JPH05283147A - Thick-film resistance heating element - Google Patents
Thick-film resistance heating elementInfo
- Publication number
- JPH05283147A JPH05283147A JP10874492A JP10874492A JPH05283147A JP H05283147 A JPH05283147 A JP H05283147A JP 10874492 A JP10874492 A JP 10874492A JP 10874492 A JP10874492 A JP 10874492A JP H05283147 A JPH05283147 A JP H05283147A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- thick
- layer
- film resistor
- resistance heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Resistance Heating (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば複写機のトナ
ー定着等に用いられる定着ヒーターに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixing heater used for toner fixing of a copying machine.
【０００２】[0002]
【従来の技術】電子式複写機のトナー定着等に用いられ
る厚膜抵抗発熱体として、近年、細長いセラミック等の
絶縁基板の表面に銀・パラジウム合金粉末等のペースト
を塗布焼成して細長いライン状の厚膜抵抗発熱体を形成
したものが実用化されている。このライン状の厚膜抵抗
発熱体の両端に電圧を印加し、厚膜抵抗発熱体の発熱で
トナーを定着するものである。2. Description of the Related Art In recent years, as a thick film resistance heating element used for toner fixing of an electronic copying machine, a long thin line-shaped heater is formed by applying a paste of silver / palladium alloy powder or the like on the surface of an insulating substrate such as a long thin ceramic. The thick-film resistance heating element is used in practice. A voltage is applied to both ends of the line-shaped thick film resistance heating element to heat the thick film resistance heating element to fix the toner.
【０００３】[0003]
【発明が解決しようとする課題】この厚膜抵抗発熱体
は、電源回路との接続は、特別仕様のソケットを設け、
基板にクリップのような弾性金属片で導通接触を図るも
のである。この場合、電源回路とソケットはリード線に
より接続されているが、ヒーターそのものには、リード
線は接続されていない。This thick film resistance heating element is provided with a special socket for connection with the power supply circuit.
An elastic metal piece such as a clip is used for conducting contact with the substrate. In this case, the power circuit and the socket are connected by a lead wire, but the heater itself is not connected by a lead wire.
【０００４】しかし、このような特別仕様のソケット
は、原価低減の障害になっており、このためリード線を
直接ヒーターに接続する試みがなされている。この場
合、定着ヒーターには瞬間的に最大１２Ａの大電流が流
れるので、通常の電気回路のようにリード線を厚膜抵抗
発熱体に半田付けをすると、半田の酸化劣化のため接合
部がはずれる虞があり、この場合、漏電事故につながる
危険がある。また、リード線を厚膜抵抗発熱体に溶接す
ると、厚膜抵抗体層が溶融してしまい、確実に接続がで
きないという問題が生じてしまう。However, such a special-purpose socket is an obstacle to cost reduction, and therefore, attempts have been made to connect the lead wire directly to the heater. In this case, a large current of maximum 12 A instantaneously flows through the fixing heater. Therefore, when the lead wire is soldered to the thick film resistance heating element as in an ordinary electric circuit, the joint part comes off due to the oxidation deterioration of the solder. In this case, there is a risk of causing an electric leakage accident. Further, when the lead wire is welded to the thick film resistance heating element, the thick film resistor layer is melted, which causes a problem that a reliable connection cannot be made.
【０００５】そこで本発明の目的とするところは、リー
ド線が電気的かつ機械的に確実に接続された厚膜抵抗発
熱体を提供することを目的とする。Therefore, it is an object of the present invention to provide a thick film resistance heating element in which lead wires are securely connected electrically and mechanically.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、請求項１ないし請求項５に記載の厚膜抵抗発熱体
は、基板表面に形成された厚膜抵抗体層と、この厚膜抵
抗体層の両通電部端に形成された厚膜電極層と、この厚
膜電極層に高温半田で半田付けされた一対の電極端子
と、電極端子に接続された外部リード線を具備してい
る。上記厚膜電極層は、半田層と厚膜抵抗体層との間の
構成成分の拡散を防止する絶縁層を構成する。In order to achieve the above object, a thick film resistance heating element according to claim 1 is provided with a thick film resistor layer formed on a surface of a substrate and the thick film resistor layer. A thick film electrode layer formed on both ends of the current-carrying portion of the resistor layer, a pair of electrode terminals soldered to the thick film electrode layer with high-temperature solder, and an external lead wire connected to the electrode terminals are provided. There is. The thick film electrode layer constitutes an insulating layer that prevents diffusion of constituent components between the solder layer and the thick film resistor layer.
