JPH0525731U - Wafer storage case - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a wafer storage case in which the airtightness of the wafer storage portion is improved and the wafer cleanliness is maintained. A decompression unit comprising a space in which the opening surface is flush with the wafer storage unit 4 and the deoxidizer 7 is stored in the outer periphery of an upper opening of the wafer storage unit 4 for storing the semiconductor wafer 2. 5, the semiconductor wafer 2 is accommodated by hermetically fitting the lid 6 by vacuum suction to the openings of the wafer accommodating portion 4 and the pressure reducing portion 5.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a case for housing a semiconductor wafer (hereinafter referred to as a wafer).

[0002]

[Prior Art]

 When a wafer is transported over a long distance or stored for a long time, for example, as shown in FIG. 2, a polypropylene wafer storage case (hereinafter referred to as a case) (1) having a large number of vertical grooves (1a) formed on a side wall thereof is provided. The wafer (2) is stored in an upright state. Then, a lid (3) is fitted into the opening via rubber packing, and the case (1) and the lid (3) are mechanically sealed by an elastic clamp mechanism (not shown) used for a lunch box or the like. It prevents the invasion of dust.

[0003]

[Problems to be solved by the device]

 The problem to be solved is that even if the case (1) and the lid (3) are mechanically sealed by an elastic clamp mechanism, the airtightness inside the case is still insufficient, and the intrusion of water etc. is prevented. In addition, it is not possible to sufficiently prevent dust from entering due to deterioration of the rubber packing, and dust is generated from the deteriorated rubber packing itself.

[0004]

[Means for Solving the Problems]

 The present invention comprises a wafer storage part with an upper opening and a space provided on the outer periphery of the wafer storage part with the opening surface flush with the wafer storage part. And a lid part that is hermetically fitted to the openings of the wafer storage part and the decompression part by vacuum suction.

[0005]

[Action]

 According to the above technical means, the lid portion is airtightly fitted to the opening of the wafer accommodating portion and the pressure reducing portion by vacuum suction of the pressure reducing portion.

[0006]

【Example】

 An embodiment of the present invention will be described below with reference to FIG. In the figure, (4) is a wafer storage part, (5) is a decompression part, and (6) is a lid part. As in the conventional case, the wafer storage section (4) is an upper opening polypropylene storage case having a large number of vertical grooves (4a) formed in the side wall, and stores the wafer (2) in an upright state. The decompression section (5) consists of a space formed by enclosing the outer periphery of the wafer storage section (4) with polypropylene side plates and making the opening surface substantially flush with the wafer storage section (4). A deoxidizer (7) such as fine powder is stored to reduce the pressure in the space. The lid portion (6) is airtightly fitted to the openings of the wafer housing portion (4) and the pressure reducing portion (5) by vacuum suction. At this time, the lid portion (6) is formed of a flexible material such as polypropylene, and the opening surfaces of the wafer storage portion (4) and the decompression portion (5) are curved slightly downward to be fitted. At this time, the bending deformation of the lid (6) is visually checked so that the airtightness of the vacuum suction can be visually confirmed. In addition, a packing made of silicon rubber or the like is attached to the contact surface between the opening surface and the lid portion (6) to enhance the airtightness. Further, if necessary, a mechanical sealing means such as an elastic clamp mechanism may be added as a sealing means until the pressure is reduced.

According to the above structure, when the lid (6) is fitted into the openings of the wafer storage section (4) and the decompression section (5), the lid section (6) is vacuum-adsorbed by the decompression section (5). The airtightness is improved by being hermetically sealed in the wafer storage part (4). In addition, the wafer storage unit (4) is kept at a substantially normal pressure to prevent dust and the like from entering the wafer storage unit (4) due to the difference in atmospheric pressure when the lid is opened.

[0008]

[Effect of the device]

 According to the present invention, since the lid is fitted by the vacuum suction of the decompression unit provided on the outer periphery of the wafer storage unit, the airtightness of the wafer storage unit is improved and the entry of dust, water, etc. can be prevented. Can maintain high wafer cleanliness.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of a wafer storage case according to the present invention.

FIG. 2 is a side sectional view showing an example of a conventional wafer storage case.

[Explanation of symbols]

 2 semiconductor wafer 4 wafer storage 5 decompression unit 6 lid 7 oxygen scavenger

Claims (2)

[Scope of utility model registration request] 1. A wafer storage part having an upper opening and a space provided on the outer periphery of the wafer storage part with its opening surface substantially flush with the wafer storage part. 2. A wafer storage case, comprising: the depressurizing part, and a wafer accommodating part and a lid part that is hermetically fitted to the opening of the depressurizing part by vacuum suction. 2. A wafer storage case in which the lid portion is made of a deformable material, and the lid portion is airtightly fitted to the opening of the wafer storage portion and the depressurized portion by vacuum suction due to the deformation of the lid portion due to depressurization.