JPH05277951A - Manufacture of diamond roll for correcting grinding wheel - Google Patents

Manufacture of diamond roll for correcting grinding wheel

Info

Publication number
JPH05277951A
JPH05277951A JP8054091A JP8054091A JPH05277951A JP H05277951 A JPH05277951 A JP H05277951A JP 8054091 A JP8054091 A JP 8054091A JP 8054091 A JP8054091 A JP 8054091A JP H05277951 A JPH05277951 A JP H05277951A
Authority
JP
Japan
Prior art keywords
diamond
diamond grains
roll
arrangement
plate member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8054091A
Other languages
Japanese (ja)
Inventor
Masato Kitajima
正人 北島
Koichi Isomura
公一 磯村
Yoshinobu Yotsui
善信 四井
Masahiro Ido
雅裕 井土
Akira Suzuki
旭 鈴木
Shinji Shibata
真司 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Van Moppes Ltd
Toyoda Koki KK
Original Assignee
Toyoda Van Moppes Ltd
Toyoda Koki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Van Moppes Ltd, Toyoda Koki KK filed Critical Toyoda Van Moppes Ltd
Priority to JP8054091A priority Critical patent/JPH05277951A/en
Publication of JPH05277951A publication Critical patent/JPH05277951A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To manufacture a diamond roll for correcting a grinding wheel wherein distribution of diamond grains is uniformalized and forms desired arrangement. CONSTITUTION:The annular recessed part 4 of a mold member 3 on which a base part A is placed is filled with a bond material C and diamond grains B. In filling, the diamond grains are fitted in small holes 7 formed in a properly arranged and distributed state in a plate member 6 for arrangement of diamond grains placed in the annular recessed part, the diamond grains being positioned therein. Thereafter, the bond material and the diamond grains are powder- molded and integrally sintered togetherwith a base part. This method brings diamond grains into a desired distribution state through proper selection of distribution arrangement and the size of small holes in the plate member for arrangement.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、砥石修正用ダイヤモ
ンドロールの製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a diamond roll for whetstone correction.

【0002】[0002]

【従来の技術】従来の技術の砥石修正(ツルーイング又
はドレッシング)用ダイヤモンドロールの製造方法にお
いては、図3に示すように型部材3とダイヤモンドロー
ルのベース部Aとにより形成された環状凹所4、図示の
例では断面が四辺形の環状凹所にダイヤモンド粒Bとボ
ンド材Cとの混合粉を充填し、環状凹所4に対応する押
圧部材5で加圧圧縮して、ダイヤモンド部Dを粉末成形
する。そのダイヤモンド部Dをベース部A共々焼成して
一体化し、更にダイヤモンド部Dを成形加工して砥石修
正用ダイヤモンドロールを製造する。
2. Description of the Related Art In a conventional method for manufacturing a diamond roll for modifying a grinding stone (truing or dressing), an annular recess 4 formed by a mold member 3 and a base portion A of the diamond roll 4 as shown in FIG. In the illustrated example, a ring-shaped recess having a quadrangular cross section is filled with a mixed powder of diamond grains B and a bonding material C, and is pressed and compressed by a pressing member 5 corresponding to the ring-shaped recess 4 to form a diamond portion D. Powder molding. The diamond part D is fired together with the base part A to be integrated, and the diamond part D is further shaped to manufacture a diamond roll for grinding wheel correction.

【0003】[0003]

【発明が解決しようとする課題】従来の技術による砥石
修正用ダイヤモンドロールの製造方法においては、粉末
成形体中のダイヤモンド粒Aの分布が無作為であって均
一でないため、その結果のダイヤモンドロールをもっ
て、砥石をツルーイング又はドレッシングすると、次の
ような問題が生じる。
In the conventional method for producing a diamond roll for whetstone correction, since the distribution of the diamond grains A in the powder compact is random and not uniform, the resulting diamond roll is used. When truing or dressing a grindstone, the following problems occur.

【0004】(1)研削抵抗が安定しない。従って、研
削焼けや研削割れ等が不安定に発生する。 (2)ドレシングインターバルが安定しない。 (3)研削面の性状が悪い。 この発明は、ダイヤモンド粒Aの分布が均一な砥石修正
用ダイヤモンドロールを製造することを目的とする。
(1) The grinding resistance is not stable. Therefore, grinding burn, grinding crack, and the like are unstable. (2) The dressing interval is not stable. (3) The quality of the ground surface is poor. An object of the present invention is to manufacture a diamond roll for whetstone correction in which the distribution of diamond grains A is uniform.