【０００７】[0007]
【作用】本発明の厚膜抵抗発熱体は、リード線と強固に
接続された電極端子が厚膜抵抗体層に電気的に接続され
た厚膜電極層に接続されているので、厚膜電極層が半田
層と厚膜抵抗体層との間の構成成分の拡散を防止し、厚
膜抵抗体層の溶融を防止する絶縁層を構成している。こ
れにより、単純に厚膜抵抗体層に電極端子を高温半田付
けした場合に生じる、半田層と厚膜抵抗体層との間の構
成成分の拡散と厚膜抵抗体層の溶融という欠点を起こさ
ずに高温半田を可能にし、その結果リード線を電気的か
つ機械的に確実に厚膜抵抗発熱体に接続できる。In the thick film resistance heating element of the present invention, since the electrode terminal firmly connected to the lead wire is connected to the thick film electrode layer electrically connected to the thick film resistor layer, the thick film electrode The layer constitutes an insulating layer which prevents diffusion of constituent components between the solder layer and the thick film resistor layer and prevents melting of the thick film resistor layer. This causes the drawbacks such as diffusion of constituent components between the solder layer and the thick film resistor layer and melting of the thick film resistor layer, which occurs when the electrode terminals are simply soldered to the thick film resistor layer at high temperature. It enables high-temperature soldering without using it, so that the lead wire can be electrically and mechanically reliably connected to the thick-film resistance heating element.
【０００８】[0008]
【実施例】以下図１ないし図５を参照して本発明の第一
の実施例を説明する。図１は第一の実施例の厚膜抵抗発
熱体の平面図、図２は図１中のＡ−Ａ線の部分断面図、
図３は電極端子の斜視図、図４は電極端子とリード線の
接続状態を示す斜視図、図５は図４中のＢ−Ｂ線の断面
図である。基板（１）は長形平板（約２７０mm×７mm×
１mm程度の大きさ）のアルミナセラミックス（Ａｌ２Ｏ
３）からなる。 基板（１）の表面には帯状に厚膜抵抗
体層（３）が形成されている。厚膜抵抗体層（３）は導
電性のペースト状塗料（材質は銀パラジウム合金（Ａｇ
／Ｐｄ）、又はこれに酸化ルテニウムを加えた金属（Ａ
ｇ／Ｐｄ＋ＲｕＯ2）に結着剤としてのガラス成分を混
合したもの）を基板（１）上にスクリーン印刷・塗布
し、その後焼成することにより厚さ約１０μｍに形成し
たものである。焼成により有機成分は蒸発し、導電性を
生む金属成分と結着剤として働くガラス成分が残る。こ
の合金に含まれるパラジウムが電気的な抵抗要素とな
り、その比率によって抵抗率が調節される。本実施例で
は、３４オーム［Ω］の抵抗値を有し、１００Ｖの電圧
印加により３Ａの電流が流れ、３００Ｗの発熱量とな
る。厚膜抵抗体層（３）の両端は幅広に形成されており
電極層接続部（５）を構成する。厚膜抵抗体層（３）の
電極層接続部（５）を除いた帯状部分が発熱する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a plan view of a thick film resistance heating element of the first embodiment, FIG. 2 is a partial sectional view taken along the line AA in FIG.
3 is a perspective view of the electrode terminal, FIG. 4 is a perspective view showing a connection state of the electrode terminal and the lead wire, and FIG. 5 is a cross-sectional view taken along the line BB in FIG. The board (1) is a long flat plate (about 270 mm x 7 mm x
Alumina ceramics (size of about 1 mm) (Al2O
It consists of 3). A band-shaped thick film resistor layer (3) is formed on the surface of the substrate (1). The thick film resistor layer (3) is a conductive paste-like paint (made of silver-palladium alloy (Ag
/ Pd) or a metal obtained by adding ruthenium oxide thereto (A
g / Pd + RuO2) mixed with a glass component as a binder) is screen-printed and applied on the substrate (1) and then baked to form a thickness of about 10 μm. The firing evaporates the organic component, leaving a metal component that produces conductivity and a glass component that functions as a binder. Palladium contained in this alloy serves as an electric resistance element, and the resistivity is adjusted by the ratio. In this embodiment, the resistance value is 34 Ω [Ω], the current of 3 A flows by the voltage application of 100 V, and the heat generation amount is 300 W. Both ends of the thick film resistor layer (3) are formed wide so as to form an electrode layer connecting portion (5). The strip-shaped part of the thick film resistor layer (3) excluding the electrode layer connecting part (5) generates heat.
