KR102398737B1 - Metal Case Molding Capacitor - Google Patents

Abstract

The present invention relates to a capacity-increased metal case molding capacitor, which comprises: a capacitor module (10) including a capacitor element (C1) formed by winding a dielectric film and formed on electrode surfaces on both sides, a first bus bar (1) having a first output terminal (1a) on an exposed side, a second bus bar (2) having a second output terminal (2a) on the exposed side, and an insulating sheet interposed between the first busbar (1) and the second busbar (2) to insulate an overlapping area; a metal case (20) made of a metal material, and having an upper opening (20a) into which the capacitor module (10) is inserted, and a module embedding space (20b) in which the capacitor module (10) is placed; a filling resin (30) injected into a fluid phase having fluidity through the upper opening (20a) of the metal case (20) in a state in which an insulating spacer (40) is located in the module embedding space of the metal case (20), and penetrating into the space between the capacitor module (10) and the metal case (20) to be cured; and the insulating spacer (40) having a predetermined thickness and located between the capacitor module (10) and the metal case (20) to perform an insulating function between the capacitor module (10) and the metal case (20). The present invention can maximize the capacitor capacity while using the metal case of a predetermined size.

Description

Capacity Increase Type Metal Case Molding Capacitor { Metal Case Molding Capacitor }

The present invention relates to a capacity-increasing type metal case-molded capacitor capable of maximally increasing the capacitor capacity while using a metal case of a predetermined size.

In general, film capacitors are widely used in various industrial fields, and for example, capacitors for electric devices, capacitors for low voltage advance, capacitors for inverters, capacitors for filters, and the like are widely known.

In the manufacture of these capacitors, dielectric films such as polyester (PET) resin, polypropylene (PP) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, polyphenylene sulfide (PPS) resin (or A plastic film) is used, and zinc, aluminum, an aluminum alloy, or aluminum is first deposited on one or both surfaces of a dielectric film as an electrode, and then a deposited film using zinc or the like is used secondarily.

Film capacitors are manufactured by winding two pairs of vapor deposition films. In order to use both surfaces of the wound capacitor element for electrode extraction, zinc or zinc alloy is thermally sprayed on both surfaces of the capacitor element to heat the sprayed surfaces. After forming, a bus bar or electrode lead wire or electrode terminal is bonded to the sprayed surface in the same way as spot and soldering, and then inserted into an exterior case, filled with an insulator such as epoxy or urethane, and cured to form a case mold type It can be manufactured as a capacitor of

In the case of a plastic case of an existing capacitor, the internal heat of the capacitor is not emitted to the outside, so the internal temperature of the capacitor rises a lot. In order to improve this, it was developed using a metal case that dissipates heat well, but the capacity and volume of the capacitor were greatly reduced due to excellent heat dissipation. There was a problem in that the dielectric breakdown voltage was defective between the poles (P/N poles of the module component unit by connecting the P and N pole busbars to the metal surface of the element inside the capacitor).

Cause of poor insulation: Put the unit with P and N pole bus bar on the metal side of the capacitor inside the metal case and mold it with a molding agent such as epoxy or urethane. On one side, when the insulation distance is shortened, burst, or a conductive foreign material flows in, insulation failure occurs due to a decrease in insulation between the metal case and the P/N poles of the capacitor module.

The present invention is a case-molded capacitor in which a capacitor unit is molded into a filler, and as a case-molding capacitor having the same technical field as the present invention, there is a case-molding capacitor with improved filling surface levelness of the registered patent No. 10-2332168 (New Intech Co., Ltd.).

When the metal case capacitor module is filled with epoxy resin, the insulating spacer bursts in the form of a mesh, so when the epoxy resin is filled, the epoxy resin enters in the form of a mesh. Growing up, designing was impossible.

Therefore, it is limited to increase the capacitor capacity by designing the insulation spacer to be generally high by about 4 mm, so it is impossible to increase the capacitor capacity while the horizontal and vertical height of the metal case of the metal case capacitor is fixed.

Increasing the metal case height can increase the capacitor capacity, but increasing the metal case height increases the weight and cost of the capacitor. A 20-30% increase was requested.

