JPH05255479A - Epoxy resin composition and its cured product - Google Patents

Abstract

PURPOSE:To provide the subject composition containing a specific epoxy compound and a specific phenolic compound, having high heat-resistance and low water-absorption and useful as a sealing material, etc., for electric and electronic parts, etc. CONSTITUTION:The objective composition contains (A) an epoxy compound expressed by formula I (R1 to R3 are H, halogen, 1-4C alkyl or aryl) and (B) a phenolic compound expressed by formula II (R4 and R5 are H, halogen, 1-4C alkyl or aryl; (n) is 0-10). The amount of the component B used as a curing agent is preferably 0.5-1.5 equivalent based on 1 equivalent of the epoxy compound of the component A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition useful as an electric / electronic component material which gives a cured product having excellent heat resistance and low water absorption and a cured product thereof.

[0002]

2. Description of the Related Art Epoxy resin has been used as a material for electric and electronic parts because of its excellent characteristics.
We have provided excellent cured products as electronic component materials.

Recently, however, the surface mounting of LSIs has been carried out, and the number of cases where they are directly immersed in a solder bath is increasing. At that time, since the sealant is exposed to a high temperature of 200 ° C. or higher, there is a problem that the moisture absorbed in the sealant expands and the sealant cracks. Therefore, the epoxy resin sealant has been required to have heat resistance sufficient to withstand such high temperatures and low water absorption.

At present, as an epoxy resin for sealing,
-Although a combination of glycidyl ether of cresol novolac and phenol novolac as a curing agent has become the mainstream, one having sufficient various properties has not been proposed yet.

[0005]

In view of heat resistance and low water absorption, the encapsulant composed of a combination of glycidyl ether of o-cresol novolac and phenol novolac is well balanced, but rapid progress in LSI packaging technology. The current situation is that we have not fully dealt with.

For example, when a glycidyl ether of a substituted phenol novolac substituted with an alkyl group having a large number of carbon atoms is used to improve water absorption, low water absorption is realized, but heat resistance and curability are deteriorated.

In order to satisfy these contradictory required properties at the same time, it is necessary to consider not only the epoxy resin or the curing agent alone, but also the combination of the two. As a result of the repeated stacking, the present invention was achieved.

[0008]

The present invention provides (1) (a)
Epoxy compound represented by the following formula (1)

[0009]

[Chemical 3]

(Wherein R ₁ , R ₂ and R ₃ each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms, or an aryl group) and (b) the following formula (2) ) A phenolic compound represented by

[0011]

[Chemical 4]

(In the formula, R ₄ and R ₅ are each independently
Hydrogen atom, halogen atom, alkyl group having 1 to 4 carbon atoms,
Alternatively, an aryl group and n represents a value of 0 to 10, preferably a value of 0 to 6. ) Is contained in the epoxy resin composition,

(2) 0.5 equivalent of the phenol compound of (b) as a curing agent to 1 equivalent of the epoxy compound of (a)
The present invention relates to the epoxy resin composition described in (1) above, which is contained in an amount of from 1.5 to 1.5 equivalents, and (3) the cured product of the epoxy resin composition described in (1) or (2) above.

The epoxy compound represented by the formula (1), which is the component (a), imparts high heat resistance to the cured product of the epoxy resin composition of the present invention. Further, since the epoxy compound of the formula (1) has a planar structure like a naphthalene ring, it has good intermolecular packing and imparts low water absorption to the cured product. The phenolic compound represented by the formula (2), which is the component (b), imparts low water absorption to the cured product while maintaining heat resistance.

In R _{1 to} R ₅ of the above formulas (1) and (2), examples of the halogen atom include chlorine atom and bromine atom, and examples of the alkyl group having 1 to 4 carbon atoms include methyl group, ethyl group, Examples thereof include t-butyl group, and examples of the aryl group include phenyl group and naphthyl group.

The epoxy resin composition of the present invention may contain a curing accelerator, if necessary.
Imidazole compounds such as 2-methylimidazole and 2-ethylimidazole, 2- (dimethylaminomethyl)
Various known curing accelerators such as tertiary amine compounds such as phenol, triphenylphosphine, etc. may be mentioned and are not particularly limited. These may be used alone or in combination of two or more. The curing accelerator is (a)
0.01 to 15 per 100 parts by weight of the epoxy compound
It is preferable to use parts by weight, particularly preferably 0.1 to 10 parts by weight.