【０００９】厚膜抵抗体層（３）の両端の電極層接続部
（５）の表面および、厚膜抵抗体層（３）が形成されて
いない基板（１）の露出している基板（１）両端表面に
は外部電極（電極端子（１１））と接続をするための厚
膜電極層（７）が各々形成されている。第２図は、この
うち一方のみを図示したものであるが、他方も同一の構
成を有している。この厚膜電極層（７）は、ニッケルを
主成分とする厚膜ペースト（ニッケル粉末とガラス粉末
をペースト状にしたもの）を、電極層接続部（５）を含
めて厚膜抵抗体層（３）が形成された後（抵抗発熱体ペ
ーストを印刷塗布・焼成後）、電極層接続部（５）上お
よび厚膜抵抗体層（３）が形成されていない基板（１）
が露出している基板（１）両端の表面上にスクリーン印
刷・塗布し、その後焼成することで厚さ約１０μｍに形
成される。このニッケルが導電性を作り、ガラス成分が
溶けて結着剤として機能する。The surface of the electrode layer connecting portion (5) at both ends of the thick film resistor layer (3) and the exposed substrate (1) of the substrate (1) on which the thick film resistor layer (3) is not formed. ) Thick film electrode layers (7) for connecting to external electrodes (electrode terminals (11)) are formed on both end surfaces. FIG. 2 shows only one of them, but the other has the same structure. The thick film electrode layer (7) is made of a thick film paste containing nickel as a main component (a paste made of nickel powder and glass powder), including the electrode layer connecting portion (5). Substrate (1) on which the electrode layer connection part (5) and thick film resistor layer (3) are not formed after (3) is formed (after the resistance heating element paste is applied by printing and firing).
The surface of both ends of the substrate (1) where is exposed is screen-printed and applied, and then baked to form a thickness of about 10 μm. This nickel creates conductivity and the glass component melts to function as a binder.
【００１０】上記厚膜抵抗体層（３）の帯状部分の表面
は、電気絶縁性の高いガラス質によってコーティングさ
れて、絶縁ガラス被覆層（９）が形成されている。この
絶縁ガラス被覆層（９）はほう珪酸ガラスを主成分とし
ており、例えば日本電気ガラス（株）製の絶縁ガラスペ
ーストＰＬＳ３３１０をスクリーン印刷により塗布し、
その後焼成して厚さ約１０μｍに形成したものである。
ＰＬＳ３３１０を用いた絶縁ガラスは厚さ３５μｍの場
合に直流電圧を印加する条件で電気絶縁耐圧が２０００
Ｖを有する。絶縁ガラスペーストＰＬＳ３３１０は厚膜
抵抗体層（３）形成後に印刷塗布・焼成される。The surface of the strip-shaped portion of the thick film resistor layer (3) is coated with glass having a high electric insulation property to form an insulating glass coating layer (9). This insulating glass coating layer (9) is mainly composed of borosilicate glass, for example, an insulating glass paste PLS3310 manufactured by Nippon Electric Glass Co., Ltd. is applied by screen printing,
After that, it is baked to have a thickness of about 10 μm.
The insulating glass using PLS3310 has an electric breakdown voltage of 2000 under the condition of applying a DC voltage when the thickness is 35 μm.
Have V. The insulating glass paste PLS3310 is applied by printing and baked after the thick film resistor layer (3) is formed.