【0005】[0005]

【課題を解決するための手段】この発明の砥石修正用ダ
イヤモンドロール製造方法は、ベース部が置かれた型部
材の成形凹所にボンド材とダイヤモンド粒が充填され、
その充填に際し、ダイヤモンド粒は、成形凹所内に置か
れたダイヤ粒配列用板部材に適宜配列分布された小穴に
嵌め込まれて位置決めされ、しかる後、ボンド材及びダ
イヤモンド粒が粉末成形されると共にベース部共々一体
的に焼結されるのである。
According to the method for producing a diamond roll for whetstone correction of the present invention, a bonding material and diamond grains are filled in a molding recess of a mold member on which a base portion is placed,
At the time of filling, the diamond grains are positioned by being fitted into the small holes appropriately arranged and distributed in the diamond grain arrangement plate member placed in the forming recess, and thereafter, the bonding material and the diamond grains are powder-formed and the base is formed. The parts are integrally sintered.

【0006】[0006]

【作用】上記の砥石修正用ダイヤモンドロール製造方法
では、ダイヤ粒配列用板部材における小穴の分布配列及
び寸法の適宜選択の選択により、ダイヤモンド粒が所望
の分布状態になる。
In the above-described method for manufacturing a diamond roll for whetstone correction, the diamond particles are brought into a desired distribution state by appropriately selecting the distribution arrangement and size of the small holes in the diamond particle arrangement plate member.

【0007】[0007]

【実施例】この発明の実施例における砥石修正用ダイヤ
モンドロール製造方法を図1及び図2に従って説明す
る。中央凹所1と内周面の段部2とをもつ2段状円形凹
所が形成された型部材3が用意され、中央凹所1に円筒
形の砥石修正用ダイヤモンドロールのベース部Aが嵌め
込まれて、段部2において断面四辺形の環状凹所4が形
成される。更に、環状凹所4に嵌合する環状の押圧部材
5と環状のダイヤ粒配列用板部材6が用意される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a diamond roll for whetstone correction according to an embodiment of the present invention will be described with reference to FIGS. A mold member 3 in which a two-step circular recess having a central recess 1 and a step portion 2 on the inner peripheral surface is formed is prepared. When fitted, an annular recess 4 having a quadrangular cross section is formed in the step portion 2. Furthermore, an annular pressing member 5 and an annular diamond grain arranging plate member 6 that fit into the annular recess 4 are prepared.

【0008】ダイヤ粒配列用板部材6は、図2に例示さ
れるように均一な適宜の分布配列の小穴7,7‥‥がフ
ォトエッチング等によって穿設されており、小穴7は、
貫通穴又は止り穴であり、砥石修正用ダイヤモンドロー
ルに使用するダイヤモンド粒Bが丁度嵌り込む径であ
り、1粒又は必要に応じ複数粒のダイヤモンド粒Bが嵌
り込む深さである。
The diamond grain arranging plate member 6 is provided with small holes 7, 7 ... Having a uniform and appropriate distribution arrangement as shown in FIG. 2 by photo-etching or the like.
It is a through hole or a blind hole, and has a diameter into which the diamond grain B used in the diamond roll for whetstone correction is just fitted, and is a depth into which one grain or a plurality of diamond grains B is fitted as necessary.

【0009】先ず、ダイヤ粒配列用板部材6が環状凹所
4に嵌め込まれて段部2に置かれ、1粒又は複数粒のダ
イヤ粒Bが各小穴7に嵌り込むように位置決め散布され
てから、ボンド材Cが充填される。
First, the diamond grain arranging plate member 6 is fitted into the annular recess 4 and placed on the step 2, and one or a plurality of diamond grains B are positioned and scattered so as to fit into the respective small holes 7. From this, the bond material C is filled.

【0010】そして、押圧部材5をもって、ボンド材C
は上方から押圧され、砥石修正用ダイヤモンドロールの
ダイヤモンド部Dが粉末成形される。更に、ベース部A
共々炉において焼成され、ダイヤモンド部Dは、ダイヤ
粒B、ボンド材C及びダイヤ粒配列用板部材6が一体的
に焼結されると共にベース部Aに一体化される。ダイヤ
モンド部Dの粉末成形・焼結は、ホットプレス又はホッ
トコイニングによってもよい。
Then, with the pressing member 5, the bond material C
Is pressed from above, and the diamond portion D of the whetstone-correcting diamond roll is powder-molded. Furthermore, the base part A
Both are fired in a furnace, and the diamond portion D is integrated with the base portion A while the diamond grains B, the bonding material C, and the diamond grain arranging plate member 6 are integrally sintered. The powder molding / sintering of the diamond portion D may be performed by hot pressing or hot coining.

