JPH05274391A - Part layout system - Google Patents

Abstract

PURPOSE:To improve the reliability of electronic circuit packages having printed circuit boards and to reduce the man-hours required for the design of printed- circuit board. CONSTITUTION:A generation temperature condition addition section 21 adds generation temperature condition of each parts to arranged data 4 generated by a connection condition arrangement method section 1. A packaging configuration addition section 22 adds packaging configuration information to the arranged data 4. A temperature distribution inspection section 23 performs the inspection of temperature distribution on the arranged data at the present point based on the generation temperature condition and the packaging configuration information added to the arranged data 4. A heat resistant evaluation section 24 evaluates heat resistance on the arranged data 4 at the present point based on the temperature distribution inspection by the temperature distribution inspection section 23 and the heat resistant evaluation of each parts. An layout position change section 25 changes the layout position of parts placed on the printed- circuit board for processing based on the heat resistance evaluation by the section 24.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board design system, and more particularly to a component placement system for determining a placement position of a component on a printed wiring board to be processed in the printed wiring board design system.

[0002]

2. Description of the Related Art Conventionally, in this type of component placement system,
The arrangement position of the component on the printed wiring board has been determined based on the shape of the component and the connection condition between the components. That is, with respect to the condition (generated temperature condition) indicating heat (temperature rise) generated during the operation of each component (during operation of the device on which the printed wiring board is mounted) and the heat generated by itself and other components, The condition (heat resistance condition) indicating the heat resistance of each part (characteristic indicating how much temperature rise can be endured) was not taken into consideration in the arrangement of parts.

[0003]

In the above-described conventional component placement system, since the generated temperature condition and the heat resistance condition regarding each component are not taken into consideration in the component placement, the result is obtained as the processing result of the component placement system. In a printed wiring board (electronic circuit package having the printed wiring board), there is a drawback that deterioration of components and malfunction may occur.

In order to avoid this defect (prevent deterioration of parts and occurrence of malfunction), it is necessary to carry out heat calculation manually in addition to the processing by the part placement system, but such heat calculation was carried out. In this case, there is a problem that the man-hour required for designing the printed wiring board becomes large.

In view of the above points, an object of the present invention is to arrange components on a printed wiring board in consideration of the temperature generation conditions and heat resistance conditions of individual components, and to provide an electronic circuit package having the printed wiring board. An object of the present invention is to provide a component placement system that improves reliability and reduces man-hours required for designing a printed wiring board (improves efficiency of design of printed wiring board).

[0006]

A component placement system of the present invention is a component placement system for determining a placement position of a component on a printed wiring board, wherein a processing target is determined based on the shape of the component and the connection condition between the components. A connection condition etc. placement method section that determines the placement position of the parts placed on the printed wiring board and generates placed data, and the temperature conditions of the generated parts of the placed data generated by this connection condition etc. placement method section. Generated temperature condition addition unit, a mounting form addition unit that adds mounting form information of the printed wiring board to be processed to the arranged data generated by the connection condition etc. arrangement technique unit, and the generated temperature condition addition unit Based on the generated temperature condition added to the arranged data by the and the mounting form information added to the arranged data by the mounting form adding unit, A temperature distribution verification section that performs temperature distribution verification, a heat resistance evaluation section that performs heat resistance evaluation on the already arranged data based on the temperature distribution verification by this temperature distribution verification section and the heat resistance condition of each part, and this heat resistance And a placement position changing unit that changes the placement position of the component placed on the printed wiring board to be processed based on the heat resistance evaluation by the property evaluation unit.

