JPH05249422A - Production of liquid crystal display element - Google Patents

Production of liquid crystal display element

Info

Publication number
JPH05249422A
JPH05249422A JP4049371A JP4937192A JPH05249422A JP H05249422 A JPH05249422 A JP H05249422A JP 4049371 A JP4049371 A JP 4049371A JP 4937192 A JP4937192 A JP 4937192A JP H05249422 A JPH05249422 A JP H05249422A
Authority
JP
Japan
Prior art keywords
liquid crystal
substrate
crystal display
substrates
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4049371A
Other languages
Japanese (ja)
Other versions
JP2678325B2 (en
Inventor
Jun Takahashi
潤 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP4049371A priority Critical patent/JP2678325B2/en
Publication of JPH05249422A publication Critical patent/JPH05249422A/en
Application granted granted Critical
Publication of JP2678325B2 publication Critical patent/JP2678325B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133302Rigid substrates, e.g. inorganic substrates

Abstract

PURPOSE:To efficiently produce the liquid crystal display element which is reduced in the thickness of one substrate at a good yield. CONSTITUTION:A pair of glass substrates 11, 12 each having an area for plural pieces of liquid crystal display elements are adhered via sealing materials 13 respectively enclosing the liquid crystal sealing regions of the respective element blocks thereof and an outer peripheral sealing material 14 enclosing all of the respective element blocks to assemble an element assemblage 10. The outside surface of one of the two substrates 11, 12 of the respective element blocks is then etched to reduce the thickness of this substrate and thereafter, the element assemblage 10 is separated to the individual elements.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は液晶表示素子の製造方法
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device.

【0002】[0002]

【従来の技術】一般に、液晶表示素子は、複数個の素子
を一括して同時に組立てる製法で製造されている。
2. Description of the Related Art Generally, a liquid crystal display device is manufactured by a method of simultaneously assembling a plurality of devices at once.

【0003】この製法は、液晶表示素子複数個分の面積
をもつ一対のガラス基板の各素子区画にそれぞれ表示用
の透明電極および配向膜等を形成し、この一対の基板
を、一方の基板にその各素子区画の液晶封入領域をそれ
ぞれ囲んで印刷したシール材を介して接着して、複数個
の液晶表示素子が並んだ素子集合体を組立て、この後、
この素子集合体の両基板を各素子区画ごとに分断して個
々の素子に分離する方法であり、分離された各素子は、
この後、前記シール材の一部に設けておいた液晶注入口
から液晶封入領域に液晶を注入して前記液晶注入口を封
止し、さらに素子の表裏面(両基板の外面)にそれぞれ
偏光板を接着して液晶表示素子とされている。
In this manufacturing method, a transparent electrode for display and an alignment film are formed in each element section of a pair of glass substrates having an area for a plurality of liquid crystal display elements, and the pair of substrates is used as one substrate. The liquid crystal encapsulation area of each of the element compartments is respectively surrounded and adhered through a printed sealant to assemble an element assembly in which a plurality of liquid crystal display elements are arranged, and thereafter,
This is a method of dividing both substrates of this element assembly into each element by dividing each element section, and each separated element is
Then, liquid crystal is injected into the liquid crystal filling area from the liquid crystal injection port provided in a part of the sealing material to seal the liquid crystal injection port, and the front and back surfaces of the device (outer surfaces of both substrates) are polarized respectively. A plate is adhered to form a liquid crystal display element.

【0004】なお、液晶表示素子内に液晶を封入する方
法には、一対の基板を接着する前に、一方の基板の各素
子区画の液晶封入領域にそれぞれ適量の液晶をディスペ
ンサ等によって滴下供給する方法もあり、この場合は、
各素子区画の液晶封入領域を囲むシール材に液晶注入口
を設けておく必要はない。
Incidentally, in the method of sealing the liquid crystal in the liquid crystal display element, before adhering the pair of substrates, an appropriate amount of the liquid crystal is dropped and supplied to the liquid crystal sealing area of each element section of one substrate by a dispenser or the like. There is also a method, in this case,
It is not necessary to provide a liquid crystal injection port in the sealing material that surrounds the liquid crystal enclosure area of each element section.

【0005】ところで、液晶表示素子には、その背後に
バックライトを配置して使用されるものと、素子の裏面
に反射板を配置して使用される反射型のものとがある。
なお、前記反射板としては、透明な光拡散板の背面に光
反射面を形成したものが使用されている。
There are two types of liquid crystal display devices, one in which a backlight is arranged behind the liquid crystal display device and the other in which a reflection plate is arranged on the back surface of the device.
As the reflection plate, a transparent light diffusion plate having a light reflection surface formed on the back surface is used.

【0006】上記反射型の液晶表示素子は、その表面側
偏光板を通って入射し、両基板間の液晶層を通った後、
裏面側偏光板により透過・遮断されて像光となった光
を、この裏面側偏光板の外面に配置した上記反射板で反
射させて表示するもので、この反射型液晶表示素子は、
時計、電卓、電子手帳等、各種電子機器の表示素子に広
く利用されている。
In the reflective liquid crystal display device, the light is incident through the polarizing plate on the front surface side, and after passing through the liquid crystal layer between both substrates,
The light that is transmitted and blocked by the back side polarizing plate to become image light is reflected by the reflection plate arranged on the outer surface of the back side polarizing plate for display, and this reflection type liquid crystal display element is
It is widely used as a display element for various electronic devices such as watches, calculators, and electronic notebooks.

【0007】しかし、上記反射型液晶表示素子は、反射
板で反射された像光を素子の表面側から観察するもので
あるため、表示を斜め方向から見ると、表示像が、明部
と暗部との境界がぼけた像となってしまうという問題を
もっている。
However, since the reflection type liquid crystal display element observes the image light reflected by the reflection plate from the surface side of the element, when the display is viewed obliquely, the display image shows a bright portion and a dark portion. There is a problem that the boundary with and becomes a blurred image.

