JPH05259006A - Electronic part - Google Patents

Abstract

PURPOSE:To shorter an electronic part, to accomplish stabilization of the electronic part when it is surface-mounted on an electronic apparatus, and to provide the electronic part having less deterioration in characteristics. CONSTITUTION:The title electronic part is composed of a part element 12 having a pair of lead members consisting of a lead electrode 13 and a lead wire 17, a bottomed metal case 11 having the built-in part element 12, and a hole-sealing member 14, with which the aperture part of the metal case 11 is sealed, consisting of the regid material which is formed by integrating a surface- mounting part 15 to be used for surface-mounting of a mounting substrate. Further, a pair of lead members are passed through the hole-sealing member 14, their tip is bent at least along the surface opposing the mounting substrate of a surface-mounting part 15, and a sealing operation is conducted between the metal case 11 and the hole-sealing member 14 by interposing a sealing member 19 between the sealing part of the metal case and the hole-sealing member 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts, and more particularly to so-called leadless electronic parts. In the following description, a chip-type aluminum electrolytic capacitor will be described in detail, but the present invention is not limited to this chip-type aluminum electrolytic capacitor, and the same applies to other electronic components.

[0002]

2. Description of the Related Art With the recent progress in downsizing and thinning of electric equipment and the progress of high-density mounting technology, electronic parts are rapidly becoming chips.

A conventional chip-type aluminum electrolytic capacitor is constructed as shown in FIGS. That is,
A metal case 2 made of aluminum and forming a capacitor body 2a having a built-in capacitor element 1 has a bottomed cylindrical shape, and a pair of lead electrodes 3 are introduced from the capacitor element 1. The opening of the metal case 2 is closed by a sealing body 4 made of an elastic body, and an insulating plate 5 is arranged on the opening side of the metal case 2. Then, the pair of lead electrodes 3 penetrates the inside of the sealing body 4 made of an elastic body, and has an end surface of the metal case 2
Is exposed to the insulating plate 5 through the opening. Further, the insulating plate 5 is provided with a pair of through holes 6 and a storage recess 7 is provided continuously with the pair of through holes 6. Further, the lead wire 8 having the flat end portions of the pair of lead electrodes 3 penetrates the pair of through holes 6 provided in the insulating plate 5, and the front end portions thereof extend along the bottom surface of the insulating plate 5. It is bent and stored in the storage recess 7.

Further, an aluminum electrolytic capacitor in which an elastic sealing member and an insulating plate are integrated by an elastic member has been proposed (Japanese Patent Laid-Open No. 60-170926, Japanese Utility Model Laid-Open No. 50-98233, Japanese Utility Model Laid-Open No. 61-). 22336 publication).

[0005]

However, the chip-type aluminum electrolytic capacitors shown in FIGS. 5 and 6 have the drawback that the number of parts is increased because the sealing body 4 made of an elastic body and the insulating plate 5 are combined. There is a limit to reducing the thickness of the sealing body 4 made of an elastic body in order to secure the sealing performance, and since the space 9 exists between the capacitor body 2a and the insulating plate 5, a high density is achieved. Although the height of products has been required to be reduced with the progress of packaging technology, the conventional chip-type aluminum electrolytic capacitors have a limitation in reducing the height.

Further, a chip type aluminum electrolytic capacitor in which an elastic sealing body and an insulating plate are integrated with each other by an elastic body has a pair of flat shape when the chip type aluminum electrolytic capacitor is surface-mounted on a printed circuit board by an automatic mounting machine. The lead wire is reflow-soldered on the printed circuit board. In this case, the temperature at the reflow soldering (~ 240
However, there is a problem that the integrated product is deformed by (° C.) and the mounting on the printed circuit board becomes incomplete.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an electronic component which is capable of reducing the height of the electronic component and stabilizing it when it is surface-mounted on an electronic device, and which has little deterioration in characteristics. It is what

[0008]

To achieve the above object, an electronic component according to the present invention comprises a component element having a pair of lead members, a bottomed metal case containing the component element,
A sealing member made of a hard material that integrally forms a surface mounting portion for surface mounting on a mounting substrate while sealing the opening of the bottomed metal case, and the pair of lead members penetrates the sealing member. The tip portion is bent along at least the surface of the surface mounting portion facing the mounting substrate, and a sealing member is interposed between the sealing portion and the sealing member of the bottomed metal case, and The space between them is sealed.