[0007]

In the component placement system of the present invention, the connection condition etc. placement method section determines the placement position of the component to be placed on the printed wiring board to be processed based on the shape of the component and the connection condition between the components. Generated data, the generation temperature condition addition unit adds the generation temperature condition of each component to the arranged data generated by the connection condition etc. placement method unit, and the mounting form addition unit is generated by the connection condition etc. placement method unit. The mounting form information of the printed wiring board to be processed is added to the arranged data, and the temperature distribution verification unit adds the generated temperature condition added by the generated temperature condition addition unit to the arranged data to the arranged data by the mounting form addition unit. Based on the added mounting form information, verify the temperature distribution of the placed data at the present time,
The heat resistance evaluation unit performs heat resistance evaluation on the already arranged data based on the temperature distribution verification by the temperature distribution verification unit and the heat resistance condition of each component, and the arrangement position change unit performs heat resistance evaluation by the heat resistance evaluation unit. Based on this, the arrangement position of the component arranged on the printed wiring board to be processed is changed.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram showing the configuration of an embodiment of the component placement system of the present invention. The component placement system of the present embodiment uses the conventional component placement method for the unplaced data 3 (a component that determines the placement position of the component on the printed wiring board to be processed based on the shape of the component and the connection condition between the components. The conventional placement method unit (connection condition etc. placement method unit) 1 for performing the placement method) to place the components of the printed wiring board to be processed in which the components are not placed, and each component for the placed data 4 In consideration of the temperature conditions (generation temperature condition and heat resistance condition), the temperature condition adding unit 2 for optimizing the temperature condition of the arrangement of the components on the printed wiring board to be processed, and the components are not arranged yet. It is configured to include unplaced data 3 that is data related to the printed wiring board to be processed, placed data 4 that is generated by the conventional placement method unit 1, and placement determination data 5 that is created by the temperature condition addition unit 2. ing. In addition,
The unplaced data 3, the arranged data 4 and the arrangement determination data 5 are the component name (information indicating the type of component) and the information indicating the arrangement position (arrangement of the arrangement position) for each component arranged on the printed wiring board to be processed. The information shown has unset for the non-placed data 3) and the like, and the generated temperature condition and mounting form information are added in the process of the temperature condition addition unit 2.

The temperature condition addition unit 2 includes a generated temperature condition addition unit 21, a mounting form addition unit 22, and a temperature distribution verification unit 23.
The heat resistance evaluation unit 24, the arrangement position change unit 25, the component information data 26, and the input device 27 are included.

FIG. 2 is a diagram showing an example of the structure of the part information data 26. The component information data 26 includes a component name, a generation temperature condition, and a heat resistance condition regarding a component arranged on the printed wiring board to be processed. The component information data 26 shown in FIG. 2 indicates that, for example, a component with the component name “LS00” generates a temperature (heat) of “10 ° C.” during operation and “55”.
It shows that it can withstand heat up to ℃.

Next, the operation of the component placement system of this embodiment having the above configuration will be described.

The conventional placement method unit 1 inputs the unplaced data 3, determines the placement position of the component on the printed wiring board to be processed based on the shape of the component and the connection condition between the components, and Generated placement data 4 to which information indicating the placement position of the component is added to 3 (setting information indicating the placement position of each component that has not been set in the non-placement data 3).

The generated temperature condition adding unit 21 in the temperature condition adding unit 2 stores the arranged data 4 in the arranged data 4 based on the individual component information (information corresponding to each component name) in the component information data 26 as shown in FIG. The generation temperature condition of the component name of the component is added to the information on each component (already-placed component). The generation temperature condition can be added by inputting from the input device 27 instead of referring to the component information data 26 (the same applies to the heat resistance condition reference described later).

Next, the mounting form addition unit 22 is information (mounting form information) indicating whether the printed wiring board to be processed is mounted vertically (standing) or planarly (horizontally).
Is added to the arranged data 4. Note that, here, the mounting form information is instructed to the mounting form addition unit 22 from the input device 27.

The temperature distribution verification unit 23 prints the processing target by a method such as fluid analysis based on the generation temperature condition added by the generation temperature condition addition unit 21 and the mounting form information added by the mounting form adding unit 22. A temperature distribution state on the wiring board (a temperature state of each operating component in the arrangement state indicated by the arrangement completed data 4 at the present time) is obtained.