【0008】これは、裏面側基板での光の屈折によるも
ので、反射型液晶表示素子の表示を表示面(表面側偏光
板面)に対して垂直な方向から見た場合は裏面側基板で
の光の屈折はなく、したがって反射板で反射された反射
光は入射時の経路と同じ経路を通って出射するが、表示
面に対して斜め方向から表示を見ると、裏面側基板での
光の屈折によって、反射光の経路が入射時の経路からず
れ、その結果、表示像の輪郭がぼけてしまう。
This is due to the refraction of light on the back side substrate, and when the display of the reflective liquid crystal display element is viewed from the direction perpendicular to the display surface (front side polarizing plate surface), the back side substrate There is no refraction of the light, so the reflected light reflected by the reflector exits through the same path as when it was incident, but when viewing the display from an oblique direction to the display surface, the light on the back side substrate Due to the refraction of, the path of the reflected light deviates from the path of the incident light, and as a result, the outline of the display image is blurred.

【0009】このため、上記反射型液晶表示素子では、
その裏面側基板の厚さをできるだけ薄くすることが望ま
れており、裏面側基板の厚さを薄くすれば、表示を斜め
方向から見たときにおける裏面側基板での光の屈折によ
る反射光の経路のずれが小さくなるため、輪郭の鮮明な
表示を得ることができる。
Therefore, in the above reflective liquid crystal display device,
It is desired to make the thickness of the back side substrate as thin as possible, and if the thickness of the back side substrate is made thin, the reflected light due to the refraction of the light at the back side substrate when the display is viewed from an oblique direction is obtained. Since the deviation of the path becomes small, it is possible to obtain a display with a clear contour.

【0010】しかし、上述したように複数個の素子を一
括して同時に組立てる製法で液晶表示素子を製造する場
合は、液晶表示素子複数個分の面積をもつ大面積のガラ
ス基板を用いるため、液晶表示素子の製造において最初
から薄いガラス基板を使用したのでは、このガラス基板
が、一対の基板をシール材を介して接着して素子集合体
を組立てる際の基板加圧力に耐えきれずに割れてしま
う。このため、上記製法で液晶表示素子を製造する場合
は、薄くても0.3mm程度以上の厚さのガラス基板を使
用する必要がある。
However, when a liquid crystal display device is manufactured by a method of simultaneously assembling a plurality of devices at once as described above, since a large-area glass substrate having an area for a plurality of liquid crystal display devices is used, the liquid crystal Since a thin glass substrate was used from the beginning in the manufacture of display elements, this glass substrate was unable to withstand the pressure applied to the substrate when assembling the element assembly by bonding a pair of substrates with a sealing material, and cracked. I will end up. Therefore, when a liquid crystal display element is manufactured by the above manufacturing method, it is necessary to use a glass substrate having a thickness of about 0.3 mm or more even if it is thin.

【0011】そこで、従来は、0.3mm〜1.1mm程度
の厚さのガラス基板を用いて素子集合体を組立て、この
素子集合体を個々の素子に分離した後、各液晶表示素子
の一方のガラス基板(反射板を配置する裏面側基板)の
外面を機械的に研磨して、一方の基板の厚さを薄くした
液晶表示素子を製造している。
Therefore, conventionally, an element assembly is assembled by using a glass substrate having a thickness of about 0.3 mm to 1.1 mm, the element assembly is separated into individual elements, and one of the liquid crystal display elements is The liquid crystal display element is manufactured by mechanically polishing the outer surface of the glass substrate (the substrate on the back surface on which the reflecting plate is arranged) of (1) to reduce the thickness of one substrate.

【0012】なお、この製造方法において、ガラス基板
面の研磨を、素子集合体を個々の素子に分離してから行
なっているのは、素子集合体の状態でガラス基板面を研
磨すると、研磨中にガラス基板が割れてしまうからであ
る。
In this manufacturing method, the surface of the glass substrate is polished after the element assembly is separated into individual elements. This is because the glass substrate will break.

【0013】[0013]

【発明が解決しようとする課題】しかしながら、上記従
来の製造方法は、素子集合体を個々の素子に分離した後
に、1つ1つの液晶表示素子についてその裏面側基板を
薄く研磨するものであるため、液晶表示素子の製造能率
が悪く、したがって液晶表示素子の製造コストが高くな
るといる問題をもっていた。
However, in the above-mentioned conventional manufacturing method, the back side substrate of each liquid crystal display element is thinly polished after separating the element assembly into individual elements. However, there is a problem that the manufacturing efficiency of the liquid crystal display element is low and therefore the manufacturing cost of the liquid crystal display element is high.

【0014】しかも、上記従来の製造方法では、ガラス
基板の外面を機械的に研磨してその厚さを薄くしている
ため、基板面の均一な研磨が難しく、そのために薄型化
された基板の厚さにばらつきがあるし、また、研磨中に
基板の角部が欠けたりして生じるガラス屑により基板面
が傷ついて、この液晶表示素子が不良品となるため、液
晶表示素子の製造歩留も悪いという問題があった。
Moreover, in the above conventional manufacturing method, since the outer surface of the glass substrate is mechanically polished to reduce its thickness, it is difficult to evenly polish the substrate surface. The manufacturing yield of liquid crystal display elements is high because the thickness of the liquid crystal display element is defective and the glass surface generated by chipping off the corners of the substrate during polishing damages the substrate surface. There was a problem that it was bad.

【0015】本発明は上記のような実情にかんがみてな
されたものであって、その目的とするところは、一方の
基板の厚さを薄くした液晶表示素子を能率的にかつ歩留
よく製造することができる液晶表示素子の製造方法を提
供することにある。
The present invention has been made in view of the above situation, and an object thereof is to efficiently manufacture a liquid crystal display device in which one of the substrates has a small thickness with a good yield. An object of the present invention is to provide a method of manufacturing a liquid crystal display device capable of performing the above.

【0016】[0016]

【課題を解決するための手段】本発明は、液晶表示素子
複数個分の面積をもつ一対のガラス基板を、その各素子
区画の液晶封入領域をそれぞれ囲むシール材と、前記各
素子区画の全てを囲む外周シール材とを介して接着して
素子集合体を組立てた後、前記各素子区画の両基板のう
ちの一方の外面をエッチングしてこの基板の厚さを薄く
し、この後前記素子集合体を個々の素子に分離すること
を特徴とするものである。
SUMMARY OF THE INVENTION According to the present invention, a pair of glass substrates having an area for a plurality of liquid crystal display elements, a sealing material surrounding each liquid crystal enclosing region of each element section, and all of the element sections are provided. After assembling the element assembly by adhering it through the outer peripheral sealing material surrounding the substrate, the outer surface of one of the substrates of each of the element sections is etched to reduce the thickness of the substrate, and then the element is formed. The feature is that the assembly is separated into individual elements.

