JPH05263259A - Ni-p-mo electroless plating bath and plating method - Google Patents
Ni-p-mo electroless plating bath and plating methodInfo
- Publication number
- JPH05263259A JPH05263259A JP9388992A JP9388992A JPH05263259A JP H05263259 A JPH05263259 A JP H05263259A JP 9388992 A JP9388992 A JP 9388992A JP 9388992 A JP9388992 A JP 9388992A JP H05263259 A JPH05263259 A JP H05263259A
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- plating
- salt
- acid
- plating bath
- salts
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高温で長時間熱処理し
た場合でも非磁性を維持するめっき皮膜を得ることがで
きる無電解Ｎｉ−Ｐ−Ｍｏめっき浴及びめっき方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless Ni-P-Mo plating bath and a plating method capable of obtaining a plating film which maintains non-magnetism even when heat-treated at a high temperature for a long time.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来、
非磁性めっき皮膜としては、Ｎｉ−Ｐ皮膜がよく知られ
ている。このＮｉ−Ｐ皮膜は、水溶性ニッケル塩、錯化
剤、次亜リン酸又はその塩を主成分とする無電解Ｎｉ−
Ｐめっき浴を用いて得られ、均一析出性、高耐食性、高
硬度、高耐摩耗性等の利点を有するが、２００℃以上の
温度で熱処理されると容易に磁性を帯びるという問題が
ある。このため、無電解Ｎｉ−Ｐめっき浴中の次亜リン
酸イオン濃度を高めるなどしてＮｉ−Ｐ皮膜中のＰ含量
を高めることが行われているが、非磁性維持の点でなお
改善の余地がある。2. Description of the Related Art Conventionally, the problems to be solved by the invention
As a non-magnetic plating film, a Ni-P film is well known. This Ni-P coating is an electroless Ni-based alloy containing water-soluble nickel salt, complexing agent, hypophosphorous acid or its salt as a main component.
It is obtained by using a P plating bath and has the advantages of uniform deposition, high corrosion resistance, high hardness, high wear resistance, etc., but when heat-treated at a temperature of 200 ° C. or higher, it is easily magnetized. For this reason, it has been attempted to increase the P content in the Ni-P coating by increasing the concentration of hypophosphite ions in the electroless Ni-P plating bath. There is room.
【０００３】一方、従来より無電解Ｎｉ−Ｐ−Ｍｏめっ
き浴及びＮｉ−Ｐ−Ｍｏめっき皮膜については種々の提
案がある（特公昭５７−５４５４５号公報、特開昭６２
−６０８７８号及び特開平３−９７８３５号公報）。し
かし、これらのＮｉ−Ｐ−Ｍｏ皮膜は、Ｍｏ含量が高
く、通常Ｍｏ含量を１０％以上として使用するもので、
このようにＭｏ含量が高いと、逆に皮膜中のリン含有量
が低くなり、皮膜が非晶質から結晶質に変化し、また浴
の安定性が悪くなるという問題がある。On the other hand, conventionally, there have been various proposals for electroless Ni-P-Mo plating baths and Ni-P-Mo plating films (Japanese Patent Publication No. 57-54545 and Japanese Patent Laid-Open No. 62-54545).
-60878 and JP-A-3-97835). However, these Ni-P-Mo coatings have a high Mo content and are usually used with a Mo content of 10% or more.
When the Mo content is high as described above, the phosphorus content in the coating is decreased, the coating is changed from amorphous to crystalline, and the stability of the bath is deteriorated.
【０００４】本発明は上記事情に鑑みなされたもので、
高温で長時間熱処理しても非磁性を維持し得るＮｉ−Ｐ
−Ｍｏ皮膜を高析出速度でつきまわりよく形成すること
ができる無電解Ｎｉ−Ｐ−Ｍｏめっき浴及びめっき方法
を提供することを目的とする。The present invention has been made in view of the above circumstances.
Ni-P that can maintain non-magnetism even after heat treatment at high temperature for a long time
An object of the present invention is to provide an electroless Ni-P-Mo plating bath and a plating method capable of forming a -Mo film at a high deposition rate with good coverage.