【0011】更にダイヤモンド部Dを成形加工して砥石
修正用ダイヤモンドロールを製造する。
Further, the diamond part D is formed and processed to manufacture a diamond roll for correcting a whetstone.

【0012】上記の工程では、粉末成形の際、ダイヤ粒
配列用板部材6が先ず環状凹所4に嵌め込まれるが、先
にボンド材Cが環状凹所4の中間深さにまで充填され、
その上にダイヤ粒配列用板部材6が置かれて、ダイヤ粒
Bが各小穴7に嵌り込むように位置決め散布されてか
ら、更にその上から環状凹所4にボンド材Cが充填され
るような工程でもよい。又は、先に充填されるボンド材
Cは、粉末成形済、又は焼成済のものであってもよい。
In the above process, the diamond grain arranging plate member 6 is first fitted into the annular recess 4 during powder molding, but the bond material C is first filled up to the intermediate depth of the annular recess 4,
The diamond grain arranging plate member 6 is placed thereon, the diamond grains B are positioned and scattered so as to fit into the respective small holes 7, and the annular recess 4 is further filled with the bond material C from above. Any process may be used. Alternatively, the bond material C filled first may be powder-molded or fired.

【0013】前者の工程で製造された砥石修正用ダイヤ
モンドロールのダイヤモンド部Dには一側面部にダイヤ
モンド粒Bが分布するが、後者の工程で製造された砥石
修正用ダイヤモンドロールのダイヤモンド部Dには厚さ
中央部にダイヤモンド粒Bが分布する。
Diamond grains B are distributed on one side surface in the diamond portion D of the whetstone-correcting diamond roll manufactured in the former step, but in the diamond portion D of the whetstone-correcting diamond roll manufactured in the latter step. The diamond grains B are distributed in the central portion of the thickness.

【0014】ダイヤ粒配列用板部材6における小穴7の
分布配列及び寸法の適宜選択及び上記の工程の選択によ
り、ダイヤモンド部Dにおけるダイヤモンド粒7が均一
な所望の分布状態である砥石修正用ダイヤモンドロール
を得ることができる。
By appropriately selecting the distribution arrangement and size of the small holes 7 in the diamond grain arranging plate member 6 and by selecting the above-mentioned steps, the diamond roll 7 for correcting a grindstone in which the diamond grains 7 in the diamond portion D are in a uniform and desired distribution state. Can be obtained.

【0015】[0015]

【発明の効果】この発明の製造方法によれば、砥石修正
用ダイヤモンドロールにおけるダイヤモンド粒の分布配
列を均一な所望の状態にすることができる。従って、そ
の砥石修正用ダイヤモンドロールによりツルーイング又
はドレッシングされた砥石は安定した正常な研削を行う
ことができる。
According to the manufacturing method of the present invention, it is possible to make the distribution arrangement of the diamond grains in the diamond roll for correcting the grindstone uniform and desired. Therefore, the whetstone trued or dressed by the whetstone-correcting diamond roll can perform stable and normal grinding.

【図面の簡単な説明】[Brief description of drawings]

【図1】 この発明の実施例における砥石修正用ダイヤ
モンドロールの製造方法の説明図である。
FIG. 1 is an explanatory view of a method for manufacturing a diamond roll for whetstone correction in an embodiment of the present invention.

【図2】 この発明の実施例における砥石修正用ダイヤ
モンドロールの製造方法に用いるダイヤ粒配列用板部材
の平面図である。
FIG. 2 is a plan view of a diamond grain arranging plate member used in the method for manufacturing the diamond roll for whetstone correction in the embodiment of the present invention.

【図3】 従来の技術における砥石修正用ダイヤモンド
ロールの製造方法の説明図である。
FIG. 3 is an explanatory view of a method for manufacturing a diamond roll for whetstone correction in the conventional technique.