Film capacitor metal case for eco-friendly car Inverter Metal case size of the capacitor without changing the horizontal, vertical, and height dimensions. It is possible to increase the capacitor capacity without changing the film capacitor dielectric film thickness. The film thickness was fixed and the capacity increase method was reviewed.

The capacity increase type metal case molding capacitor according to an exemplary embodiment of the present invention includes a capacitor element C1 formed by winding a dielectric film and formed on electrode surfaces on both sides thereof, and electrically connected to one electrode surface of the capacitor element, and A first busbar (1) having a first output terminal (1a) on the exposed side, and electrically connected to the other electrode surface of the capacitor element (C) and having a second output terminal (2a) on the exposed side A capacitor module (10) comprising a second bus bar (2) and an insulating sheet interposed between the first bus bar (1) and the second bus bar (2) to insulate the overlapping area class;

a metal case 20 having an upper opening 20a into which the capacitor module 10 is inserted and a module internal space 20b in which the capacitor module 10 is placed, and made of a metal material; In a state where the insulating spacer 40 is positioned in the module interior space of the metal case 20 , it is injected into a fluid phase through the upper opening surface 20a of the metal case 20 , and the capacitor module 10 . and a filling resin 30 that penetrates into the space between the metal case 20 and hardens; an insulating spacer 40 having a constant thickness and positioned between the capacitor module 10 and the metal case 20 to perform an insulating function between the capacitor module 10 and the metal case 20; Consisting of including,

The insulating spacer 40 includes an open wall insulating part 50 that insulates between the walls (bottom and side walls) of the metal case 20 and the capacitor module 10 , and the open wall insulating part 50 ) is characterized by having a plastic insulating member 51 having a certain thickness and an opening 55 through which the filling resin 30 penetrates.

In the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the insulating spacer 40 is formed on the upper part of the open wall insulating part 50 and is higher than the upper surface 22 of the side wall of the metal case 20 . It is preferable to further include a protruding closed type (ie, no openings over the entire 360 degree area so that the flowable filling resin cannot escape) sidewall dams.

In the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the filling resin 30 is filled and cured to a position higher than the upper surface 22 of the side wall of the metal case 20, and the closed type (ie, fluidity) The side wall dam 60 (which does not have an opening in the entire 360 degree area so that the filling resin cannot escape) is formed integrally with the plastic insulating member 51 and is larger than the upper surface 22 of the side wall of the metal case 20 A closed type (ie, no opening) side wall plate portion 61 positioned high, a) the upper side 61a of the closed side wall plate portion 61 is higher than the side wall top surface 22 of the metal case 20 Located high, b) the lower side 61b of the closed side wall plate part 61 is located lower than the upper side wall 22 of the metal case 20, c) the open part of the open wall insulating part 50 ( 55 ) is located lower than the lower side of the closed (ie, not having an open portion) side wall plate portion 61 and is located lower than the upper side wall 22 of the metal case 20 .

In the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the upper side 61a of the closed sidewall dam 60 is 3mm to 100mm (metal material) than the sidewall upper surface 22 of the metal case 20 The difference in height between the case top surface and the upper side of the closed sidewall dam: D1) It is preferable to be formed higher.

In the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the filling resin 30 is, a) a first water level having a height equal to or lower than the top surface 22 of the side wall of the metal case 20 ( After filling up to H1) and first curing, b) from the first water level (Level 1) to the second water level having a height equal to or lower than the upper side 61a of the closed side wall plate part 61 (Level 2) By secondary filling to the second water level (H2), the resin penetrates into the opening 55 of the wall insulating part 50 when filling up to the second water level (H2) at once and overflows the upper surface 22 of the side wall of the metal case 20 it is prevented

In the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the insulating spacer 40 has a filling line indicating the first water level (H1) or the second water level (Level 2) on the inner surface.

