JPH0526958A - Carrier for lcc package - Google Patents

Abstract

PURPOSE:To mechanically protect the package fed through a tester in a carrier for an LCC package. CONSTITUTION:A carrier for an LCC package is constituted of a substrate 1 and movable support members 2. The LCC package 3 is mounted on the central part of the substrate 1 facedown and the long grooves 1a directed toward the central part of the substrate 1 are provided to four corners of the substrate 1. Each of the movable support members 2 has the erected pawl 2a at the tip part thereof and the tongue pieces 2b respectively provided to both side surfaces of the pawl 2a in an erected state and is composed of a spring material. The tongue pieces 2b are engaged with each groove a of the substrate 1 to advance and recede in a slidable manner and, when the movable support members 2 advance, the pawls 2a elastically press four respective corners of the rear of the LCC package 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LCC package carrier, and more particularly, to mechanically protect an LCC packaged semiconductor device carried in a test apparatus.
A carrier for holding a package.

In recent years, the progress of large-scale integration of semiconductor devices has been remarkable, but on the other hand, the miniaturization of semiconductor device packages has been vigorously promoted in response to the miniaturization of electronic equipment. The semiconductor device package can be classified into various types, and can be divided into a leaded type and a so-called leadless type without leads.

A package called LCC (leadless chip carrier) is a low-profile leadless package that can be surface-mounted, and leads are more prominent than a low-profile flat-pack package that can be surface-mounted. This is a package form that contributes to the miniaturization and thinning of equipment, since the mounting area can be reduced by the amount not required.

On the other hand, electronic devices such as semiconductor devices are
No matter how well the design is designed and the manufacturing process is well controlled, some defective products are mixed in, and it is unavoidable as an essential problem especially in a large-scale integrated circuit with a high degree of integration. However, on the other hand, it is inevitable that it will have a major impact on various fields such as social life.

Therefore, in the various manufacturing processes that pass through until the semiconductor device is completed, the inspection process such as product inspection or reliability inspection of the semiconductor device that passes last is not only for improving productivity, It is also a very important process for the manufacturer to guarantee the quality of the semiconductor device and prevent the defective product from being mixed into the product and causing a failure.

A semiconductor device testing apparatus used in this inspection process is generally called a handler,
A transportation system for unloading is attached so that semiconductor devices can be automatically inspected. However, since the LCC is a leadless package, it is important how to handle the carrier in a transport system stably and efficiently.

[0007]

2. Description of the Related Art FIG. 5 is a perspective view of an example of an LCC package, FIG. 5 (A) is a bottom perspective view, FIG. 5 (B) is a top perspective view, and FIG. 6 is an example of a conventional test apparatus. 6A is a schematic configuration diagram, and FIG. 6B is a perspective view of a main part. In the figure, 3 is an LCC package, 3a
Is an electrode pad, 4 is a DUT, 5 is a preheat part, 6 is a transfer part, 7 is a contact part, 8 is a chamber, 11
Is a loader, 12 is an input, 13 is a top carrier, 14 is an orienter, 15 is a sorter, 16 is a stocker rail, and 17 is an unloader.

In FIG. 5, the LCC package 3 includes a ceramic package and a plastic package, but in any package form, the leads do not protrude from the wall surface of the package. Then, solderable electrode pads 3a are arranged in parallel on the peripheral edge of the back surface of the package.

When mounting the LCC package 3 on a printed board, for example, the electrode pads 3a are directly soldered to the conductor surface of the printed board by solder reflow or the like. Therefore, the mounting area can be reduced within the shadow area of the package. Another advantage is that parasitic elements such as capacitance can be kept to a minimum because there is no lead.

Therefore, the LCC package 3 is not only a package that can be made lighter, thinner, shorter, and smaller for various electronic devices, but also a package suitable for applications requiring high-speed and high-frequency characteristics.

By the way, the step of inspecting a semiconductor device is carried out in a state where the final product form is finished after the assembling step of mounting, bonding and sealing the semiconductor chip is completed.

In FIG. 6A, the test apparatus in the inspection process has a preheat section 5, a transfer section 6, and a contact section 7 along a path along which various DUTs 4 such as semiconductor devices packaged in LCC move. The chambers 8 are continuously arranged in the chamber 8. A roof and a rail (not shown) are provided in a vertically opposed pair in each of the parts 5, 6 and 7, and the DUT 4 moves while being guided by being sandwiched between the roof and the rail. It is like this.

A transport system for loading and unloading the DUT 4 is provided at the inlet and outlet of the chamber 8. Then, according to a predetermined procedure, the DUT 4 is fed into the chamber 8 or is sorted and taken out.

