JPH05275899A - Missing part inspecting apparatus - Google Patents

Missing part inspecting apparatus

Info

Publication number
JPH05275899A
JPH05275899A JP4067696A JP6769692A JPH05275899A JP H05275899 A JPH05275899 A JP H05275899A JP 4067696 A JP4067696 A JP 4067696A JP 6769692 A JP6769692 A JP 6769692A JP H05275899 A JPH05275899 A JP H05275899A
Authority
JP
Japan
Prior art keywords
inspection
parts
substrate
reversing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4067696A
Other languages
Japanese (ja)
Other versions
JP3211338B2 (en
Inventor
Nozomi Niito
望 新戸
Koji Matsumoto
幸治 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP06769692A priority Critical patent/JP3211338B2/en
Publication of JPH05275899A publication Critical patent/JPH05275899A/en
Application granted granted Critical
Publication of JP3211338B2 publication Critical patent/JP3211338B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To enable the quick and sure inspection of the state of mounted parts for any parts coming off, damaged or missing parts by detecting whether inspection probes have gone into insertion holes or not. CONSTITUTION:A substrate 14 mounted with parts is transported on transport rails 13 to a substrate reversing unit 14. A reversing frame 19 is moved up, and both ends of the substrate 14 mounted with parts are clamped by a rotary clamping wheel 22 and a clamping wheel 26. When the clamped substrate 14 mounted with parts has been moved up, the rotary clamping wheel 22 is rotated, reversing the substrate 14 mounted with parts. The substrate 14 mounted with parts is then transported on the transport rails 13 until it is stopped by a stopper 37 of an inspection unit 12. An air cylinder 32 is actuated, moving down a cylindrical inspection plate 35. If there are any missing parts, inspection probes 36 go into lead insertion holes in the substrate 14 mounted with parts, and thus the cylindrical body is stationary there; if leads of the mounted part are in the lead insertion holes, the inspection probes cannot go in, and thus the cylindrical body is lifted up. Thus missing parts and the state of inserted leads are detected by checking the state of the cylindrical body.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、欠品検査装置に関
し、更に詳しくは、実装基板へ取付けられる電子部品の
欠品状態を検出する技術に係わる。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an out-of-stock inspection device, and more particularly to a technique for detecting an out-of-stock state of electronic components mounted on a mounting board.

【0002】[0002]

【従来の技術】従来、この種の欠品検査技術としては、
図6に示すようなものが知られている。裏面に配線パタ
ーン2が形成された実装基板1の挿通孔1aに複数の電
子部品A,B…のリードa,bを挿入し、該基板1の裏
面側に突出したリード端を折り曲げた状態で、実装基板
1の表面上方より検査杆3〜3を下降させて電子部品
A,B…の有無を検出という技術である。
2. Description of the Related Art Conventionally, as this kind of shortage inspection technique,
The one shown in FIG. 6 is known. In the state where the leads a and b of the plurality of electronic components A, B ... Are inserted into the insertion holes 1a of the mounting board 1 having the wiring pattern 2 formed on the back surface and the lead ends protruding toward the back surface of the board 1 are bent. Is a technique of detecting the presence or absence of the electronic components A, B ... by lowering the inspection rods 3 to 3 from above the surface of the mounting substrate 1.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うな従来の装置では、実装した電子部品が傾いていた
り、電子部品の形状が適していないなどの問題点があっ
た。また、図6に示すように、電子部品Bのリードb
が、実装基板1の挿通孔1aに入っていなかったり、電
子部品が抜けかかっている場合は、その不具合を検出で
きないという問題があった。さらに、近年、実装密度が
高くなり、実装基板表面側から観察しても、その不具合
が発見しにくいなどの問題点も発生している。
However, in such a conventional device, there are problems that the mounted electronic parts are tilted or the shape of the electronic parts is not suitable. Further, as shown in FIG. 6, the lead b of the electronic component B
However, when the mounting board 1 is not in the insertion hole 1a or the electronic component is about to come off, there is a problem that the failure cannot be detected. Further, in recent years, the mounting density has increased, and even when observed from the surface side of the mounting substrate, problems such as difficulty in finding the defect have occurred.

