JPH05273397A - Device for confirming emission position of radiation - Google Patents

Device for confirming emission position of radiation

Info

Publication number
JPH05273397A
JPH05273397A JP4070894A JP7089492A JPH05273397A JP H05273397 A JPH05273397 A JP H05273397A JP 4070894 A JP4070894 A JP 4070894A JP 7089492 A JP7089492 A JP 7089492A JP H05273397 A JPH05273397 A JP H05273397A
Authority
JP
Japan
Prior art keywords
sample
radiation irradiation
radiation
irradiation position
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4070894A
Other languages
Japanese (ja)
Inventor
Kiyotaka Ishibashi
清隆 石橋
Kazuji Yokoyama
和司 横山
Kenichi Inoue
憲一 井上
Yutaka Kawada
豊 川田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP4070894A priority Critical patent/JPH05273397A/en
Publication of JPH05273397A publication Critical patent/JPH05273397A/en
Pending legal-status Critical Current

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  • Analysing Materials By The Use Of Radiation (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To confirm an emission position of radiation without reference to the thickness change of a sample, by constituting so that an emission position of radiation is displayed on the sample. CONSTITUTION:A slit laser beam 11 perpendicular to an X-Y plane and making longitudinal a plane including the emission axis Z of radiation is emitted on the emission position of radiation of a sample 4. When the surface of the sample 4 is imaged by an image apparatus 6 to be displayed on the scope of a monitor 7, the displayed sample 4 becomes the state displaying a luminous line including the emission position of radiation. Therefore, where a bright line directional to the emission axis of radiation passing through the emission position of radiation of the sample 4 is displayed on the monitor scope by a monitor controller 10, the intersection of the luminous line by the beam 11 and the bright line constantly becomes the emission position of radiation of the sample 4, and the emission position of the sample 4 can be confirmed on the monitor scope without reference to the thickness change of the sample 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は,半導体製造における微
細加工や材料分析における分光分析などを行うために荷
電粒子やX線等の放射線を試料に照射する放射線照射装
置において,試料表面を撮像したモニタ画面上で試料表
面の放射線照射位置を確認するための放射線照射位置確
認装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention images a sample surface in a radiation irradiating device which irradiates a sample with radiation such as charged particles and X-rays for performing microfabrication in semiconductor manufacturing and spectral analysis in material analysis. The present invention relates to a radiation irradiation position confirmation device for confirming a radiation irradiation position on a sample surface on a monitor screen.

【0002】[0002]