【0017】[0017]

【作用】すなわち、本発明は、素子集合体の状態で各素
子区画の両基板のうちの一方の外面をエッチングするこ
とにより、各液晶表示素子の一方の基板の厚さを一括し
て薄くするものである。なお、この場合、素子集合体の
内部は各素子区画の全てを囲む外周シール材によってシ
ールされているため、基板外面のエッチングに際して素
子集合体の内部がエッチング雰囲気にさらされることは
なく、したがって、基板の内面がエッチングされてダメ
ージを受けることはない。
That is, according to the present invention, the thickness of one substrate of each liquid crystal display element is collectively reduced by etching the outer surface of one of the two substrates of each element section in the element assembly state. It is a thing. In this case, since the inside of the element assembly is sealed by the outer peripheral sealing material that surrounds all of the element sections, the inside of the element assembly is not exposed to the etching atmosphere when the outer surface of the substrate is etched, and therefore, The inner surface of the substrate is not damaged by etching.

【0018】そして、本発明では、素子集合体の状態で
各素子区画の一方の基板の厚さを薄くしているため、こ
の後に素子集合体を分断して個々に分離される各素子
は、その全てが既に一方の基板の厚さを薄くされた素子
であり、したがって、一方の基板の厚さを薄くした液晶
表示素子を能率的に製造できる。しかも、本発明では、
基板外面をエッチングして基板の厚さを薄くしているた
めに、基板を均一に薄くすることができるし、また機械
的研磨のように基板を損傷してしまうこともないから、
製造歩留もよい。
Further, in the present invention, since the thickness of one substrate of each element section is reduced in the state of the element assembly, each element which is subsequently separated by dividing the element assembly is All of them are elements in which the thickness of one of the substrates is already thin, and therefore, a liquid crystal display element in which the thickness of one of the substrates is thin can be efficiently manufactured. Moreover, in the present invention,
Since the outer surface of the substrate is etched to reduce the thickness of the substrate, the substrate can be uniformly thinned, and the substrate is not damaged like mechanical polishing.
Good manufacturing yield.

【0019】[0019]

【実施例】【Example】

[第1の実施例] [First Embodiment]

【0020】以下、本発明の第1の実施例を図1〜図5
を参照して説明する。図1は液晶表示素子の製造方法を
示す各製造工程時の断面図であり、液晶表示素子は、次
のような工程で製造する。 (工程1)
A first embodiment of the present invention will be described below with reference to FIGS.
Will be described. FIG. 1 is a cross-sectional view showing the manufacturing method of a liquid crystal display element at each manufacturing step. The liquid crystal display element is manufactured by the following steps. (Process 1)

【0021】まず、図1(a)に示すように、液晶表示
素子複数個分の面積をもつ一対のガラス基板11,12
を、その各素子区画の液晶封入領域をそれぞれ囲むシー
ル材13と、前記各素子区画の全てを囲む外周シール材
14とを介して接着して素子集合体10を組立てる。
First, as shown in FIG. 1A, a pair of glass substrates 11 and 12 having an area for a plurality of liquid crystal display elements.
The element assembly 10 is assembled by adhering the two through the sealing material 13 that surrounds the liquid crystal enclosing area of each element section and the outer peripheral sealing material 14 that surrounds all of the element sections.

【0022】図2は上記素子集合体10の一部切開平面
図であり、この素子集合体10は、後述する基板外面の
エッチング工程を終了した後、両基板11,12を図に
一点鎖線で示した分断線a,bに沿って折断することに
より、個々の素子に分離される。
FIG. 2 is a partially cutaway plan view of the element assembly 10. In this element assembly 10, after the etching process of the outer surface of the substrate, which will be described later, is completed, both substrates 11 and 12 are indicated by a chain line. The individual elements are separated by breaking along the dividing lines a and b shown.

【0023】上記ガラス基板11,12は、素子集合体
10の組立て時に割れ等を生じないような厚さ(約0.
3mm〜1.1mm)の基板であり、図1において下側の基
板(以下、下基板という)11の分断線aで囲まれた各
素子区画部分はそれぞれ液晶表示素子の表面側基板Aと
なり、上側の基板(以下、上基板という)12の分断線
bで囲まれた各素子区画部分はそれぞれ液晶表示素子の
裏面側基板Bとなる。
The glass substrates 11 and 12 have a thickness (about 0.
3 mm to 1.1 mm), each element partition portion surrounded by a dividing line a of the lower substrate (hereinafter referred to as the lower substrate) 11 in FIG. 1 becomes a front surface side substrate A of the liquid crystal display element, Each element partition portion of the upper substrate (hereinafter, referred to as an upper substrate) 12 surrounded by a dividing line b becomes a rear substrate B of the liquid crystal display element.

【0024】そして、両基板11,12の各素子区画に
はそれぞれ表示用の透明電極と配向膜とが形成されてい
る。なお、図1および図2には透明電極および配向膜は
示していないが、前記透明電極は、例えば図3に示すよ
うなパターンの複数のセグメント電極15と、これらセ
グメント電極15に対向するコモン電極16(図4参
照)であり、この実施例では、下基板11の全ての素子
区画にセグメント電極15を形成し、上基板12の全て
の素子区画にコモン電極16を形成している。また、図
3および図4において、17,18は前記配向膜であ
る。この配向膜17,18は、例えばポリイミドからな
っており、その膜面にはラビング処理が施されている。
Then, a transparent electrode for display and an alignment film are formed in each element section of both substrates 11 and 12. Although the transparent electrode and the alignment film are not shown in FIGS. 1 and 2, the transparent electrode is, for example, a plurality of segment electrodes 15 having a pattern as shown in FIG. 3 and a common electrode facing these segment electrodes 15. 16 (see FIG. 4), in this embodiment, the segment electrodes 15 are formed in all the element sections of the lower substrate 11, and the common electrodes 16 are formed in all the element sections of the upper substrate 12. 3 and 4, 17 and 18 are the alignment films. The alignment films 17 and 18 are made of polyimide, for example, and the film surfaces thereof are rubbed.

