JPH05259348A - Semiconductor device - Google Patents

Abstract

PURPOSE:To miniaturize a base body with an area to provide outer terminals secured enough by providing outer terminals on at least two faces out of side faces including the top and bottom faces and the ridges of a box-shaped base body. CONSTITUTION:The top face of a base body 1 is provided with gull-wing type outer terminals 3, and its bottom with surface-mounted type pin type outer terminals 4. Since a plurality of points in the bottom, top, and side faces have outer terminals, the base body can be miniaturized as compared with the case where outer terminals are so many as those in a prior art semiconductor device. Further mounting density can be increased by narrowing the occupancy area in high-density board mounting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device which requires high-density board mounting.

[0002]

2. Description of the Related Art As shown in FIGS. 4 and 5, a conventional semiconductor device includes an IC chip 2a inside a box-shaped substrate 1.
Is provided. 2b is a cap for sealing.

The external terminals 4 for inputting / outputting signals to / from the IC chip 2a are centrally provided in the lower surface region of the base 1.

[0004]

In the conventional semiconductor device, since the external terminals 4 are integrated and provided on the lower surface of the substrate 1, the number of external terminals 4 is increased by promoting the increase in the number of pins of the IC chip 2a. It is necessary to increase the area of the lower surface of the base body 1 as the number increases, and the outer dimensions of the base body increase accordingly. This has a drawback that the area occupied by the base on the mounting substrate increases, the number of semiconductor devices mounted per substrate decreases, and the high-density mounting is adversely affected.

An object of the present invention is to provide a semiconductor device having a high packaging density by reducing the outer dimensions of the base of the semiconductor device.

[0006]

In order to achieve the above-mentioned object, a semiconductor device according to the present invention is a semiconductor device having a box-shaped base body and external terminals, the top surface, the bottom surface, and the ridge portion of the base body. The external terminals are provided in at least two areas of the side surface including the.

[0007]

By disposing the external terminals on a plurality of surfaces (including the ridge line portion) of the base in a dispersed manner, a region for providing the external terminals is sufficiently secured and the base is miniaturized.

[0008]

The present invention will be described below with reference to the drawings. In the drawings, according to the present invention, external terminals are provided on at least two of the upper surface, the lower surface, and the side surface including the ridgeline of the box-shaped base 1.

In the semiconductor device shown in FIG. 1, a gull wing type external terminal 3 is provided on the upper surface of the base body 1, and a surface mount type pin type external terminal 4 is provided on the bottom surface of the base body 1.
2a is an IC chip and 2b is a sealing cap.

In the semiconductor device of FIG. 2, J lead type external terminals 5 are provided on the upper surface of the base body 1, and further, land grid array (LGA) type external terminals 6 are provided on the bottom surface of the base body 1.

In the semiconductor device of FIG. 3, a pin insertion type (DIP type) external terminal 7 is provided on the side surface of the base body 1, and a pin insertion type (PGA type) external terminal 8 is provided on the bottom surface of the base body 1.

[0012]

As described above, according to the present invention, the external terminals are provided at a plurality of positions on the bottom surface, the upper surface, and the side surfaces of the base body. Therefore, when the number of external terminals is the same as that of the conventional semiconductor device, It is possible to reduce the size of the base body, and it is possible to increase the mounting density by narrowing the occupied area in high-density board mounting.

[Brief description of drawings]

FIG. 1A is a perspective view showing an embodiment of the present invention,
(B) is a sectional view.

FIG. 2 is a sectional view showing another embodiment of the present invention.

FIG. 3 is a sectional view showing another embodiment of the present invention.

4A is a perspective view showing a conventional example, and FIG. 4B is a sectional view.

FIG. 5 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 1 Base 2a IC chip 2b Sealing cap 3 Gull wing type external terminal 4 Pin type external terminal 5 J Lead type external terminal 6 Land type external terminal 7 Pin insertion type (DIP type) external terminal 8 pin insertion type (PGA type) external terminal

Claims (1)

[Claims] 1. A semiconductor device having an external terminal on a box-shaped base, wherein the external terminal is provided on an area of at least two of the upper surface, the lower surface, and the side surface including the ridge. Characteristic semiconductor device.