JPH05277779A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH05277779A
JPH05277779A JP4119497A JP11949792A JPH05277779A JP H05277779 A JPH05277779 A JP H05277779A JP 4119497 A JP4119497 A JP 4119497A JP 11949792 A JP11949792 A JP 11949792A JP H05277779 A JPH05277779 A JP H05277779A
Authority
JP
Japan
Prior art keywords
optical path
path length
laser beam
processing
length adjusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4119497A
Other languages
Japanese (ja)
Inventor
Toshikatsu Hatajima
敏勝 畑島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Iron Works Co Ltd
Original Assignee
Kitagawa Iron Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Iron Works Co Ltd filed Critical Kitagawa Iron Works Co Ltd
Priority to JP4119497A priority Critical patent/JPH05277779A/en
Publication of JPH05277779A publication Critical patent/JPH05277779A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To prevent the fluctuation in the condensing property of a laser beam with a change in optical path length and to improve the stability of laser beam processing by maintaining the optical path length of the laser beam from a laser oscillator up to a processing position at a specified distance. CONSTITUTION:This laser beam machine has an optical path length adjusting means 7 moving in such a manner as to maintain the specified optical path length until the laser beam 2 emitted form the laser oscillator 1 arrives at a processing head 6 disposed with a condenser lens 5. The device has an optical path length adjusting and computing device 17 for controlling the optical path length adjusting means 7 disposed with bend mirrors 5, 6 by measuring the moving quantity Lx in the X direction of a processing head 6 and the moving quantity Ly in the Y direction thereof with the detectors of servo motors for respective axes or detectors, etc., installed separately therefrom and making the computation (Lx+Ly)/2=Lu, then commanding the moving quantity Lu to drive the servo motors. Not only the directions X, Y but a direction Z may be taken into account to compute (Lx+Ly+Lz)/2=Lu at the time of calculating the moving quantity Lu.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、被加工物にレーザ光を
照射して加工を行うレーザ加工装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for irradiating a workpiece with a laser beam for processing.

【0002】[0002]

【従来技術】従来のレーザ加工装置は、レーザ発振器よ
り出射したレーザ光を集光レンズを設けた加工ヘッドに
導き、集光レンズによって集光したレーザ光を被加工物
に照射することにより加工をおこなっていた。
2. Description of the Related Art A conventional laser processing apparatus guides a laser beam emitted from a laser oscillator to a processing head provided with a condenser lens and irradiates the workpiece with the laser beam condensed by the condenser lens. It was done.

【0003】その例を図3に示す。図において1はレー
ザ発振器、2はレーザ光、3・4はベンドミラー、5は
集光レンズ、6は加工ヘッド、7は被加工物、8はコラ
ムで、レーザ発振器1から出射されたレーザ光2は、ベ
ンドミラー3・4によって反射され加工ヘッド内に設置
された集光レンズ5に導かれ、集光レンズ5によって集
光されたレーザ光によって被加工物7の加工が行われ
る。
An example thereof is shown in FIG. In the figure, 1 is a laser oscillator, 2 is a laser beam, 3 and 4 are bend mirrors, 5 is a condenser lens, 6 is a processing head, 7 is a workpiece, 8 is a column, and the laser beam emitted from the laser oscillator 1 is shown. 2 is reflected by the bend mirrors 3 and 4 and guided to a condenser lens 5 installed in the processing head, and the workpiece 7 is processed by the laser light condensed by the condenser lens 5.

【0004】次にレーザ光による加工の特性について説
明する。図3のようにレーザ光2がベンドミラー3・4
によって加工ヘッド6へ導かれ、加工ヘッド6をNC装
置等で制御して移動させ、任意の形状の加工を行うレー
ザ加工装置では、図4のように加工ヘッド6が図中のA
位置にある状態とB位置にある状態とではレーザ発振器
1からの距離が異なり、レーザ光に2mrad程度の拡
散角があるため集光レンズ5に入射するレーザ光の径が
異なってくるので、集光レンズ5で集光されたレーザ光
のスポット径や焦点深度や集光レンズから最小スポット
径までの距離などが異なり、加工テーブル上の全ての位
置において同一加工条件で加工するということが非常に
困難であるという欠点があった。
Next, the characteristics of processing by laser light will be described. As shown in FIG. 3, the laser light 2 is bent by the bend mirrors 3 and 4.
Is guided to the processing head 6, and the processing head 6 is moved by being controlled by an NC device or the like to perform processing in an arbitrary shape.
Since the distance from the laser oscillator 1 is different between the position and the position B and the laser light has a diffusion angle of about 2 mrad, the diameter of the laser light incident on the condenser lens 5 is different. The spot diameter and depth of focus of the laser light condensed by the optical lens 5 and the distance from the condensing lens to the minimum spot diameter are different, and it is very important to process under the same processing conditions at all positions on the processing table. It had the drawback of being difficult.

