JPH05256620A - Circuit board inspecting device - Google Patents

Circuit board inspecting device

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Publication number
JPH05256620A
JPH05256620A JP4053759A JP5375992A JPH05256620A JP H05256620 A JPH05256620 A JP H05256620A JP 4053759 A JP4053759 A JP 4053759A JP 5375992 A JP5375992 A JP 5375992A JP H05256620 A JPH05256620 A JP H05256620A
Authority
JP
Japan
Prior art keywords
edge
center
circuit board
gravity
calculating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4053759A
Other languages
Japanese (ja)
Inventor
Hirotaka Suganuma
弘孝 菅沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP4053759A priority Critical patent/JPH05256620A/en
Publication of JPH05256620A publication Critical patent/JPH05256620A/en
Withdrawn legal-status Critical Current

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  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To provide a circuit board inspecting device capable of correctly determining the center of gravity position of a fitted part item and precisely judging the position drift. CONSTITUTION:A circuit board inspecting device is provided with an image pickup unit 2 photographing an electronic part item C fitted on a circuit board K, an edge position calculating means 3b calculating the edge position based on the intensity data of multiple edge detection lines crossing the electronic part item C, a center of gravity position calculating means 3d calculating the center of gravity position of the fitted part item C based on the edge position, a judging means 3f comparing the obtained center of gravity position with the reference position and judging the position drift of the fitted part item C, and the second edge position calculating means 3c calculating the edge position based on 1/2 of the sum of the coordinates of the intersection of the upper limit and the lower limit of the threshold value specified by the intensity data and the maximum value and minimum value of the intensity data when the detection point of the intensity data does not exist between the upper limit and lower limit of the threshold value of the intensity data obtained by the edge detection line.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、回路基板上に装着され
た電子部品の実装状態を検査する回路基板検査装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection device for inspecting the mounting state of electronic components mounted on a circuit board.

【0002】[0002]

【従来の技術】この種の回路基板検査装置は、回路基板
上に装着された電子部品(以下、単に部品という)を撮
像する2次元カメラと、マイクロコンピュ−タを用いた
画像処理装置とから構成されている。画像処理装置で
は、カメラを通じて得られる部品と交差する複数のエッ
ジ検出ラインの輝度デ−タからエッジ位置を算出し、該
エッジ位置から装着部品の重心位置を求めこれを基準位
置と比較して位置ずれ等の判定を行なっている。
2. Description of the Related Art A circuit board inspection apparatus of this type comprises a two-dimensional camera for picking up an image of an electronic component (hereinafter, simply referred to as a component) mounted on a circuit board, and an image processing apparatus using a microcomputer. It is configured. In the image processing device, the edge position is calculated from the luminance data of a plurality of edge detection lines intersecting with the component obtained through the camera, the position of the center of gravity of the mounted component is calculated from the edge position, and the position is compared with the reference position. Judgment such as deviation is performed.

【0003】以下に、上記画像処理装置で実施される従
来の判定方法を、両端部に電極Caを有する角柱型の部
品Cを例にあげて詳細に説明する。
A conventional determination method implemented by the above image processing apparatus will be described in detail below by taking a prism-shaped component C having electrodes Ca at both ends as an example.

【0004】まず、図3に示すように両端の電極Caと
X,Y方向で夫々交差する各4本のエッジ検出ラインX
1 乃至X4 及びY1 乃至Y4 から図4のような連続した
輝度デ−タを夫々抽出し、各輝度デ−タから電極Caと
半田印刷部Kaとの境界位置となるエッジx1 乃至x4
及びy1 乃至y4 の座標を求める。尚、8本のエッジ検
出ラインは電極Caが本来くるべき位置に合わせて予め
設定される。
First, as shown in FIG. 3, each of the four edge detection lines X intersects with the electrodes Ca at both ends in the X and Y directions, respectively.
The continuous luminance data as shown in FIG. 4 is extracted from 1 to X4 and Y1 to Y4 respectively, and the edges x1 to x4 which are the boundary positions between the electrode Ca and the solder print portion Ka are extracted from the respective luminance data.
And the coordinates of y1 to y4 are obtained. The eight edge detection lines are set in advance according to the position where the electrode Ca should originally come.