【従来の技術】荷電粒子やX線等の放射線を所定位置に
配した試料の表面に照射して,微細加工や分析等を行う
に際して,放射線が試料の所定位置に的確に照射される
ことが重要で,そのため,照射位置を確認する放射線照
射位置確認装置が用いられる。図5に従来の放射線照射
位置確認装置30が使用される状態を模式図として示
す。同図に示されるように,放射線発生装置33から放
射される放射線34は,所定位置に設置された試料ステ
ージ35上に置かれた試料36の表面に照射され,試料
36に対しエッチングや成膜等の微細加工あるいは材料
分析等が行われる。この試料36の所定位置に照射され
る放射線の照射位置を確認するために,放射線照射位置
確認装置30が配置される。放射線照射位置確認装置3
0は,所定位置に配置されて試料36を撮像する撮像器
31と撮像された画像を表示するモニタ32とを具備し
て構成されている。図6はモニタ画面37に表示された
試料36の画像の例を示し,図示表示画像に示すよう
に,撮像器31は放射線34の照射方向の斜め方向から
試料36を撮像している。上記構成による放射線照射位
置を設定するには,放射線による照射が目視できるよう
に,放射線34に照射されることによって発光する発光
材を使用する。まず,試料36と同一の厚さ,形状を有
する前記発光材を試料ステージ35上の所定位置に載置
して放射線34を照射すると,照射された位置が発光す
るので照射位置を目視することができる。そこで,試料
ステージ35の設置位置を調整して放射線照射位置を設
定する。上記の操作により放射線照射位置が設定された
とき,モニタ32に表示される試料36の表面の放射線
照射位置に輝点マーク38が表示されるように表示画面
を構成する。以上の操作により放射線照射位置の設定と
モニタ画面による照射位置確認の準備が完了するので,
試料ステージ35上の発光材に代えて試料36を載置し
て放射線を照射する所定の作業が開始できる。放射線照
射位置の確認は,モニタ画面37上に設定された輝点マ
ーク38により確認される。
2. Description of the Related Art Radiation such as charged particles or X-rays can be accurately applied to a predetermined position of a sample when performing fine processing or analysis by irradiating the surface of a sample placed at a predetermined position. It is important that a radiation irradiation position confirmation device is used to confirm the irradiation position. FIG. 5 schematically shows a state in which the conventional radiation irradiation position confirmation device 30 is used. As shown in the figure, the radiation 34 emitted from the radiation generator 33 is applied to the surface of the sample 36 placed on the sample stage 35 installed at a predetermined position, and the sample 36 is subjected to etching or film formation. Fine processing such as the above or material analysis is performed. A radiation irradiation position confirmation device 30 is arranged in order to confirm the irradiation position of the radiation irradiated to the predetermined position of the sample 36. Radiation irradiation position confirmation device 3
Reference numeral 0 is configured to include an image pickup device 31 arranged at a predetermined position for picking up an image of the sample 36 and a monitor 32 for displaying the picked up image. FIG. 6 shows an example of an image of the sample 36 displayed on the monitor screen 37. As shown in the display image in the figure, the imager 31 images the sample 36 from an oblique direction of the irradiation direction of the radiation 34. In order to set the radiation irradiation position with the above configuration, a light emitting material that emits light by being irradiated with the radiation 34 is used so that the irradiation with the radiation can be visually observed. First, when the luminescent material having the same thickness and shape as the sample 36 is placed at a predetermined position on the sample stage 35 and irradiated with the radiation 34, the irradiated position emits light, so that the irradiation position can be visually checked. it can. Therefore, the installation position of the sample stage 35 is adjusted to set the radiation irradiation position. When the radiation irradiation position is set by the above operation, the display screen is configured so that the bright spot mark 38 is displayed at the radiation irradiation position on the surface of the sample 36 displayed on the monitor 32. By the above operation, the setting of the radiation irradiation position and the preparation of the irradiation position confirmation on the monitor screen are completed.
It is possible to start a predetermined work of placing a sample 36 on the sample stage 35 in place of the light emitting material and irradiating radiation. The confirmation of the radiation irradiation position is confirmed by the bright spot mark 38 set on the monitor screen 37.

【0003】[0003]

【発明が解決しようとする課題】しかしながら,試料3
6の厚さが変わったとき,例えば,図6に破線で示すよ
うに試料36の厚さが薄くなったときには,モニタ画面
38に表示される試料36の表面位置は表示画面の水平
方向にずれるが,前記輝点はモニタ画面上の固定位置に
あるので正確な放射線照射位置を表さず,試料36の厚
さが薄いときの放射線照射位置38′の位置が正確に判
断できない状態となる。図6に示す破線は試料36の厚
さが薄くなった場合であるが,逆に試料36の厚さが厚
くなった場合にも同様に試料36の表面位置が表示画面
の水平方向にずれて放射線照射位置が正確に判断できな
い状態となる。このように従来の放射線照射位置確認装
置においては,試料の厚さが変化したときに正確な放射
線照射位置が判定できず,正確な放射線照射位置を得る
ためには,従来例で示したように発光材により放射線照
射位置を設定しなおすことが必要となる。試料の厚さが
頻繁に変化するような場合においては作業能率は極端に
悪くなる。本発明は上記問題点に鑑み創案されたもの
で,放射線照射位置が試料上に随時表示されるように構
成して,試料の厚さが変化したときにも放射線照射位置
を確認することのできる放射線照射位置確認装置を提供
することを目的とする。
[Problem to be Solved by the Invention] However, sample 3
When the thickness of the sample 6 changes, for example, when the thickness of the sample 36 becomes thin as shown by the broken line in FIG. 6, the surface position of the sample 36 displayed on the monitor screen 38 shifts in the horizontal direction of the display screen. However, since the bright spot is at a fixed position on the monitor screen, it does not represent an accurate radiation irradiation position, and the position of the radiation irradiation position 38 'when the thickness of the sample 36 is thin cannot be accurately determined. The broken line shown in FIG. 6 indicates the case where the thickness of the sample 36 becomes thin, but conversely, when the thickness of the sample 36 becomes thicker, the surface position of the sample 36 shifts in the horizontal direction of the display screen similarly. The radiation irradiation position cannot be accurately determined. As described above, in the conventional radiation irradiation position confirmation apparatus, the accurate radiation irradiation position cannot be determined when the thickness of the sample changes, and in order to obtain the accurate radiation irradiation position, as shown in the conventional example, It is necessary to reset the radiation irradiation position with the light emitting material. When the thickness of the sample changes frequently, the work efficiency becomes extremely poor. The present invention was devised in view of the above problems, and the radiation irradiation position can be displayed on the sample at any time so that the radiation irradiation position can be confirmed even when the thickness of the sample changes. An object is to provide a radiation irradiation position confirmation device.

