JPH05249179A - Lid opening/closing mechanism of ic socket with lid - Google Patents

Abstract

PURPOSE:To efficiently test ICs by testing the ICs in a state where the lids of IC sockets are closed after putting the ICs in the IC sockets and taking out the ICs from the IC sockets by opening the lids after completing the tests. CONSTITUTION:IC sockets 1 are mounted on a socket board 3 and, when the notches 1B of the sockets 1 are pressed, the lids 1A of the sockets are opened. When the lids 1A are closed, the lids 1A are locked by means of the notches 1B. The title mechanism 2 is equipped with a roller 2A and pushing bar 2B and, when the mechanism 2 moves above the sockets 1, the roller 2A closes the opened lids 1A of the sockets 1 and the bar 2B pushes the lids 1A. When the bar 2B pushes the lids 1A, the notches 1B lock the lids 1A and, when the bar 2 pushes the notches 1B of the sockets 1, the lids 1A are opened. When the lids 1A are opened, the ICs are taken out from the sockets 1 and socket board 3 is circulated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention conveys an IC from a supply buffer to a test board to test the IC, and when the IC after the test is accommodated in the accommodation buffer, the IC is put in an IC socket with a lid. The IC is tested with the lid of the IC socket closed, and the lid of the IC socket is opened after the test is completed.
The present invention relates to a lid opening / closing mechanism for an IC socket with a lid that removes C from the IC socket.

[0002]

2. Description of the Related Art Next, I for IC handler according to the prior art is used.
The C transport mechanism will be described with reference to FIG. 2, 7 is a supply buffer, 8A is a block, 8B is a cylinder, 8C is a suction pad, 9 is an accommodation buffer, 10 is an IC to be measured, 11
Is an IC socket, and 12 is a socket board.

FIG. 2A is a plan view of the supply buffer 6.
A plurality of ICs 10 are stored in the supply buffer 7. Figure 2
B is a side view of the supply buffer 7, on which a block 8A having a plurality of suction pads 8C is arranged. Cylinder 7A, block 8A and suction pad 8
C constitutes one unit. The suction pad 8C is attached to the tip of the cylinder 8B and lowers the block 8A to suck the IC 10 in the supply buffer 7.

FIG. 2C is a state diagram in which the block 8A is lifted and the block 8A is conveyed onto the socket board 12 after the IC 10 is sucked by the suction pad 8C according to FIG.
A plurality of IC sockets 11 are mounted on the socket board 12, and a test signal is supplied to the IC sockets 11. Block 8A is lowered from the state of FIG.
0 is mounted in the IC socket 11.

FIG. 2D is a plan view of the socket board 12. As shown in FIG. 2C, a plurality of I's carried by the block 8A are transferred.
C10 is simultaneously inserted into a plurality of IC sockets 11 and tested. Since the IC 10 is fixed during the test, the IC 10 is pressed against the IC socket 11 with the suction pad 8C. FIG. 2E is a plan view of the accommodating buffer 9, which shows I after the measurement is completed.
It houses C10. The IC 10 that has undergone the test in FIG. 2C is adsorbed by the adsorption pad 8C, and is transported onto the accommodation buffer 9 by the block 8A.

[0006]

In FIG. 2, block 8 is used.
A moves between the supply buffer 7, the socket board 12, and the accommodation buffer 9 and moves up and down. Therefore, it takes time to replace the IC 10. A carrier for an IC handler is described in the specification of Japanese Patent Application No. 3-77840. According to this invention, the IC replacement time is shortened, but the positioning mechanism parts are complicated.

The present invention puts an IC in an IC socket with a lid and tests the IC with the lid of the IC socket closed.
After completion of the test, by opening the lid of the IC socket and taking out the IC from the IC socket, it is possible to reduce the occupation time of the block 8A in FIG. 2 and to provide an IC socket lid opening / closing mechanism with which the IC 10 can be efficiently tested. With the goal.

[0008]

In order to achieve this object, according to the present invention, the socket board 3 is mounted,
When the notch 1B is pushed, the lid 1A opens, and when the lid 1A is closed, the notch 1B locks the lid 1A.
And having the roller 2A and the push rod 2B, by moving on the IC socket 1 with the lid, the roller 2A closes the lid 1A of the IC socket with the lid 1 and the push rod 2B closes the lid 1A.
The notch 1B locks the lid 1A by pressing, and the lid opening / closing mechanism 2 that opens the lid 1A by pressing the notch 1B of the closed IC socket 1 with the lid with the push rod 2B, and the block 5 attached to the test board 4. , The contact probe 6 embedded in the block 5 and supplied with a test signal, the IC 10 is put in the IC socket 1 with a lid, the lid 1A is closed by the lid opening / closing mechanism 2, and the socket board 3 is placed on the test board 4. The IC socket 1 with a lid is pushed down against the contact probe 6 to test the IC 10,
After the test of 0 is completed, the socket board 3 is lifted from the test board 4, and the IC 10 is transported together with the socket board 3,
Open the lid 1A of the IC socket 1 with a lid by the lid opening / closing mechanism 2,
The IC 10 is taken out and the socket board 3 is circulated.