【0005】次に、X方向のエッジx1 乃至x4 のX座
標の平均と、Y方向のエッジy1 乃至y4 のY座標の平
均から、部品Cの重心CG のX座標CX とY座標CY を
算出する。以上で回路基板K上に装着された部品Cの重
心CG の座標(CX ,CY )が求められる。
Next, the X coordinate CX and the Y coordinate CY of the center of gravity CG of the part C are calculated from the average of the X coordinates of the edges x1 to x4 in the X direction and the average of the Y coordinates of the edges y1 to y4 in the Y direction. .. Thus, the coordinates (CX, CY) of the center of gravity CG of the component C mounted on the circuit board K are obtained.

【0006】エッジx1 乃至x4 及びy1 乃至y4 の座
標の算出方法は、図4で示した輝度デ−タの最大値MA
Xと最小値MINで規定、例えば最大値MAXの80%
と20%で規定されるしきい値の上限HIGHと下限L
OWの間に輝度デ−タの検出ポイントが入るか否かで異
なってくる。
The method for calculating the coordinates of the edges x1 to x4 and y1 to y4 is to calculate the maximum value MA of the luminance data shown in FIG.
Specified by X and minimum value MIN, for example 80% of maximum value MAX
And the upper limit of the threshold specified by 20% and the lower limit L
It depends on whether or not a luminance data detection point is entered during OW.

【0007】つまり、図5に示すように輝度デ−タの検
出ポイントP1 乃至P5 のうち、3つの検出ポイントP
2 ,P3 ,P4 がしきい値の上限HIGHと下限LOW
の間に入る場合には、次式よりエッジのX座標X0 を求
めている。
That is, as shown in FIG. 5, among the detection points P1 to P5 of the brightness data, three detection points P are detected.
2, P3 and P4 are the upper limit HIGH and the lower limit LOW of the threshold
If it falls within the interval, the X coordinate X0 of the edge is obtained from the following equation.

【0008】X0 =Σ(Xi・Fi)/Σ(Fi) Xi:検出ポイントのX座標 Fi:輝度レベル値 一方、図6に示すように輝度デ−タの検出ポイントP1
乃至P5 の全てがしきい値の上限HIGHと下限LOW
の間に入らない場合、例えば部品Cに対する照明の関係
で電極Caの側面に影ができ、得られる輝度デ−タに急
勾配が生じた場合には上式を利用することができないの
で、輝度デ−タとしきい値の上限HIGH及び下限LO
Wとの交点A,BのX座標と輝度レベル値から、次式よ
りエッジのX座標X0 を求めている。
X0 = Σ (Xi · Fi) / Σ (Fi) Xi: X coordinate of the detection point Fi: Luminance level value On the other hand, as shown in FIG. 6, the luminance data detection point P1
All of P5 to P5 are the upper limit HIGH and the lower limit LOW of the threshold value.
In the case where the brightness does not fall within the range, for example, when the side surface of the electrode Ca is shaded due to the illumination of the component C and the obtained brightness data has a steep gradient, the above equation cannot be used. Upper limit of data and threshold value and lower limit LO
From the X-coordinates of the intersections A and B with W and the brightness level value, the X-coordinate X0 of the edge is obtained by the following equation.

【0009】X0 ={(XA ・FA )+(XB ・FB
)}/(FA +FB ) XA :交点AのX座標 XB :交点BのX座標 FA :交点Aの輝度レベル値 FB :交点Bの輝度レベル値 Y方向のエッジ検出ラインY1 乃至Y4 の場合も上記と
同様にしてエッジy1乃至y4 のY座標が適宜求められ
る。
X0 = {(XA.FA) + (XB.FB
)} / (FA + FB) XA: X coordinate of intersection A XB: X coordinate of intersection B FA: Luminance level value of intersection A FB: Luminance level value of intersection B The above also applies to edge detection lines Y1 to Y4 in the Y direction Similarly to the above, the Y coordinates of the edges y1 to y4 are appropriately obtained.