【0004】[0004]

【課題を解決するための手段】上記目的を達成するため
に本発明が採用する第1の手段は,レーザ光を1本使用
するもので,所定位置に放射線発生装置と試料とが配置
され,前記放射線発生装置から放射される放射線により
照射される前記試料表面を前記放射線照射方向の斜め方
向の所定位置から撮像器により撮像し,モニタ画面によ
り前記試料表面上の放射線照射位置を確認するための放
射線照射位置確認装置において,前記放射線照射軸と前
記撮像軸とを含む平面と直交し,前記放射線照射軸を含
む第1の面を長手方向とする第1のスリットレーザ光を
前記試料表面の放射線照射位置に照射する第1のレーザ
光源と,前記モニタ画面上に表示された前記試料表面の
放射線照射位置を通り前記第1の面に直交する輝線を表
示するモニタ制御装置とを具備してなることを特徴とす
る放射線照射位置確認装置として構成される。また,本
発明が採用する第2の手段は,レーザ光を2本使い,所
定位置に放射線発生装置と試料とが配置され,前記放射
線発生装置から放射される放射線により照射される前記
試料表面を前記放射線照射方向の斜め方向の所定位置か
ら撮像器により撮像し,モニタ画面により前記試料表面
上の放射線照射位置を確認するための放射線照射位置確
認装置において,前記放射線照射軸と前記撮像軸とを含
む平面と直交し,前記放射線照射軸を含む第1の面を長
手方向とする第1のスリットレーザ光を前記試料表面の
放射線照射位置に照射する第1のレーザ光源と,前記第
1の面に直交し前記放射線照射軸を含む第2の面を長手
方向とする第2のレーザ光を前記試料表面の放射線照射
位置に照射する第2のレーザ光源とを具備してなること
を特徴とする放射線照射位置確認装置として構成され
る。
In order to achieve the above object, the first means adopted by the present invention is to use one laser beam, in which a radiation generator and a sample are arranged at predetermined positions. For confirming the radiation irradiation position on the sample surface on the monitor screen by imaging the sample surface irradiated by the radiation emitted from the radiation generator from a predetermined position in a diagonal direction of the radiation irradiation direction with an imager In the radiation irradiation position confirmation apparatus, a first slit laser beam, which is orthogonal to a plane including the radiation irradiation axis and the imaging axis and has a first surface including the radiation irradiation axis as a longitudinal direction, is irradiated onto the sample surface. A first laser light source for irradiating an irradiation position and a monitor control for displaying a bright line passing through a radiation irradiation position of the sample surface displayed on the monitor screen and orthogonal to the first surface. Configured as a radiation position checking apparatus characterized by comprising; and a location. A second means adopted by the present invention is to use two laser beams, arrange a radiation generating device and a sample at a predetermined position, and irradiate the sample surface irradiated with the radiation emitted from the radiation generating device. In a radiation irradiation position confirmation device for capturing an image from a predetermined position in a diagonal direction of the radiation irradiation direction by an imager and confirming the radiation irradiation position on the sample surface on a monitor screen, the radiation irradiation axis and the imaging axis are A first laser light source for irradiating a radiation irradiation position on the sample surface with a first slit laser light which is orthogonal to a plane including the radiation and has a first surface including the radiation irradiation axis as a longitudinal direction; and the first surface A second laser light source for irradiating a radiation irradiation position on the sample surface with a second laser light having a second surface which is orthogonal to and has the radiation irradiation axis as a longitudinal direction. Irradiation configured as position confirmation device that.

【0005】[0005]

