て容量形成部8を包囲した形態で
ある。容量形成部8にはエッチング処理の後、化成処理
によって酸化皮膜層12が形成され、この酸化皮膜層1
2の上面に固体電解質層14が形成され、さらにその上
に導体層16が形成されている。そして、陽極体6の背
面部には陽極体6の形状に沿って折り曲げられたL字形
を成す陽極端子18が溶接や導電性接着剤による接着等
の固着手段によって取り付けられ、また、導体層16の
上面には陰極端子20が導体層を成す導電性接着剤22
を以て固着されている。陰極端子20は、陽極体6の形
状ないし肉厚に対応して断面C字形を成しており、その
他端部側は陽極体6の背面部側に絶縁性接着剤24を以
て固着されている。
FIG. 1 shows an embodiment of a method for manufacturing a solid electrolytic capacitor of the present invention. As shown in FIG. 1A, a sealing auxiliary plate 4 is bonded to the capacitor element 2 as a pretreatment for resin sealing. The capacitor element 2 is formed by an anode body 6 which is a base member. The anode body 6 has standing wall portions 10 formed on three sides of a capacity forming portion 8 having a rectangular flat plate shape, and each standing wall portion 10 forms a capacity. It is a form in which the portion 8 is surrounded. An oxide film layer 12 is formed on the capacitance forming portion 8 by a chemical conversion process after the etching process.
The solid electrolyte layer 14 is formed on the upper surface of 2, and the conductor layer 16 is further formed thereon. Then, an L-shaped anode terminal 18, which is bent along the shape of the anode body 6, is attached to the back surface of the anode body 6 by a fixing means such as welding or adhesion with a conductive adhesive, and the conductor layer 16 is also provided. The conductive adhesive 22 on the upper surface of which the cathode terminal 20 forms a conductor layer
It is fixed with. The cathode terminal 20 has a C-shaped cross section corresponding to the shape or thickness of the anode body 6, and the other end side is fixed to the back side of the anode body 6 with an insulating adhesive 24.

【0011】封止補助板4は、樹脂封止を補助する補助
部材であるとともに、外装構造の一部を成している。即
ち、この封止補助板4は、陽極体6に立壁部10を以て
形成されている開口面を覆う蓋部26と樹脂溜部28と
を一体に形成したものであり、両者の境界部には両者を
切り離すためのノッチ部30が形成されている。樹脂溜
部28には、両側面部を覆う壁板32が形成されている
とともに、余剰封止樹脂を外部に流し出すためのドレイ
ン部34が形成されている。このドレイン部34は、封
止補助板4の一部をV字形に折り曲げ、その高さを壁板
32より低く設定するとともに、余剰封止樹脂をガイド
する傾斜部36を形成したものである。また、ドレイン
部34は、陽極体6側への封止樹脂の供給量を適正化す
る高さに設定され、実施例では壁板32より僅かに低く
設定して壁板32側への封止樹脂の不要な流れ出しを防
止している。
The sealing auxiliary plate 4 is an auxiliary member for assisting the resin sealing and forms a part of the exterior structure. That is, the sealing auxiliary plate 4 is formed by integrally forming the lid portion 26 and the resin reservoir portion 28 that cover the opening face formed by the standing wall portion 10 on the anode body 6, and the boundary portion between the both. A notch portion 30 is formed to separate the two. The resin reservoir 28 is formed with a wall plate 32 covering both side surfaces and a drain portion 34 for draining the surplus sealing resin to the outside. The drain part 34 is formed by bending a part of the auxiliary sealing plate 4 into a V shape, setting its height lower than that of the wall plate 32, and forming an inclined part 36 for guiding the excess sealing resin. Further, the drain portion 34 is set to a height that optimizes the supply amount of the sealing resin to the anode body 6 side, and in the embodiment, it is set slightly lower than the wall plate 32 to seal the wall plate 32 side. Prevents unnecessary flow of resin.

【0012】次に、図1の(B)に示すように、樹脂溜
部28に封止樹脂38を供給し、それを加熱することに
より溶融させ、その流動性によって陽極体6の封止すべ
き空間部分へ流し込む。封止樹脂38の供給量は、封止
空間の容積に樹脂溜部28の容積を加えた体積より大き
く設定することにより、樹脂封止を確実に行なうことが
できる。この場合、38´は、最終的に封止に寄与しな
い余剰封止樹脂である。
Next, as shown in FIG. 1B, a sealing resin 38 is supplied to the resin reservoir 28 and heated to melt it, and the anode body 6 is sealed by its fluidity. Pour into the space where it should be. By setting the supply amount of the sealing resin 38 to be larger than the volume of the sealing space plus the volume of the resin reservoir 28, the resin sealing can be reliably performed. In this case, 38 'is a surplus sealing resin that does not finally contribute to the sealing.