In FIG. 6B, first, the DUT 4 stored in a magazine or the like is inserted into the loader 11 which is inclined downward and is attached in an inclined state, and is fed into the conveying system. Then, the DUTs 4 are taken out one by one by the input 12, move in the lateral direction, are distributed to the plurality of top carriers 13, and are fed to the preheat section 5.

The preheat portions 5 are arranged in parallel downwardly corresponding to the respective top carriers 13. Then, the DUT 4 is preheated to a predetermined temperature and adjusted in temperature while moving through the preheat section 5. Then, the transfer section 6 changes the direction to the vertical direction so that the DUT 4 becomes lateral and moves to the contact section 7.

The contact portion 7 is provided vertically,
The DUT 4 turns sideways and moves while naturally falling. The contact portion 7 corresponds to a so-called IC socket that is often used in a semiconductor device testing apparatus, and the DUT 4 that has dropped is stopped at a predetermined position by a stop means (not shown). . When the DUT 4 is LCC-packaged, a contact called a pogo pin is elastically contacted horizontally from the electrode pad on the back side of the DUT 4 having a sideways orientation to perform an electrical test. Then, the DUT 4 for which the test has been completed is sent to the transport system.

Upon leaving the contact portion 7, the DUT 4 having undergone the test is deflected by the orienter 14 from the vertical direction to the downwardly inclined direction and enters the sorter 15. This sorter 15 moves laterally to move the DUT 4 to a non-defective product,
It is distributed according to characteristics such as defective products. The distributed DUTs 4 are temporarily stored in the stocker rails 16 and then stored in a magazine or the like inserted in the unloader 17 and carried out.

[0018]

As described above, in the semiconductor device testing apparatus, the object to be tested is transported by using gravity, and the loading, temperature adjustment, and unloading are performed at an inclined position. It is carried out by sliding between the roof and rails installed, and at the contact part to be tested, it is carried out by letting the roof and rails vertically arranged fall naturally.

Therefore, when the object to be tested is an LCC package, if the package is subjected to an inspection process until it is exposed as it is, the packages are
Alternatively, it may collide with a stopping means or the like to receive an impact, and the package surface may be scratched or cracked, resulting in a defective appearance or defective characteristics, often resulting in a defective product.

In addition, the inspection process is performed at the highest value-added stage in the semiconductor device manufacturing process. for that reason,
There is a problem that not only the processing efficiency of the inspection process is deteriorated, but also the productivity of the entire semiconductor device manufacturing process is deteriorated.

Therefore, the present invention has an object to provide a carrier for holding a package in order to mechanically protect an LCC-packaged semiconductor device carried in a test apparatus.

[0022]

The above-mentioned problems include a substrate and a movable supporting member, wherein the substrate has an LC
The C package is placed face down, and long grooves toward the center are formed at the four corners, and the movable support member includes a bent claw at the projecting end.
The movable support member has a curved tongue on each of the opposite side surfaces, and is made of a spring material.
The tongue engages with the long groove of the substrate and moves forward and backward while sliding, and the claws elastically press the four corners of the back surface of the LCC package when moving forward. It is solved by a carrier for a structured LCC package.

[0023]

In the test in the inspection process of the LCC packaged semiconductor device, conventionally, the device was moved in the bare bare test device, whereas in the present invention,
I am trying to hold it in the carrier. That is, long grooves toward the center are provided at the four corners of the substrate, and the movable supporting members are engaged with the long grooves so that they can slide forward and backward.

By the way, when the LCC package is placed face down on the substrate, pads are juxtaposed in the peripheral portion of the back surface, but the four corners are open. Therefore, the four corners of the LCC package are elastically stopped by the claws provided at the projecting end of the movable support member.

With this configuration, it is possible to prevent a shock from being directly applied to the package when the LCC-packaged semiconductor device moves in the test apparatus, so that the inspection process can be rationalized.

[0026]

1 is a perspective view of a first embodiment of the present invention, FIG.
1 is an enlarged perspective view of a main part of FIG. 1, FIG. 3 is a perspective view of a second embodiment of the present invention, and FIG. 4 is a schematic perspective view of a third embodiment of the present invention. In the figure, 1 is a substrate, 1a is a long groove, 1b is a window,
2 is a movable support member, 2a is a claw, 2b is a tongue piece, 2c is an engagement hole, 3
Is the LCC package.