【作用】本発明の第1の手段によれば,放射線により照
射される試料の放射線照射位置に放射線照射軸と前記撮
像軸とを含む平面と直交し放射線照射軸を含む第1の面
を長手方向とする第1のスリットレーザ光を照射して,
これを撮像器により撮像してモニタ画面上に表示するこ
とにより,試料表面の放射線照射位置を含む発光ライン
が表示された試料の状態を見ることができる。そこで,
モニタ制御装置によりモニタ画面上に試料の放射線照射
位置を通過する放射線照射軸方向の輝線を表示するよう
に制御すると,この輝線と前記第1のレーザ光による発
光ラインとの交点が常に放射線照射位置となるので,こ
の交点が試料の放射線照射位置にあることをモニタ画面
上で確認することにより,放射線照射位置を容易に確認
することができる。試料の厚さが変化したときにも,試
料の厚さに対応して前記発光ラインの位置が輝線上にず
れるので,試料の厚さの変化にかかわりなく放射線照射
位置を確認することができる。また,本発明の第2の手
段によれば,放射線照射軸と前記撮像軸とを含む平面と
直交し放射線照射軸を含む第1の面を長手方向とする第
1のスリットレーザ光と,前記第1の面に直交し前記放
射線照射軸を含む第2の面長手方向とする第2のスリッ
トレーザ光とを試料表面の放射線照射位置に照射して,
これを撮像器により撮像してモニタ画面上に表示するこ
とにより,第1のスリットレーザ光による発光ラインと
第2のスリットレーザ光との交点が常に放射線照射位置
となるので,この交点が試料の放射線照射位置にあるこ
とをモニタ画面上で確認することにより,放射線照射位
置を容易に確認することができる。試料の厚さが変化し
たときにも,前記第1のレーザ光による発光ラインの位
置が第2のレーザ光による発光ライン上に試料の厚さに
対応してずれるので,試料の厚さにかかわらず放射線照
射位置を確認することができる。
According to the first means of the present invention, the first surface including the radiation irradiation axis, which is orthogonal to the plane including the radiation irradiation axis and the imaging axis, is elongated at the radiation irradiation position of the sample irradiated with the radiation. By irradiating the first slit laser light that is directed to
By imaging this with an imager and displaying it on the monitor screen, the state of the sample in which the emission line including the radiation irradiation position on the sample surface is displayed can be seen. Therefore,
When the monitor control device controls to display on the monitor screen a bright line in the radiation irradiation axis direction that passes through the radiation irradiation position of the sample, the intersection of this bright line and the emission line of the first laser beam is always at the radiation irradiation position. Therefore, the radiation irradiation position can be easily confirmed by confirming on the monitor screen that this intersection is at the radiation irradiation position of the sample. Even when the thickness of the sample changes, the position of the light emitting line shifts on the bright line corresponding to the thickness of the sample, so that the radiation irradiation position can be confirmed regardless of the change in the thickness of the sample. Further, according to the second means of the present invention, a first slit laser beam having a first surface orthogonal to a plane including the radiation irradiation axis and the imaging axis and having a radiation irradiation axis as a longitudinal direction, A second slit laser beam, which is orthogonal to the first surface and is in the second surface longitudinal direction including the radiation irradiation axis, is irradiated to the radiation irradiation position on the sample surface,
By imaging this with an imager and displaying it on the monitor screen, the intersection of the emission line of the first slit laser light and the second slit laser light is always the radiation irradiation position. By confirming that the radiation irradiation position is on the monitor screen, the radiation irradiation position can be easily confirmed. Even when the thickness of the sample is changed, the position of the emission line of the first laser beam is shifted on the emission line of the second laser beam in correspondence with the thickness of the sample. Instead, it is possible to confirm the radiation irradiation position.

【0006】[0006]