【0013】次に、封止樹脂38を冷却して硬化させた
後、図1の(C)に示すように、樹脂溜部28とともに
余剰封止樹脂38´を切り離し、製品としての固体電解
コンデンサを得ることができる。
Next, after the encapsulating resin 38 is cooled and cured, as shown in FIG. 1C, the excess encapsulating resin 38 'is cut off together with the resin reservoir 28 to form a solid electrolytic capacitor as a product. Can be obtained.

【0014】次に、本発明の固体電解コンデンサの製造
方法の具体的な処理方法を図2ないし図5を参照して説
明する。
Next, a concrete processing method of the method for manufacturing the solid electrolytic capacitor of the present invention will be described with reference to FIGS.

【0015】先ず、図2に示すように、アルミニウム等
の皮膜形成金属を用いて陽極体6を形成する。この陽極
体6は、プレス加工又は切出し加工によって形成し、容
量形成部8の三辺部を立壁部10で包囲する形状とし、
陰極端子20の引出し及び封止樹脂38の注入の便宜の
ため、開口部11を形成したものである。そして、陽極
体6の上面には立壁部10で包囲された開口面が形成さ
れている。
First, as shown in FIG. 2, the anode body 6 is formed using a film-forming metal such as aluminum. The anode body 6 is formed by pressing or cutting, and has a shape in which three sides of the capacity forming portion 8 are surrounded by the standing wall portion 10,
The opening 11 is formed for the convenience of drawing out the cathode terminal 20 and injecting the sealing resin 38. An opening surface surrounded by the standing wall portion 10 is formed on the upper surface of the anode body 6.

【0016】次に、図3に示すように、陽極体6の容量
形成部8には、エッチング処理の後、化成処理によって
酸化皮膜層12を形成し、この酸化皮膜層12の上面に
気相重合、化学重合又は電解重合によってポリピロール
等のポリマー膜からなる固体電解質層14を形成する。
この固体電解質層14の上面に導電性接着剤を以て実質
的な陰極を成す導体層16を形成する。そして、陽極体
6の背面部にはL字形を成す陽極端子18を取り付け、
また、導体層16の上面には陰極端子20を導電性接着
剤22を以て固着してコンデンサ素子2を完成する。
Next, as shown in FIG. 3, an oxide film layer 12 is formed on the capacity forming portion 8 of the anode body 6 by etching and then chemical conversion treatment, and a vapor phase is formed on the upper surface of the oxide film layer 12. The solid electrolyte layer 14 made of a polymer film such as polypyrrole is formed by polymerization, chemical polymerization or electrolytic polymerization.
On the upper surface of this solid electrolyte layer 14, a conductive layer 16 is formed with a conductive adhesive to form a substantial cathode. Then, an L-shaped anode terminal 18 is attached to the back surface of the anode body 6,
Further, the cathode terminal 20 is fixed to the upper surface of the conductor layer 16 with a conductive adhesive 22 to complete the capacitor element 2.

【0017】次に、図4に示すように、例えば、陽極体
6と同様の金属材料を用いて封止補助板4を形成する。
この封止補助板4の蓋部26にコンデンサ素子2の陽極
体6の開口面を合わせ、両者を溶接又は接着剤を以て接
合する。このとき、陽極体6と蓋部26との接合を密に
すれば、その分だけ気密性が強化される。
Next, as shown in FIG. 4, the sealing auxiliary plate 4 is formed using the same metal material as the anode body 6, for example.
The opening surface of the anode body 6 of the capacitor element 2 is aligned with the lid portion 26 of the sealing auxiliary plate 4, and the both are welded or bonded with an adhesive. At this time, if the junction between the anode body 6 and the lid portion 26 is made tight, the airtightness is strengthened accordingly.

【0018】次に、図5の(A)に示すように、適当な
体積をもつ塊状の封止樹脂38を樹脂溜部28に入れ、
この状態で封止樹脂38を加熱して溶融させる。
Next, as shown in FIG. 5A, a block-shaped encapsulating resin 38 having an appropriate volume is put in the resin reservoir 28,
In this state, the sealing resin 38 is heated and melted.

