JPH0526740Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a die bonding apparatus having a detection plate for machine protection and a detection plate for XY table changeover.

Dies such as semiconductor pellets are affixed by dividing a wafer 4 into small pieces on the upper surface of an adhesive sheet 3 attached to a cassette ring 1 by a rubber ring or a metal ring 2, as shown in FIG.

In the die bonding apparatus, the cassette ring 1 is positioned and mounted on a ring holder 11, as shown in FIG.
is held on an XY table 13 that moves in the XY directions with respect to the pedestal 12. Therefore, the die bonding apparatus uses a needle 15 that is supported by a needle guide 14 to be movable up and down, to peck the adhesive sheet 3 from the back side and attach the collector 16 to the adhesive sheet 3.
dies on the adhesive sheet 3 one by one and can be transferred to a die position correction stage or a die bonding position. Also adhesive sheet 3
The cassette ring 1 is made movable by driving the XY table 13 so that each time the collector 16 picks up one die from above, the next die comes directly below the collect 16.

Here, in the conventional die bonding apparatus described above, a machine protection detection plate 18 made of a mirrored disk and having the same outer diameter D as the inner diameter D of the cassette ring 1 is mounted on the XY table 13 via the mounting bracket 17. In addition, a reflective detector 19 for detecting movement of the detection plate 18 is provided on the pedestal 12 side.
That is, the detection plate 18 and the detector 19 restrict the movement of the cassette ring 1 beyond the set movement range, thereby making it possible to prevent damage to the needle guide 14 due to collision with the cassette ring 1.

In addition, in the conventional die bonding apparatus described above, an XY table changing detection plate 21 is mounted on the XY table 13 via a mounting bracket 20, and is made of a mirrored disk and has the same outer diameter d as the outer diameter d of the wafer 4. In addition, a reflective detector 22 for detecting movement of the detection plate 21 is provided on the pedestal 12 side. That is, the detection plate 21 and the detector 22 are
The time point at which the die located at the outer edge of the wafer 4 is attracted is detected, and the time point at which the XY table 13 is alternately moved can be detected.

However, in the conventional die bonding apparatus described above, it is necessary to secure installation space for each of the detection plates 18 and 21 at two positions, as well as for the two mounting brackets 17 and 20 and the two detectors 1.
9 and 22 are required. Further, with the needle 15 located corresponding to the center of the wafer 4, the detector 1
It is necessary to position the detector 9 at the center of the detection plate 18 and the detector 22 at the center of the detection plate 21, which requires two centering operations.

The purpose of this invention is to use a simple configuration to restrict the movable range of the cassette ring and to detect the point in time when the XY table is replaced.

In order to achieve the above object, this invention includes a cassette ring to which an adhesive sheet with wafers is attached, a ring holder for positioning and mounting the cassette ring, and an
an XY table that moves in the direction; an XY table change detection plate that is provided on the XY table and includes a detection line that determines the range in which the wafer exists;
A die bonding apparatus including a detector provided on the mount and detecting a detection line of the XY table changing detection plate, wherein the die bonding apparatus includes a detection line on the XY table that determines the movable range of the cassette ring. A detection plate is arranged so that its detection line is outside of and surrounds the detection line of the XY table change detection plate, and the detector also detects the detection line of the machine protection detection plate. This is how it was done.

According to this invention, a detection plate for protecting the machine is provided, and by detecting the detection line of this detection plate, the movable range of the cassette ring is regulated. By detecting the detection line of the detection plate,
Detect the line change movement point of the XY table, and further,
By providing the detection line of the machine protection detection plate outside the detection line of the XY table change detection plate so as to surround it, both detection plates can be centrally arranged in a single position, and both detectors can be Since it is shared for the detection plate, the installation space and components can be reduced and the configuration can be simplified.

Hereinafter, embodiments of this invention will be described with reference to the drawings.

FIG. 3 is an overall view showing an embodiment of this invention. Similar to the conventional example, this die bonding apparatus includes a cassette ring 1 to which an adhesive sheet 3 to which a wafer 4 is attached is mounted, and a ring holder 11 to position and place the cassette ring 1.
, an XY table 13 that holds the ring holder 11 and moves in the XY direction with respect to the pedestal 12, a needle 15 that pushes up the die from the back side of the adhesive sheet 3, and a needle guide 14 that supports the needle 15 in a vertically movable manner. ,have.

This die bonding apparatus is equipped with a detection plate 31 for machine protection. This detection plate 31
is attached to the XY table 13 by the mounting bracket 32, and the movable range in which the cassette ring 1 does not interfere with others, in this embodiment, the cassette ring 1 is
A detection line 33 having the same diameter D as the inner diameter D of is formed. That is, this detection plate 31 has a black matte portion 33A on the inner circumferential side of diameter D, and a mirror surface portion 33A on the outer circumferential side.
3B, and the boundary line between the black matte portion 33A and the mirror surface portion 33B is defined as the detection line 33.