【0005】[0005]

【発明が解決しようとする課題】レーザ発振器から加工
位置までの光路長が異なる加工装置では、集光性の違い
が発生し同一の加工条件では加工できない場合が発生す
る。特に、被加工物の板厚が厚くなると加工条件幅が狭
く、上記のように集光性に違いが発生すると加工不良が
発生し易いという問題点があった。
In a processing apparatus in which the optical path length from the laser oscillator to the processing position is different, there is a case where processing cannot be performed under the same processing conditions due to a difference in light converging property. In particular, there has been a problem that as the plate thickness of the work piece becomes thicker, the width of the processing condition becomes narrower, and if a difference in light-collecting property occurs as described above, a processing defect is likely to occur.

【0006】[0006]

【問題を解決するための手段】本発明は、上記問題に鑑
みてなされたもので、レーザ発振器から加工位置までの
光路長を調整するための光路長調整手段を光路長調整演
算装置を介して制御し、レーザ発振器から加工位置まで
の光路長が一定距離の状態で加工可能としたものであ
る。
The present invention has been made in view of the above problems, and an optical path length adjusting means for adjusting an optical path length from a laser oscillator to a processing position is provided via an optical path length adjusting arithmetic unit. It is controlled so that the optical path length from the laser oscillator to the processing position can be processed at a constant distance.

【0007】[0007]

【作用】光路長調整演算装置によって光路長調整手段を
制御することにより、レーザ発振器から加工位置までの
光路長が常に一定距離に保持され、レーザ光の集光性に
変動を生じることを防止し、レーザ加工の安定性が向上
するという作用がある。
By controlling the optical path length adjusting means by the optical path length adjusting arithmetic unit, the optical path length from the laser oscillator to the processing position is always maintained at a constant distance, and fluctuations in the converging property of the laser light are prevented. The effect is to improve the stability of laser processing.

【0008】[0008]

【実施例】以下、本発明を図1の実施例により具体的に
説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the embodiment shown in FIG.

【0009】レーザ発振器1より出射されたレーザ光2
は、ベントミラー3,13で反射され、ベントミラー
9,10を具備した光路長調整手段11に導かれ、ベン
ドミラー9,10で反射されたレーザ光はコラム8に配
置したベンドミラー12と加工ヘッド6の上部に配置し
たベンドミラー4で反射され、集光レンズ5を設置した
加工ヘッド6へ導かれ、集光レンズ5で集光したレーザ
光を被加工物7に照射して加工が行われる。
Laser light 2 emitted from a laser oscillator 1
Is reflected by the bent mirrors 3 and 13 and guided to the optical path length adjusting means 11 equipped with the bent mirrors 9 and 10, and the laser light reflected by the bend mirrors 9 and 10 is processed with the bend mirror 12 arranged in the column 8. It is reflected by the bend mirror 4 arranged above the head 6, guided to the processing head 6 provided with the condenser lens 5, and irradiated with the laser beam condensed by the condenser lens 5 to the workpiece 7 for processing. Be seen.

【0010】加工ヘッド6は、NC装置等で制御されて
おり図中の矢印YとZの方向に移動自在で、しかも、加
工ヘッド6は矢印Xの方向に移動自在なコラム8に設置
されているので矢印Xの方向へも移動自在である。
The machining head 6 is controlled by an NC device or the like and is movable in the directions of arrows Y and Z in the figure, and the machining head 6 is installed in a column 8 which is movable in the direction of arrow X. Since it is present, it can also be moved in the direction of arrow X.