Embodiment 1 In FIGS. 1 and 2, the substrate 1 is made of a plastic plate, and the LCC package 3 is mounted face down in the central portion. Then, the LC of the substrate 1
At the positions corresponding to the four corners of the C package 3, long grooves 1a are provided toward the center.

The movable support member 2 is made of, for example, a thin plate of a spring material such as phosphor bronze, and is provided with a claw 2a at a bent projecting end portion and is biased downward. In addition, curved tongue pieces 2b are provided on both opposite side surfaces. Furthermore, an engagement hole 2c is provided in the central portion.

As shown in FIG. 2, the movable support member 2 elastically engages with the tongue piece 2b so as to sandwich the side wall of the long groove 1a of the substrate 1, and along the long groove 1a, the central portion and the peripheral portion are formed. It can slide forward and backward while sliding.

In the LCC package carrier thus constructed, the LCC package 3 is formed in the central portion of the substrate 1.
When the movable support member 2 is moved forward, the tongue piece 2b turns into the LCC.
It is designed to be elastically suppressed and fixed to the four corners of the package 3. If the movable support member 2 is retracted, L
The CC package 3 can be removed.

When the LCC package 3 is supported by an LCC package carrier using an automatic machine, the LC is placed on the center of the substrate 1 by a robot (not shown).
After the C package 3 is placed, the movable support member 2 may be advanced toward the center from all sides using the engagement holes 2c. When removing the LCC package 3, the reverse operation may be performed.

Embodiment 2 In FIG. 3, a window 1b is provided in the central portion of the substrate 1. In this way, the semiconductor device including the LCC package 3 is rewritable E that can be erased by ultraviolet rays.
In the case of PROM or the like, it is possible to irradiate with ultraviolet light while supporting it on a carrier.

Embodiment 3 In FIG. 4, for example, four sets of movable supporting members 2 can be incorporated in the substrate 1. Then, four LCC packages 3 can be stored in one carrier.

In this way, since the LCC package is moved in the test device while being held by the carrier, even if the carriers collide with each other or the carrier collides with the stopping means, it is possible to prevent the package from being directly impacted. You can

Various modifications can be made to the shape of the movable supporting member and the accompanying means for engaging the substrate with the movable supporting member. Further, various modifications can be made to the number of LCC packages held on one substrate.

[0036]

According to the present invention, in the inspection process of a semiconductor device, the LCC package is moved inside the device while being held by the carrier. Therefore, a shock is directly applied to the package while moving between the roof and the rail. Can be prevented.

Further, since it is possible to appropriately hold a plurality of packages on one carrier, it is possible to carry out a test while moving a plurality of packages at the same time, and to rationalize the inspection process.

Therefore, not only the obstacles that occur during the test can be prevented, but also the throughput can be improved. As a result, the present invention largely contributes to the rationalization of the inspection process of semiconductor devices, which is becoming more and more important.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a main part of FIG.

FIG. 3 is a perspective view of a second embodiment of the present invention.

FIG. 4 is a schematic perspective view of a third embodiment of the present invention.

FIG. 5 is a perspective view of an example of an LCC package, (A).
Is a perspective view seen from below, and (B) is a perspective view seen from above.

6A and 6B are explanatory views of an example of a conventional test apparatus, FIG. 6A is a schematic configuration diagram, and FIG. 6B is a perspective view of a main part.

[Explanation of symbols]

1 Substrate 1a Long groove 1b
Window 2 Movable support member 2a Claw 2b
Tongue 2c Engagement hole 3 LCC package

Claims (4)

[Claims] 1. A substrate (1) and a movable supporting member (2), wherein the substrate (1) has an LCC package (3) placed face down on a central portion thereof, and has four corners. In, the long groove (1a) toward the central portion is bored, the movable support member (2), the claw (2a) bent at the tip end,
The movable supporting member (2) has a curved tongue piece (2b) on each of the opposite side surfaces, and is made of a spring material, and the movable support member (2) has a tongue piece (2b) having a long groove (2). It engages with 1a) and moves forward and backward while sliding, and when it moves forward, the claw (2a) has the above LCC package.
(3) A carrier for an LCC package, characterized in that the four corners of the back surface of (3) are elastically pressed. 2. The carrier for an LCC package according to claim 1, wherein the movable supporting member (2) has an engaging hole (2c) in a central portion so as to be slid by an automatic machine. 3. The carrier for an LCC package according to claim 1, wherein the substrate (1) has a window (1b) in a central portion. 4. The carrier for an LCC package according to claim 1, wherein the substrate (1) is provided with a plurality of sets of long grooves (1a) and a plurality of the LCC packages (3) are mounted thereon.