[0009]

According to the electronic component having the above construction, the surface mounting portion for surface mounting on the mounting substrate is integrally formed on the sealing member made of a hard material for sealing the opening of the bottomed metal case. Since the sealing member can be made thin, and the volume ratio of the component elements in the bottomed metal case is increased, the size and height can be reduced. In addition, since the sealing member is made of a hard material, even when reflow soldering is performed when this electronic component is surface-mounted on the mounting board with an automatic mounting machine, the sealing member will deform at the temperature during the reflow soldering. As a result, it is possible to stabilize the surface mounting of this electronic component on an electronic device.

Further, since the sealing member is interposed between the sealing portion of the bottomed metal case and the sealing member to seal the two, the sealing property between the two can be remarkably improved. In this case, in the case of the chip type aluminum electrolytic capacitor in which the component element is impregnated with the driving electrolytic solution, it is possible to prevent the diffusion of the driving electrolytic solution together with the fact that the sealing member is formed of a hard material. There is little deterioration of the product characteristics, and the service life can be extended.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. In FIG. 1 and FIG. 2, reference numeral 11 denotes a metal case forming a chip type aluminum electrolytic capacitor body 11a having a capacitor element 12 built therein.
1 is a bottomed cylindrical shape, and the capacitor element 1
A pair of lead electrodes 13 is led out from 2. The opening of the metal case 11 is sealed by a sealing member 14 made of a hard material. Further, a surface mounting portion 15 for surface mounting the chip type aluminum electrolytic capacitor body 11a on the printed circuit board is integrally formed on the sealing member 14 with a hard material.

The pair of lead electrodes 13 penetrates the inside of the through hole 16 formed in the sealing member 14, and the pair of lead electrodes 13 are connected to the pair of lead wires 17 having flat end portions. To form a lead member. The flattened end portions of the pair of lead wires 17 are bent along the surface of the surface mounting portion 15 of the sealing member 14, and are housed in a housing recess 18 provided in the surface mounting portion 15. Further, a seal member 19 made of an adhesive or an elastic ring is interposed between the opening of the metal case 11 and the sealing member 14 to seal between the both 11, 14 and the opening of the metal case 11. The airtightness of the chip type aluminum electrolytic capacitor body 11a is maintained by drawing.

Further, the surface of the sealing member 14 in contact with the sealing member 19 is roughened by applying one or both of chemical treatment and physical treatment such as etching and sandblasting, or independently. The unevenness is formed. A thermoplastic resin or a thermosetting resin is suitable as the hard material forming the sealing member 14, and a material such as ceramic can also be used. Also,
The thermosetting resin or the photocurable resin forming the seal member 19 is preferably an epoxy type, an acrylic type, a phenol type, a urethane type, or a rubber type, and an ethylene propylene rubber is used as an elastic body forming the seal member 19. Butyl rubber, fluororubber, etc. are suitable.

Next, concrete examples will be shown. As one specific example of the present invention, the sealing member 14 is made of polyphenylene sulfide resin (PPS resin), the metal case 11 is made of aluminum material, and epoxy resin is used as an adhesive for forming the seal member 19. A chip-type aluminum electrolytic capacitor was manufactured using. On the other hand, as a comparative example, the conventional chip type aluminum electrolytic capacitor shown in FIGS. 5 and 6 was used. In addition, the same capacitor element and driving electrolytic solution were used in both the example of the present invention and the comparative example.