According to an embodiment of the present invention, there is provided a method for manufacturing a capacity-increasing metal case molded capacitor comprising: an insulating spacer positioning step (S10) of locating an insulating spacer 40 made of plastic in a module interior space of a metal case 20; A capacitor module 10 comprising a capacitor element C1 and a first busbar 1 and a second busbar 2 that conducts electricity with the electrode surface of the capacitor element C1 is formed with an upper opening surface 20a. an element positioning step (S20) of locating the metal case 20 through;

A first resin filling step (S30) of filling the filling resin 30 to the first water level (H1) having a height equal to or lower than the upper surface 22 of the side wall of the metal case 20 and then curing (S30); A second second having a height higher than the first water level H1 and the upper end surface 22 of the side wall of the metal case 20 and equal to or lower than the upper side 61a of the closed side wall plate portion 61 of the insulating spacer 40 . A secondary resin filling step (S40) of curing after filling the filling resin 30 to the water level (H2);

The insulating spacer 40 is formed on the upper part of the open wall insulating part 50 and is of a closed type (that is, 360 degrees so that the fluid filling resin cannot escape) that is formed higher than the upper surface 22 of the side wall of the metal case 20. It is characterized in that it further comprises a sidewall dam (which has no openings in the area).

According to the present invention, a capacity-increasing type metal case molding capacitor capable of increasing the capacitor capacity by using a metal case of a limited size (specific gravity, high weight, and high material cost) and a manufacturing method are provided.

In addition, in the case of the present invention, a module extending beyond the module interior space of the metal case to the external space above the opening surface is molded with a resinous filler (the molding water level is higher than the upper surface of the metal case). A metal case molding capacitor structure and a manufacturing method thereof are provided.

In addition, according to the present invention, it has excellent insulation in the inner space of the metal case and has a structure that increases the unity of the element module, the insulating spacer, and the metal case. Provided are a capacity-increasing type metal case molding capacitor capable of increasing the capacity of the capacitor and a manufacturing method thereof.

1 is a perspective view of an assembling state of a capacity-increasing metal case molding capacitor according to an embodiment of the present invention;
2 is a perspective view of an assembly state of a capacity increase type metal case molding capacitor according to an embodiment of the present invention.
3 is a perspective view of a metal case molding capacitor capacitor module and an insulating spacer (metal case removed state) of the present invention.
4A is a perspective view of a metal case of the present invention, FIG. 4B is a detailed view of an insulating spacer of the present invention, and FIG. 4C is a detailed view of a capacitor module of the present invention.
5 is a flow chart of a method for manufacturing a capacity-increasing metal case molding capacitor according to the present invention.
Figure 6 (a, b) is an explanatory diagram of the charging step (first water level, second water level) of the manufacturing method of the capacity increase type metal case molding capacitor of the present invention.

Hereinafter, a capacity increase type metal case molding capacitor and a manufacturing method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 1 is a perspective view of an assembling state of a capacity increase type metal case molding capacitor according to an embodiment of the present invention, FIG. 2 is a perspective view of an assembling state of a capacity increase type metal case molding capacitor according to an embodiment of the present invention, and FIG. 3 is a perspective view of the present invention Metal case molding capacitor capacitor module and insulating spacer perspective view (metal case removed state), FIG. 4A is a metal case perspective view of the present invention, FIG. 4B is a detailed insulating spacer view of the present invention, FIG. 4C is a detailed capacitor module module view of the present invention, FIG. 5 is a flowchart of a method for manufacturing a capacity-increasing metal case molding capacitor according to the present invention. 6 (a, b) is an explanatory diagram (a first water level, a second water level) of the charging step of the manufacturing method of the capacity increase type metal case molding capacitor of the present invention.

1 to 5 , the capacity increase type metal case molding capacitor according to an embodiment of the present invention includes a capacitor module 10 , a metal case 20 , a filling resin 30 , and an insulating spacer 40 . is comprised of

3 and 4C, the capacitor module 10 includes a capacitor module 10; A first busbar having a capacitor element C1 formed by winding a dielectric film and formed on electrode surfaces on both sides, and a first output terminal 1a electrically connected to one electrode surface of the capacitor element and having a first output terminal 1a on the exposed side (1), a second bus bar (2) electrically connected to the electrode surface of the other side of the capacitor element (C) and having a second output terminal (2a) on an exposed side, and the first bus bar (1) and an insulating sheet interposed between the second bus bar 2 and insulating the overlapping area.

As shown in FIGS. 1, 2, and 4A, the metal case 20 has an upper opening surface 20a into which the capacitor module 10 is inserted, and a module built-in space 20b in which the capacitor module 10 is placed. and is made of metal.