【0010】そして、部品Cの重心CG の座標(CX ,
CY )を予め設定した基準座標と比較し、該部品Cの重
心CG に許容範囲を越えるずれがある場合には位置ずれ
の判定を下す。
Then, the coordinates (CX,
CY) is compared with preset reference coordinates, and if the center of gravity CG of the component C has a deviation exceeding the allowable range, the position deviation is determined.

【0011】[0011]

【発明が解決しようとする課題】しかしながら、上述し
た後者のエッジ位置算出方法では、ノイズ排除の関係で
しきい値の下限LOWをあまり低く設定できないことも
影響して、求められたエッジのX座標X0 が図6に示す
ようにしきい値の上限HIGHにかなり近いものとな
る。
However, in the latter edge position calculation method described above, the lower limit LOW of the threshold value cannot be set too low due to noise elimination, and this influences the X coordinate of the obtained edge. As shown in FIG. 6, X0 becomes very close to the upper limit HIGH of the threshold value.

【0012】例えば、交点AのX座標XA が2.1、交
点BのX座標XB が2.8、交点Aの輝度レベル値FA
が8、交点Bの輝度レベル値FB が2の場合には、エッ
ジのX座標X0 の値は2.24となり、求められたエッ
ジのX座標X0 は交点AのX座標XA に近接する。
For example, the X coordinate XA of the intersection A is 2.1, the X coordinate XB of the intersection B is 2.8, and the brightness level value FA of the intersection A is
8 and the brightness level value FB of the intersection B is 2, the value of the X coordinate X0 of the edge becomes 2.24, and the obtained X coordinate X0 of the edge is close to the X coordinate XA of the intersection A.

【0013】つまり、後者のエッジ位置算出方法では適
正なエッジ座標、つまりしきい値の上限HIGHと下限
LOWのほぼ中間点となることが望ましいエッジ座標を
得ることができず、当然ながら該エッジ座標から求めら
れた部品Cの重心CG の座標が不正確になって位置ずれ
等の判定を的確に行なえなくなる難点がある。
That is, in the latter edge position calculation method, it is not possible to obtain proper edge coordinates, that is, edge coordinates that are desired to be substantially the midpoint between the upper limit HIGH and the lower limit LOW of the threshold value. There is a problem that the coordinates of the center of gravity CG of the component C obtained from the above become inaccurate, and it becomes impossible to accurately determine the position shift or the like.

【0014】本発明は上記事情に鑑みてなされたもの
で、その目的とするところは、装着部品の重心位置を正
確に求めて位置ずれ等を判定を高精度に行なえる回路基
板検査装置を提供することにある。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a circuit board inspection apparatus capable of accurately determining the position of the center of gravity of a mounted component and determining the positional deviation and the like with high accuracy. To do.

【0015】[0015]

【課題を解決するための手段】上記目的を達成するため
本発明では、回路基板上に装着された電子部品を撮像す
る撮像器と、電子部品と交差する複数のエッジ検出ライ
ンの輝度デ−タからエッジ位置を算出するエッジ位置算
出手段と、該エッジ位置から装着部品の重心位置を求め
る重心位置算出手段と、求められた重心位置を基準位置
と比較して装着部品の位置ずれ等を判定する判定手段と
を具備した回路基板検査装置において、エッジ検出ライ
ンで得られた輝度デ−タにおけるしきい値の上限と下限
の間に該輝度デ−タの検出ポイントが入らない場合に、
輝度デ−タと該輝度デ−タの最大値及び最小値から規定
されるしきい値の上限及び下限との交点の座標の和の2
分の1からエッジ位置を算出する第2のエッジ位置算出
手段を設けている。
In order to achieve the above object, according to the present invention, an image pickup device for picking up an image of an electronic component mounted on a circuit board, and luminance data of a plurality of edge detection lines intersecting with the electronic component. Edge position calculating means for calculating the edge position from the edge position, center of gravity position calculating means for calculating the center of gravity position of the mounting component from the edge position, and comparing the determined center of gravity position with a reference position to determine the displacement of the mounting component, etc. In the circuit board inspecting device equipped with the judging means, when the detection point of the luminance data does not fall between the upper limit and the lower limit of the threshold in the luminance data obtained on the edge detection line,
2 of the sum of the coordinates of the intersection of the brightness data and the upper and lower limits of the threshold value defined by the maximum value and the minimum value of the brightness data
A second edge position calculation means for calculating the edge position from 1 / min is provided.