Next, the heat resistance evaluation unit 24 is in operation in the arrangement state indicated by the arranged data 4 at the present time based on the heat resistance condition of each part (see FIG. 2) obtained from the part information data 26. Evaluate whether each component meets the heat resistance requirements. That is, the temperature of each component under operation evaluated by the temperature distribution verification unit 23 is compared with the temperature indicated by the heat resistance condition of the component to determine whether the former is equal to or lower than the latter (evaluated). If the temperature is below the temperature indicated by the heat resistance condition,
"It means that the part meets the heat resistance requirements").

The arrangement position changing unit 25 is a heat resistance evaluation unit 24.
Based on the result of the heat resistance evaluation (evaluation of whether or not each part satisfies the heat resistance condition), the arrangement position of the part that does not satisfy the heat resistance condition is changed. Here, as a method of changing the arrangement position by the arrangement position changing unit 25, a conventional change method such as a pair exchange method is applied.

The arrangement position changing unit 25 controls the temperature distribution verifying unit 23 together with the arranged data 4 after the arrangement position is changed.
Return to.

The temperature distribution verification unit 23 performs temperature distribution verification (obtaining the temperature distribution state on the printed wiring board to be processed) for the arranged data 4 after the arrangement position is changed, and the heat resistance evaluation unit 24 calculates the temperature. Perform heat resistance evaluation based on distribution verification.

In this way, the processing by the temperature distribution verification unit 23, the heat resistance evaluation unit 24, and the arrangement position change unit 25 eliminates the existence of any part that does not satisfy the heat resistance condition in the heat resistance evaluation by the heat resistance evaluation unit 24. Is repeated until.

When there is no part that does not satisfy the heat resistance condition in the heat resistance evaluation by the heat resistance evaluation section 24,
The heat resistance evaluation unit 24 indicates that the already arranged data 4 at that time
Is output as arrangement determination data 5.

[0023]

As described above, according to the present invention, when arranging components, the arrangement position is determined in consideration of the generation temperature condition and the heat resistance condition regarding each component (the optimization regarding the temperature condition of the component arrangement is performed). By doing so, it is possible to improve the reliability of the electronic circuit package having the printed wiring board (prevent deterioration of parts and malfunctions) and reduce the man-hours required for designing the printed wiring board. There is an effect that can be.

[Brief description of drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.

FIG. 2 is a diagram showing an example of a configuration of part information data in FIG.

[Explanation of symbols]

 1 Conventional placement method part (connection condition etc. placement method part) 2 Temperature condition addition part 3 Unplaced data 4 Placed data 5 Placement decision data 21 Generated temperature condition addition part 22 Mounting form addition part 23 Temperature distribution verification part 24 Heat resistance evaluation Part 25 Arrangement position change part 26 Parts information data 27 Input device

Claims (1)

[Claims] 1. A component placement system for determining a placement position of a component on a printed wiring board, wherein the placement position of the component placed on the printed wiring board to be processed based on the shape of the component and the connection condition between the components. A connection condition equal placement technique unit that determines the generated placement data and a generated temperature condition addition unit that adds the generated temperature condition of each component to the placed data generated by the connection condition equal placement technique unit; A mounting form adding unit that adds mounting form information of the printed wiring board to be processed to the arranged data generated by the condition arrangement unit, and a generated temperature condition added to the arranged data by the generated temperature condition adding unit. A temperature distribution verification unit for performing temperature distribution verification on the arranged data at the present time based on the mounting form information added to the arranged data by the mounting form adding unit; A heat resistance evaluation unit that evaluates the heat resistance of the already arranged data based on the temperature distribution verification by the temperature distribution verification unit and the heat resistance condition of each part, and the processing target based on the heat resistance evaluation by this heat resistance evaluation unit. And a placement position changing unit that changes a placement position of a component placed on the printed wiring board.