【実施例】以下,添付図面を参照して本発明を具体化し
た実施例につき説明し,本発明の理解に供する。尚,以
下の実施例は本発明を具体化した一例であって,本発明
の技術的範囲を限定するものではない。ここに,図1は
本発明の第1実施例に係る放射線照射位置確認装置の構
成を示す模式図,図2は図1に示す構成においてモニタ
画面上に表示される画像図,図3は本発明の第2実施例
に係る放射線照射位置確認装置の構成を示す模式図,図
4は図3に示す構成におけるモニタ画面上に表示される
画像図である。まず,本発明の第1実施例について説明
する。図1において,所定位置に配された放射線発生装
置1と試料ステージ3とを具備して放射線照射装置が構
成されており,前記試料ステージ3上に試料4を載置し
て,これに放射線発生装置から放射線が照射され,微細
加工や分光分析等の所定作業がなされる。この放射線照
射装置においては試料の所定照射位置に正確に放射線が
照射されていることを確認するために,本実施例に係る
放射線照射位置確認装置5が設置される。放射線照射位
置確認装置5は,前記放射線照射方向(Z軸方向)の斜
め方向から試料4の表面を撮像する撮像器6と,撮像さ
れた画像を表示するモニタ7と,モニタ7への画像表示
を制御するモニタ制御装置10と,前記放射線照射軸Z
と撮像軸とを含むX−Z平面と直交し放射線照射軸Zを
含むY軸方向を長手方向とする第1のスリットレーザ光
11を試料4の放射線照射位置に照射する第1のレーザ
光源12とを具備して構成されている。上記のように構
成された放射線照射位置確認装置5において,モニタ7
に表示される画像は図2に示すようになる。即ち,モニ
タ7の画面8に表示される画像には,表面に前記第1の
スリットレーザ光11によるY方向の発光ライン13が
生じた試料4が表示されており,さらに,モニタ画面8
上には試料4表面の放射線照射位置を通る放射線照射軸
Z方向の輝線14が表示されている。この輝線14はモ
ニタ制御装置により画面8上の放射線照射方向に該当す
る画素を線状に発光させることにより表示される。図2
から明らかなように,いったん上記発光ライン13が放
射線照射位置9で交わるように上記画面8上の輝線14
の位置を設定すれば,試料4の厚みが変わっても発光ラ
イン13と輝線14との交点が常に所定の放射線照射位
置9となるため,第1のレーザ光源12を随時動作させ
第1のレーザ光11により試料4の表面を発光させた状
態をモニタ7により観察すれば放射線照射位置を確認す
ることができる。従って,試料4の厚さが変わったとき
にも,前記発光ライン13と輝線14との交点が放射線
照射位置となる。
Embodiments of the present invention will be described below with reference to the accompanying drawings for the understanding of the present invention. The following embodiments are examples of embodying the present invention and do not limit the technical scope of the present invention. 1 is a schematic diagram showing the configuration of the radiation irradiation position confirmation apparatus according to the first embodiment of the present invention, FIG. 2 is an image diagram displayed on a monitor screen in the configuration shown in FIG. 1, and FIG. FIG. 4 is a schematic diagram showing the configuration of the radiation irradiation position confirmation apparatus according to the second embodiment of the invention, and FIG. 4 is an image diagram displayed on the monitor screen in the configuration shown in FIG. First, a first embodiment of the present invention will be described. In FIG. 1, a radiation irradiation device is configured by including a radiation generator 1 and a sample stage 3 arranged at predetermined positions, and a sample 4 is placed on the sample stage 3 to generate radiation. Radiation is emitted from the device, and predetermined work such as microfabrication and spectroscopic analysis is performed. In this radiation irradiating device, a radiation irradiating position confirming device 5 according to the present embodiment is installed in order to confirm that the predetermined irradiating position of the sample is accurately irradiated with the radiation. The radiation irradiation position confirmation device 5 includes an imager 6 that images the surface of the sample 4 from an oblique direction of the radiation irradiation direction (Z-axis direction), a monitor 7 that displays the captured image, and an image display on the monitor 7. Control device 10 for controlling the radiation, and the radiation irradiation axis Z
A first laser light source 12 for irradiating a radiation irradiation position of the sample 4 with a first slit laser light 11 which is orthogonal to an X-Z plane including the image pickup axis and has a Y-axis direction including the radiation irradiation axis Z as a longitudinal direction. And is configured. In the radiation irradiation position confirmation device 5 configured as described above, the monitor 7
The image displayed at is as shown in FIG. That is, in the image displayed on the screen 8 of the monitor 7, the sample 4 having the emission line 13 in the Y direction generated by the first slit laser beam 11 on its surface is displayed.
A bright line 14 in the radiation irradiation axis Z direction passing through the radiation irradiation position on the surface of the sample 4 is displayed above. The bright line 14 is displayed by causing the pixels corresponding to the radiation irradiation direction on the screen 8 to linearly emit light by the monitor control device. Figure 2
As is clear from the above, once the emission line 13 intersects at the radiation irradiation position 9, the bright line 14 on the screen 8
If the position of is set, the intersection of the emission line 13 and the bright line 14 is always at the predetermined radiation irradiation position 9 even if the thickness of the sample 4 is changed. Therefore, the first laser light source 12 is operated at any time and the first laser light source 12 is operated. The radiation irradiation position can be confirmed by observing on the monitor 7 the state in which the surface of the sample 4 is caused to emit light by the light 11. Therefore, even when the thickness of the sample 4 changes, the intersection of the emission line 13 and the bright line 14 becomes the radiation irradiation position.

