JPH0525769U - Mounting structure for discreet parts - Google Patents
Mounting structure for discreet partsInfo
- Publication number
- JPH0525769U JPH0525769U JP7261291U JP7261291U JPH0525769U JP H0525769 U JPH0525769 U JP H0525769U JP 7261291 U JP7261291 U JP 7261291U JP 7261291 U JP7261291 U JP 7261291U JP H0525769 U JPH0525769 U JP H0525769U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal tube
- collar
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】 プリント配線基板へのディスクリート部品の
取付において、半田クラックの障害の発生を防止する。
【構成】 2はプリント配線基板で、鍔付き円筒形の金
属管6をプリント配線基板2の所定の取付孔に予め挿入
し、ディスクリート部品1のリード4を鍔付き円筒形の
金属管6の内側に挿通する。しかる後、半田処理により
導体ランド部3と部品のリード4が半田付けされて半田
部分5を形成する。
(57) [Abstract] [Purpose] Prevents the occurrence of solder crack failures when mounting discrete components to a printed wiring board. [Configuration] 2 is a printed wiring board, a cylindrical metal tube 6 with a collar is previously inserted into a predetermined mounting hole of the printed wiring board 2, and the leads 4 of the discrete component 1 are inside the cylindrical metal tube 6 with a collar. Insert into. After that, the conductor land portion 3 and the component lead 4 are soldered by soldering to form a solder portion 5.
Description
【0001】[0001]
本考案はプリント配線基板に係り、ディスクリート部品の取付構造に関する。 The present invention relates to a printed wiring board and a mounting structure for discrete components.
【0002】[0002]
従来のディスクリート部品の取付構造は、図2に示すように片面のプリント配 線基板2の所要の取付孔にディスクリート部品1を挿入し、しかる後、半田処理 が行われ、導体ランド部3と部品のリード4が半田付けされて半田部分15が形 成されている。ところが、半田処理において、半田量のコントロールは非常に難 しく、小型部品と比べて大型部品の半田付着量は所要値より少なくなり易く、特 にリードの形状が角型の場合などで半田の不足から半田付不良が生じ易い。また 、部品によってリードの径は様々であり且つ、一つの部品に付いている複数個の リード間の寸法のバラッキは多く、これらの誤差を吸収するため取付孔の径はリ ードの径よりかなり大きくなっており、リードの移動によって当該部品が浮き上 がったり、傾いたりし、半田クラックなどの障害の発生の原因となっている。 As shown in Fig. 2, the conventional mounting structure for discrete parts is such that the discrete part 1 is inserted into the required mounting hole of the printed wiring board 2 on one side, and then soldering is performed to make the conductor land 3 and the part Lead 4 is soldered to form a solder portion 15. However, it is very difficult to control the amount of solder in the soldering process, and the amount of solder adhered to large parts tends to be less than the required value compared to small parts, especially when the lead shape is square and there is insufficient solder. Therefore, defective soldering easily occurs. Also, the diameter of the lead varies depending on the part, and there are many variations in the size between the leads attached to one part.To absorb these errors, the diameter of the mounting hole should be smaller than the diameter of the lead. The size is quite large, and the movement of the leads causes the relevant parts to rise and tilt, causing failures such as solder cracks.
【0003】[0003]
本考案はこのような点に鑑みなされたもので、大型部品の場合は相対的な半田 付着量が不足し易く、特にリードの形状が角型の場合などで半田不足から半田付 不良が生じ易く、また、取付部品が浮き上がったり、傾いたりすることによって 半田クラックなどの障害が発生しないディスクリート部品の取付構造を提供する ものである。 The present invention has been made in view of such a point, and in the case of a large-sized component, the relative amount of attached solder tends to be insufficient, and in particular, when the lead shape is square, insufficient soldering tends to cause defective soldering. Also, the present invention provides a mounting structure for discrete components in which solder cracks or other troubles do not occur due to the mounting components rising or tilting.
【0004】[0004]
本考案は上述の問題を解決すために、プリント配線基板へのディスクリート部 品の取付において、プリント配線基板の所要の取付孔に予め鍔付き金属管を挿入 して、部品のリードを鍔付き金属管に挿通し、しかる後、半田処理するようにし たディスクリート部品の取付構造を提供するものである。 In order to solve the above-mentioned problems, the present invention inserts a collared metal tube into a required mounting hole of the printed wiring board in advance when mounting the discrete component on the printed wiring board, and attaches the lead of the component to the metal portion with the collared part. The purpose of the present invention is to provide a mounting structure for discrete parts that is inserted into a pipe and then soldered.
【0005】[0005]
以上のように構成したので、本考案によるディスクリート部品の取付構造にお いては、プリント配線基板の取付孔に予め鍔付き金属管を挿入して、ディスクリ ート部品のリードを鍔付き円筒形の金属管の内側に挿通することにより、取付孔 の径と鍔付き円筒形の金属管の外径との差及び鍔付き金属管の内径とリードの径 との差がいずれも小さくなり、鍔付き金属管の外側とプリント配線基板の導体ラ ンド部が半田付けされると同時に鍔付き金属管の内側とリードも毛細管現象によ り半田付けされ、均一な半田付着量が得られ半田部分の強度が大幅に増すため半 田クラックなどの障害の発生を防止することが出来る。 With the above-mentioned structure, in the discrete component mounting structure according to the present invention, the lead of the discrete component is inserted into the mounting hole of the printed wiring board in advance, and the lead of the discrete component is cylindrical with the collar. By inserting it inside the metal tube, the difference between the diameter of the mounting hole and the outer diameter of the cylindrical metal tube with a collar and the difference between the inner diameter of the metal tube with a collar and the diameter of the lead are both reduced, The outer side of the metal tube with the cover and the conductor land part of the printed wiring board are soldered, and at the same time the inner side of the metal tube with the collar and the leads are also soldered by the capillary phenomenon, so that a uniform amount of solder adhesion can be obtained. Since the strength is greatly increased, it is possible to prevent the occurrence of failures such as rice cracks.