【0004】本発明は、このような従来の問題点に着目
して創案されたものであって、実装部品の抜け、破損、
欠品等を確実に検出でき、しかも検査の手間,作業人員
を削減できる欠品検査装置を得んとするものである。
The present invention was devised by focusing on the above-mentioned conventional problems.
The purpose of the present invention is to obtain a missing item inspection device that can reliably detect missing items, etc., and reduce the labor and labor required for inspection.

【0005】[0005]

【課題を解決するための手段】そこで、本発明は、リー
ドを挿通孔に挿通して複数の電子部品を取付けた実装基
板を反転させて基板裏面を上向きにする基板反転手段
と、前記基板反転手段により反転された実装基板の夫々
挿通孔に挿通可能な検査針を上方より下降させ、該検査
針が前記挿通孔に挿入されたか否かを検出する検出手段
と、を備えたことを、その解決手段としている。
Therefore, according to the present invention, there is provided a board reversing means for reversing a mounting board on which a plurality of electronic components are mounted by inserting leads into the through holes so that the back surface of the board faces upward, and the board reversing means. The inspection needle insertable into each insertion hole of the mounting board inverted by the means is lowered from above to detect whether or not the inspection needle is inserted into the insertion hole. It is a solution.

【0006】[0006]

【作用】基板反転装置は、実装基板の裏面、即ち配線パ
ターン面側を上に向ける。このため、検査手段の検査針
が、基板の挿通孔に直接対向することが可能となり、電
子部品本体が検査を妨害することがない。検査針は下降
することにより、挿入孔内の電子部品のリードの有無を
検出することが可能となる。
The substrate reversing device faces the back surface of the mounting board, that is, the wiring pattern surface side upward. Therefore, the inspection needle of the inspection means can directly face the insertion hole of the board, and the electronic component body does not interfere with the inspection. By lowering the inspection needle, it becomes possible to detect the presence or absence of the lead of the electronic component in the insertion hole.

【0007】[0007]

【実施例】以下、本発明に係る欠品検査装置の詳細を図
面に示す実施例に基づいて説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the shortage inspection device according to the present invention will be described below with reference to the embodiments shown in the drawings.

【0008】図1は、本実施例の欠品検査装置の正面図
であり、図2は側面図である。図中10は、欠品検査装
置であって、基板反転部11と、検査部12と、実装基
板の搬送を行なう搬送レール13,13とから大略構成
されている。
FIG. 1 is a front view of the shortage inspection device of this embodiment, and FIG. 2 is a side view thereof. In the figure, reference numeral 10 denotes a shortage inspection device, which is roughly composed of a board reversing section 11, an inspection section 12, and transfer rails 13 and 13 for transferring a mounting board.

【0009】搬送レール13は、基板反転部11と検査
部12に亘って架設され、図に示すように、実装基板1
4を載せて図示しない搬送手段にて搬送が可能となって
いる。また、搬送レール13,13上を運ばれる実装基
板14を検査部12の所定位置で停止させるため、搬送
レール13,13の間に上下動可能なストッパ37が設
けられている。
The carrier rail 13 is installed over the board reversing section 11 and the inspection section 12, and as shown in the figure, the mounting board 1 is mounted.
4 can be placed on the sheet and conveyed by a conveying means (not shown). Further, a stopper 37 that can move up and down is provided between the transport rails 13 and 13 in order to stop the mounting board 14 transported on the transport rails 13 and 13 at a predetermined position of the inspection unit 12.