【0025】また、上記下基板11の各素子区画(液晶
表示素子の表面側基板A)の一側縁部は、液晶封入領域
を囲むシール材13の外側に張出す端子配列部とされて
いる。この端子配列部には、図3および図4に示すよう
に、上記各セグメント電極15の端子15aと、上基板
12に形成したコモン電極16の端子16aとが形成さ
れており、上基板12側のコモン電極16は、素子集合
体10を個々の素子に分離した後、シール材13の外側
において導電ペースト19等により下基板11に形成し
た端子16aと導通接続される。上記素子集合体10
は、次のようにして組立てる。
Further, one side edge portion of each element section of the lower substrate 11 (front surface side substrate A of the liquid crystal display element) is a terminal array portion which extends to the outside of the sealing material 13 which surrounds the liquid crystal enclosed area. .. As shown in FIGS. 3 and 4, terminals 15a of the segment electrodes 15 and terminals 16a of the common electrodes 16 formed on the upper substrate 12 are formed in the terminal arrangement portion, and the upper substrate 12 side After separating the element assembly 10 into individual elements, the common electrode 16 is electrically connected to the terminal 16a formed on the lower substrate 11 by the conductive paste 19 or the like outside the sealing material 13. The element assembly 10
Is assembled as follows.

【0026】まず、各素子区画にそれぞれ上記セグメン
ト電極15と配向膜17とを形成した下基板11と、各
素子区画にそれぞれ上記コモン電極16と配向膜18と
を形成した上基板12とのうち、一方の基板面に、その
各素子区画の液晶封入領域をそれぞれ囲むシール材13
と、各素子区画の全てを囲む外周シール材14とを、ス
クリーン印刷法等によって同時に印刷する。なお、前記
シール材13,14には、ガラス基板11,12とのエ
ッチング選択比が高い接着剤(エポキシ樹脂系接着剤
等)を用いる。また、各素子区画のシール材13はその
一部に液晶注入口13aとなる隙間を残して印刷し、ま
た外周シール材14はその一部に通気口14aとなる隙
間を残して印刷する。
First, of the lower substrate 11 in which the segment electrodes 15 and the alignment film 17 are formed in each element section, and the upper substrate 12 in which the common electrode 16 and the alignment film 18 are formed in each element section, respectively. , A sealing material 13 surrounding the liquid crystal encapsulation region of each element section on one substrate surface.
And the outer peripheral sealing material 14 that surrounds all of the element sections are simultaneously printed by a screen printing method or the like. An adhesive having a high etching selection ratio with respect to the glass substrates 11 and 12 (epoxy resin adhesive or the like) is used for the sealing materials 13 and 14. In addition, the seal material 13 of each element section is printed with a part thereof leaving a gap to be the liquid crystal injection port 13a, and the outer peripheral seal material 14 is printed with a part leaving a gap to be the vent hole 14a.

【0027】次に、上記一対のガラス基板11,12を
その各素子区画を互いに対向させて重ね合わせ、この両
基板11,12を前記シール材13,14を介して接着
する。この場合、両基板11,12間の空間は、各素子
区画のシール材13の一部に設けた液晶注入口13aと
外周シール材14の一部に設けた通気口14aとを介し
て外部に連通しているため、両基板11,12間の空気
圧が高くなることはなく、したがって、両基板11,1
2をその全域にわたって均一な間隔で接着することがで
きる。
Next, the pair of glass substrates 11 and 12 are overlapped with their element sections facing each other, and the substrates 11 and 12 are bonded to each other via the sealing materials 13 and 14. In this case, the space between the substrates 11 and 12 is exposed to the outside through the liquid crystal injection port 13a provided in a part of the sealing material 13 of each element section and the ventilation port 14a provided in a part of the outer peripheral sealing material 14. Since they are communicated with each other, the air pressure between the two substrates 11 and 12 does not increase, and therefore the two substrates 11 and
The two can be adhered over the entire area at uniform intervals.

【0028】このようにして素子集合体10を組立てた
後は、外周シール材14の一部に設けておいた通気口1
4aを、ガラス基板11,12とのエッチング選択比が
高い封止材(エポキシ樹脂系接着剤等)20で封止し、
素子集合体10の内部を密封する。 (工程2)
After the element assembly 10 is assembled in this manner, the vent hole 1 provided in a part of the outer peripheral seal material 14 is provided.
4a is sealed with a sealing material (epoxy resin adhesive or the like) 20 having a high etching selection ratio with the glass substrates 11 and 12,
The inside of the element assembly 10 is sealed. (Process 2)

【0029】次に、図1(b)に示すように、上記素子
集合体10の両基板11,12のうち、液晶表示素子の
表面側基板となる基板、例えば下基板11の外面に、そ
の全面を覆うレジストマスク21を形成する。 (工程3)
Next, as shown in FIG. 1 (b), of the two substrates 11 and 12 of the element assembly 10, a substrate to be the front surface side substrate of the liquid crystal display device, for example, the outer surface of the lower substrate 11, is formed. A resist mask 21 that covers the entire surface is formed. (Process 3)

【0030】次に、上記素子集合体10の両基板11,
12のうち、液晶表示素子の裏面側基板となる上基板1
2の外面をエッチングして、この上基板12の厚さを図
1(c)に示すように薄くする。
Next, both substrates 11 of the element assembly 10 are
Out of 12, an upper substrate 1 which is a back side substrate of a liquid crystal display element
The outer surface of 2 is etched to reduce the thickness of the upper substrate 12 as shown in FIG. 1 (c).

【0031】この上基板12の外面のエッチングは、弗
酸をベースとするエッチング液を用い、このエッチング
液中に素子集合体10を浸漬して行なう。このように、
素子集合体10をエッチング液に浸漬すると、素子集合
体10の両基板11,12のうち、外面をレジストマス
ク21で覆われている下基板11はエッチングされない
が、エッチング液にさらされる上基板12は、その外面
からエッチングされて薄くなって行く。なお、この上基
板12のエッチング時間は、最終的に得ようとする基板
厚さに応じて設定すればよく、このエッチング時間を制
御することにより、上基板12の厚さを0.2mm〜0.
1mmまで薄くすることができる。
The outer surface of the upper substrate 12 is etched by using a hydrofluoric acid-based etching solution and immersing the element assembly 10 in the etching solution. in this way,
When the element assembly 10 is immersed in the etching solution, the lower substrate 11 of the two substrates 11 and 12 of the element assembly 10 whose outer surfaces are covered with the resist mask 21 is not etched, but is exposed to the etching solution. Is etched from its outer surface and becomes thinner. The etching time of the upper substrate 12 may be set according to the thickness of the substrate to be finally obtained. By controlling the etching time, the thickness of the upper substrate 12 is 0.2 mm to 0 mm. .
It can be thinned to 1 mm.