【0016】[0016]

【作用】本発明に係る検査装置では、エッジ検出ライン
で得られた輝度デ−タにおけるしきい値の上限と下限の
間に該輝度デ−タの検出ポイントが入らない場合に、第
2のエッジ位置算出手段において輝度デ−タと該輝度デ
−タの最大値及び最小値から規定されるしきい値の上限
及び下限との交点の座標の和の2分の1からエッジ位置
が算出され、該エッジ位置から重心位置算出手段におい
て装着部品の重心位置が求められる。求められた装着部
品の重心位置は判定手段において基準位置と比較され、
これにより装着部品の位置ずれ等が判定される。
In the inspection apparatus according to the present invention, when the luminance data detection point does not fall between the upper and lower thresholds of the luminance data obtained on the edge detection line, the second The edge position calculation means calculates the edge position from one half of the sum of the coordinates of the intersection of the brightness data and the upper and lower limits of the threshold value defined by the maximum value and the minimum value of the brightness data. From the edge position, the center-of-gravity position calculating means obtains the center-of-gravity position of the mounted component. The determined position of the center of gravity of the mounted component is compared with the reference position in the determination means,
As a result, the displacement of the mounted component and the like are determined.

【0017】[0017]

【実施例】図1には本発明を適用した回路基板検査装置
の概略を示してある。同図において、1はX−Y−θテ
−ブル等から成る搬送テ−ブル、2はCCD等を用いた
照明器2a付きの2次元カメラ、3はマイクロコンピュ
−タを用いた画像処理装置、4はモニタ−、Kは回路基
板、Cは回路基板K上に装着された部品である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 schematically shows a circuit board inspection apparatus to which the present invention is applied. In the figure, 1 is a transport table made up of an XY-θ table or the like, 2 is a two-dimensional camera with an illuminator 2a using a CCD or the like, and 3 is an image processing apparatus using a microcomputer. 4 is a monitor, K is a circuit board, and C is a component mounted on the circuit board K.

【0018】画像処理装置3は、カメラ2を通じエッジ
位置算出に必要な輝度デ−タを記憶する画像メモリ3a
と、輝度デ−タからエッジ位置の算出を行なう第1,第
2のエッジ位置算出回路3b,3cと、エッジ位置から
重心位置の算出を行なう重心位置算出回路3dと、判定
基準デ−タを記憶する基準位置メモリ3eと、求められ
た重心位置を基準位置と比較して装着部品の位置ずれ等
を判定する判定回路3fとを具備している。
The image processing device 3 includes an image memory 3a for storing brightness data required for edge position calculation through the camera 2.
The first and second edge position calculation circuits 3b and 3c for calculating the edge position from the brightness data, the center of gravity position calculation circuit 3d for calculating the center of gravity position from the edge position, and the judgment reference data. It is provided with a reference position memory 3e for storing and a determination circuit 3f for comparing the obtained center of gravity position with the reference position to determine the displacement of the mounted component and the like.

【0019】以下に、上記画像処理装置3で実施される
判定方法を、両端部に電極Caを有する角柱型の部品C
を例にあげて説明する。尚、本説明では先に説明した図
3乃至図5を引用する。
The determination method carried out by the image processing apparatus 3 will be described below with reference to a prismatic part C having electrodes Ca at both ends.
Will be described as an example. In this description, FIGS. 3 to 5 described above are cited.