1 to 4, the filling resin 30 is the upper opening surface 20a of the metal case 20 in a state where the insulating spacer 40 is positioned in the module interior space of the metal case 20. It is injected into a fluid phase having fluidity through the , and penetrates into the space between the capacitor module 10 and the metal case 20 and hardens.

3 and 4B , the insulating spacer 40 has a constant thickness and is positioned between the capacitor module 10 and the metal case 20 to provide insulation between the capacitor module 10 and the metal case 20 . perform the function The insulating spacer 40 includes an open wall insulating part 50 that insulates between the walls (bottom wall and sidewall) of the metal case 20 and the capacitor module 10 , and the open wall insulating part 50 has a constant thickness. It includes a plastic insulating member 51 having a and an opening 55 through which the filling resin 30 penetrates.

1 to 4, in the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the insulating spacer 40 is formed on the open wall insulating part 50, and the metal case ( 20), it is configured to further include a closed type (that is, without an opening in the entire 360 degree area so that the flowable filling resin cannot escape) that protrudes higher than the upper surface 22 of the side wall 22).

1 to 4, in the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the filling resin 30 is located higher than the upper surface 22 of the side wall of the metal case 20 It is filled until hardened. A closed type (that is, having no openings in the entire 360 degree area so that the fluid filling resin cannot escape) is formed integrally with the plastic insulating member 51 and the sidewall of the metal case 20 . It is a closed (ie, no opening) sidewall plate portion 61 that is positioned higher than the upper surface (22, a portion of the side wall that forms a 360-degree closed-curve dam, some projecting portions not applicable).

a) The upper side 61a of the closed side wall plate part 61 is the upper side surface 22 of the side wall of the metal case 20, the upper surface of the part that does not have an opening in the entire 360 degree area so that the fluid filling resin cannot escape) located higher

b) The lower side 61b of the closed side wall plate part 61 is located lower than the upper side wall 22 of the metal case 20 . c) The open part 55 of the open wall insulating part 50 is located below the lower side of the closed type (ie, not having an opening part) side wall plate part 61 and the side wall top surface 22 of the metal case 20 ) is lower than

1 and 2, in the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the upper side 61a of the closed sidewall dam 60 is the metal case 20. It is preferable to be formed higher than the upper surface of the sidewall 22 by 3mm to 100mm (the difference in height between the upper surface of the metal case and the upper side of the closed sidewall dam). If the height difference is too small, the effect of capacity increase is insignificant, and if the height difference is too large, it is difficult to achieve the desired purpose of the metal case (improving cooling efficiency). the result was known.

Alternatively, the upper side 61a of the closed sidewall dam 60 is higher than the sidewall upper surface 22 of the metal case 20 by (0.01 to 1) × the height M2 of the metal case 20. can When the height difference is too small, the effect of increasing the capacity is insignificant, and when the height difference is too large, there is a problem in that it is difficult to achieve the desired purpose of the metal case (improving cooling efficiency).

As shown in Figs. 1 and 2, particularly Fig. 6 (a, b), in the capacity increase type metal case molding capacitor according to an embodiment of the present invention, the filling resin 30 is a) a metal case ( 20) is filled to the first water level H1 having a height equal to or lower than the top surface 22 of the side wall, and then is primarily cured. Thereafter, b) secondary filling is performed from the first water level (Level 1) to the second water level (Level 2) having a height equal to or lower than the upper side 61a of the closed side wall plate part 61 . Accordingly, when filling up to the second water level (H2) at once, the resin infiltrates into the opening 55 of the wall insulating part 50 and overflows the upper surface 22 of the side wall of the metal case 20 is prevented.

<1st water level: 1st filling>

In the first resin filling step (S30), the filling resin 30 is filled to the first water level H1 having a height equal to or lower than the top surface 22 of the side wall of the metal case 20 and then cured.

As shown, in the present invention, the lower side 61b of the closed side wall plate part 61 and the uppermost part of the open part 55 of the open wall insulating part 50 may point to the same point, and the closing of the metal case 20 It may be formed 2 ~ 5mm below the top surface 22 of the side wall of the mold.