【0032】この場合、上基板12は、エッチング液中
において機械的な力がかからない状態でエッチングされ
るため、素子集合体10の状態で上基板12の厚さを薄
くしても、この上基板12に割れが発生することはない
し、また上基板12のエッチングは基板面全体にわたっ
て均等に進行するため、上基板12をその全体にわたっ
て均一に薄くすることができる。
In this case, since the upper substrate 12 is etched in the etching liquid in a state where no mechanical force is applied, even if the thickness of the upper substrate 12 in the element assembly 10 is reduced, Since no cracks occur in 12 and the etching of the upper substrate 12 progresses uniformly over the entire substrate surface, the upper substrate 12 can be thinned uniformly over the entire surface.

【0033】なお、素子集合体10をエッチング液中に
浸漬しても、素子集合体10の内部は、各素子区画の全
てを囲みかつ通気口14aを封止材19で封止した外周
シール材14によってシールされているため、素子集合
体10の内部がエッチング雰囲気であるエッチング液に
さらされることはなく、したがって、基板11,12の
内面がエッチングされてダメージを受けることはない。
Even when the element assembly 10 is dipped in the etching solution, the inside of the element assembly 10 encloses all of the element compartments and the vent hole 14a is sealed with the sealing material 19 to provide a peripheral sealing material. Since it is sealed by 14, the inside of the element assembly 10 is not exposed to the etching liquid, which is an etching atmosphere, and therefore the inner surfaces of the substrates 11 and 12 are not etched and damaged.

【0034】また、この場合、被エッチング基板である
上基板12の外面エッチングを行なっている間に、この
上基板12と外面をレジストマスク21で覆われている
下基板11の外周面もエッチングされるが、両基板1
1,12の外周面が外周シール材14の内周面より内側
に後退するまでは、素子集合体10内へのエッチング液
の侵入が外周シール材14によって阻止されるから、外
周シール材14を基板外周縁からある程度の間隔をとっ
て設けるとともに、この外周シール材14の幅を十分大
きくとっておけば、両基板11,12の外周面がエッチ
ングされても何等問題はない。
Further, in this case, while the outer surface of the upper substrate 12 which is the substrate to be etched is being etched, the upper substrate 12 and the outer peripheral surface of the lower substrate 11 whose outer surface is covered with the resist mask 21 are also etched. But both boards 1
Until the outer peripheral surfaces of 1 and 12 recede inward from the inner peripheral surface of the outer peripheral seal material 14, the outer peripheral seal material 14 prevents the etchant from entering the element assembly 10. As long as the outer peripheral sealing material 14 is provided with a certain distance from the outer peripheral edge of the substrate and the outer peripheral sealing material 14 has a sufficiently large width, there is no problem even if the outer peripheral surfaces of both substrates 11 and 12 are etched.

【0035】このように、素子集合体10の状態で上基
板12の外面をエッチングした後は、速やかに素子集合
体10を洗浄し、素子集合体10に付着しているエッチ
ング液を完全に除去し、この後、下基板11からレジス
トマスク21を剥離する。 (工程4)
As described above, after the outer surface of the upper substrate 12 is etched in the state of the element assembly 10, the element assembly 10 is promptly washed to completely remove the etching liquid adhering to the element assembly 10. After that, the resist mask 21 is peeled off from the lower substrate 11. (Process 4)

【0036】次に、図1(d)に示すように、上記素子
集合体10の両基板11,12を、上述した分断線a,
bに沿って折断し、この素子集合体10を個々の素子に
分離する。図1(e)は分離された1つの素子を示して
いる。 (工程5)
Next, as shown in FIG. 1 (d), the two substrates 11 and 12 of the element assembly 10 are connected to each other by the above-mentioned dividing line a,
The device assembly 10 is cut along the line b to separate the device assembly 10 into individual devices. FIG. 1E shows one separated element. (Process 5)

【0037】この後は、分離した各素子の裏面側基板B
に形成されているコモン電極6と、表面側基板Aの端子
配列部に形成してあるコモン電極端子6aとを、図3お
よび図4に示したようにシール材13の外側において導
電ペースト19等により導通接続するとともに、各素子
内にシール材13の一部に設けておいた液晶注入口13
aから真空注入法により液晶LCを注入して前記液晶注
入口13aを図3に示すように封止樹脂22で封止し、
この後、素子の表裏面(両基板A,Bの外面)にそれぞ
れ偏光板を接着するとともに、さらに裏面側の偏光板の
外面に反射板を接着して、反射型の液晶表示素子を完成
する。
After this, the back side substrate B of each separated element
The common electrode 6 formed on the front surface side substrate A and the common electrode terminal 6a formed on the terminal array portion of the front surface side substrate A are connected to the conductive paste 19 and the like outside the sealing material 13 as shown in FIGS. Liquid crystal injection port 13 provided in a part of the sealing material 13 in each element.
A liquid crystal LC is injected from a by a vacuum injection method, and the liquid crystal injection port 13a is sealed with a sealing resin 22 as shown in FIG.
Thereafter, a polarizing plate is adhered to each of the front and back surfaces of the device (outer surfaces of both substrates A and B), and a reflection plate is further adhered to the outer surface of the polarizing plate on the back surface side to complete a reflective liquid crystal display device. ..

【0038】図5は完成した液晶表示素子を示してい
る。図5において、23,24は両基板A,Bの外面に
それぞれ接着された偏光板、25は裏面側偏光板24の
外面に接着された反射板であり、この反射板25は、透
明な光拡散板の背面に光反射面を形成したものである。
FIG. 5 shows a completed liquid crystal display element. In FIG. 5, reference numerals 23 and 24 denote polarizing plates adhered to the outer surfaces of both substrates A and B, respectively, and 25 denotes a reflection plate adhered to the outer surface of the back side polarizing plate 24. The reflection plate 25 is a transparent light. A light reflecting surface is formed on the back surface of the diffusion plate.

【0039】この液晶表示素子は、その裏面側基板Bの
厚さを薄くしたものであるため、表示を斜め方向から見
たときにおける裏面側基板Bでの光の屈折による反射光
の経路のずれは小さく、したがって輪郭の鮮明な表示を
得ることができる。
In this liquid crystal display element, since the thickness of the back surface side substrate B is thin, the deviation of the path of the reflected light due to the refraction of light on the back surface side substrate B when the display is viewed from the oblique direction. Is small and therefore a sharp display of the contour can be obtained.