FIG. 3 shows the product life test results of one example of the present invention and a comparative example (capacitance change rate during storage at 110 ° C.).
As is clear from FIG. 3, the chip-type aluminum electrolytic capacitor according to the embodiment of the present invention is longer than that of the conventional chip-type aluminum electrolytic capacitor which is a comparative example. The rate of change in electrostatic capacitance can be suppressed to a small value.

As another specific example of the present invention, the surface of the sealing member 14 in contact with the seal member 19 is roughened by sandblasting, and otherwise the same as the specific example of the present invention. A chip-type aluminum electrolytic capacitor having the constitution was produced. On the other hand, as a comparative example, a non-roughened one was used.

FIG. 4 shows the product life test results (rate of change in capacitance during storage at 110 ° C.) of another embodiment of the present invention and a comparative example. As is apparent from FIG.
The chip-type aluminum electrolytic capacitors in other examples of the present invention can suppress the rate of change in capacitance after a long period of time as compared with the comparative example in which the surface is not roughened.

In the above embodiments, the chip type aluminum electrolytic capacitor was described as an example of the electronic component, but the present invention is not limited to the chip type aluminum electrolytic capacitor, and the same applies to other electronic components. It goes without saying that the structure can be applied.

[0019]

As described above, according to the electronic component of the present invention, the surface mounting portion for surface mounting on the mounting substrate is integrated with the sealing member made of a hard material for sealing the opening of the bottomed metal case. Since the sealing member is formed to be thin, it is possible to make the sealing member thin, and thereby the volume ratio of the component elements in the bottomed metal case is increased, so that the size and height can be reduced. Also, because the sealing member is made of a hard material, even if reflow soldering is performed when surface mounting this electronic component on the mounting board with an automatic mounting machine, the sealing member changes depending on the temperature during the reflow soldering. There is no such thing,
As a result, it is possible to stabilize the surface mounting of this electronic component on an electronic device.

Further, since the sealing member is interposed between the sealing portion of the bottomed metal case and the sealing member to seal the two, the sealing property between the two can be remarkably improved. In this case, in the case of a chip-type aluminum electrolytic capacitor in which a component element is impregnated with a driving electrolytic solution, it is possible to prevent the diffusion of the driving electrolytic solution together with the fact that the sealing member is formed of a hard material. There is little deterioration of the product characteristics, and the service life can be extended.

[Brief description of drawings]

FIG. 1 is a partial sectional front view of a chip-type aluminum electrolytic capacitor showing an embodiment of the present invention.

FIG. 2 is a perspective view of the same chip type aluminum electrolytic capacitor.

FIG. 3 is a characteristic diagram showing product life test results of an example of the present invention and a comparative example.

FIG. 4 is a characteristic diagram showing product life test results of another example of the present invention and a comparative example.

[Fig. 5] Front view of a fracture of a conventional chip-type aluminum electrolytic capacitor

FIG. 6 is a perspective view of the same chip type aluminum electrolytic capacitor.

[Explanation of symbols]

 11 Metal Case 12 Capacitor Element 13 Pair of Lead Electrodes 14 Sealing Member 15 Surface Mount Part 17 Pair of Lead Wires 19 Sealing Member

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiaki Yamashita 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (4)

[Claims] 1. A component element having a pair of lead members, a bottomed metal case for incorporating the component element, and an opening of the bottomed metal case for sealing and surface mounting on a mounting substrate. A sealing member made of a hard material integrally formed with the surface mounting portion, wherein the pair of lead members penetrates through the sealing member and folds the tip ends thereof along at least the surface of the surface mounting portion facing the mounting substrate. An electronic component that is bent and has a sealing member interposed between a sealing portion of the bottomed metal case and a sealing member to perform sealing between the two. 2. An adhesive is used as the seal member.
Electronic components described. 3. The electronic component according to claim 1, wherein an elastic ring is used as the seal member. 4. The electronic component according to claim 1, wherein independent concavities and convexities are formed on a surface of at least one of the sealing portion of the bottomed metal case and the sealing member which is in contact with the sealing member.