【0007】次に,本発明の第2実施例について説明す
る。以下の説明において,先の第1実施例と同一の要素
には同一の符号を付して,その説明は省略する。図3に
おいて,放射線発生装置1と試料ステージ3とが所定位
置に配され,前記試料ステージ3上に試料4を載置して
放射線照射装置が構成されている。この構成における放
射線照射位置を確認するために本実施例に係る放射線照
射位置確認装置15が設置されている。放射線照射位置
確認装置15は,前記放射線照射方向(Z軸方向)の斜
め方向から試料4の表面を撮像する撮像器6と,撮像さ
れた画像を表示するモニタ7と,前記放射線照射軸Zと
撮像軸とを含むX−Z平面と直交し放射線照射軸Zを含
むY軸方向を長手方向とする第1のスリットレーザ光1
1を試料4の放射線照射位置に照射する第1のレーザ光
源12と,前記放射線照射軸Zと撮像軸とを含むX−Z
平面を長手方向とする第2のスリットレーザ光21を試
料4の放射線照射位置に照射する第2のレーザ光源22
とを具備して構成されている。上記のように構成された
放射線照射位置確認装置15による試料4の撮像画像
は,図4に示すようになる。即ち,モニタ7の画面18
に表示された試料ステージ3上に載置された試料4に
は,その表面に前記第1のスリットレーザ光11による
Y方向のスリット発光による第1の発光ライン13と,
前記第2のスリットレーザ光21によるX方向のスリッ
ト発光による第2の発光ライン23とが撮像されてい
る。従って,第1の発光ライン13と第2の発光ライン
23との交点が所定の放射線照射位置9を示すことにな
る。図4から明らかなように,いったん上記第1の発光
ライン13と第2の発光ライン23とが放射線照射位置
9で交わるように設定すれば,試料4の厚みが変わって
も第1の発光ライン13と第2の発光ライン23との交
点が所定の放射線照射位置9となるため,第1のレーザ
光源12と第2のレーザ光源22とを随時動作させ,第
1のスリットレーザ光11と第2のスリットレーザ光2
1とにより試料4の表面を発光させた状態をモニタ7に
より観察すれば放射線照射位置を確認することができ
る。
Next, a second embodiment of the present invention will be described. In the following description, the same elements as those of the first embodiment described above are designated by the same reference numerals and the description thereof will be omitted. In FIG. 3, the radiation generator 1 and the sample stage 3 are arranged at predetermined positions, and the sample 4 is placed on the sample stage 3 to form a radiation irradiation device. In order to confirm the radiation irradiation position in this configuration, the radiation irradiation position confirmation device 15 according to this embodiment is installed. The radiation irradiation position confirmation device 15 includes an imager 6 that images the surface of the sample 4 from an oblique direction of the radiation irradiation direction (Z-axis direction), a monitor 7 that displays the captured image, and the radiation irradiation axis Z. First slit laser light 1 having a Y-axis direction orthogonal to the X-Z plane including the imaging axis and including the radiation irradiation axis Z as a longitudinal direction
XZ including a first laser light source 12 for irradiating the radiation irradiation position of the sample 4 with 1 and the radiation irradiation axis Z and the imaging axis.
A second laser light source 22 for irradiating the radiation irradiation position of the sample 4 with the second slit laser light 21 having the plane as the longitudinal direction.
And is configured. The captured image of the sample 4 by the radiation irradiation position confirmation device 15 configured as described above is as shown in FIG. That is, the screen 18 of the monitor 7
On the surface of the sample 4 placed on the sample stage 3 shown in FIG. 1, a first emission line 13 is formed by slit emission in the Y direction by the first slit laser beam 11, and
An image of the second emission line 23 formed by slit emission in the X direction by the second slit laser light 21 is captured. Therefore, the intersection of the first light emitting line 13 and the second light emitting line 23 indicates the predetermined radiation irradiation position 9. As is clear from FIG. 4, once the first light emitting line 13 and the second light emitting line 23 are set to intersect at the radiation irradiation position 9, the first light emitting line is changed even if the thickness of the sample 4 is changed. Since the intersection of 13 and the second light emission line 23 becomes the predetermined radiation irradiation position 9, the first laser light source 12 and the second laser light source 22 are operated at any time, and the first slit laser light 11 and 2 slit laser light 2
By observing the state where the surface of the sample 4 is caused to emit light by means of 1 and the monitor 7, the radiation irradiation position can be confirmed.