【０００５】[0005]
【課題を解決するための手段及び作用】本発明者らは、
上記目的を達成するため鋭意検討を行った結果、水溶性
ニッケル塩と、水溶性モリブデン酸塩と、次亜リン酸又
はその塩とを含む無電解Ｎｉ−Ｐ−Ｍｏめっき浴の錯化
剤として、ジカルボン酸又はその塩を２種以上併用する
と共に、その少なくとも１種をオキシジカルボン酸又は
その塩とすることにより、３００℃で３時間熱処理した
場合でも非磁性が維持されるＮｉ−Ｐ−Ｍｏめっき皮膜
が高析出速度でつきまわりよく得られることを見い出し
た。Means and Actions for Solving the Problems The present inventors have
As a result of intensive studies to achieve the above object, as a complexing agent for an electroless Ni-P-Mo plating bath containing a water-soluble nickel salt, a water-soluble molybdate, and hypophosphorous acid or a salt thereof. , Two or more dicarboxylic acids or salts thereof are used in combination, and at least one of them is an oxydicarboxylic acid or salt thereof, whereby non-magnetic property is maintained even when heat-treated at 300 ° C. for 3 hours. It has been found that a plating film can be obtained well at a high deposition rate.
【０００６】即ち、後述する実施例、比較例の結果から
明らかなように、オキシジカルボン酸／塩やＯＨ基を含
まないカルボン酸／塩を単独使用したり、これにモノカ
ルボン酸／塩やトリカルボン酸／塩を添加しても浴安定
性、析出速度、非磁性特性等の点で問題があるのに対
し、２種以上のジカルボン酸／塩を併用し、しかもその
少なくとも１種をオキシジカルボン酸又はその塩とした
場合、析出速度が低下したり、つきまわり不良が生じる
ことなく、良好なＮｉ−Ｐ−Ｍｏ皮膜がめっきされると
共に、このめっき皮膜は高温で長時間熱処理しても非磁
性が維持されることを知見し、本発明をなすに至ったも
のである。That is, as is clear from the results of Examples and Comparative Examples described later, oxydicarboxylic acid / salt or carboxylic acid / salt containing no OH group can be used alone, or monocarboxylic acid / salt or tricarboxylic acid can be used. Even if an acid / salt is added, there are problems in terms of bath stability, deposition rate, non-magnetic properties, etc., whereas two or more dicarboxylic acids / salts are used in combination, and at least one of them is oxydicarboxylic acid. Alternatively, when a salt thereof is used, a good Ni-P-Mo film is plated without lowering the deposition rate or causing poor throwing power, and this plating film is non-magnetic even when heat-treated at high temperature for a long time. Therefore, the present invention has been completed and the present invention has been accomplished.
【０００７】従って、本発明は、水溶性ニッケル塩と、
水溶性モリブデン酸塩と、次亜リン酸又はその塩と、２
種以上のジカルボン酸又はその塩とを含み、上記ジカル
ボン酸又はその塩の少なくとも１種がオキシジカルボン
酸又はその塩であることを特徴とする無電解Ｎｉ−Ｐ−
Ｍｏめっき浴、及び、このめっき浴中に被めっき物を浸
漬し、該被めっき物上にＮｉ−Ｐ−Ｍｏめっき皮膜を形
成することを特徴とする無電解Ｎｉ−Ｐ−Ｍｏめっき方
法を提供する。Therefore, the present invention provides a water-soluble nickel salt,
Water-soluble molybdate, hypophosphorous acid or its salt, and 2
At least one dicarboxylic acid or salt thereof is an oxydicarboxylic acid or salt thereof, and electroless Ni-P-
Provided is a Mo plating bath and an electroless Ni-P-Mo plating method characterized by immersing an object to be plated in the plating bath to form a Ni-P-Mo plating film on the object to be plated. To do.
【０００８】以下、本発明につき更に詳しく説明する
と、本発明の無電解Ｎｉ−Ｐ−Ｍｏめっき浴は、水溶性
ニッケル塩とモリブデン酸塩と還元剤として次亜リン酸
又はその塩とを含む。The present invention will be described in more detail below. The electroless Ni-P-Mo plating bath of the present invention contains a water-soluble nickel salt, a molybdate and hypophosphorous acid or a salt thereof as a reducing agent.