【0011】上記のように、矢印X,Yの方向に移動自
在なことから被加工物7に任意の形状で加工可能でしか
も矢印Zの方向の変位にたいしても追従可能である装置
において、加工ヘッド6が矢印X,Yの方向へ移動する
ことにより生じるレーザ発振器1からの光路長の変化量
を光路長調整手段11の位置を光路長調整演算装置17
を介しサーボモータ14を制御することにより相殺し、
レーザ発振器1からの光路長が一定になるようにしたこ
とを特徴とするレーザ加工装置である。
As described above, since it is movable in the directions of the arrows X and Y, it is possible to process the workpiece 7 in any shape and to follow the displacement in the direction of the arrow Z. The amount of change in the optical path length from the laser oscillator 1 caused by the movement of 6 in the directions of the arrows X and Y indicates the position of the optical path length adjusting means 11 and the optical path length adjusting arithmetic unit 17.
Cancel by controlling the servo motor 14 via
The laser processing apparatus is characterized in that the optical path length from the laser oscillator 1 is made constant.

【0012】光路長調整手段11の制御方法につい図1
および図2によって説明する。
FIG. 1 shows the control method of the optical path length adjusting means 11.
2 will be described.

【0013】加工ヘッド6がXおよびYの方向へ移動し
たとき、X方向への移動量LxとY方向への移動量Ly
をサーボモータの検出器あるいは別置の検出器等で計測
する。
When the machining head 6 moves in the X and Y directions, a moving amount Lx in the X direction and a moving amount Ly in the Y direction.
Is measured with a servomotor detector or a separate detector.

【0014】光路長調整演算装置17に前記移動量Lx
およびLyを入力し(Lx+Ly)/2=Luの演算を
行った後、光路長調整手段11の移動量Luとして出力
する。
The optical path length adjustment calculation device 17 is provided with the moving amount Lx.
And Ly are input, the calculation of (Lx + Ly) / 2 = Lu is performed, and then the amount of movement Lu of the optical path length adjusting unit 11 is output.

【0015】ただし、前記LxおよびLyは、矢印X,
Yの+方向への移動量に対しては正の値であり、−方向
への移動量の場合は負の値となる。従って、前記Luの
値が正の場合には光路長調整手段11は矢印Uの+方向
へ移動し、Luの値が負の場合には−方向へ移動する。
However, Lx and Ly are the arrows X,
It has a positive value with respect to the amount of movement of Y in the + direction, and has a negative value with respect to the amount of movement in the − direction. Therefore, when the value of Lu is positive, the optical path length adjusting means 11 moves in the + direction of the arrow U, and when the value of Lu is negative, it moves in the-direction.

【0016】光路長調整演算装置17から出力された移
動量Luは光路長調整手段11を駆動するサーボモータ
14のサーボアンプに出力されサーボモータ14を駆動
し、更にサーボモータ14の回転軸に固定されたボール
ネジ15を駆動し、ボールネジ15のナット部に固定さ
れた光路長調整手段11を移動量Luだけ移動させるこ
とにより、レーザ発振器から加工位置までの光路長は加
工ヘッド6の位置の移動には無関係に一定となる。
The movement amount Lu output from the optical path length adjusting arithmetic unit 17 is output to the servo amplifier of the servomotor 14 for driving the optical path length adjusting means 11 to drive the servomotor 14, and is further fixed to the rotary shaft of the servomotor 14. The optical path length from the laser oscillator to the processing position is moved to the position of the processing head 6 by driving the ball screw 15 that is driven and moving the optical path length adjusting means 11 fixed to the nut portion of the ball screw 15 by the movement amount Lu. Is constant regardless of.

【0017】また、移動量Luを算出するにあたって
は、X,Yの方向のみならずZの方向も加味し、(Lx
+Ly+Lz)/2=Luとしてもよい。
Further, in calculating the movement amount Lu, not only the X and Y directions but also the Z direction is taken into consideration, and (Lx
+ Ly + Lz) / 2 = Lu may be set.

【0018】[0018]

【発明の効果】以上述べたように本発明によれば、X軸
・Y軸・Z軸など複数の軸が同時に移動するような場合
に於いて、一箇所の光路長調整手段を制御することで光
路長を一定距離に保持することができるため、ミラー枚
数が最小となる。さらに、光路長調整手段の調整方向は
加工ヘッドの移動方向に対し制約を受けず、レーザ加工
装置の配置に対して自由度がある。
As described above, according to the present invention, when a plurality of axes such as the X axis, the Y axis, and the Z axis move simultaneously, it is possible to control the optical path length adjusting means at one place. Since the optical path length can be maintained at a constant distance, the number of mirrors is minimized. Further, the adjusting direction of the optical path length adjusting means is not restricted by the moving direction of the processing head, and the laser processing device can be arranged freely.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るレーザ加工装置の実施例を示す斜
視図
FIG. 1 is a perspective view showing an embodiment of a laser processing apparatus according to the present invention.