In one embodiment of the present invention as shown in Fig. 6 (a, b), the lower side 61b of the closed side wall plate part 61 and the uppermost part of the open part 55 of the open wall insulating part 50 point to the same point, and the metal material It was made to be formed 3 mm below the top surface 22 of the closed side wall of the case 20.

In the embodiment, the primary filling level is 1 mm (1-3 mm) higher than the lower side 61b of the closed side wall plate part 61 higher than this, that is, the closed side wall upper surface 22 of the metal case 20. 2 mm (1 to 3 mm) is filled to the lower point (first water level). This is to prevent overflow in the process of moving the oven for primary curing after filling the fluid phase with the primary resin.

<2nd water level: 2nd filling>

In the secondary resin filling step (S40), the upper side 61a of the closed sidewall plate portion 61 of the insulating spacer 40 is higher than the first water level H1 and the top surface 22 of the sidewall of the metal case 20. After the filling resin 30 is filled to the second water level H2 having a height equal to or lower than that of , the resin 30 is cured.

As shown in Figure 6b, in the secondary resin filling step (S40) of the present invention, the filling resin 30 is filled to 1-3 mm below the upper side 61a of the closed side wall plate part 61 of the insulating spacer 40. It is preferable to be This is to prevent overflow in the process of moving the oven for secondary curing after filling the secondary resin in the fluid phase.

It is preferable that the insulating spacer 40 has a filling line indicating the first water level (H1) or the second water level (Level 2) on the inner surface.

3, 4B, and 4C, the second bus bar 2 includes a vertical partition plate 2b, and the first bus bar 1 and the second bus bar 2 are insulating members. There is further provided an overlapping sub-bar overlapping portion 3 with a gap therebetween, and the capacitor element C1 is provided in the rear space of the vertical partition plate 2b (the space above the element electrode surface contact portion of the second bus bar), , it is preferable that the second capacitor element C2 is further provided in the space in front of the vertical partition plate 2b (the space below the element electrode surface contact portion of the first busbar).

As shown in FIG. 5 , in the method for manufacturing a capacity-increasing metal case molding capacitor, the insulating spacer positioning step (S10), the device positioning step (S20), the primary resin filling step (S30), and the secondary resin filling step (S40) ) is included.

In the insulating spacer positioning step ( S10 ), the insulating spacer 40 made of plastic is positioned in the module interior space of the metal case 20 .

In the element positioning step S20, a capacitor module 10 including a capacitor element C1 and a first busbar 1 and a second busbar 2 conducting the electrode surface of the capacitor element C1. is positioned on the metal case 20 through the upper opening surface 20a.

In the first resin filling step (S30), the filling resin 30 is filled to the first water level H1 having a height equal to or lower than the top surface 22 of the side wall of the metal case 20 and then cured.

In the secondary resin filling step (S40), the upper side 61a of the closed sidewall plate portion 61 of the insulating spacer 40 is higher than the first water level H1 and the top surface 22 of the sidewall of the metal case 20. After the filling resin 30 is filled to the second water level H2 having a height equal to or lower than that of , the resin 30 is cured.

As shown in FIGS. 1 to 4 , here, the insulating spacer 40 is formed on the upper part of the open wall insulating part 50 and protrudes higher than the side wall upper surface 22 of the metal case 20. That is, it is preferable to further include a sidewall dam (which does not have an opening in the entire 360 degree area) so that the fluid filling resin cannot escape.

Hereinafter, the capacity increase type metal case molding capacitor of the present invention will be described in more detail.

<Improvements>

1) The size of the metal case is the same as before

2) Existing metal case (182.4L X 121.9W X 42.2H) The insulation spacer height of the capacitor is 45.3mm and the capacitor capacity is 850V High 280uF + Low 90uF

3) To improve the primary capacity increase, to increase the capacity, the metal case size is the same, the capacitor dielectric thickness is the same, the insulation spacer height is 51.4mm, 850V High 354.1uF + Low 123.2uF, High capacity is 26.5%, Low capacity is 36.9% Designed to increase.

4) Secondary capacity increase improvement, to increase capacity, the metal case size is the same, the capacitor dielectric thickness is the same, the insulation spacer height is 55.6mm, 850V High 404.4uF + Low 138.2uF, High capacity 44.4%, Low capacity 53.6% Designed to increase.