【0020】まず、装着部品Cをカメラ2で撮像して、
図3に示すように両端の電極CaとX,Y方向で夫々交
差する各4本のエッジ検出ラインX1 乃至X4 及びY1
乃至Y4 から図4のような連続した輝度デ−タを夫々抽
出し、該デ−タを画像メモリ3aに記憶させる。図4に
おけるMAXとMINは輝度デ−タの最大値と最小値
で、HIGHとLOWは、例えば最大値MAXの80%
と20%で規定されるしきい値の上限HIGHと下限L
OWである。
First, the mounting part C is imaged by the camera 2,
As shown in FIG. 3, four edge detection lines X1 to X4 and Y1 which intersect the electrodes Ca at both ends in the X and Y directions, respectively.
The continuous luminance data as shown in FIG. 4 are extracted from Y4 to Y4 and stored in the image memory 3a. MAX and MIN in FIG. 4 are the maximum and minimum values of luminance data, and HIGH and LOW are, for example, 80% of the maximum value MAX.
And the upper limit of the threshold specified by 20% and the lower limit L
OW.

【0021】しきい値の上限HIGHと下限LOWの間
に輝度デ−タの検出ポイントが入る場合、即ち図5に示
すように輝度デ−タの検出ポイントP1 乃至P5 のう
ち、3つの検出ポイントP2 ,P3 ,P4 がしきい値の
上限HIGHと下限LOWの間に入る場合には、第1の
エッジ位置算出回路3bにおいて次式よりエッジのX座
標X0 を求める。
When the luminance data detection points fall between the upper limit HIGH and the lower limit LOW of the threshold value, that is, as shown in FIG. 5, three detection points among the luminance data detection points P1 to P5 are detected. When P2, P3 and P4 fall between the upper limit HIGH and the lower limit LOW of the threshold value, the X coordinate X0 of the edge is obtained by the following equation in the first edge position calculation circuit 3b.

【0022】X0 =Σ(Xi・Fi)/Σ(Fi) Xi:検出ポイントのX座標 Fi:輝度レベル値 Y方向のエッジ検出ラインY1 乃至Y4 の場合も上記と
同様にしてエッジy1乃至y4 のY座標が適宜求められ
る。
X0 = .SIGMA. (Xi.Fi) /. SIGMA. (Fi) Xi: X coordinate of the detection point Fi: Brightness level value In the case of the edge detection lines Y1 to Y4 in the Y direction, the same applies to the case of the edges y1 to y4. The Y coordinate is obtained as appropriate.

【0023】また、しきい値の上限HIGHと下限LO
Wの間に輝度デ−タの検出ポイントが入らない場合、即
ち図2に示すように輝度デ−タの検出ポイントP1 乃至
P5の全てがしきい値の上限HIGHと下限LOWの間
に入らない場合には、該輝度デ−タとしきい値の上限H
IGH及び下限LOWとの交点A´,B´のX座標か
ら、第2のエッジ位置算出回路3cにおいて次式よりエ
ッジのX座標X0 ´を求める。
Further, the upper limit HIGH and the lower limit LO of the threshold value are set.
When the luminance data detection point does not fall within W, that is, as shown in FIG. 2, all the luminance data detection points P1 to P5 do not fall between the upper limit HIGH and the lower limit LOW of the threshold value. In this case, the luminance data and the upper limit H of the threshold value
From the X-coordinates of the intersections A'and B'of IGH and the lower limit LOW, the X-coordinate X0 'of the edge is calculated by the following equation in the second edge position calculation circuit 3c.

【0024】X0 ´=(XA ´+XB ´)/2 XA ´:交点A´のX座標 XB ´:交点B´のX座標 つまり、交点A´のX座標XA ´が2.1で、交点B´
のX座標XB ´が2.8の場合では、上記式よりエッジ
のX座標X0 の値は2.45となり、求められたエッジ
のX座標X0 ´はしきい値の上限HIGHと下限LOW
の中間点となって、従来のように該座標X0 ´がしきい
値の上限HIGHに近接するようなことはない。Y方向
のエッジ検出ラインY1 乃至Y4 の場合も上記と同様に
してエッジy1 乃至y4 のY座標が適宜求められる。
X0 '= (XA' + XB ') / 2 XA': X coordinate of intersection A'XB ': X coordinate of intersection B'That is, X coordinate XA' of intersection A'is 2.1 and intersection B ' ´
When the X coordinate XB 'of the edge is 2.8, the value of the X coordinate X0 of the edge becomes 2.45 from the above equation, and the X coordinate X0' of the obtained edge is the upper limit HIGH and the lower limit LOW of the threshold value.
The coordinate X0 'does not come close to the upper limit HIGH of the threshold value as in the conventional case. Also in the case of the edge detection lines Y1 to Y4 in the Y direction, the Y coordinates of the edges y1 to y4 are appropriately obtained in the same manner as above.