【図2】光路長調整手段の制御を示すフローチャートFIG. 2 is a flowchart showing control of an optical path length adjusting means.

【図3】従来のレーザ加工装置を示す斜視図FIG. 3 is a perspective view showing a conventional laser processing apparatus.

【図4】光路長の違いによるレーザ光の径の違いを示す
光路図
FIG. 4 is an optical path diagram showing a difference in diameter of laser light due to a difference in optical path length.

【符号の説明】[Explanation of symbols]

1・・・・・レーザ発振器 2・・・・・レーザ光 3、4・・・ベンドミラ 5・・・・・集光レンズ 6・・・・・加工ヘッド 7・・・・・被加工物 8・・・・・コラム 9、10・・ベンドミラ 11・・・・光路長調整手段 14・・・・サーボモータ 15・・・・ボールネジ 17・・・・光路長調整演算装置 1 ... Laser oscillator 2 ... Laser light 3, 4 ... Bend mirror 5 ... Condensing lens 6 ... Processing head 7 ... Workpiece 8・ ・ ・ Column 9, 10 ・ ・ Bend mirror 11 ・ ・ ・ ・ ・ ・ Optical path length adjusting means 14 ・ ・ ・ ・ Servo motor 15 ・ ・ ・ ・ Ball screw 17 ・ ・ ・ ・ ・ ・ Optical path length adjusting arithmetic unit

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 レーザ発振器から出射されたレーザ光を
集光レンズを設けた加工ヘッドに入射させ、前記加工ヘ
ッドが直交する三方向に移動自在で被加工物を加工する
装置において、レーザ発振器から加工ヘッドに至るレー
ザ光の光路長を一定距離に保持する光路長調整手段と前
記光路長調整手段の移動量を演算する光路長調整演算装
置を設けたことを特徴とするレーザ加工装置。
1. A device for processing a workpiece by causing a laser beam emitted from a laser oscillator to enter a processing head provided with a condenser lens, and the processing head being movable in three directions orthogonal to each other. A laser processing apparatus comprising: an optical path length adjusting means for maintaining an optical path length of a laser beam reaching a processing head at a constant distance; and an optical path length adjusting arithmetic device for calculating a movement amount of the optical path length adjusting means.
JP4119497A 1992-03-27 1992-03-27 Laser beam machine Pending JPH05277779A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4119497A JPH05277779A (en) 1992-03-27 1992-03-27 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4119497A JPH05277779A (en) 1992-03-27 1992-03-27 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH05277779A true JPH05277779A (en) 1993-10-26

Family

ID=14762734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4119497A Pending JPH05277779A (en) 1992-03-27 1992-03-27 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH05277779A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043453A (en) * 1996-02-23 2000-03-28 Hitachi Via Mechanics Ltd. Apparatus for laser processing with a mechanical cutter
EP1285718A1 (en) * 2001-08-18 2003-02-26 Trumpf Werkzeugmaschinen GmbH + Co. KG Machine tool for machining workpieces by laser beam
JP2010188424A (en) * 2010-04-28 2010-09-02 Yamazaki Mazak Corp Laser beam machine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043453A (en) * 1996-02-23 2000-03-28 Hitachi Via Mechanics Ltd. Apparatus for laser processing with a mechanical cutter
EP1285718A1 (en) * 2001-08-18 2003-02-26 Trumpf Werkzeugmaschinen GmbH + Co. KG Machine tool for machining workpieces by laser beam
US6586706B2 (en) 2001-08-18 2003-07-01 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laser machine tool with beam guide
EP1336448A2 (en) * 2001-08-18 2003-08-20 Trumpf Werkzeugmaschinen GmbH + Co. KG Machine tool for machining workpieces by laser, with at least one common shared rack
EP1336448A3 (en) * 2001-08-18 2003-09-10 Trumpf Werkzeugmaschinen GmbH + Co. KG Machine tool for machining workpieces by laser, with at least one common shared rack
JP2010188424A (en) * 2010-04-28 2010-09-02 Yamazaki Mazak Corp Laser beam machine

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