5) When the primary capacity increase insulation spacer height is 51.4mm, and the secondary capacity increase improvement product has a 55.6mm insulation spacer height, when the epoxy resin is filled, the epoxy resin overflows due to the low epoxy metal case height.

6) The insulating spacer is in the form of a mesh on 4 sides, but when the insulating spacer is positioned, the mesh (opening part 55 of the open wall insulating part 50) is designed to be formed from 3 mm or less at the top of the metal case, and then the insulating spacer was manufactured.

6) On the inside of the insulation spacer, mark a line that is about 2mm lower from the height of the metal case (top of the side wall of the metal case), and when filling the epoxy resin, fill it up to the height indicated on the height of the insulation spacer, harden the epoxy resin, and then apply the secondary epoxy resin to the height of the insulation spacer After filling to about 3 mm below, the epoxy resin was secondary cured.

7) The epoxy resin did not overflow from the height of the metal case when the epoxy was filled.

8) The reason that the epoxy resin does not overflow is that the mesh hole between the metal case and the insulating spacer is filled with epoxy resin and cured because it is filled and cured only to about 2mm or less from the top height of the metal case during the first epoxy filling. The resin does not overflow.

4. Effects

Capacity (㎌)

Size (mm)
volume (ℓ)
weight
High Cp.
Low Cap.
horizontal
length
_{metal case height
Overall height (insulated spacer)
metal case volume
total volume
(space)
metal case weight
full metal
case weight} weight reduction
280
(before improvement)
90
182.4
121.9
42.2
-
(before improvement)
0.938
-
2307.6
-
-
354.1
(1 plan)
123.2

182.4
121.9
42.2
51.4
(1 plan)
0.938
1.14
2307.6
2807.0
499.3
404.4
(1 plan)
138.2
182.4
121.9
42.2
55.6
(2 eyes)
0.938
1.24
2307.6
3034.9
727.3

Capacity (㎌)

Capacity increase rate (%)
ripple current
Ripple current improvement rate (%)
High Cp.

Low Cap.
High Cp.
Low Cap.
High Cp.
Low Cap.
High Cp.
Low Cap.
280
(before improvement)
90
-
-
125
45
-
-
354.1
(1 plan)
123.2
26.5%
36.9%
158
62
26.5%
36.9%
404.4
(2 eyes)
138.2
44.4%
53.6%
181
69
44.4%
53.6%

1) The capacity of the capacitor is increased without increasing the height of the metal case, that is, the weight of the metal case is about 499.3 g for the primary capacity increase plan,

The secondary capacity increase plan can reduce the weight of the metal case by about 727.3 g and save the material cost of the metal case.

2) The high capacitor capacity and the low capacitor capacity could be increased by 26.5% and 36.9% for the primary capacity increase plan without increasing the metal case weight and size.

3) The high capacitor capacity was able to increase by 44.4% and the low capacitor capacity by 53.6% by the secondary capacity increase plan without increasing the metal case weight and size.

4) Without increasing the weight and size of the metal case, the ripple current in the primary capacity increase was able to increase the capacitor capacity by 26.5% for High and 36.9% for Low.

5) Without increasing the weight and size of the metal case, the ripple current in the secondary capacity increase was able to increase the capacitor capacity by 44.4% and low by 53.6%.

Although the present invention has been described with reference to the above-mentioned preferred embodiments, the scope of the present invention is not limited to these embodiments, and the scope of the present invention is defined by the following claims and is equivalent to the present invention various modifications and variations pertaining to

The reference numerals described in the claims below are merely to aid the understanding of the invention and do not affect the interpretation of the scope of rights.

C1: capacitor element 1: first busbar
1a: first output terminal 2: second bus bar
2a: second output terminal 10: capacitor module
20: metal case 20a: upper opening surface
20b: module built-in space 22: upper surface of side wall
30: filling resin 40: insulating spacer
50: open wall insulation 51: plastic insulation member
55: open part 60: closed sidewall dam
61: closed side wall plate part