【００１１】絶縁ガラス被覆層（９）は厚膜抵抗体層
（３）の帯状部分だけでなく厚膜電極層（７）の境界部
分まで塗布されている。これは厚膜抵抗体層（３）の帯
状部分と電極層接続部（５）の境界付近の温度勾配が急
なために、この付近の厚膜抵抗体層（３）が断線する可
能性が高いが、この部分を絶縁ガラス被覆層（９）で覆
うことにより、この危険性を低減している。また厚膜電
極層（７）の境界付近（図１において実線ａが厚膜電極
層（７）の境界を表す）は発熱の影響で剥離しやすい
が、この部分を絶縁ガラス被覆層（９）で覆うことによ
り、この危険性も低減している。なお、図１において破
線ｂ、破線ｃはそれぞれ絶縁ガラス被覆層（９）の境界
線と厚膜抵抗体層（３）の境界線を意味している。The insulating glass coating layer (9) is applied not only to the strip portion of the thick film resistor layer (3) but also to the boundary portion of the thick film electrode layer (7). This is because the temperature gradient near the boundary between the strip-shaped portion of the thick film resistor layer (3) and the electrode layer connecting portion (5) is steep, so that the thick film resistor layer (3) near this may be broken. Although high, this risk is reduced by covering this part with an insulating glass coating layer (9). Further, the vicinity of the boundary of the thick film electrode layer (7) (the solid line a in FIG. 1 represents the boundary of the thick film electrode layer (7)) is easily peeled off due to the effect of heat generation, but this portion is separated by the insulating glass coating layer (9). This risk is also reduced by covering with. In FIG. 1, the broken line b and the broken line c mean the boundary line of the insulating glass coating layer (9) and the boundary line of the thick film resistor layer (3), respectively.
【００１２】厚膜電極層（７）が直接基板（１）上に塗
布形成されている領域に電極端子（１１）が高温半田付
けの一種である銀ろうを介して固定されている。電極端
子（１１）は長方形の金属平板部（１１ａ）にコの字状
のリード線挟持爪部（１１ｂ）からなっており、リード
線挟持爪部（１１ｂ）は金属平板部（１１ａ）に予め溶
接接続されている。電極端子（１１）は例えばニッケル
板等で形成されている。電極端子（１１）が厚膜電極層
（７）に接続される前に、電源回路（図示せず）に接続
されるリード線（１３）がリード線挟持爪部（１１ｂ）
に挟持固定される。リード線（１３）のリード線挟持爪
部（１１ｂ）に挟持固定されている部分は、リード線挟
持爪部（１１ｂ）に溶接固定され、その他の部分は、絶
縁被覆されている。The electrode terminals (11) are fixed to the region where the thick film electrode layer (7) is directly formed on the substrate (1) through silver solder which is a kind of high temperature soldering. The electrode terminal (11) is composed of a rectangular metal flat plate part (11a) and a U-shaped lead wire holding claw part (11b). The lead wire holding claw part (11b) is formed on the metal flat plate part (11a) in advance. Welded and connected. The electrode terminal (11) is formed of, for example, a nickel plate or the like. Before the electrode terminal (11) is connected to the thick film electrode layer (7), the lead wire (13) connected to the power supply circuit (not shown) has a lead wire holding claw portion (11b).
It is clamped and fixed to. A portion of the lead wire (13) that is sandwiched and fixed to the lead wire sandwiching claw portion (11b) is welded and fixed to the lead wire sandwiching claw portion (11b), and the other portions are insulated and coated.
【００１３】上記のように予めリード線（１３）が接続
された電極端子（１１）は銀ろう層（１５）で厚膜電極
層（７）に接続固定されている。銀ろう層（１５）は電
気的導通と機械的固定の両方の機能を有する。銀ろう自
体は周知の技術であるが、例えば、ナイス（株）製Ｓｉ
ｌ１０８などがある。このものは銀５６ｗｔ％、銅２０
ｗｔ％、亜鉛１７ｗｔ％、錫５ｗｔ％に若干の微量成分
が添加されたものである。The electrode terminal (11) to which the lead wire (13) is connected in advance as described above is connected and fixed to the thick film electrode layer (7) by the silver brazing layer (15). The silver brazing layer (15) has the functions of both electrical conduction and mechanical fixing. Although silver brazing itself is a well-known technique, for example, Si
l108 and the like. This is silver 56wt%, copper 20
It is composed of wt%, zinc 17 wt% and tin 5 wt% with some minor components added.