【０００９】ここで、水溶性ニッケル塩としては、硫酸
ニッケル、塩化ニッケル等が用いられ、めっき浴中の濃
度は、ニッケルとして２〜１０ｇ／ｌ、特に４〜８ｇ／
ｌとすることが好ましい。Here, as the water-soluble nickel salt, nickel sulfate, nickel chloride or the like is used, and the concentration of nickel in the plating bath is 2 to 10 g / l, particularly 4 to 8 g / l.
It is preferable that it is 1.
【００１０】また、水溶性モリブデン酸塩としては、モ
リブデン酸ナトリウム、モリブデン酸アンモニウム、モ
リブデン酸カリウム、モリブデン酸カルシウム、リンモ
リブデン酸、リンモリブデン酸アンモニウム等が用いら
れ、めっき浴中の濃度は０．０１〜５ｇ／ｌ、特に０．
０５〜１ｇ／ｌとすることが好ましい。モリブデン酸塩
の濃度が０．０１ｇ／ｌより低いとめっき皮膜中のモリ
ブデン含量が少なくなり、耐熱非磁性の効果が十分得ら
れなくなり、一方５ｇ／ｌを越えると、析出速度が低下
したり、つきまわり不良が発生したりする場合が生じ
る。As the water-soluble molybdate, sodium molybdate, ammonium molybdate, potassium molybdate, calcium molybdate, phosphomolybdic acid, ammonium phosphomolybdate, etc. are used, and the concentration in the plating bath is 0. 01-5 g / l, especially 0.
It is preferably from 05 to 1 g / l. When the concentration of molybdate is less than 0.01 g / l, the content of molybdenum in the plating film becomes small, and the effect of heat-resistant non-magnetic property cannot be sufficiently obtained. On the other hand, when it exceeds 5 g / l, the deposition rate decreases, There may be a case where improper throwing power occurs.
【００１１】次亜リン酸又はその塩としては、次亜リン
酸ナトリウム、次亜リン酸カリウム等が好適に使用さ
れ、めっき浴中の濃度は１０〜５０ｇ／ｌ、特に２０〜
４０ｇ／ｌとすることが好ましい。As the hypophosphorous acid or its salt, sodium hypophosphite, potassium hypophosphite, etc. are preferably used, and the concentration in the plating bath is 10 to 50 g / l, especially 20 to
It is preferably 40 g / l.
【００１２】本発明のめっき浴には、錯化剤として２種
以上のジカルボン酸又はその塩が配合される。かかるジ
カルボン酸又はその塩としては、酒石酸、リンゴ酸、コ
ハク酸、マロン酸、ジグリコール酸、シュウ酸、フタル
酸等やそれらのナトリウム塩、カリウム塩、アンモニウ
ム塩などが併用されて添加されるが、その少なくとも１
種はオキシジカルボン酸又はその塩であることが必要で
ある。従って、錯化剤として２種以上のオキシジカルボ
ン酸又はその塩を併用したり（この場合、モノオキシジ
カルボン酸又はその塩とポリオキシジカルボン酸又はそ
の塩とを併用することが好ましい）、オキシジカルボン
酸又はその塩とＯＨ基を含まないジカルボン酸又はその
塩とを併用することができるが、特にオキシジカルボン
酸又はその塩とＯＨ基を含まないジカルボン酸又はその
塩とを併用することが非磁性特性、析出速度、浴安定性
の点から好ましい。この場合、前者と後者の併用比率は
モル比として１０：１〜０．５：１、特に８：１〜１：
１であることが、その併用効果をより有効に発揮させる
ことができる点から推奨される。なお、モノオキシジカ
ルボン酸又はその塩とポリオキシジカルボン酸又はその
塩とを併用する場合も同様の比率で併用することが好ま
しい。The plating bath of the present invention contains two or more kinds of dicarboxylic acids or salts thereof as complexing agents. As such a dicarboxylic acid or a salt thereof, tartaric acid, malic acid, succinic acid, malonic acid, diglycolic acid, oxalic acid, phthalic acid and the like and their sodium salts, potassium salts, ammonium salts and the like are added in combination. , At least one
The seed must be an oxydicarboxylic acid or salt thereof. Therefore, two or more kinds of oxydicarboxylic acids or salts thereof are used in combination as a complexing agent (in this case, it is preferable to use monooxydicarboxylic acids or salts thereof and polyoxydicarboxylic acids or salts thereof) in combination. An acid or a salt thereof and an OH group-free dicarboxylic acid or a salt thereof can be used in combination, and in particular, it is non-magnetic to use an oxydicarboxylic acid or a salt thereof and an OH group-free dicarboxylic acid or a salt thereof in combination. It is preferable in terms of characteristics, deposition rate and bath stability. In this case, the molar ratio of the former to the latter is 10: 1 to 0.5: 1, especially 8: 1 to 1: 1.
