JPH0528789B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for inspecting the quality of electrodes in rectangular chip electronic components such as chip resistors.

(Prior art) A square chip resistor is formed by coating and adhering electrode material to the opposing side end surfaces of a thin strip-shaped substrate on which dividing grooves have been formed in advance, and dividing the substrate at the dividing grooves in a subsequent process. be done. Since the quality of electrode formation affects the reliability of the chip component, a step is provided to inspect the quality of the electrode material after it is applied.

Conventionally, as shown in FIG. 7, a large number of strip-shaped substrates 1 each having an electrode material coated on the opposing side surfaces 3 and 4 are stacked, and the side surfaces A of this stacked substrate group are visually inspected. Therefore, measures were taken to detect uneven coating and electrode defects.

(Problems to be Solved by the Invention) However, with the above-mentioned conventional means, there is a risk that oversights may occur due to the visual inspection.
It was necessary to rearrange the boards, resulting in low productivity.

The present invention aims to provide an apparatus that can efficiently and accurately inspect the quality of electrodes.

(Means for Solving the Problems) The present invention involves sandwiching and passing a strip-shaped substrate having electrodes formed on opposing side end surfaces between a pair of roller electrodes, and applying a voltage between both electrodes. The structure was designed to measure the electrical characteristics between the electrodes.

(Example) FIG. 1 shows the main parts of a chip resistor testing device, and FIG. 2 shows its front side.

The strip-shaped substrate 1 to be inspected has a length corresponding to an appropriate number, and a resistive film is formed on its surface, and a dividing groove 2 is formed to facilitate division in a later process. , and an electrode material is formed by coating on the opposing side end surfaces 3 and 4.

This strip-shaped substrate 1 is sequentially conveyed in a column along a transfer guide 5 by an appropriate means (not shown), and guided between a pair of roller electrodes 6 and 7 disposed opposite to each other.

The roller electrodes 6 and 7 are connected to brackets 8 and 7, respectively.
Conductive material support shafts 10 and 11 rotatably supported by 9
is attached to the top edge of the The brackets 8 and 9 are biased toward each other by springs 12 and 13, so that the side end surfaces 3 and 4 of the strip-shaped substrate 1 are held between the roller electrodes 6 and 7 with appropriate pressure. has been done.

Further, the lower ends of the support shafts 10 and 11 are connected to the measuring instrument 14.
The measuring device 11 applies an appropriate voltage to both roller electrodes 6 and 7 to measure their conductivity.

Therefore, if the electrode material is appropriately applied and formed on the portions sandwiched between the roller electrodes 6 and 7, a current corresponding to the applied voltage and the resistance value of the resistive film is measured. On the other hand, if the applied electrode at the clamping point is missing, the roller electrodes 6 and 7 are insulated, so the measurement is made as a non-conducting state between the two electrodes.
Missing of the electrode is detected.

Alternative Example 1 As shown in FIGS. 3 and 4, the roller electrodes 6, 7 are laminated with a plurality of thin electrode pieces 6a, 6b, 6c, an electrode piece 7a, 7b and 7c may each be configured. If a suitable voltage is applied independently between each electrode piece facing each other, local missing of the applied electrode in the thickness direction of the strip-shaped substrate 1 can be detected.

Alternative Example 2 As shown in FIGS. 5 and 6, the roller electrodes 6 and 7 are distributed and arranged along the substrate transfer direction, and the arranged electrode pieces 6a, 7a, 6b, 7
Even if the configuration is such that the substrate clamping heights of electrodes b, 6c, and 7c are made different, it is possible to detect local missing electrodes in the thickness direction of the substrate. In this case, each electrode piece 6
Even if the thickness of the electrodes a, 7a, . . . itself is large, only the width of the substrate-clamping periphery can be made extremely small, making it easier to detect minute electrode defects.

Although the above-mentioned embodiment has been explained by taking a chip resistor as an example, the present invention can also be applied to inspecting the quality of electrodes of chip electronic components such as rectangular chip capacitors.

(Effects) As explained above, according to the present invention, electrode inspection on the side surface of the substrate can be performed while continuously transporting the strip-shaped substrate, greatly improving work efficiency and facilitating the development of automation. Summer.

Furthermore, since the electrode quality is determined by electrical measurement, the inspection accuracy is significantly higher than that of visual inspection, and quality reliability can be improved.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing the main parts of the device of the present invention;
The figure is a partially cutaway front view. FIG. 3 is a perspective view of a main part of another embodiment, and FIG. 4 is a partially enlarged view thereof. FIG. 5 is a perspective view of a main part of still another embodiment, and FIG. 6 is a partially enlarged view thereof. FIG. 7 is a perspective view showing a board inspection state in a conventional inspection means. 1... Band-shaped substrate, 3, 4... Side end surface, 6, 7
...Roller electrode.

Claims (1)

[Scope of Claims] 1. A pair of roller electrodes that sandwich and pass a band-shaped substrate having electrodes formed on opposing side end surfaces, and a voltage is applied between both roller electrodes to determine the electrical characteristics between the electrodes. An inspection device for square chip electronic components, characterized in that it is equipped with means for measuring . 2. The inspection device for rectangular chip electronic components according to claim 1, wherein the roller electrode is divided so as to act on different locations in the thickness direction of the strip-shaped substrate.