【0019】次に、図5の(B)に示すように、封止樹
脂38が溶融すると、その流動性によって、封止樹脂2
8は陽極体6の封止すべき空間部にその流動性を以て流
入し、余剰封止樹脂38´は樹脂溜部28に残留すると
ともにドレイン部34から外部に流出する。
Next, as shown in FIG. 5B, when the sealing resin 38 melts, the sealing resin 2 is melted due to its fluidity.
8 flows into the space of the anode body 6 to be sealed with its fluidity, and the surplus sealing resin 38 'remains in the resin reservoir 28 and flows out from the drain 34 to the outside.

【0020】次に、この封止樹脂38を冷却して硬化さ
せた後、図5の(C)に示すように、封止補助板4にお
ける機械的強度の低い部分であるノッチ部30に剪断力
を加えて蓋部26側から樹脂溜部28とともに余剰封止
樹脂38を切り離す。この結果、図1の(C)に示した
製品としての固体電解コンデンサが得られる。
Next, after the sealing resin 38 is cooled and hardened, as shown in FIG. 5 (C), shearing is performed on the notch portion 30 which is a portion of the sealing auxiliary plate 4 having low mechanical strength. By applying force, the excess sealing resin 38 is separated from the lid 26 side together with the resin reservoir 28. As a result, the solid electrolytic capacitor as the product shown in FIG. 1C is obtained.

【0021】このような製造方法によれば、外装構造の
一部を成す蓋部26を備えた封止補助板4を以て陽極体
6の開口面を塞ぎ、その封止補助板4から陽極体6の内
部に封止樹脂38を注入させることができ、封止樹脂3
8の加熱溶融と相俟って極めて容易に樹脂注入及び封止
を行なうことができる。
According to such a manufacturing method, the opening surface of the anode body 6 is closed by the sealing auxiliary plate 4 having the lid portion 26 forming a part of the exterior structure, and the sealing auxiliary plate 4 to the anode body 6 is closed. The sealing resin 38 can be injected into the inside of the
In combination with the heating and melting of No. 8, resin injection and sealing can be performed very easily.

【0022】なお、実施例では、塊状を成す封止樹脂3
8を加熱溶融させて樹脂封止を行なったが、予め軟化し
ている封止樹脂38を樹脂溜部28に供給し、補完的な
加熱処理で適正な流動性を封止樹脂38に与えるように
してもよい。
Incidentally, in the embodiment, the encapsulating resin 3 having a lump shape is used.
8 was heated and melted to perform resin encapsulation, but the pre-softened encapsulating resin 38 is supplied to the resin reservoir 28 so that the supplementary heat treatment gives proper fluidity to the encapsulating resin 38. You may

【0023】[0023]

【発明の効果】以上説明したように、本発明によれば、
次のような効果が得られる。 a.微小な封止部分への封止樹脂の注入が容易になり、
固体電解コンデンサの小型化とともに、樹脂封止の信頼
性を高め、製造コストの低減を図ることができる。 b.封止樹脂の注入の容易化により、高級な封止樹脂の
供給機等の樹脂供給手段を用いる必要がなく、製造設備
面からも製造コストの低減を図ることができる。 c.封止樹脂には高粘度から低粘度のものまで、各種の
ものを用いることができ、高粘度の封止樹脂を使用した
場合にも、低粘度のものを使用した場合と同様の樹脂封
止を行なうことができ、樹脂封止の信頼性を高めること
ができる。 d.封止補助板の蓋部を外装構造の一部に利用でき、こ
の蓋部で陽極体の開口部を覆うため、固体電解コンデン
サの気密性をより強化することができ、信頼性の高い封
止構造を実現できる。 e.外装処理のコストを低減できる。
As described above, according to the present invention,
The following effects can be obtained. a. It is easy to inject the sealing resin into the minute sealing parts,
Along with downsizing of the solid electrolytic capacitor, reliability of resin encapsulation can be improved and manufacturing cost can be reduced. b. By facilitating the injection of the sealing resin, it is not necessary to use a resin supply means such as a high-grade sealing resin supply machine, and the manufacturing cost can be reduced from the viewpoint of manufacturing equipment. c. Various types of sealing resin can be used, from high viscosity to low viscosity, and even when using high viscosity sealing resin, the same resin sealing as when using low viscosity It is possible to improve the reliability of the resin sealing. d. The lid part of the sealing auxiliary plate can be used as part of the exterior structure, and since the lid part covers the opening of the anode body, the airtightness of the solid electrolytic capacitor can be further strengthened, and highly reliable sealing is achieved. The structure can be realized. e. The cost of exterior processing can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の固体電解コンデンサの製造方法の一実
施例を示す断面図である。
FIG. 1 is a cross-sectional view showing an embodiment of a method for manufacturing a solid electrolytic capacitor of the present invention.