A value of 1 is recommended because the combined effect can be exhibited more effectively. When monooxydicarboxylic acid or its salt and polyoxydicarboxylic acid or its salt are used in combination, it is preferable to use them in the same ratio.
【００１３】また、必要により、上記２種以上のジカル
ボン酸又はその塩に加え、グリコール酸、乳酸、グルコ
ン酸、クエン酸やその塩等のモノカルボン酸類、トリカ
ルボン酸類などを本発明の効果を損なわない範囲で添加
しても差し支えない。If necessary, in addition to the above-mentioned two or more kinds of dicarboxylic acids or salts thereof, monocarboxylic acids such as glycolic acid, lactic acid, gluconic acid, citric acid and salts thereof, tricarboxylic acids and the like may impair the effects of the present invention. There is no problem even if it is added within the range that does not exist.
【００１４】上記錯化剤の配合量は適宜選定されるが、
水溶性ニッケル塩１モルに対し１〜７モル、特に２〜６
モルとすることが好ましい。The blending amount of the above complexing agent is appropriately selected,
1 to 7 mol, especially 2 to 6 mol per mol of water-soluble nickel salt
It is preferable that the amount is mol.
【００１５】なお、本発明のめっき浴には、鉛塩その他
の安定剤、ｐＨ調整剤などの成分を添加することがで
き、またそのｐＨは酸性、特にｐＨ４〜５の範囲とする
ことが好ましい。ｐＨが低すぎると析出速度が低下する
場合があり、ｐＨが高すぎるとめっき皮膜の応力が高く
なったり、浴が不安定になる場合がある。Components such as lead salts and other stabilizers and pH adjusters may be added to the plating bath of the present invention, and the pH thereof is preferably acidic, particularly in the range of pH 4-5. .. If the pH is too low, the deposition rate may decrease, and if the pH is too high, the stress of the plating film may increase and the bath may become unstable.
【００１６】本発明のめっき浴を用いてＮｉ−Ｐ−Ｍｏ
めっき皮膜を得る場合は、被めっき物を該めっき浴に浸
漬すればよいが、この場合、めっき温度は７０〜９５℃
で行うことが好ましい。なお、めっき速度は、９０℃の
めっき温度において通常５〜１０μｍ／ｈｒである。ま
た、めっきに際しては、スターラーによる撹拌、ポンプ
による撹拌、被めっき物を揺動させるなどの方法でめっ
き浴を適度に撹拌することが好ましく、撹拌により確実
に良好な耐熱非磁性のめっき皮膜を得ることができる。
これに対し、撹拌を行わないと、めっき皮膜の非磁性特
性が低下する場合が生じる。Using the plating bath of the present invention, Ni-P-Mo
To obtain a plating film, the object to be plated may be immersed in the plating bath. In this case, the plating temperature is 70 to 95 ° C.
It is preferable to carry out. The plating rate is usually 5 to 10 μm / hr at a plating temperature of 90 ° C. Further, during plating, it is preferable to appropriately stir the plating bath by stirring with a stirrer, stirring with a pump, shaking the object to be plated, etc., and reliably obtain a good heat-resistant non-magnetic plating film by stirring. be able to.
On the other hand, if stirring is not performed, the non-magnetic properties of the plating film may deteriorate.