【0010】基板反転部11は、昇降動作が2段階とな
るように、エアーシリンダ15,16を備えている。エ
アーシリンダ15は、取付板17に固定され、エアーシ
リンダ15のピストンロッド18の先端は反転基枠19
の中央に取付けられている。また、エアーシリンダ16
の下端は、取付板20に固設され、エアーシリンダ16
のピストンロッド21の先端は上記取付板17に取付け
られている。また、反転基枠19下面には、下方に向け
て2本のガイド杆21,21が固設され、これらガイド
杆21,21は取付板17,20の両端部を夫々貫通し
て摺動自在に嵌合されている。
The substrate reversing unit 11 is equipped with air cylinders 15 and 16 so that the raising / lowering operation is performed in two stages. The air cylinder 15 is fixed to the mounting plate 17, and the tip of the piston rod 18 of the air cylinder 15 has a reverse base frame 19.
It is installed in the center of. Also, the air cylinder 16
The lower end of the air cylinder 16 is fixed to the mounting plate 20.
The tip of the piston rod 21 is attached to the attachment plate 17. Further, two guide rods 21 and 21 are fixed to the lower surface of the reverse base frame 19 downward, and these guide rods 21 and 21 are slidable by penetrating both ends of the mounting plates 17 and 20, respectively. Is fitted to.

【0011】上記反転基枠19の両端には、立上板19
A,19Bが一体に設けられている。立上板19Aの上
端部内側面には、回転挾持車輪22が設けられ、この車
輪22は傘形歯車23,24を介して、反転基枠19の
一端部に固設されたモータ25の回転駆動力が伝達され
るようになっている。また、立上板19Bの上部には、
上記回転挾持車輪22と対向する挾持車輪26が回転自
在に設けられ、しかもこの車輪26は、エアーシリンダ
27のピストンロッド28の端部に軸装されている。こ
のため、エアーシリンダ27の作動により、挾持車輪2
6は、図4中矢示する方向に往復動作が可能となってい
る。
A rising plate 19 is provided at both ends of the inversion base frame 19.
A and 19B are integrally provided. A rotary holding wheel 22 is provided on the inner surface of the upper end portion of the rising plate 19A, and the wheel 22 is rotationally driven by a motor 25 fixed to one end portion of the reversing base frame 19 via bevel gears 23 and 24. Power is transmitted. Also, on the upper part of the rising plate 19B,
A holding wheel 26 facing the rotating holding wheel 22 is rotatably provided, and the wheel 26 is mounted on the end of a piston rod 28 of an air cylinder 27. Therefore, the operation of the air cylinder 27 causes the holding wheel 2 to move.
6 can reciprocate in the direction of the arrow in FIG.

【0012】検査部12は、レール13の脇に立設され
た支柱29,29に対して上下方向に摺動自在な昇降体
30を設け、この昇降体30は、装置本体31に設けら
れたエアーシリンダ32によって昇降駆動されるように
なっている。そして、昇降体30には、水平方向に検査
板取付枠33が設けられ、この検査板取付枠33には、
クランプ34A,34Bが設けられており、これらクラ
ンプ34A,34Bに検査板35が挾持され得るように
なっている。また、検査板35が保持される位置は、搬
送レール13,13上に被検査板である実装基板14が
位置する真上である。検査板35には、上から下に向け
て挿通された検査針36が多数備えられ、この検査針3
6は、図3に示すように、基板反転部11で裏返されて
搬送された実装基板14のリード挿入孔14Bの夫々に
対応する位置に配置されている。検査針36上部には、
落下防止及び検査の際の識別用端子である円柱体36A
が形成されている。
The inspection unit 12 is provided with an elevating body 30 which is vertically slidable with respect to columns 29, which are erected on the side of the rail 13, and the elevating body 30 is provided in the main body 31 of the apparatus. It is adapted to be driven up and down by an air cylinder 32. Then, the lifting body 30 is provided with an inspection plate mounting frame 33 in the horizontal direction, and the inspection plate mounting frame 33 includes
Clamps 34A and 34B are provided so that the inspection plate 35 can be held by these clamps 34A and 34B. The position where the inspection plate 35 is held is right above the mounting board 14 which is the plate to be inspected on the transport rails 13, 13. The inspection plate 35 is provided with a large number of inspection needles 36 inserted from top to bottom.
As shown in FIG. 3, 6 are arranged at the positions corresponding to the respective lead insertion holes 14B of the mounting substrate 14 which is turned over by the substrate reversing unit 11 and conveyed. Above the inspection needle 36,
Cylinder body 36A which is a terminal for identification for fall prevention and inspection
Are formed.