【0006】[0006]
以下図面に基いて本考案によるディスクリート部品の取付構造の一実施例を詳 細に説明する。図1は本考案によるディスクリート部品の取付構造の一実施例の 要部断面図である。図において、2はプリント配線基板で、鍔付き円筒形金属管 6をプリント配線基板2の所要の取付孔に予め挿入し、ディスクリート部品1の リード4を鍔付き金属管6の内側に挿通する。しかる後、半田処理により導体ラ ンド部3と当該部品のリード4が半田付けされて半田部分5を形成する。 上記説明では鍔付き金属管を円筒形としたが、鍔付き角形の金属管でも同様な 効果を期待できる。 An embodiment of a discrete component mounting structure according to the present invention will be described in detail below with reference to the drawings. FIG. 1 is a sectional view of an essential part of an embodiment of a mounting structure for discrete components according to the present invention. In the figure, reference numeral 2 denotes a printed wiring board in which a flanged cylindrical metal tube 6 is previously inserted into a required mounting hole of the printed wiring board 2 and leads 4 of the discrete component 1 are inserted into the flanged metal tube 6. Then, the conductor land portion 3 and the lead 4 of the component are soldered by soldering to form a solder portion 5. In the above description, the flanged metal tube is cylindrical, but the same effect can be expected with a flanged metal tube.
【0007】[0007]
以上説明したように、本考案によるディスクリート部品の取付構造においては 、プリント配線基板の取付孔に予め鍔付き円筒形の金属管を挿入し、ディスクリ ート部品のリードを鍔付き円筒形の金属管の内側に挿通することにより、取付孔 の径と鍔付き円筒形の金属管の外径との差及び鍔付き円筒形の金属管の内径とリ ードの径との差がいずれも小さくなり、鍔付き円筒形の金属管の外側とプリント 配線基板の導体ランド部が半田付けされると同時に鍔付き円筒形の金属管の内側 とリードも毛細管現象により半田付けされるため、均一な半田付着量が得られ、 半田部分の強度が大幅に増すため半田クラックなどの障害の発生を防止すること ができる。 As described above, in the mounting structure of the discrete component according to the present invention, the cylindrical metal tube with the collar is previously inserted into the mounting hole of the printed wiring board, and the lead of the discrete component is connected to the cylindrical metal tube with the collar. By inserting it inside the pipe, the difference between the diameter of the mounting hole and the outer diameter of the cylindrical metal pipe with a collar and the difference between the inner diameter of the cylindrical metal pipe with a collar and the diameter of the lead are both small. Since the outside of the cylindrical metal tube with a collar and the conductor land of the printed wiring board are soldered, the inside of the cylindrical metal tube with a collar and the leads are also soldered by the capillary phenomenon, so uniform soldering is achieved. Since the adhesion amount is obtained and the strength of the solder portion is significantly increased, it is possible to prevent the occurrence of failures such as solder cracks.
【図1】本考案によるディスクリート部品取付構造の一
実施例の要部断面図である。FIG. 1 is a sectional view of an essential part of an embodiment of a discrete component mounting structure according to the present invention.
【図2】従来のディスクリート部品取付構造の一実施例
の要部断面図である。FIG. 2 is a sectional view of an essential part of an example of a conventional discrete component mounting structure.
1 ディスクリート部品 2 プリント配線基板 3 導体ランド部 4 リード 5 半田部分 6 鍔付き円筒形の金属管 15 半田部分 1 Discrete parts 2 Printed wiring board 3 Conductor land part 4 Lead 5 Solder part 6 Cylindrical metal tube with a collar 15 Solder part
Claims (1)
品の取付において、プリント配線基板の所要の取付孔に
予め鍔付き金属管を挿入して、部品のリードを鍔付き金
属管に嵌通し、しかる後、半田処理するようにしたこと
を特徴とするディスクリート部品の取付構造。1. When mounting a discrete component on a printed wiring board, a collared metal tube is previously inserted into a required mounting hole of the printed wiring board, the lead of the component is fitted into the collared metal tube, and then, Mounting structure for discrete parts characterized by soldering.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7261291U JPH0525769U (en) | 1991-09-10 | 1991-09-10 | Mounting structure for discreet parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7261291U JPH0525769U (en) | 1991-09-10 | 1991-09-10 | Mounting structure for discreet parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0525769U true JPH0525769U (en) | 1993-04-02 |
Family
ID=13494392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7261291U Pending JPH0525769U (en) | 1991-09-10 | 1991-09-10 | Mounting structure for discreet parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0525769U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185951A (en) * | 2004-12-24 | 2006-07-13 | Sumitomo Wiring Syst Ltd | Structure for fixing board terminal to circuit board |
-
1991
- 1991-09-10 JP JP7261291U patent/JPH0525769U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185951A (en) * | 2004-12-24 | 2006-07-13 | Sumitomo Wiring Syst Ltd | Structure for fixing board terminal to circuit board |
JP4506456B2 (en) * | 2004-12-24 | 2010-07-21 | 住友電装株式会社 | Board terminal mounting structure on circuit board |
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