【0025】次に、重心位置算出回路3dにて、X方向
のエッジx1 乃至x4 のX座標の平均と、Y方向のエッ
ジy1 乃至y4 のY座標の平均から、部品Cの重心CG
のX座標CX とY座標CY を算出する。以上で回路基板
K上に装着された部品Cの重心CG の座標(CX ,CY
)が求められる。
Next, in the center-of-gravity position calculation circuit 3d, the center of gravity CG of the part C is calculated from the average of the X coordinates of the edges x1 to x4 in the X direction and the average of the Y coordinates of the edges y1 to y4 in the Y direction.
The X coordinate CX and the Y coordinate CY of are calculated. With the above, the coordinates of the center of gravity CG of the component C mounted on the circuit board K (CX, CY
) Is required.

【0026】次に、求められた部品Cの重心CG の座標
(CX ,CY )と予め設定された基準座標とを判定回路
3fで比較し、部品Cの重心CG に許容範囲を越えるず
れがある場合には位置ずれの判定を下す。位置ずれの判
定を受けた回路基板Kは後の工程でラインから除去され
る。
Next, the determination circuit 3f compares the obtained coordinates (CX, CY) of the center of gravity CG of the component C with a preset reference coordinate, and the center of gravity CG of the component C has a deviation exceeding the allowable range. In this case, the position shift is judged. The circuit board K that has received the positional deviation determination is removed from the line in a later step.

【0027】このように上述の検査装置では、エッジ検
出ラインで得られる輝度デ−タにおけるしきい値の上限
HIGHと下限LOWの間に該輝度デ−タの検出ポイン
トが入らない場合でも、輝度デ−タとしきい値の上限H
IGH及び下限LOWとの交点A´,B´の座標からエ
ッジ座標を適正に捕らえて、装着部品Cの重心CG の座
標を正確に求めることができる。つまり、装着部品Cに
対する照明等の影響で前者の座標算出式が利用できない
場合でも、装着部品Cの重心CG の座標を正確に求めて
位置ずれ等を判定を高い精度で実施することが可能とな
る。
As described above, in the above-described inspection apparatus, even if the detection point of the luminance data does not fall between the upper limit HIGH and the lower limit LOW of the threshold in the luminance data obtained on the edge detection line, the luminance is not detected. Upper limit of data and threshold H
The coordinates of the center of gravity CG of the mounting component C can be accurately obtained by properly capturing the edge coordinates from the coordinates of the intersections A'and B'with the IGH and the lower limit LOW. In other words, even when the former coordinate calculation formula cannot be used due to the influence of illumination or the like on the mounted component C, it is possible to accurately determine the coordinates of the center of gravity CG of the mounted component C and perform the displacement determination with high accuracy. Become.

【0028】[0028]

【発明の効果】以上詳述したように、本発明によれば、
エッジ検出ラインで得られた輝度デ−タにおけるしきい
値の上限と下限の間に該輝度デ−タの検出ポイントが入
らない場合でも、輝度デ−タとしきい値の上限及び下限
との交点からエッジ位置を適正に捕らえて装着部品の重
心位置を正確に求めることが可能であり、これにより位
置ずれ等の判定を高精度で実施できる。
As described in detail above, according to the present invention,
Even if the detection point of the luminance data does not fall between the upper limit and the lower limit of the threshold in the luminance data obtained on the edge detection line, the intersection of the luminance data and the upper and lower limits of the threshold. Therefore, the edge position can be properly captured and the position of the center of gravity of the mounted component can be accurately obtained, which enables highly accurate determination of the positional deviation and the like.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明を適用した回路基板検査装置の概略図FIG. 1 is a schematic diagram of a circuit board inspection apparatus to which the present invention is applied.