【００１７】このようにして得られるＮｉ−Ｐ−Ｍｏめ
っき皮膜は、析出状態で非晶質であり、通常Ｎｉ８２〜
９０．９重量％、Ｐ９〜１３重量％、Ｍｏ０．１〜５重
量％の組成を有するもので、このＮｉ−Ｐ−Ｍｏめっき
皮膜は高温（例えば３００℃）で長時間（例えば３時
間）熱処理しても非磁性が維持されるものである。ま
た、このＮｉ−Ｐ−Ｍｏめっき皮膜は、Ｍｏ含量が少な
いので、Ｎｉ−Ｐめっき皮膜の特長、即ち均一析出性、
高耐食性、高硬度、高耐摩耗性という利点を有効に発揮
するものである。The Ni-P-Mo plating film thus obtained is amorphous in the deposited state and is usually Ni82-
The Ni-P-Mo plating film has a composition of 90.9% by weight, P9 to 13% by weight, and Mo 0.1 to 5% by weight, and this Ni-P-Mo plating film is heat-treated at high temperature (for example, 300 ° C) for a long time (for example, 3 hours). Even so, the non-magnetic property is maintained. In addition, since this Ni-P-Mo plating film has a low Mo content, the characteristics of the Ni-P plating film, namely, uniform deposition,
It effectively exhibits the advantages of high corrosion resistance, high hardness, and high wear resistance.
【００１８】[0018]
【実施例】以下、実施例と比較例を示し、本発明を具体
的に説明するが、本発明は下記の実施例に制限されるも
のではない。EXAMPLES The present invention will be specifically described below by showing Examples and Comparative Examples, but the present invention is not limited to the following Examples.
【００１９】〔実施例１〜２，比較例１〜９〕下記組成
の無電解めっき浴を調製し、被めっきサンプルとして亜
鉛置換処理を施したアルミニウム板上にスターラー撹拌
下において９０℃で１２０分間めっきを行い、約１５μ
ｍ厚さのめっき皮膜を得た。[Examples 1 to 2 and Comparative Examples 1 to 9] Electroless plating baths having the following compositions were prepared, and an aluminum plate subjected to zinc substitution treatment as a sample to be plated was stirred at 90 ° C. for 120 minutes under stirring with a stirrer. Plated to about 15μ
A plating film having a thickness of m was obtained.
【００２０】浴組成 硫酸ニッケル（ニッケルとして） ６ ｇ／ｌ 次亜リン酸ナトリウム ３０ 〃 モリブデン酸ナトリウム ０．３ 〃 表１に示す錯化剤 表１に示す量 安定剤 微 量 ｐＨ ４．５ Bath composition Nickel sulfate (as nickel) 6 g / l Sodium hypophosphite 30 〃 Sodium molybdate 0.3 〃 Complexing agent shown in Table 1 Amount shown in Table 1 Stabilizer Minute amount pH 4.5
【００２１】[0021]
【表１】 [Table 1]
【００２２】〔実施例３〜６，比較例１０〕下記組成の
無電解めっき浴を調製し、実施例１〜２と同様にしてめ
っきを行い、約１５μｍ厚さのめっき皮膜を得た。次
に、このめっき皮膜を電気オーブンを使用し、３００
℃，２時間の条件で空気中において熱処理し、飽和磁束
密度を測定した。結果を図１〜３に示す。なお、モリブ
デン酸ナトリウム量を０〜１ｇ／ｌ変化させた場合の皮
膜組成を表２に示す。浴組成 硫酸ニッケル（ニッケルとして） ６ ｇ／ｌ 次亜リン酸ナトリウム ３０ 〃 モリブデン酸ナトリウム ０〜１ 〃 リンゴ酸 １８ 〃 コハク酸 １６ 〃 安定剤 微 量 ｐＨ ４．５ なお、磁性測定条件は下記の通りである。 磁性測定条件 ：振動試料型磁力計（理研電子製ＢＨＶ−
５０型） 印加磁場２５００Ｏe 感度０．００５ＥＭＵ 試料 １×１ｃｍ 測定回数ｎ＝２[Examples 3 to 6 and Comparative Example 10]
An electroless plating bath was prepared and treated in the same manner as in Examples 1-2.