The epoxy resin composition of the present invention may further contain known additives, if necessary. Examples of the additives include inorganic fillers such as silica, alumina, talc and glass fibers, surface treatment agents for fillers such as silane coupling agents, release agents, pigments and the like.

The epoxy resin composition of the present invention is obtained by uniformly mixing the components, and is usually 130 to 170.
Pre-cure in the range of 30-300 seconds at a temperature of ℃,
By post-curing at a temperature of 150 to 200 ° C. for 2 to 10 hours, a sufficient curing reaction proceeds to obtain the cured product of the present invention. It is also possible to uniformly disperse or dissolve the components of the epoxy resin composition in a solvent or the like, remove the solvent, and cure.

Since the cured product thus obtained retains high heat resistance, the epoxy resin composition of the present invention can be used in a wide range of fields where heat resistance is required. Specifically, all kinds of electrical materials such as insulating materials, laminated boards, sealing materials, etc.
It is useful as an electronic material. In addition to molding materials and composite materials, they can also be used in fields such as coating materials.

[0020]

EXAMPLES The present invention will be described below with reference to examples. The present invention is not limited to these examples.

Examples 1 to 5 and Comparative Example 1 An epoxy compound represented by the following formula (3) as the epoxy compound (a) (epoxy equivalent 212 g / eq, softening point 7)
1 ° C)

[0022]

[Chemical 5]

As the curing agent (b), a phenol compound represented by the following formula (4) (hydroxyl group equivalent: 140 g / eq)
To

[0024]

[Chemical 6]

(In the formula, the value of n is 1.9 (average value)) Also, in the comparative example, the conventionally used orthocresol novolac epoxy resin (EOCN1020, epoxy equivalent 200 g / eq, softening point 67 ° C., Japan A phenol compound represented by the formula (4) was used as a curing agent for Kayaku Co., Ltd., and these were mixed with a curing accelerator at a ratio shown in Table 1 to obtain an epoxy resin composition. Triphenylphosphine was used as a curing accelerator. The epoxy resin composition obtained by mixing the respective components is roll-kneaded at 70 to 80 ° C. for 15 minutes, cooled, pulverized, tabletted, further molded by a transfer molding machine, and post-cured to obtain a cured product. The glass transition temperature and water absorption of the cured product were measured.

The measurement results are shown in Table 1. The glass transition temperature and water absorption measurement conditions, transfer molding conditions, and post cure conditions are as follows. Glass transition temperature thermomechanical measuring device (TMA): TM- manufactured by Vacuum Riko Co., Ltd.
7000 Temperature rising rate: 2 ° C / min Water absorption rate Test piece (cured product): Diameter 50 mm Thickness 3 mm Disc Weight increase after boiling in 100 ° C water for 24 hours (% by weight)

Transfer molding conditions Temperature: 150 ° C. Molding pressure: 50 kg / cm ² hours: 3 minutes Post-cure conditions Temperature: 180 ° C. Time: 8 hours

In Table 1, the numerical values in the column of each component represent parts by weight.

Table 1 Actual Example Comparative Example 1 2 3 4 5 1 Epoxy compound (a) 100 100 100 100 100 Orthocresol Novolac 100 Epoxy resin Curing agent (b) 40 53 66 79 92 70 Curing accelerator 1 1 1 1 1 1 Glass transition temperature (℃) 152 155 157 154 153 154 Water absorption (%) 0.67 0.68 0.67 0.64 0.62 1.05

[0024]

The cured product of the epoxy resin composition of the present invention has high heat resistance and low water absorption, and is useful for various uses such as a sealant. The epoxy compound of component (a) and the phenol compound of component (b) used in the epoxy resin composition of the present invention are the conventional phenol novolac type epoxy resin and phenol as a curing agent in terms of heat resistance and water absorption. It is possible to provide a cured product having excellent properties as compared with novolac and having excellent properties.

Claims (3)

[Claims] 1. An epoxy compound represented by the following formula (1): (In the formula, R ₁ , R ₂ , and R ₃ each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms, or an aryl group.) And (b) represented by the following formula (2). Phenol compounds (Wherein R ₄ and R ₅ each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms, or an aryl group, and n represents a value from 0 to 10). An epoxy resin composition characterized by: 2. A phenol compound of (b) is used as a curing agent in an amount of 0.5 to 1 equivalent of the epoxy compound of (a).
The epoxy resin composition according to claim 1, which contains 1.5 equivalents. 3. A cured product of the epoxy resin composition according to claim 1.