【００１４】以上の構成を有する厚膜抵抗発熱体は、リ
ード線と強固に接続された電極端子が厚膜抵抗体層
（３）と銀ろう（１５）で電気的に、かつ強い接着力で
接続されている。そしてニッケルを主成分とする厚膜電
極層（７）が銀ろう層（１５）の銀を溶かし込まないの
で厚膜抵抗体層（３）の銀成分の拡散を防止するととも
に、銀成分の拡散の結果銀ろうが厚膜抵抗体層（３）を
溶かしてしまうという欠点を解消できる。In the thick film resistance heating element having the above construction, the electrode terminal firmly connected to the lead wire is electrically and strongly bonded by the thick film resistor layer (3) and the silver solder (15). It is connected. Since the thick film electrode layer (7) containing nickel as a main component does not dissolve the silver in the silver brazing layer (15), the silver component in the thick film resistor layer (3) is prevented from diffusing and the silver component diffusing. As a result, the drawback that the silver solder melts the thick film resistor layer (3) can be solved.
【００１５】さらに、厚膜電極層（７）はニッケルを主
成分としているが、ニッケルは高温半田付け作業時、表
面が酸化しにくく、従って例えば銅ペーストやアルミペ
ースト、鉄ペーストを使用したときに表面が酸化するこ
とで接続不良を起こしてしまうような欠点がなく、電気
的な接続を確実に行える。しかし、表面の酸化という欠
点に目をつむるならば、銅ペーストやアルミペースト、
鉄ペーストも使用可能である。Further, the thick film electrode layer (7) contains nickel as a main component, but the surface of nickel is difficult to oxidize during high temperature soldering work. Therefore, for example, when copper paste, aluminum paste or iron paste is used. There is no defect that a connection failure occurs due to oxidation of the surface, and electrical connection can be reliably performed. However, if you pay attention to the drawback of surface oxidation, copper paste or aluminum paste,
Iron paste can also be used.
【００１６】本発明は上記実施例に限定されない。例え
ば、図６のように電極層接続部（５）が基板（１）端部
まで印刷塗布・形成されて、この電極層接続部（５）上
に厚膜電極層（７）を形成しても良い。すなわち、第１
の実施例は発熱体にＡｇが拡散し、抵抗値が上がること
を防止するという効果を併せ持つことを目的としている
が、この効果をねらわなければ、図６のような構成でも
良い。The present invention is not limited to the above embodiment. For example, as shown in FIG. 6, the electrode layer connecting portion (5) is applied by printing to the end portion of the substrate (1), and the thick film electrode layer (7) is formed on the electrode layer connecting portion (5). Is also good. That is, the first
The purpose of this example is to have an effect of preventing Ag from diffusing into the heating element and increasing the resistance value, but the structure shown in FIG. 6 may be used if this effect is not aimed.
【００１７】また、上記実施例では、高温半田層（１
５）が銀ろうで構成されているが、金（Ａｕ）ろうであ
ってもよく、この場合は厚膜抵抗体層（３）が銀・パラ
ジウム（Ａｇ／Ｐｄ）合金であると、相互拡散が生じる
ので本発明のような拡散防止機能を有する厚膜電極層
（７）が有効である。In the above embodiment, the high temperature solder layer (1
Although 5) is composed of silver braze, it may be gold (Au) braze. In this case, if the thick film resistor layer (3) is a silver-palladium (Ag / Pd) alloy, mutual diffusion occurs. Therefore, the thick film electrode layer (7) having a diffusion preventing function as in the present invention is effective.
【００１８】さらに本発明は種々変形可能である。例え
ば、リード線先端の非被覆部が十分に広い面積をもって
いて、特別な部材を必要とせずに電極端子として導電性
銀ろう（１５）を介して厚膜電極層（７）と接続できれ
ば、本発明は適用可能である。この場合、リード線先端
に続く部分に非導電性銀ろう（１７）を塗布して、リー
ド線先端と厚膜電極層との固定を強固にすることとな
る。リード線先端とこれに続く部分が電極端子を兼用す
る。Further, the present invention can be variously modified. For example, if the uncoated portion at the tip of the lead wire has a sufficiently large area and can be connected to the thick film electrode layer (7) through the conductive silver solder (15) as an electrode terminal without requiring a special member, The invention is applicable. In this case, the non-conductive silver solder (17) is applied to the portion following the tip of the lead wire to strengthen the fixation between the tip of the lead wire and the thick film electrode layer. The tip of the lead wire and the portion following it also serve as electrode terminals.
