JPH0527375Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a thin plate take-out device for mechanically taking out a plurality of stacked thin plates one by one.

<Conventional technology> Thin plates, such as IC lead frames, are made by punching a thin metal plate into a desired pattern using a press.
Plating treatment is performed as appropriate. When processing such IC lead frames, in order to improve processing efficiency, it is conceivable to stack a plurality of these IC lead frames and take them out one by one in succession.

Conventionally, a vacuum suction type device as shown in Japanese Utility Model Application Laid-Open No. 56-104894 and shown in FIG. 6 has been known as a take-out device based on this idea. This conventional example is comprised of a vacuum extraction/conveying device 1 and a mounting device 3 for stacking and mounting a plurality of rectangular IC lead frames 2.

The mounting device 3 includes a mount base 4 on which a plurality of IC lead frames 2 are stacked and placed, and a mount base 4 that is attached to the mount base 4 and supports the IC lead frames 2.
It consists of a holder 5 for positioning the whole in a predetermined position by applying it to two corresponding sides of the holder.

The vacuum removal/conveying device 1 comprises a support plate 6 and a suction box 8 which can be arbitrarily set close to or away from each other along a guide hole 7 provided in the support plate 6. And this suction box 8
A plurality of suction holes 9 are provided on the lower surface of the unit, so that air can be sucked through a suction pipe 10 connected to a suction pump (not shown). Further, the suction box 8 is moved up and down via the support plate 6 by a shaft 11 of an air cylinder attached to the upper surface of the support plate 6.

Therefore, if the lower surface of the suction box 8 is brought into contact with the upper surface of the uppermost IC lead frame 2a of the stacked IC lead frames 2 from above and air is sucked from the suction hole 9, the uppermost IC lead frame 2a will be removed. It is possible to take out and transport it to any position.

<Problems to be solved by the invention> However, with regard to such a take-out device, improvements have been desired in the following points.

That is, the IC lead frame 2 is punched into a complicated and delicate pattern, and there are many openings,
Since there are notches, etc., it is necessary to set a minute part as a suction part avoiding these openings, notches, etc., and to reliably align the suction hole 9 of the suction box 8 with the suction part when taking out and transporting.
Therefore, machining of the suction hole 9 of the suction box 8 requires high accuracy in terms of position, size, etc. Moreover, when IC lead frames 2 having different punching patterns are to be taken out and transported, suction boxes 8 must be prepared and replaced for each type.

Furthermore, even if the position of the suction hole 9 is machined to match the suction part of the IC lead frame 2, the entire suction box 8 moves up and down during all the repeated operations to bring it into contact with the IC lead frame 2. The trajectory must always be reproduced in a consistent manner every time the device operates, and the positioning guide mechanism for this purpose also requires high precision, which tends to make the entire device complicated and expensive.

Furthermore, a vacuum pump, duct, etc. as suction equipment are essential, which increases the size of the device.

The present invention was made by paying attention to such conventional technology, and among the thin plates stacked together,
To provide a thin plate take-out device which makes it possible to securely take out the uppermost thin plate by applying it to one piece, and to do so with a simple structure.

<Means for solving the problem> Specifically, in this invention, claw bodies are arranged facing each other and can be moved toward and away from each other. The thin plate is clamped and taken out by bringing its clamping surface into contact with the topmost thin plate of the state in an inclined state, and the claw bodies are arranged in an opposing state and can move toward and away from each other. To provide a device for taking out a thin plate, which is attached to a pair of holder plates in a hanging state via a leaf spring, and has a gripping surface of a claw body having a rough surface.

<Function> The holder plate is previously stacked and positioned above the uppermost thin plate, and with the pair of claws positioned exactly on both sides of the thin plate, both holder plates are brought close to each other. In this case, the pair of claw bodies approaches both side surfaces of the thin plate, and both holder plates approach each other, so that the clamping surfaces of both claw bodies come into contact with both side faces of the thin plate, but at this time, the leaf spring is bent and each The gripping surface of the claw body is inclined, so to speak, to the side surface of the thin plate, so that it abuts not on the side surface but on the upper edge of the thin plate. Then, if the "rough surfaces" formed on each clamping surface of the pair of claws firmly clamp the upper edge of the thin plate and continue to maintain this clamping state, then both holder plates are moved upward together with the claws. , the uppermost thin plate can be reliably removed one by one.

<Embodiments> Hereinafter, preferred embodiments of the present invention will be described based on the drawings. Incidentally, the same reference numerals are used for parts common to the conventional one, and redundant explanation will be omitted.

1 to 3 show a first embodiment of the present invention.

The rectangular thin plate 2 is attached to the mount base 4 with the corresponding left and right side surfaces 12, 12 held by the holder 5.
Multiple sheets are stacked on top. The gantry base 4 is movable up and down by an air cylinder (not shown), and is set so that the height of the uppermost thin plate 2a is always the same.

A shaft 11 of an air cylinder (not shown) is connected to the center of the support plate 6 and is movable up and down (in the direction of arrow X), left and right (in the direction of arrow Y), and back and forth (in the direction of arrow Z). Two hole-shaped guide holes 7 are provided in parallel. A pair of holder plates 14 are each attached to the lower side of the support plate 6 by guide pins 13 that are movable within the guide hole 7 . At the center of the outer surface of this holder plate 14 is an air cylinder 1 that can move forward and backward horizontally.
5 shafts 16 are connected. That is, both holder plates 14 can be moved toward and away from each other in the left and right directions as the shafts 16, 16 move. Note that an air cylinder (not shown) connected to the support plate 6 and each air cylinder 15 connected to both holder plates 14 are connected to the holder plate 14.
It is attached and supported by a moving mechanism (not shown) so that it can be moved up and down, left and right, and front and back.