【図2】エッジ検出ラインにおける輝度デ−タを示す図FIG. 2 is a diagram showing luminance data on an edge detection line.

【図3】重心の算出手順を示す部品上面及び側面図FIG. 3 is a top view and a side view of a component showing a procedure for calculating a center of gravity.

【図4】エッジ検出ラインにおける輝度デ−タを示す図FIG. 4 is a diagram showing luminance data on an edge detection line.

【図5】エッジ検出ラインにおける輝度デ−タを示す図FIG. 5 is a diagram showing luminance data in an edge detection line.

【図6】エッジ検出ラインにおける輝度デ−タを示す図FIG. 6 is a diagram showing luminance data on an edge detection line.

【符号の説明】[Explanation of symbols]

K…回路基板、C…部品、CG …重心、2…カメラ、3
…画像処理装置、3b…第1のエッジ位置算出回路、3
c…第2のエッジ位置算出回路、3d…重心位置算出回
路、3f…判定回路、X1 〜X4 ,Y1 〜Y4 …エッジ
検出ライン、x1 〜x4 ,y1 〜y4 …エッジ、MAX
…輝度レベルの最大値、MIN…輝度レベルの最小値、
HIGH…しきい値の上限、LOW…しきい値の下限、
A´,B´…交点、X0 ´…エッジのX座標。
K ... Circuit board, C ... Component, CG ... Center of gravity, 2 ... Camera, 3
... image processing device, 3b ... first edge position calculation circuit, 3
c ... Second edge position calculation circuit, 3d ... Centroid position calculation circuit, 3f ... Judgment circuit, X1 to X4, Y1 to Y4 ... Edge detection line, x1 to x4, y1 to y4 ... Edge, MAX
... maximum value of brightness level, MIN ... minimum value of brightness level,
HIGH ... upper limit of threshold, LOW ... lower limit of threshold,
A ', B' ... intersection, X0 '... edge X coordinate.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 回路基板上に装着された電子部品を撮像
する撮像器と、電子部品と交差する複数のエッジ検出ラ
インの輝度デ−タからエッジ位置を算出するエッジ位置
算出手段と、該エッジ位置から装着部品の重心位置を求
める重心位置算出手段と、求められた重心位置を基準位
置と比較して装着部品の位置ずれ等を判定する判定手段
とを具備した回路基板検査装置において、 エッジ検出ラインで得られた輝度デ−タにおけるしきい
値の上限と下限の間に該輝度デ−タの検出ポイントが入
らない場合に、輝度デ−タと該輝度デ−タの最大値及び
最小値から規定されるしきい値の上限及び下限との交点
の座標の和の2分の1からエッジ位置を算出する第2の
エッジ位置算出手段を設けた、 ことを特徴とする装着部品検査装置。
1. An image pickup device for picking up an image of an electronic component mounted on a circuit board, an edge position calculating means for calculating an edge position from brightness data of a plurality of edge detection lines intersecting with the electronic component, and the edge. Edge detection in a circuit board inspection device equipped with a center-of-gravity position calculation means for determining the center-of-gravity position of the mounted component from the position, and a determination means for comparing the calculated center-of-gravity position with a reference position to determine the displacement of the mounted component, etc. When the detection point of the luminance data does not fall between the upper limit and the lower limit of the threshold in the luminance data obtained on the line, the luminance data and the maximum and minimum values of the luminance data The mounting component inspection device further comprises a second edge position calculating means for calculating an edge position from a half of a sum of coordinates of intersections with upper and lower limits of the threshold defined by
JP4053759A 1992-03-12 1992-03-12 Circuit board inspecting device Withdrawn JPH05256620A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4053759A JPH05256620A (en) 1992-03-12 1992-03-12 Circuit board inspecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4053759A JPH05256620A (en) 1992-03-12 1992-03-12 Circuit board inspecting device

Publications (1)

Publication Number Publication Date
JPH05256620A true JPH05256620A (en) 1993-10-05

Family

ID=12951748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4053759A Withdrawn JPH05256620A (en) 1992-03-12 1992-03-12 Circuit board inspecting device

Country Status (1)

Country Link
JP (1) JPH05256620A (en)

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