【００１９】さらに上記２つの実施例とも、基板の片面
のみに各種厚膜層や電極端子が形成されているが、両面
を利用しても良く、さらに基板両端に電極端子が形成さ
れているものに限定されず、基板の片端の表裏両面に２
つの電極端子が形成されたものであってもよい。さら
に、厚膜抵抗体層（３）が基板中央付近で枝分かれし
て、その結果、片側表面に複数の電極端子が並んで配置
されたような抵抗発熱体にも本発明は適用可能である。Further, in each of the above-mentioned two embodiments, various thick film layers and electrode terminals are formed on only one side of the substrate, but both sides may be used, and electrode terminals are formed on both ends of the substrate. However, it is not limited to 2
It may be formed with one electrode terminal. Further, the present invention is applicable to a resistance heating element in which the thick film resistor layer (3) is branched near the center of the substrate, and as a result, a plurality of electrode terminals are arranged side by side on one surface.
【００２０】さらに本発明は、基板（１）をセラミック
とすることに限定されず、金属やポリイミド樹脂のよう
な、耐熱性の高い合成樹脂部材を用いることができる。
金属を用いる場合には、厚膜抵抗体層との間に絶縁下地
層が必要となることは勿論である。また形状に付いても
平板であることには限定されない。また、厚膜抵抗体層
（３）の発熱部分が直線である必要もなく、用途も、定
着用ヒーター以外に応用可能である。Further, the present invention is not limited to the substrate (1) made of ceramic, and a synthetic resin member having high heat resistance such as metal or polyimide resin can be used.
When using a metal, it goes without saying that an insulating underlayer is required between the metal and the thick film resistor layer. Further, the shape is not limited to the flat plate. Further, the heating portion of the thick film resistor layer (3) does not need to be a straight line, and the application can be applied to other than the fixing heater.
【００２１】また、電極端子（１１）の構造も上記実施
例に限定されない。電極端子が平板でなくても、銀ろう
が使用可能なものは、本発明が適用可能である。また、
リード線（１３）と電極端子（１１）とは、溶接により
接続されているものに限らず、単なるかしめ止めされて
いるものでも良く、逆に上記実施例のようなかしめ止め
をせず、溶接だけで固定されているものでも良い。Further, the structure of the electrode terminal (11) is not limited to the above embodiment. The present invention is applicable to the case where silver solder can be used even if the electrode terminals are not flat plates. Also,
The lead wire (13) and the electrode terminal (11) are not limited to being connected by welding, but may be simply caulked, and conversely, they are not caulked as in the above embodiment, and are welded. It may be fixed only.
【００２２】[0022]
【発明の効果】本発明は、単純に厚膜抵抗体層に電極端
子を高温半田付けした場合に生じる、半田層と厚膜抵抗
体層との間の構成成分の拡散という欠点を起こさず、従
って拡散によって生ずる厚膜抵抗体層の溶融という欠点
も起こさず、高温半田を可能にし、その結果リード線を
電気的かつ機械的に確実に厚膜抵抗発熱体に接続でき
る。The present invention does not cause the drawback of diffusion of constituent components between the solder layer and the thick film resistor layer, which occurs when the electrode terminals are simply soldered to the thick film resistor layer at high temperature. Therefore, the disadvantage of melting the thick film resistor layer caused by diffusion does not occur, and high temperature soldering is possible, and as a result, the lead wire can be electrically and mechanically reliably connected to the thick film resistor heating element.
【図１】本発明の第１の実施例に係る抵抗発熱体の平面
図FIG. 1 is a plan view of a resistance heating element according to a first embodiment of the present invention.
【図２】図１中のＡ−Ａ線における部分断面図FIG. 2 is a partial cross-sectional view taken along the line AA in FIG.
【図３】第１の実施例に使用される電極端子の斜視図FIG. 3 is a perspective view of an electrode terminal used in the first embodiment.
【図４】図３示の電極端子にリード線を接続した状態を
示す斜視図FIG. 4 is a perspective view showing a state in which lead wires are connected to the electrode terminals shown in FIG.
【図５】図４中Ｂ−Ｂ線における断面図5 is a sectional view taken along line BB in FIG.
【図６】本発明の第２の実施例に係る抵抗発熱体の図２
に対応する部分断面図FIG. 6 is a view of a resistance heating element according to a second embodiment of the present invention.