A plating film having a thickness of about 15 μm was obtained by plating. Next
Then, using an electric oven to coat this plating film with 300
Saturated magnetic flux after heat treatment in air at 2 ℃ for 2 hours
The density was measured. The results are shown in FIGS. Morib
Skin when the amount of sodium denate is changed from 0 to 1 g / l
The film composition is shown in Table 2.Bath composition Nickel sulfate (as nickel) 6 g / l Sodium hypophosphite 30 〃 Sodium molybdate 0-1 〃 Malic acid 18 〃 Succinic acid 16 〃 Stabilizer Micro pH 4.5 The magnetic measurement conditions are as follows. is there. Magnetic measurement conditions : Vibration sample magnetometer (Riken Denshi BHV-
50 type) Applied magnetic field 2500Oe Sensitivity 0.005 EMU sample 1 × 1 cm Number of measurements n = 2
【００２３】[0023]
【表２】 [Table 2]
【００２４】[0024]
【発明の効果】本発明のめっき浴を用いためっき方法に
よれば、めっき浴の安定性もよく、また高温で長時間熱
処理しても非磁性を維持し得るＮｉ−Ｐ−Ｍｏ皮膜を高
析出速度でつきまわりよく形成することができる。According to the plating method using the plating bath of the present invention, the stability of the plating bath is good, and a Ni-P-Mo coating capable of maintaining non-magnetism even when heat-treated at a high temperature for a long time is improved. It can be formed well at the deposition rate.
【図１】Ｎａ2ＭｏＯ4を種々の濃度で含むめっき浴から
得られためっき皮膜を３００℃で２時間熱処理した場合
におけるＮａ2ＭｏＯ4濃度と飽和磁束密度との関係を示
すグラフである。FIG. 1 is a graph showing the relationship between the Na 2 MoO 4 concentration and the saturation magnetic flux density when a plating film obtained from a plating bath containing Na 2 MoO 4 at various concentrations is heat-treated at 300 ° C. for 2 hours.
【図２】Ｎａ2ＭｏＯ4を０ｇ／ｌ又は０．３ｇ／ｌ含む
めっき浴から得られためっき皮膜を種々の温度で２時間
熱処理した場合における熱処理温度と飽和磁束密度との
関係を示すグラフである。FIG. 2 is a graph showing the relationship between the heat treatment temperature and the saturation magnetic flux density when a plating film obtained from a plating bath containing 0 g / l or 0.3 g / l of Na 2 MoO 4 is heat treated at various temperatures for 2 hours. Is.
【図３】Ｎａ2ＭｏＯ4を０ｇ／ｌ又は０．３ｇ／ｌ含む
めっき浴から得られためっき皮膜を３００℃で熱処理し
た場合における熱処理時間と飽和磁束密度との関係を示
すグラフである。FIG. 3 is a graph showing the relationship between heat treatment time and saturation magnetic flux density when a plating film obtained from a plating bath containing Na 2 MoO 4 of 0 g / l or 0.3 g / l is heat-treated at 300 ° C.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 斉藤 昌弘 大阪府枚方市出口１丁目５番１号 上村工 業株式会社開発技術研究所内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Masahiro Saito 1-5-1, Exit Hirakata-shi, Osaka Uemura Industrial Co., Ltd.
Claims (2)
酸塩と、次亜リン酸又はその塩と、２種以上のジカルボ
ン酸又はその塩とを含み、上記ジカルボン酸又はその塩
の少なくとも１種がオキシジカルボン酸又はその塩であ
ることを特徴とする無電解Ｎｉ−Ｐ−Ｍｏめっき浴。1. A water-soluble nickel salt, a water-soluble molybdate, a hypophosphorous acid or a salt thereof, and two or more kinds of dicarboxylic acids or salts thereof, and at least one kind of the above dicarboxylic acids or salts thereof. Is an oxydicarboxylic acid or a salt thereof, an electroless Ni-P-Mo plating bath.