【0013】以下、本装置の作用・動作を説明する。The operation and operation of this apparatus will be described below.

【0014】先ず、実装組立て(半田付け前)が終了し
た実装基板14を搬送レール13,13で基板反転部1
1の所定位置に搬送し、エアーシリンダ15を作動させ
て、反転基枠19を上昇させ、次に、搬送レール13に
載置されている実装基板14の両端を回転挾持車輪22
と挾持車輪26とで挾持する。なお、このとき、エアー
シリンダ27は、挾持車輪26を内側に向けて押し出す
ようにする。
First, the mounting board 14 that has been mounted and assembled (before soldering) is transferred to the board reversing unit 1 by the transfer rails 13 and 13.
1 to the predetermined position, the air cylinder 15 is operated to raise the reversing base frame 19, and then both ends of the mounting substrate 14 mounted on the transfer rail 13 are rotated and held by the wheels 22.
And the holding wheels 26. At this time, the air cylinder 27 pushes the gripping wheel 26 inward.

【0015】次に、エアーシリンダ16を作動させて挾
持した実装基板14を上昇させた後、モータ25を回転
させて反転挾持車輪22を回転駆動し、実装基板14を
裏返しにする。次に、エアーシリンダ16,15を順次
作動させて実装基板14を搬送レール13,13に再度
載置する。
Next, the air cylinder 16 is operated to raise the sandwiched mounting substrate 14, and then the motor 25 is rotated to rotationally drive the reversing sandwiching wheel 22 to turn the mounting substrate 14 upside down. Next, the air cylinders 16 and 15 are sequentially operated to mount the mounting substrate 14 on the transfer rails 13 and 13 again.

【0016】その後、実装基板14は、搬送レール1
3,13上を搬送され、検査部12でストッパ37によ
って停止させる。次に、エアーシリンダ32を作動させ
て検査板35を下降させる。これにより、図3(A)の
状態から同図(B)の状態となり、図に示すように欠品
がある場合は、検査針36が実装基板14のリード挿入
孔14Bに入り、その円柱体36Aは移動せず、実装部
品のリードがリードa挿入孔14Bに通されている場合
は、検査針36が入らず、円柱体36Aは浮き上がる。
このような円柱体36Aの状態を検出することにより、
欠品状態やリードaの挿入状態が検出できる。なお、こ
の検出手段は、例えば円柱体36Aの頭部の動きによっ
て警告灯が点燈するようにスイッチを配置するなど各種
の検出手段を採用することが可能である。
After that, the mounting board 14 is mounted on the carrier rail 1.
It is conveyed on the sheets 3 and 13 and stopped by the stopper 37 at the inspection unit 12. Next, the air cylinder 32 is operated to lower the inspection plate 35. As a result, the state of FIG. 3 (A) changes to the state of FIG. 3 (B), and if there is a missing item as shown in the figure, the inspection needle 36 enters the lead insertion hole 14B of the mounting board 14 and the cylindrical body 36A does not move, and when the lead of the mounted component is passed through the lead a insertion hole 14B, the inspection needle 36 does not enter and the columnar body 36A floats.
By detecting such a state of the cylindrical body 36A,
It is possible to detect the out-of-stock state and the insertion state of the lead a. As the detecting means, various detecting means can be adopted, for example, a switch is arranged so that the warning light is turned on by the movement of the head of the cylindrical body 36A.

【0017】このような検査部12において検査が施さ
れた実装基板14は、搬送レール13,13で搬送さ
れ、欠品等のある実装基板14と欠品等のない実装基板
14とに分別される。
The mounting board 14 that has been inspected by the inspection section 12 is conveyed by the conveying rails 13 and 13 and is separated into a mounting board 14 having a missing item and a mounting board 14 having no missing item. It

【0018】以上、本発明の実施例について説明した
が、本発明はこれに限定されるものではなく、構成の要
旨に付随する各種の設計変更が可能である。
Although the embodiment of the present invention has been described above, the present invention is not limited to this, and various design changes associated with the gist of the configuration can be made.