【0008】[0008]

【発明の効果】以上の説明の通り本発明の第1の手段に
よれば,放射線により照射される試料の放射線照射位置
に放射線照射軸と前記撮像軸とを含む平面と直交し放射
線照射軸を含む第1の面を長手方向とする第1のスリッ
トレーザ光を照射して,これを撮像器により撮像してモ
ニタ画面上に表示することにより,試料表面の放射線照
射位置を含む発光ラインが表示された試料の状態で見る
ことができる。そこで,モニタ制御装置によりモニタ画
面上に試料の放射線照射位置を通過する放射線照射軸方
向の輝線を表示するように制御すると,この輝線と前記
第1のスリットレーザ光による発光ラインとの交点が常
に放射線照射位置となるので,この交点が試料の放射線
照射位置にあることをモニタ画面上で確認することによ
り,放射線照射位置を容易に確認することができる。ま
た,本発明の第2の手段によれば,放射線照射軸と前記
撮像軸とを含む平面と直交し放射線照射軸を含む第1の
面を長手方向とする第1のスリットレーザ光と,前記第
1の面に直交し前記放射線照射軸を含む第2の面を長手
方向とする第2のスリットレーザ光とを試料表面の放射
線照射位置に照射して,これを撮像器により撮像してモ
ニタ画面上に表示することにより,第1のスリットレー
ザ光による発光ラインと第2のスリットレーザ光との交
点が常に放射線照射位置となるので,この交点が試料の
放射線照射位置にあることをモニタ画面上で確認するこ
とにより,放射線照射位置を容易に確認することができ
る。従って,本発明によれば,試料の厚さの変化にかか
わりなくスリットレーザ光による発光ラインと輝線との
交点,あるいは直交する2つのスリットレーザ光の交点
が放射線照射位置を示すので,それらの交点が試料表面
の放射線照射位置にあることをモニタ画面上で観察する
ことにより,試料厚さにかかわりなく正確に放射線照射
位置を確認することができる効果を奏する。
As described above, according to the first means of the present invention, the radiation irradiation axis of the sample irradiated with the radiation is orthogonal to the plane including the radiation irradiation axis and the imaging axis. By irradiating the first slit laser light having the first surface including the first surface as the longitudinal direction, imaging the image with the first slit laser light and displaying it on the monitor screen, the emission line including the radiation irradiation position on the sample surface is displayed. It can be seen in the state of the prepared sample. Therefore, when the monitor control device is controlled to display a bright line in the radiation irradiation axis direction passing through the radiation irradiation position of the sample on the monitor screen, the intersection of this bright line and the emission line of the first slit laser light is always present. Since it is the radiation irradiation position, the radiation irradiation position can be easily confirmed by confirming on the monitor screen that this intersection is at the radiation irradiation position of the sample. Further, according to the second means of the present invention, a first slit laser beam having a first surface orthogonal to a plane including the radiation irradiation axis and the imaging axis and having a radiation irradiation axis as a longitudinal direction, A second slit laser beam having a second surface orthogonal to the first surface and including the radiation irradiation axis as a longitudinal direction is irradiated to a radiation irradiation position on the surface of the sample, and this is imaged by an imager to be monitored. By displaying it on the screen, the intersection of the emission line of the first slit laser light and the second slit laser light is always the radiation irradiation position. Therefore, it is necessary to monitor that this intersection is at the radiation irradiation position of the sample. By checking the above, the radiation irradiation position can be easily confirmed. Therefore, according to the present invention, the intersection of the emission line and the bright line by the slit laser light or the intersection of two slit laser lights orthogonal to each other indicates the radiation irradiation position regardless of the change in the thickness of the sample. By observing on the monitor screen that the irradiation position is on the surface of the sample, the irradiation position can be confirmed accurately regardless of the sample thickness.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の第1実施例に係る放射線照射位置確
認装置の模式図。
FIG. 1 is a schematic diagram of a radiation irradiation position confirmation apparatus according to a first embodiment of the present invention.

【図2】 第1実施例に係るモニタの表示画面図。FIG. 2 is a display screen diagram of a monitor according to the first embodiment.

【図3】 本発明の第2実施例に係る放射線照射位置確
認装置の模式図。
FIG. 3 is a schematic diagram of a radiation irradiation position confirmation device according to a second embodiment of the present invention.

【図4】 第2実施例に係るモニタの表示画面図。FIG. 4 is a display screen diagram of a monitor according to a second embodiment.

【図5】 従来例の放射線照射位置確認装置の模式図。FIG. 5 is a schematic view of a conventional radiation irradiation position confirmation device.

【図6】 従来例に係るモニタの表示画面図。FIG. 6 is a display screen diagram of a monitor according to a conventional example.