A total of four claw bodies 17 are attached to the outer surfaces of both holder plates 14 via leaf springs 18 in a pair at the front and rear, in a hanging state. Each claw body 17
is used to clamp the thin plate 2 from the left and right directions, and the clamping surface 19 of each claw body 17 is a rough surface so that the corresponding upper edges 20 on the left and right of the uppermost thin plate 2a to be clamped are surely caught. It has become rough.

Next, the operation will be explained.

A moving mechanism (not shown) positions the support plate 6 directly above the stacked thin plates 2. At this time, both holder plates 14 are in positions separated by a distance greater than the left and right width of the thin plate 2. Then, each claw body 17 is lowered together with the support plate 6 by the shaft 11 of an air cylinder (not shown), and the opposing surfaces, that is, the clamping surfaces 19 facing each other on the left and right sides of the claw body 17 are lowered together with the support plate 6.
is positioned at a height that faces the left and right side surfaces 21 of the uppermost thin plate 2a. Next, air cylinder 1
5, the two holder plates 14 are brought close to each other, and the spacing between the clamping surfaces 19 of each claw body 17 is reduced. Further, if each claw body 17 is brought close together with the holder plate 14 by the air cylinder 15, each claw body 1
The opposing clamping surfaces 19 of 7 will come into contact with the side surfaces 21 of the thin plate 2, but even after the contact, the claw bodies 17 together with both holder plates 14 continue to be brought close to each other.
The leaf spring 18 is bent, and the clamping surfaces 19 of each claw body 17 come into contact with the corresponding upper edges 20 on the left and right sides of the uppermost thin plate 2a, and clamp them from the left and right sides (FIGS. 2 and 3).
(see figure). As a result, the uppermost thin plate 2a maintains the clamped state due to the biasing force due to the elasticity of the deformed leaf spring 18 and the frictional force between the clamping surface 19 of each claw body 17 and the corresponding upper edge 20. Become. In this state, by stopping the approach of both holder plates 14 and moving the entire supporting plate 6 upward and left and right or front and back, only the uppermost thin plate 2a of the stack can be taken out and transported.

After the entire support plate 6 is conveyed to a predetermined position, both holder plates 14 are separated, and the uppermost thin plate 2a held therebetween can be moved to a predetermined position (for example, on a conveyor belt).

In addition, in the above, when taking out the thin plate 2 in the stacked state, the uppermost thin plate 2 is lifted up.
Of course, the left and right side surfaces 21 of a may be placed at a height such that they face the clamping surface 19 of the claw body 17.

In addition, the number of claw bodies 17 attached to the holder plate 14 via leaf springs 18 was set to four in total, one pair at the front and the other, but the number of claw bodies and the width size of the clamping surface were changed in accordance with the longitudinal dimension of the thin plate 2. Good too.

FIG. 4 shows a second embodiment. In the first embodiment, the clamping surface 19 is a serrated rough surface, but in the second embodiment, it is a twill-like uneven surface.

FIG. 5 shows a third embodiment. In the third embodiment, the gripping surface 19 is made rough by pasting sandpaper 22 on the claw body 17.

In addition, in the above second and third embodiments, the clamping surface 1
The elements other than 9 are the same as those in the first embodiment, so redundant explanation will be omitted.

<Effects> Since the take-out device according to the present invention has the content as explained above, it uses the biasing force due to the elasticity of the deformed leaf spring, and the frictional force between the roughened gripping surface of the claw body and the corresponding upper edge of the thin plate. This has the excellent effect of being able to reliably hold the uppermost thin plate between the mutually opposing claw bodies, and also eliminates the need for conventional vacuum removal and
It has a simpler structure than a conveyance device, and has the additional advantage of being easier to adapt to a variety of devices.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the thin plate removal device, Fig. 2 is a side view seen from the direction of the arrow in Fig. 1, Fig. 3 is a partially enlarged view of the part indicated by the arrow in Fig. 2, and Fig. 4 is the second
FIG. 5 is an enlarged view of the claw body showing the third embodiment, and FIG. 6 is a perspective view corresponding to FIG. 1 showing the conventional example. 2...IC lead frame (thin plate), 2a...Top thin plate, 14...Holder plate, 15...
Air cylinder (moving means), 17...Claw body, 1
8... Leaf spring, 19... Clamping surface.

Claims (1)

[Claims for Utility Model Registration] The device is equipped with claw bodies that are arranged in a state of facing each other and can move toward and away from each other, and these claw bodies move close to each other and touch the uppermost thin plate of a plurality of stacked thin plates. In a thin plate take-out device which grips and takes out the thin plate by bringing their gripping surfaces into contact with each other in an inclined state, the claws 17 are arranged in a pair of holders facing each other and capable of moving toward and away from each other. plate spring 18 on plate 14
A device for taking out a thin plate, characterized in that the device is attached in a hanging state through the device, and the gripping surface 19 of the claw body is made into a rough surface.