【図2】図1に示した固体電解コンデンサの製造方法に
用いられる陽極体を示す斜視図である。
2 is a perspective view showing an anode body used in the method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG.

【図3】図1に示した固体電解コンデンサの製造方法に
用いられるコンデンサ素子を示す縦断面図である。
3 is a vertical cross-sectional view showing a capacitor element used in the method for manufacturing the solid electrolytic capacitor shown in FIG.

【図4】図1に示した固体電解コンデンサの製造方法に
用いられるコンデンサ素子及び封止補助板を示す斜視図
である。
FIG. 4 is a perspective view showing a capacitor element and a sealing auxiliary plate used in the method for manufacturing the solid electrolytic capacitor shown in FIG.

【図5】図1に示した固体電解コンデンサの製造方法に
おける中間工程を示す断面図である。
5 is a cross-sectional view showing an intermediate step in the method for manufacturing the solid electrolytic capacitor shown in FIG.

【符号の説明】[Explanation of symbols]

2 コンデンサ素子 4 封止補助板 6 陽極体 8 容量形成部 10 立壁部 26 蓋部 28 樹脂溜部 38 封止樹脂 38´ 余剰封止樹脂 2 Capacitor element 4 Sealing auxiliary plate 6 Anode body 8 Capacitance forming part 10 Standing wall part 26 Lid part 28 Resin reservoir part 38 Sealing resin 38 'Surplus sealing resin

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成4年4月17日[Submission date] April 17, 1992

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0003[Name of item to be corrected] 0003

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0003】[0003]

【発明が解決しようとする課題】ところで、このような
固体電解コンデンサでは、混成集積回路を主要な用途と
しており、その微細化の要請に伴って小型化、軽量化を
余儀なくされている。このため、その構成要素である陽
極体も小型化され、封止樹脂の注入部分も微細化傾向に
ある。
By the way, in such a solid electrolytic capacitor, a hybrid integrated circuit is mainly used, and miniaturization and weight reduction are unavoidable in accordance with a demand for miniaturization thereof. For this reason, the anode body, which is a component thereof, is also downsized, and the portion where the sealing resin is injected tends to be miniaturized.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 蓋部とこの蓋部に連続して樹脂溜部を形
成した封止補助板を形成し、この封止補助板の前記蓋部
を以て容量形成部を立壁部で包囲した陽極体の開口面を
閉塞するとともに、前記樹脂溜部から前記立壁部内に封
止樹脂を充填させ、この封止樹脂を硬化させた後、前記
樹脂溜部とともにその内部に残留する余剰封止樹脂を切
り離すことを特徴とする固体電解コンデンサの製造方
法。
1. An anode body in which a lid portion and a sealing auxiliary plate in which a resin reservoir portion is formed continuously with the lid portion are formed, and the capacity forming portion is surrounded by a standing wall portion with the lid portion of the sealing auxiliary plate. While closing the opening surface of the sealing resin from the resin reservoir into the standing wall and curing the sealing resin, the excess sealing resin remaining inside the resin reservoir along with the resin reservoir is separated. A method of manufacturing a solid electrolytic capacitor, comprising:
JP12255692A 1992-04-15 1992-04-15 Manufacture of solid electrolytic capacitor Pending JPH05291085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12255692A JPH05291085A (en) 1992-04-15 1992-04-15 Manufacture of solid electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12255692A JPH05291085A (en) 1992-04-15 1992-04-15 Manufacture of solid electrolytic capacitor

Publications (1)

Publication Number Publication Date
JPH05291085A true JPH05291085A (en) 1993-11-05

Family

ID=14838816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12255692A Pending JPH05291085A (en) 1992-04-15 1992-04-15 Manufacture of solid electrolytic capacitor

Country Status (1)

Country Link
JP (1) JPH05291085A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110157775A1 (en) * 2009-12-30 2011-06-30 Industrial Technology Research Institute Decoupling device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110157775A1 (en) * 2009-12-30 2011-06-30 Industrial Technology Research Institute Decoupling device
US8289679B2 (en) * 2009-12-30 2012-10-16 Industrial Technology Research Institute Decoupling device

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