Partial sectional view corresponding to
１・・・基板、 ３・・・厚膜抵抗体層、 ５・・・電
極層接続部 ７・・・厚膜電極層、 ９・・・絶縁ガラス被覆層、
１１・・・電極端子 １３・・・リード線、 １５・・・導電性銀ろうDESCRIPTION OF SYMBOLS 1 ... Substrate, 3 ... Thick film resistor layer, 5 ... Electrode layer connection part 7 ... Thick film electrode layer, 9 ... Insulating glass coating layer,
11 ... Electrode terminal 13 ... Lead wire, 15 ... Conductive silver solder
Claims (5)
体層と、この厚膜抵抗体層の両通電部端に形成された厚
膜電極層と、この厚膜電極層に高温半田で半田付けされ
た一対の電極端子と、電極端子に接続された外部リード
線を具備し、上記厚膜電極層は、半田層と厚膜抵抗体層
との間の構成成分の拡散を防止する絶縁層の働きを有す
ることを特徴とする厚膜抵抗発熱体。1. A substrate, a thick film resistor layer formed on the surface of the substrate, thick film electrode layers formed on both ends of the current conducting portion of the thick film resistor layer, and high temperature solder on the thick film electrode layer. The thick film electrode layer prevents diffusion of constituent components between the solder layer and the thick film resistor layer. A thick film resistance heating element having a function of an insulating layer.
の融点よりも高いことを特徴とする請求項１の厚膜抵抗
発熱体。2. The thick film resistance heating element according to claim 1, wherein the oxidation temperature of the thick film electrode layer is higher than the melting point of the high temperature solder.
ろうが主成分であり、厚膜電極層はニッケルが主成分で
あることを特徴とする請求項２の厚膜抵抗発熱体。3. The thick film resistance heating according to claim 2, wherein the thick film resistor layer contains silver, the high temperature solder contains silver solder as a main component, and the thick film electrode layer contains nickel as a main component. body.
とを特徴とする請求項１の厚膜抵抗発熱体。4. The thick film resistance heating element according to claim 1, wherein the electrode terminal and the lead wire are welded to each other.
ことを特徴とする請求項１の厚膜抵抗発熱体。5. The thick film resistance heating element according to claim 1, wherein the tip of the lead wire also serves as an electrode terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10874492A JPH05283147A (en) | 1992-03-31 | 1992-03-31 | Thick-film resistance heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10874492A JPH05283147A (en) | 1992-03-31 | 1992-03-31 | Thick-film resistance heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05283147A true JPH05283147A (en) | 1993-10-29 |
Family
ID=14492417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10874492A Pending JPH05283147A (en) | 1992-03-31 | 1992-03-31 | Thick-film resistance heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05283147A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002203667A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | Heating element and card leader using the same |
| JP2004259703A (en) * | 2004-04-07 | 2004-09-16 | K-Tech Devices Corp | Resistive heating element |
| JP2005039178A (en) * | 2003-06-30 | 2005-02-10 | Kyocera Corp | Piezoelectric actuator and its manufacturing method and liquid discharge device |
| US11206870B1 (en) | 2020-06-30 | 2021-12-28 | Japan Tobacco Inc. | Non-combustion suction device |
-
1992
- 1992-03-31 JP JP10874492A patent/JPH05283147A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002203667A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | Heating element and card leader using the same |
| JP4631166B2 (en) * | 2000-12-28 | 2011-02-16 | パナソニック株式会社 | Heating element and card reader using the same |
| JP2005039178A (en) * | 2003-06-30 | 2005-02-10 | Kyocera Corp | Piezoelectric actuator and its manufacturing method and liquid discharge device |
| JP4593905B2 (en) * | 2003-06-30 | 2010-12-08 | 京セラ株式会社 | Piezoelectric actuator, manufacturing method thereof, and liquid ejection device |
| JP2004259703A (en) * | 2004-04-07 | 2004-09-16 | K-Tech Devices Corp | Resistive heating element |
| US11206870B1 (en) | 2020-06-30 | 2021-12-28 | Japan Tobacco Inc. | Non-combustion suction device |
| WO2022003802A1 (en) * | 2020-06-30 | 2022-01-06 | 日本たばこ産業株式会社 | Non-combustion type suction device |
| JPWO2022003802A1 (en) * | 2020-06-30 | 2022-01-06 |
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