【0019】[0019]

【発明の効果】以上の説明から明らかなように、本発明
によれば、実装基板への電子部品の取付け状態の検査を
容易且つ迅速に行なえ得るものとなし、検査人員を削減
できる効果がある。また、実装基板における欠品状態の
検査の他、電子部品のリードが基板のリード挿入孔に適
切に挿入されているか否かの検出も行える効果がある。
As is apparent from the above description, according to the present invention, it is possible to easily and quickly inspect the mounting state of electronic components on a mounting board, and it is possible to reduce the number of inspection personnel. .. Further, in addition to the inspection of the defective condition of the mounting board, it is possible to detect whether the leads of the electronic component are properly inserted into the lead insertion holes of the board.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例に係る欠品検査装置の正面図。FIG. 1 is a front view of a shortage inspection device according to an embodiment of the present invention.

【図2】本発明の実施例に係る欠品検査装置の側面図。FIG. 2 is a side view of the shortage inspection device according to the embodiment of the present invention.

【図3】(A)及び(B)は実施例の検査状態を示す説
明図。
FIG. 3A and FIG. 3B are explanatory views showing the inspection state of the embodiment.

【図4】基板反転部の説明図。FIG. 4 is an explanatory diagram of a substrate reversing unit.

【図5】検査部の説明図。FIG. 5 is an explanatory diagram of an inspection unit.

【図6】従来例の説明図。FIG. 6 is an explanatory diagram of a conventional example.

【符号の説明】[Explanation of symbols]

10…欠品検査装置 11…基板反転部 12…検査部 13…搬送レール 14…実装基板 14B…リード挿通孔 36…検査針 DESCRIPTION OF SYMBOLS 10 ... Missing goods inspection device 11 ... Board reversing part 12 ... Inspection part 13 ... Conveying rail 14 ... Mounting board 14B ... Lead insertion hole 36 ... Inspection needle

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 リードを挿通孔に挿通して複数の電子部
品を取付けた実装基板を反転させて基板裏面を上向きに
する基板反転手段と、 前記基板反転手段により反転された実装基板の夫々挿通
孔に挿通可能な検査針を上方より下降させ、該検査針が
前記挿通孔に挿入されたか否かを検出する検出手段と、
を備えたことを特徴とする欠品検査装置。
1. A board reversing means for reversing a mounting board on which a plurality of electronic components are mounted by inserting a lead into an insertion hole so that a back surface of the board faces upward, and a mounting board reversed by the board reversing means, respectively. A detection unit that lowers the inspection needle that can be inserted into the hole from above and detects whether or not the inspection needle has been inserted into the insertion hole;
A missing item inspection device comprising:
JP06769692A 1992-03-26 1992-03-26 Shortage inspection equipment Expired - Fee Related JP3211338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06769692A JP3211338B2 (en) 1992-03-26 1992-03-26 Shortage inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06769692A JP3211338B2 (en) 1992-03-26 1992-03-26 Shortage inspection equipment

Publications (2)

Publication Number Publication Date
JPH05275899A true JPH05275899A (en) 1993-10-22
JP3211338B2 JP3211338B2 (en) 2001-09-25

Family

ID=13352383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06769692A Expired - Fee Related JP3211338B2 (en) 1992-03-26 1992-03-26 Shortage inspection equipment

Country Status (1)

Country Link
JP (1) JP3211338B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019186925A1 (en) * 2018-03-29 2019-10-03 平田機工株式会社 Working system and work method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019186925A1 (en) * 2018-03-29 2019-10-03 平田機工株式会社 Working system and work method
JPWO2019186925A1 (en) * 2018-03-29 2021-05-27 平田機工株式会社 Work system and work method
US11351639B2 (en) 2018-03-29 2022-06-07 Hirata Corporation Working system and work method

Also Published As

Publication number Publication date
JP3211338B2 (en) 2001-09-25

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