【0040】また、この液晶表示素子では、その表面側
基板Aの厚さを、素子集合体10を組立てるときの厚さ
(約0.3mm〜1.1mm)のままとしているため、この
表面側基板Aの強度は高く、したがって液晶表示素子の
強度も十分であるし、さらに、両基板A,Bに形成した
透明電極15,16の端子15a,16aを強度の高い
表面側基板Aに設けているため、液晶表示素子をその駆
動回路に接続する際に、液晶表示素子の端子配列部(表
面側基板Aの一側縁部)に圧力がかかっても、液晶表示
素子が破壊されることはない。
Further, in this liquid crystal display element, the thickness of the front surface side substrate A is the same as that at the time of assembling the element assembly 10 (about 0.3 mm to 1.1 mm). The strength of the substrate A is high, and therefore the strength of the liquid crystal display element is also sufficient. Therefore, when the liquid crystal display element is connected to the drive circuit, even if pressure is applied to the terminal arrangement portion (one side edge portion of the front surface side substrate A) of the liquid crystal display element, the liquid crystal display element is not destroyed. Absent.

【0041】そして、上記製造方法においては、素子集
合体10の状態で各素子区画の両基板、つまり液晶表示
素子の表面側および裏面側基板A,B部のうち、裏面側
基板B部の外面をエッチングすることにより、各液晶表
示素子の一方の基板の厚さを一括して薄くしているた
め、この後に素子集合体10を分断して個々に分離され
る各素子は、その全てが既に一方の基板の厚さを薄くさ
れた素子であり、したがって、一方の基板の厚さを薄く
した液晶表示素子を能率的に製造することができる。
In the above manufacturing method, in the state of the element assembly 10, both substrates of each element section, that is, the outer surface of the back side substrate B section of the front side and back side substrates A and B of the liquid crystal display element. Since the thickness of one substrate of each liquid crystal display element is collectively thinned by etching, all the elements already separated from each other by dividing the element assembly 10 thereafter. It is an element in which the thickness of one of the substrates is thin, and therefore, a liquid crystal display element in which the thickness of one of the substrates is thin can be efficiently manufactured.

【0042】しかも、上記製造方法では、基板外面をエ
ッチングして基板の厚さを薄くしているために、基板を
均一に薄くすることができるし、また機械的研磨のよう
に基板を損傷してしまうこともないから、上記液晶表示
素子の製造歩留もよい。 [第2の実施例]
Moreover, in the above manufacturing method, since the outer surface of the substrate is etched to reduce the thickness of the substrate, the substrate can be uniformly thinned, and the substrate is damaged by mechanical polishing. Since it does not occur, the manufacturing yield of the liquid crystal display device is good. [Second Embodiment]

【0043】なお、上記第1の実施例では、全ての素子
区画に液晶表示素子の表面側基板に設ける電極(第1の
実施例ではセグメント電極)と表裏両基板の電極の端子
を形成した基板11と、全ての素子区画に液晶表示素子
の裏面側基板に設ける電極(第1の実施例ではコモン電
極)を形成した基板12とを用いて素子集合体10を組
立て、その一方の基板の厚さを薄くしているが、上記素
子集合体10は、1つおきの素子区画に液晶表示素子の
表面側基板に設ける電極と表裏両基板の電極の端子を形
成し、他の素子区画に裏面側基板に設ける電極を形成し
た一対のガラスを用いて組立ててもよく、その場合は、
両方のガラス基板の各素子区画部分を交互に薄くすれば
よい。
In the first embodiment, a substrate in which electrodes provided on the front substrate of the liquid crystal display element (segment electrodes in the first embodiment) and terminals of electrodes on both front and back substrates are formed in all the element compartments An element assembly 10 is assembled by using 11 and a substrate 12 on which electrodes (common electrodes in the first embodiment) provided on the back side substrate of the liquid crystal display element are formed in all the element sections, and the thickness of one of the substrates is assembled. Although the element assembly 10 is made thin, terminals for electrodes provided on the front side substrate of the liquid crystal display element and electrodes for both front and back substrates are formed in every other element section, and the back surface is provided in the other element section. You may assemble using a pair of glass which formed the electrode provided in a side board, and in that case,
It is sufficient to alternately thin each element partition portion of both glass substrates.

【0044】すなわち、図6および図7は本発明の第2
の実施例を示しており、図6は液晶表示素子の製造方法
を示す各製造工程時の断面図、図8は素子集合体10の
一部切開平面図である。なお、図6および図7におい
て、第1の実施例と対応するものには同符号を付し、重
複する説明は省略する。
That is, FIGS. 6 and 7 show the second embodiment of the present invention.
FIG. 6 is a cross-sectional view at each manufacturing step showing a method for manufacturing a liquid crystal display element, and FIG. 8 is a partially cutaway plan view of the element assembly 10. 6 and 7, the parts corresponding to those of the first embodiment are designated by the same reference numerals, and the duplicated description will be omitted.

【0045】まず、素子集合体10の構成を説明する
と、この素子集合体10は、図6(a)および図7に示
すように、1つおきの素子区画に液晶表示素子の表面側
基板に設ける電極と表裏両基板の電極の端子を形成し、
他の素子区画に裏面側基板に設ける電極を形成した一対
のガラス11,12を、その各素子区画の液晶封入領域
をそれぞれ囲むシール材13と、前記各素子区画の全て
を囲む外周シール材14とを介して接着して組立てたも
のであり、この素子集合体10は、後述する基板外面の
エッチング工程を終了した後、両基板11,12を図に
一点鎖線で示した分断線a,bに沿って折断することに
より、個々の素子に分離される。
First, the structure of the element assembly 10 will be described. As shown in FIGS. 6 (a) and 7, the element assembly 10 is arranged in every other element section on the surface side substrate of the liquid crystal display element. Form the electrodes of the electrodes to be provided and the electrodes of the front and back substrates,
A pair of glasses 11 and 12 having electrodes provided on the back side substrate in the other element sections, a sealing material 13 surrounding each liquid crystal enclosing area of each element section, and an outer peripheral sealing material 14 surrounding all of the element sections. This element assembly 10 is assembled by adhering the substrates 11 and 12 together after completion of the etching process of the outer surface of the substrate which will be described later. The individual elements are separated by breaking along.