Further, this die bonding apparatus is equipped with an XY table change detection plate 34. This detection plate 3
4, by attaching the protrusion 36 to the recess 35 provided at the center of the upper surface of the machine protection detection plate 31, the machine protection detection plate 31 is centrally provided with a concentric shape in the upper part of the machine protection detection plate 31. is attached to the existing range of the wafer 4, in this example, the outer diameter d of the wafer 4.
A detection line 37 having the same outer diameter d is formed.
That is, this detection plate 34 has a mirror surface portion 37A on its entire surface, and the boundary line between the mirror surface portion 37A and the black matte portion 33A of the detection plate 31 is defined as the detection line 37.

Therefore, the detection plate 31 has its detection line 3
3 is arranged outside the detection line 37 of the detection plate 34 and so as to surround it.

Further, on the pedestal 12 side, each of the detection plates 31,
A reflection type detector 38 is attached that can detect each of the 34 detection lines 33 and 37. In addition,
The detector 38 is located at the center of both detection plates 31 and 34, with the needle 15 being located at the center of the wafer 4.

Next, the operation of the above embodiment will be explained.

With the needle guide 14 raised and in close contact with the back surface of the adhesive sheet 3, the needle 15 is raised,
Push up the die. At this time, while descending, the collet 16 vacuum-chucks the pushed-up die and ascends. The collet 16 moves the sucked die to the semiconductor substrate for bonding, and is positioned above the needle 15 again. On the other hand, the needle 15 and the needle guide 14 are lowered, and then the XY
The table 13 moves one pitch in the XY direction. In this way, the dies are successively pushed up by the needle 15 and attracted to the collet 16.

After repeating the above suction operation, when the die located at the outer edge of the wafer 4 is suctioned, the detector 38
detects the detection line 37 of the XY table change detection plate 34. In response to this detection signal, the XY drive section drives the XY table 13 in a row-changing manner so that the collector 16 can pick up a new row of dies on the wafer 4.

In addition, when adjusting the pushing up amount of the needle 15, etc., prior to the above-mentioned die suction operation by the collet 16, the needle 15 is placed facing a portion of the sheet 3 where the wafer 4 does not exist (i.e., the needle 15 is placed on the sheet 3 facing the part where the wafer 4 does not exist (it is unnecessary for the die on the wafer 4). The XY table 13 is moved so that the above-mentioned push-up adjustment operation can be performed without causing any damage. Therefore, in this case, there is a possibility that the cassette ring 1 collides with the needle guide 14 outside the range where the detection line 37 of the XY table changing detection plate 34 is detected by the detector 38. At this time, if the cassette ring 1 moves beyond the predetermined movement range, the detector 38 detects the detection line 33 of the machine protection detection plate 31.
Detect. Based on this detection signal, the XY drive section drives the XY table 13 so that the cassette ring 1 moves within a predetermined movement range, thereby avoiding collision between the cassette ring 1 and the needle guide 14.

According to the above embodiment, the detection line 33 of the machine protection detection plate 31 is provided outside the detection line 37 of the XY table change detection plate 34 so as to surround it. The XY table change detection plate 34 is centrally installed in a single position, which reduces the installation space, reduces the number of parts, and simplifies centering work by sharing the mounting bracket 32 and detector 38. It becomes possible to aim for.

Furthermore, even if the movable range of the cassette ring and the range of wafer presence are not circular, this invention can be applied by setting the detection lines of the machine protection detection plate and the XY table changeover detection plate accordingly. applicable.

Further, the detector is not limited to a reflection type, but may be of other types such as a transmission type.

As described above, according to the present invention, with a simple configuration, the movable range of the cassette ring can be restricted, and the point in time when the XY table is replaced can be detected.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an adhesive sheet attached to a cassette ring, FIG. 2 is a sectional view showing a conventional die bonding apparatus, and FIG. 3 is a sectional view showing an embodiment of this invention. 1... Cassette ring, 3... Adhesive sheet, 4
...Wafer, 11...Ring holder, 12...
... Frame, 13... XY table, 14... Needle guide, 15... Needle, 31... Machine protection detection plate, 33... Detection line, 34... XY table change detection plate, 37... Detection line, 38
……Detector.

Claims (1)

[Scope of utility model registration request] A cassette ring to which an adhesive sheet to which wafers are attached is attached, a ring holder for positioning and placing the cassette ring, an XY table for moving the ring holder in the XY direction with respect to a mount, and In the die bonding apparatus, the XY table change detection plate includes an XY table change detection plate having a detection line for determining an existence range, and a detector provided on the mount and detects the detection line of the XY table change detection plate. A machine protection detection plate having a detection line on the top thereof that determines the movable range of the cassette ring is arranged so that the detection line is outside of and surrounds the detection line of the XY table change detection plate. . A die bonding apparatus, characterized in that the detector also detects a detection line of the machine protection detection plate.