を浸漬し、該被めっき物上にＮｉ−Ｐ−Ｍｏめっき皮膜
を形成することを特徴とする無電解Ｎｉ−Ｐ−Ｍｏめっ
き方法。2. An electroless Ni-P-Mo plating characterized by immersing an object to be plated in the plating bath according to claim 1 to form a Ni-P-Mo plating film on the object to be plated. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4093889A JP2757672B2 (en) | 1992-03-19 | 1992-03-19 | Electroless Ni-P-Mo plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4093889A JP2757672B2 (en) | 1992-03-19 | 1992-03-19 | Electroless Ni-P-Mo plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05263259A true JPH05263259A (en) | 1993-10-12 |
| JP2757672B2 JP2757672B2 (en) | 1998-05-25 |
Family
ID=14095049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4093889A Expired - Fee Related JP2757672B2 (en) | 1992-03-19 | 1992-03-19 | Electroless Ni-P-Mo plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2757672B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012087386A (en) * | 2010-10-21 | 2012-05-10 | Toyota Motor Corp | Electroless nickel plating bath and electroless nickel plating method using the same |
| CN105506589A (en) * | 2015-12-30 | 2016-04-20 | 大连大学 | Chemical-plating Ni-P/Ni-Mo-P composite structure coating and preparation method thereof |
| CN107475699A (en) * | 2017-08-28 | 2017-12-15 | 中石化炼化工程（集团）股份有限公司 | The corrosion-inhibiting coating of gas-liquid allotter, preparation method and applications |
| EP3409815A1 (en) | 2017-06-02 | 2018-12-05 | ATOTECH Deutschland GmbH | Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62274076A (en) * | 1986-05-23 | 1987-11-28 | Toyo Kohan Co Ltd | Electroless nickel-phosphorus plating bath |
| JPH01225777A (en) * | 1988-03-07 | 1989-09-08 | Seiko Epson Corp | Electroless plating bath |
| JPH0229753A (en) * | 1988-07-20 | 1990-01-31 | Nippon Zeon Co Ltd | Resist composition |
| JPH03150368A (en) * | 1989-11-07 | 1991-06-26 | Toagosei Chem Ind Co Ltd | Production of heat resistant nonmagnetic plated body |
| JPH0429739A (en) * | 1990-05-28 | 1992-01-31 | Toshiba Lighting & Technol Corp | Device for irradiating ultraviolet ray |
| JPH0515790A (en) * | 1991-07-17 | 1993-01-26 | Asahi Chem Ind Co Ltd | New hollow fiber ion adsorbing membrane structure |
-
1992
- 1992-03-19 JP JP4093889A patent/JP2757672B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62274076A (en) * | 1986-05-23 | 1987-11-28 | Toyo Kohan Co Ltd | Electroless nickel-phosphorus plating bath |
| JPH01225777A (en) * | 1988-03-07 | 1989-09-08 | Seiko Epson Corp | Electroless plating bath |
| JPH0229753A (en) * | 1988-07-20 | 1990-01-31 | Nippon Zeon Co Ltd | Resist composition |
| JPH03150368A (en) * | 1989-11-07 | 1991-06-26 | Toagosei Chem Ind Co Ltd | Production of heat resistant nonmagnetic plated body |
| JPH0429739A (en) * | 1990-05-28 | 1992-01-31 | Toshiba Lighting & Technol Corp | Device for irradiating ultraviolet ray |
| JPH0515790A (en) * | 1991-07-17 | 1993-01-26 | Asahi Chem Ind Co Ltd | New hollow fiber ion adsorbing membrane structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012087386A (en) * | 2010-10-21 | 2012-05-10 | Toyota Motor Corp | Electroless nickel plating bath and electroless nickel plating method using the same |
| CN105506589A (en) * | 2015-12-30 | 2016-04-20 | 大连大学 | Chemical-plating Ni-P/Ni-Mo-P composite structure coating and preparation method thereof |
| EP3409815A1 (en) | 2017-06-02 | 2018-12-05 | ATOTECH Deutschland GmbH | Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits |
| WO2018220220A1 (en) | 2017-06-02 | 2018-12-06 | Atotech Deutschland Gmbh | Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits |
| CN107475699A (en) * | 2017-08-28 | 2017-12-15 | 中石化炼化工程（集团）股份有限公司 | The corrosion-inhibiting coating of gas-liquid allotter, preparation method and applications |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2757672B2 (en) | 1998-05-25 |
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