【0046】上記ガラス基板11,12は、素子集合体
10の組立て時に割れ等を生じないような厚さ(約0.
3mm〜1.1mm)の基板であり、下基板11の分断線a
で囲まれた各素子区画部分のうち、1つおきの区画部分
はそれぞれ液晶表示素子の表面側基板Aとなり、他の区
画部分はそれぞれ液晶表示素子の裏面側基板Bとなる。
また、上基板12の分断線bで囲まれた各素子区画部分
のうち、下基板11の表面側基板A部に対向する区画部
分はそれぞれ液晶表示素子の裏面側基板Bとなり、下基
板11の裏面側基板B部に対向する区画部分はそれぞれ
液晶表示素子の表面側基板Aとなる。
The glass substrates 11 and 12 have a thickness (about 0.
3 mm to 1.1 mm), and the dividing line a of the lower substrate 11
Every other partition part among the device partition parts surrounded by is the front surface side substrate A of the liquid crystal display element, and the other partition parts are the back surface side substrate B of the liquid crystal display element.
Further, among the respective element partition portions surrounded by the dividing line b of the upper substrate 12, the partition portions facing the front surface side substrate A portion of the lower substrate 11 become the rear surface side substrate B of the liquid crystal display element respectively, and The partition portions facing the back surface side substrate B portion become the front surface side substrate A of the liquid crystal display element.

【0047】そして、図示しないが、両基板11,12
の各素子区画のうち、表面側基板A部にはそれぞれ液晶
表示素子の表面側基板に設ける表示用の透明電極と配向
膜とが形成されており、裏面側基板B部にはそれぞれ液
晶表示素子の裏面側基板に設ける表示用の透明電極と配
向膜とが形成されている。
Although not shown, both substrates 11 and 12
In each element section of the above, the transparent electrode for display and the alignment film provided on the front surface side substrate of the liquid crystal display element are respectively formed in the front surface side substrate A portion, and the back surface side substrate B portion is provided in each liquid crystal display element. A transparent electrode for display and an alignment film provided on the back-side substrate are formed.

【0048】また、両基板11,12の表面側基板A部
の一側縁部は、液晶封入領域を囲むシール材13の外側
に張出す端子配列部とされている。この端子配列部に
は、表裏両基板の電極の端子が形成されており、前記裏
面側基板B部の電極は、素子集合体10を個々の素子に
分離した後、シール材13の外側において導電ペースト
等により表面側基板A部の端子と導通接続される。
Further, one side edge portion of the front surface side substrate A portion of both substrates 11 and 12 is a terminal array portion which extends to the outside of the sealing material 13 surrounding the liquid crystal enclosing region. The terminals of the electrodes on both the front and back substrates are formed in this terminal arrangement portion, and the electrodes on the back substrate B portion are electrically conductive outside the sealing material 13 after separating the element assembly 10 into individual elements. It is electrically connected to the terminal of the front side substrate A portion by a paste or the like.

【0049】この実施例による液晶表示素子の製造方法
を説明すると、この実施例では、まず図6(a)および
図7に示した素子集合体10を組立てた後、図6(b)
に示すように、両基板1,2の外面にそれぞれ、その各
素子区画のうち表面側基板A部を覆うレジストマスク2
1を形成する。
A method of manufacturing a liquid crystal display element according to this embodiment will be described. In this embodiment, first, the element assembly 10 shown in FIGS. 6A and 7 is assembled, and then, FIG.
As shown in FIG. 3, a resist mask 2 is provided on the outer surface of each of the substrates 1 and 2 to cover the front-side substrate A of each element section.
1 is formed.

【0050】次に、上記素子集合体10をエッチング液
中に浸漬して、素子集合体10の両基板11,12の各
素子区画のうち、レジストマスク21で覆われていない
裏面側基板B部の外面をエッチングし、両基板11,1
2の前記裏面側基板B部の厚さを図6(c)に示すよう
に所望の厚さに薄くする。この基板外面のエッチングを
行なった後は、速やかに素子集合体10を洗浄し、この
後両基板11,12からレジストマスク21を剥離す
る。
Next, the element assembly 10 is dipped in an etching solution to make a back surface side substrate B portion of each element section of both substrates 11 and 12 of the element assembly 10 which is not covered with the resist mask 21. The outer surfaces of the two substrates 11 and 1 are etched.
As shown in FIG. 6C, the thickness of the back side substrate B of 2 is thinned to a desired thickness. After the etching of the outer surface of the substrate, the element assembly 10 is quickly washed, and then the resist mask 21 is peeled off from both the substrates 11 and 12.

【0051】次に、図6(d)に示すように、上記素子
集合体10の両基板11,12を、分断線a,bに沿っ
て折断し、この素子集合体10を個々の素子に分離す
る。図6(e)は分離された1つの素子を示している。
Next, as shown in FIG. 6 (d), both the substrates 11 and 12 of the element assembly 10 are broken along the dividing lines a and b, and the element assembly 10 is divided into individual elements. To separate. FIG. 6E shows one separated element.

【0052】この後は、第1の実施例と同様に、分離し
た各素子の裏面側基板Bに形成されている電極と表面側
基板Aの端子配列部に形成してある端子とを、シール材
13の外側において導電ペースト等により導通接続する
とともに、各素子内に真空注入法により液晶LCを注入
して液晶注入口13aを封止し、この後、素子の表裏面
(両基板A,Bの外面)にそれぞれ偏光板を接着すると
ともに、さらに裏面側の偏光板の外面に反射板を接着し
て、反射型の液晶表示素子を完成する。
After this, as in the first embodiment, the electrodes formed on the back surface side substrate B and the terminals formed in the terminal array portion of the front surface side substrate A of each separated element are sealed. A conductive paste or the like is electrically connected to the outside of the material 13, and liquid crystal LC is injected into each element by a vacuum injection method to seal the liquid crystal injection port 13a, and thereafter, the front and back surfaces of the element (both substrates A and B). A polarizing plate is adhered to each outer surface of the polarizing plate, and a reflective plate is further adhered to the outer surface of the polarizing plate on the back surface side to complete a reflective liquid crystal display element.