Claims (8)

delete delete A first busbar having a capacitor element C1 formed by winding a dielectric film and formed on electrode surfaces on both sides, and a first output terminal 1a electrically connected to one electrode surface of the capacitor element and having a first output terminal 1a on the exposed side (1), a second bus bar (2) electrically connected to the other electrode surface of the capacitor element (C1) and having a second output terminal (2a) on an exposed side, and the first bus bar (1) a capacitor module 10 interposed between the second bus bar 2 and an insulating sheet to insulate the overlapping region;

a metal case 20 having an upper opening 20a into which the capacitor module 10 is inserted and a module internal space 20b in which the capacitor module 10 is placed, and made of a metal material;

In a state where the insulating spacer 40 is positioned in the module interior space of the metal case 20 , it is injected into a fluid phase through the upper opening surface 20a of the metal case 20 , and the capacitor module 10 . and a filling resin 30 that penetrates into the space between the metal case 20 and hardens;

an insulating spacer 40 having a constant thickness and positioned between the capacitor module 10 and the metal case 20 to perform an insulating function between the capacitor module 10 and the metal case 20; Consists of including,

The insulating spacer 40 includes an open wall insulating part 50 that insulates between the wall (bottom wall and sidewall) of the metal case 20 and the capacitor module 10,

The open wall insulating part 50 includes a plastic insulating member 51 having a certain thickness and an opening 55 through which the filling resin 30 penetrates,

The insulating spacer 40 is formed on the upper part of the open wall insulating part 50 and protrudes higher than the upper surface of the side wall of the metal case 20 (22, the side wall portion forming a 360-degree closed-curve dam, some protruding parts are not applicable) It is configured to further include a closed type (that is, not having an opening over the entire 360 degree area so that the flowable filling resin cannot escape) sidewall dam that is

The filling resin 30 is filled and cured to a position higher than the upper surface 22 of the side wall of the metal case 20,

The closed type (that is, it does not have an opening in the entire 360 degree area so that the fluid filling resin cannot escape) is formed integrally with the plastic insulating member 51 and is formed of the metal case 20 . a closed (ie, no opening) sidewall plate portion (61) positioned higher than the sidewall top surface (22);

a) the upper side (61a) of the closed side wall plate part (61) is located higher than the upper side surface (22, ) of the side wall of the metal case (20),
b) the lower side 61b of the closed side wall plate part 61 is located lower than the upper side wall 22 of the metal case 20,
c) the open part 55 of the open wall insulating part 50 is located lower than the lower side of the closed type (ie, not having an open part) side wall plate part 61 and the upper side wall of the metal case 20 ( 22) Capacitance-increasing type metal case molding capacitor, characterized in that it is positioned lower than
4. The method of claim 3,
The upper side 61a of the closed sidewall dam 60 is 3mm to 100mm than the upper surface of the sidewall of the metal case 20 (22, the sidewall portion forming the 360-degree closed curve dam, some protrusions not applicable) The capacity increase type metal case molding capacitor, characterized in that the height difference between the top surface and the upper side of the closed sidewall dam) is higher.
4. The method of claim 3,
The filling resin 30,
a) After filling to the first water level (H1) having a height equal to or lower than the top surface of the side wall of the metal case 20 (22, the side wall portion forming a 360-degree closed-curve dam, some protruding portions are not applicable.) After hardening,
b) by secondary filling from the first water level (H1) to the second water level (H2) having a height equal to or lower than the upper side (61a) of the closed side wall plate part (61);

When filling up to the second water level (H2) at once, the resin infiltrates into the opening 55 of the wall insulating part 50 and overflows the upper surface 22 of the side wall of the metal case 20, characterized in that Capacitance-increasing metal case-molded capacitors.
6. The method of claim 5,
The insulating spacer (40) is a capacity-increasing type metal case molding capacitor, characterized in that it has a filling line informing the first water level (H1) or the second water level (Level 2) on the inner surface.
4. The method of claim 3,
The second bus bar (2) is provided with a vertical partition plate (2b),
The first bus bar (1) and the second bus bar (2) are further provided with an overlapping sub-sub bar overlapping part 3 with an insulating member interposed therebetween,
The capacitor element C1 is provided in the rear space of the vertical partition plate 2b (the space above the element electrode surface contact part of the second bus bar),
A capacity increase type metal case molding capacitor, characterized in that a second capacitor element (C2) is further provided in a space in front of the vertical partition plate (2b) (a space below the element electrode surface contact portion of the first busbar). delete

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