【符号の説明】[Explanation of symbols]

1──放射線発生装置 3──試料ステージ 4──試料 5,25──放射線照射位置確認装置 6──撮像器 7──モニタ 9──放射線照射位置 11──第1のスリットレーザ光 12──第1のレーザ光源 14──輝線 21──第2のスリットレーザ光 22──第2のレーザ光源 1-Radiation generator 3--Sample stage 4--Sample 5,25-Radiation irradiation position confirmation device 6-Imager 7-Monitor 9-Radiation irradiation position 11-First slit laser beam 12 --First laser light source 14 --Bright line 21 --Second slit laser light 22 --Second laser light source

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 所定位置に放射線発生装置と試料とが配
置され,前記放射線発生装置から放射される放射線によ
って照射される前記試料表面を前記放射線照射方向の斜
め方向の所定位置から撮像器により撮像し,モニタ画面
により前記試料表面上の放射線照射位置を確認するため
の放射線照射位置確認装置において, 前記放射線照射軸と前記撮像軸とを含む平面と直交し,
前記放射線照射軸を含む第1の面を長手方向とする第1
のスリットレーザ光を前記試料表面の放射線照射位置に
照射する第1のレーザ光源と,前記モニタ画面上に表示
された前記試料表面の放射線照射位置を通り前記第1の
面に直交する輝線を表示するモニタ制御装置とを具備し
てなることを特徴とする放射線照射位置確認装置。
1. A radiation generator and a sample are arranged at a predetermined position, and the surface of the sample irradiated with the radiation emitted from the radiation generator is imaged by a camera from a predetermined position oblique to the radiation irradiation direction. Then, in a radiation irradiation position confirmation device for confirming the radiation irradiation position on the surface of the sample on a monitor screen, in a plane orthogonal to the plane including the radiation irradiation axis and the imaging axis,
A first surface having a first surface including the radiation irradiation axis as a longitudinal direction
A first laser light source for irradiating the radiation irradiation position on the sample surface with the slit laser light, and a bright line passing through the radiation irradiation position on the sample surface displayed on the monitor screen and orthogonal to the first surface. A radiation irradiation position confirmation device, comprising:
【請求項2】 所定位置に放射線発生装置と試料とが配
置され,前記放射線発生装置から放射される放射線によ
り照射される前記試料表面を前記放射線照射方向の斜め
方向の所定位置から撮像器により撮像し,モニタ画面に
より前記試料表面上の放射線照射位置を確認するための
放射線照射位置確認装置において, 前記放射線照射軸と前記撮像軸とを含む平面と直交し,
前記放射線照射軸を含む第1の面を長手方向とする第1
のスリットレーザ光を前記試料表面の放射線照射位置に
照射する第1のレーザ光源と,前記第1の面に直交し前
記放射線照射軸を含む第2の面を長手方向とする第2の
スリットレーザ光を前記試料表面の放射線照射位置に照
射する第2のレーザ光源とを具備してなることを特徴と
する放射線照射位置確認装置。
2. A radiation generator and a sample are arranged at a predetermined position, and the surface of the sample irradiated with the radiation emitted from the radiation generator is imaged by a camera from a predetermined position in a diagonal direction of the radiation irradiation direction. Then, in a radiation irradiation position confirmation device for confirming the radiation irradiation position on the surface of the sample on a monitor screen, in a plane orthogonal to the plane including the radiation irradiation axis and the imaging axis,
A first surface having a first surface including the radiation irradiation axis as a longitudinal direction
Laser light source for irradiating the radiation irradiation position on the surface of the sample with the slit laser light, and a second slit laser having a second surface orthogonal to the first surface and including the radiation irradiation axis as a longitudinal direction. A radiation irradiation position confirmation device, comprising: a second laser light source for irradiating light onto a radiation irradiation position on the surface of the sample.
JP4070894A 1992-03-27 1992-03-27 Device for confirming emission position of radiation Pending JPH05273397A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4070894A JPH05273397A (en) 1992-03-27 1992-03-27 Device for confirming emission position of radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4070894A JPH05273397A (en) 1992-03-27 1992-03-27 Device for confirming emission position of radiation

Publications (1)

Publication Number Publication Date
JPH05273397A true JPH05273397A (en) 1993-10-22

Family

ID=13444698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4070894A Pending JPH05273397A (en) 1992-03-27 1992-03-27 Device for confirming emission position of radiation

Country Status (1)

Country Link
JP (1) JPH05273397A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190002377U (en) * 2018-03-15 2019-09-25 두산중공업 주식회사 Guide jig for attaching film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190002377U (en) * 2018-03-15 2019-09-25 두산중공업 주식회사 Guide jig for attaching film

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