【0053】この実施例においても、素子集合体10の
状態で各素子区画の両基板、つまり液晶表示素子の表面
側および裏面側基板A,Bとなる部分のうち、裏面側基
板B部の外面をエッチングすることにより、各液晶表示
素子の一方の基板の厚さを一括して薄くしているため、
一方の基板の厚さを薄くした液晶表示素子を能率的に製
造することができるし、また、基板外面をエッチングし
て基板の厚さを薄くしているために、基板を均一に薄く
することができるとともに、基板を損傷してしまうこと
もないから、上記液晶表示素子を歩留よく製造すること
ができる。 [他の実施例]
Also in this embodiment, the outer surface of the back side substrate B of the both substrates of each element section in the state of the element assembly 10, that is, the front side and back side substrates A and B of the liquid crystal display element. Since the thickness of one substrate of each liquid crystal display element is collectively reduced by etching,
It is possible to efficiently manufacture a liquid crystal display device in which one of the substrates is thin, and to make the substrate uniform by etching the outer surface of the substrate to reduce the thickness of the substrate. Moreover, since the substrate is not damaged, the liquid crystal display device can be manufactured with high yield. [Other embodiments]

【0054】なお、上記第1および第2の実施例では、
素子集合体10の状態での基板外面のエッチングを、素
子集合体10をエッチング液中に浸漬して行なっている
が、この基板外面のエッチングは、素子集合体10にエ
ッチング液を散布して行なっても、またドライエッチン
グによって行なってもよい。
In the above first and second embodiments,
The etching of the outer surface of the substrate in the state of the element assembly 10 is performed by immersing the element assembly 10 in an etching solution. The etching of the outer surface of the substrate is performed by spraying the etching solution on the element assembly 10. Alternatively, it may be performed by dry etching.

【0055】また、上記実施例では、素子集合体10を
個々の液晶表示素子に分離した後に、各液晶表示素子に
液晶を注入しているが、この液晶は、一対のガラス基板
1,2を接着して素子集合体10を組立てる前に、一方
のガラス基板の各素子区画の液晶封入領域にディスペン
サ等によって滴下供給してもよく、その場合は、各素子
区画の液晶封入領域を囲むシール材3に液晶注入口を設
けておく必要はない。
In the above embodiment, the liquid crystal is injected into each liquid crystal display element after the element assembly 10 is separated into individual liquid crystal display elements. Before assembling the element assembly 10 by adhering, it may be dropped and supplied by a dispenser or the like to the liquid crystal filling area of each element section of one glass substrate. In that case, a sealing material surrounding the liquid crystal filling area of each element section. It is not necessary to provide a liquid crystal injection port in 3.

【0056】[0056]

【発明の効果】本発明によれば、素子集合体の状態で各
素子区画の両基板のうちの一方の外面をエッチングして
この基板の厚さを薄くし、この後前記素子集合体を個々
の素子に分離しているため、一方の基板の厚さを薄くし
た液晶表示素子を能率的に製造することができるし、ま
た、基板外面をエッチングして基板の厚さを薄くしてい
るために、基板を均一に薄くすることができるととも
に、基板を損傷してしまうこともないから、上記液晶表
示素子を歩留よく製造することができる。
According to the present invention, the thickness of this substrate is reduced by etching the outer surface of one of the two substrates of each element section in the state of the element assembly, and then the element assembly is individually separated. Since it is separated into elements, it is possible to efficiently manufacture a liquid crystal display element in which one of the substrates is thin, and the outer surface of the substrate is etched to reduce the thickness of the substrate. In addition, since the substrate can be uniformly thinned and the substrate is not damaged, the liquid crystal display device can be manufactured with high yield.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例による液晶表示素子の製
造方法を示す各製造工程時の断面図
FIG. 1 is a cross-sectional view at each manufacturing step showing a method of manufacturing a liquid crystal display element according to a first embodiment of the present invention.

【図2】図1(a)に示した素子集合体の一部切開平面
図。
2 is a partially cutaway plan view of the element assembly shown in FIG.

【図3】上記素子集合体から分離された液晶表示素子の
液晶封入後の状態の一部切開平面図。
FIG. 3 is a partially cutaway plan view of a liquid crystal display device separated from the device assembly after being filled with liquid crystal.

【図4】図3のIV−IV線に沿う断面図。FIG. 4 is a sectional view taken along line IV-IV in FIG.

【図5】完成された液晶表示素子の断面図。FIG. 5 is a sectional view of the completed liquid crystal display element.

【図6】本発明の第2の実施例による液晶表示素子の製
造方法を示す各製造工程時の断面図。
6A and 6B are cross-sectional views at each manufacturing step showing a method of manufacturing a liquid crystal display element according to a second embodiment of the present invention.

【図7】図6(a)に示した素子集合体の一部切開平面
図。
FIG. 7 is a partially cutaway plan view of the element assembly shown in FIG.

【符号の説明】[Explanation of symbols]

10…素子集合体、11,12…ガラス基板、A…表面
側基板、B…裏面側基板、13…シール材、14…外周
シール材、21…レジストマスク。
10 ... Element assembly, 11, 12 ... Glass substrate, A ... Front side substrate, B ... Back side substrate, 13 ... Seal material, 14 ... Peripheral seal material, 21 ... Resist mask.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】液晶表示素子複数個分の面積をもつ一対の
ガラス基板を、その各素子区画の液晶封入領域をそれぞ
れ囲むシール材と、前記各素子区画の全てを囲む外周シ
ール材とを介して接着して素子集合体を組立てた後、前
記各素子区画の両基板のうちの一方の外面をエッチング
してこの基板の厚さを薄くし、この後前記素子集合体を
個々の素子に分離することを特徴とする液晶表示素子の
製造方法。
1. A pair of glass substrates having an area for a plurality of liquid crystal display elements, with a sealing material surrounding each liquid crystal enclosing area of each element section and an outer peripheral sealing material surrounding all of the element sections. After assembling the element assembly by bonding with each other, the outer surface of one of the two substrates of each element section is etched to reduce the thickness of this substrate, and then the element assembly is separated into individual elements. A method for manufacturing a liquid crystal display element, comprising:
JP4049371A 1992-03-06 1992-03-06 Manufacturing method of liquid crystal display element Expired - Lifetime JP2678325B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4049371A JP2678325B2 (en) 1992-03-06 1992-03-06 Manufacturing method of liquid crystal display element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4049371A JP2678325B2 (en) 1992-03-06 1992-03-06 Manufacturing method of liquid crystal display element

Publications (2)

Publication Number Publication Date
JPH05249422A true JPH05249422A (en) 1993-09-28
JP2678325B2 JP2678325B2 (en) 1997-11-17

Family

ID=12829176

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2678325B2 (en)

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