【符号の説明】[Explanation of symbols]

1 中央凹所 2 段部 3 型部材 4 環状凹所 5 押圧部材 6 ダイヤ粒配列用板部材 7 小穴 A ベース部 B ダイヤモンド粒 C ボンド材 D ダイヤモンド部 1 Central recess 2 Step part 3 Type member 4 Annular recess 5 Pressing member 6 Plate member for diamond grain arrangement 7 Small hole A Base portion B Diamond grain C Bond material D Diamond portion

───────────────────────────────────────────────────── フロントページの続き (72)発明者 四井 善信 愛知県刈谷市朝日町1丁目1番地 豊田工 機株式会社内 (72)発明者 井土 雅裕 愛知県刈谷市朝日町1丁目1番地 豊田工 機株式会社内 (72)発明者 鈴木 旭 愛知県岡崎市舞木町城山7番地54 豊田バ ンモップス株式会社内 (72)発明者 柴田 真司 愛知県岡崎市舞木町城山7番地54 豊田バ ンモップス株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Yoshinori Yotsui 1-1, Asahi-cho, Kariya city, Aichi Toyota Koki Co., Ltd. (72) Inventor Masahiro Ido 1-1-chome, Asahi-cho, Kariya city, Aichi prefecture Toyota Kogyo Inside the machine Co., Ltd. (72) Inventor Suzuki Asahi 7 7 Shiroyama, Maiki-cho, Okazaki-shi, Aichi Prefecture Toyota Banmops Co., Ltd. (72) Inventor Shinji Shibata, 7 Shiroyama, Maiki-cho, Okazaki-shi, Aichi Prefecture 54

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ベース部が置かれた型部材の成形凹所に
ボンド材とダイヤモンド粒が充填され、その充填に際
し、ダイヤモンド粒は、成形凹所内に置かれたダイヤ粒
配列用板部材に適宜配列分布された小穴に嵌め込まれて
位置決めされ、しかる後、ボンド材及びダイヤモンド粒
が粉末成形されると共にベース部共々一体的に焼結され
る砥石修正用ダイヤモンドロールの製造方法。
1. A bonding material and diamond grains are filled in a molding recess of a mold member in which a base portion is placed, and when filling the diamond grains, the diamond grains are appropriately applied to a diamond grain array plate member placed in the molding recess. A method of manufacturing a diamond roll for correcting a grindstone, which is fitted and positioned in small holes arranged and distributed, and thereafter, a bond material and diamond grains are powder-formed and the base portion is integrally sintered together.
JP8054091A 1991-03-20 1991-03-20 Manufacture of diamond roll for correcting grinding wheel Pending JPH05277951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8054091A JPH05277951A (en) 1991-03-20 1991-03-20 Manufacture of diamond roll for correcting grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8054091A JPH05277951A (en) 1991-03-20 1991-03-20 Manufacture of diamond roll for correcting grinding wheel

Publications (1)

Publication Number Publication Date
JPH05277951A true JPH05277951A (en) 1993-10-26

Family

ID=13721188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8054091A Pending JPH05277951A (en) 1991-03-20 1991-03-20 Manufacture of diamond roll for correcting grinding wheel

Country Status (1)

Country Link
JP (1) JPH05277951A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1190834A (en) * 1997-09-12 1999-04-06 Osaka Diamond Ind Co Ltd Super-abrasive grain grinding wheel and its manufacture
JP2000354967A (en) * 1999-06-09 2000-12-26 Asahi Diamond Industrial Co Ltd Manufacture of conditioner
JP2005319527A (en) * 2004-05-07 2005-11-17 Hoshun Yu Diamond saw
JP2006515807A (en) * 2003-08-11 2006-06-08 エーワ ダイアモンド インダストリアル カンパニイリミテッド Diamond tools
KR20160040146A (en) * 2013-08-07 2016-04-12 라이스하우어 아게 Dressing tool and method for the production thereof
CN112676568A (en) * 2020-12-03 2021-04-20 西安博奥达金刚石工磨具有限公司 Preparation method of parallel surface CVD diamond roller

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1190834A (en) * 1997-09-12 1999-04-06 Osaka Diamond Ind Co Ltd Super-abrasive grain grinding wheel and its manufacture
JP2000354967A (en) * 1999-06-09 2000-12-26 Asahi Diamond Industrial Co Ltd Manufacture of conditioner
JP2006515807A (en) * 2003-08-11 2006-06-08 エーワ ダイアモンド インダストリアル カンパニイリミテッド Diamond tools
JP2005319527A (en) * 2004-05-07 2005-11-17 Hoshun Yu Diamond saw
KR20160040146A (en) * 2013-08-07 2016-04-12 라이스하우어 아게 Dressing tool and method for the production thereof
JP2016527095A (en) * 2013-08-07 2016-09-08 ライスハウアー アーゲーReishauer AG Rework tool and method for producing the same
CN112676568A (en) * 2020-12-03 2021-04-20 西安博奥达金刚石工磨具有限公司 Preparation method of parallel surface CVD diamond roller

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