[0009]

Next, the configuration of the lid opening / closing mechanism of the IC socket with a lid according to the present invention will be described with reference to FIG. 1 in FIG. 1 is an IC socket with a lid (hereinafter, simply referred to as an IC socket), 1A is a lid, 1B is a notch, 2 is a lid opening / closing mechanism, and 2
A is a roller, 2B is a push rod, 3 is a socket board, 4 is a test board, 5 is a block, and 6 is a contact probe. As the IC socket 1, an IC51-0322 type IC socket manufactured by Yamaichi Denki Kogyo Co., Ltd. is used. The IC socket 1 has a notch 1B. When the notch 1B is pushed, the lid 1A is opened, and when the lid 1A is closed, the notch 1B causes the lid 1 to open.
It is a structure in which A is locked.

FIG. 1A is a state diagram in which the IC 10 is transferred from the supply buffer 7 of FIG. 2 to the socket board 3 of FIG. 1 by the block 8A. The socket board 3 has a plurality of ICs.
The socket 1 is attached, and the IC 10 transported by the block 8A is placed on the IC socket 1. I
The IC 10 is placed on the C socket 1 and the lid of the IC socket 1 is closed by means described later.

FIG. 1A shows the IC 10 from the state of FIG.
It is a state diagram in which the lid of the IC socket 1 is put in the socket 1, the socket board 3 is transported onto the test board 4, and the lid is closed. A block 5 is mounted on the test board 4, a contact probe 6 is embedded in the block 5, and a test signal is supplied to the contact probe 6 from a tester (not shown). The socket board 3 is lowered from the state of FIG. 1A, the IC socket 1 is pressed against the contact probe 6, and the IC 10 is tested.

FIG. 1C is a plan view of the test board 4,
A plurality of blocks 5 and contact probes 6 are arranged on the test board 4, and a plurality of ICs 10 are simultaneously tested. When the test of the IC 10 is completed, the socket board 3 of FIG. 1A is raised and the IC 10 is transported together with the socket board 3.

FIG. 1D is a view showing a state in which the lid of the IC socket 1 after the test is opened by the means described later. In Figure 1d,
The block 8A of FIG. 1A adsorbs the IC 10 from the IC socket 1 and takes it out, and the IC 10 is stored in the accommodation buffer 9 of FIG.
To transport.

That is, in FIG. 2, the IC 10 is transported from the supply buffer 7 to the accommodation buffer 9 only by the block 8A. In FIG. 1, the block 8A is provided only until the IC 10 is inserted into the IC socket 1 and after the test is completed and the IC 10 is conveyed to the accommodation buffer 9 from the state where the lid of the IC socket 1 is opened.
The IC 10 is conveyed by, the IC 10 is put into the IC socket 1, the lid of the IC socket 1 is closed, the socket board 3 is conveyed onto the test board 4, and the IC 10 is tested.
After the test is completed, the socket board 3 carries the IC 10 until the lid of the IC socket 1 is opened. The socket board 3 from which the IC 10 is taken out returns to the state of FIG. 1A, and the socket board 3 is circulated. Therefore, the occupied time of the block 8A is reduced, and the IC 10 can be efficiently transported.

Next, the mechanism for closing the lid of the IC socket 1 will be described with reference to FIG. FIG. 3A is a state diagram in which the IC 10 is put in the IC socket 1 with the lid 1A opened. Lid opening / closing mechanism 2
Is held at a height corresponding to the opened lid 1A, and moves in the arrow direction from FIG.

FIG. 3A is a state diagram in which the lid opening / closing mechanism 2 has moved from the state of FIG. 3A and the roller 2A has begun to hit the lid 1A. FIG. The roller 2A moves to the lid 1A, and the push rod 2B moves to the lid 1A.
It is a state diagram of pressing. The push rod 2B is driven by a cylinder or the like. In the state of FIG. 3C, the IC socket 1
The lid 1A is locked by the notch of the IC socket 1. When the lid opening / closing mechanism 2 moves from the state shown in FIG. 3C, the open lid 1A is closed one after another.

Next, the mechanism for opening the lid of the IC socket 1 will be described with reference to FIG. Figure 4a shows an IC with the lid 1A closed.
It is a state diagram in which the lid opening / closing mechanism 2 has been moved to the end portion of the socket 1, and the lid opening / closing mechanism 2 is held at a height that does not hit the lid 1A even when the lid 1A is opened.

FIG. 4A shows a state in which the push rod 2B of the lid opening / closing mechanism 2 is extended from the state of FIG. 4A and the notch 1B of the IC socket 1 is pushed by the push rod 2B. When the notch 1B is pushed, the lid is pushed. 1A opens. 4C is a state diagram in which the lid 1A of the socket 1 is all opened and the lid opening / closing mechanism 2 is retracted from the IC socket 1 by repeating the states of FIGS. 4A and 4A. In the state of FIG. 4C, the block 8A descends onto the IC socket 1 and carries the IC 10 in the IC socket 1 to the accommodation buffer 9.

[0019]

According to the present invention, an IC is placed in an IC socket with a lid, the IC is tested with the lid of the IC socket closed, and after the test is completed, the lid of the IC socket is opened and the IC
Since it is taken out from the C socket, the occupation time of the block 8A in FIG. 2 is reduced, and the IC 10 can be efficiently tested.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a lid opening / closing mechanism of an IC socket with a lid according to the present invention.

FIG. 2 is a configuration diagram of an IC transfer mechanism for an IC handler according to a conventional technique.

FIG. 3 is an operation explanatory view of a mechanism for opening the lid of the IC socket 1.

FIG. 4 is an operation explanatory view of a mechanism for closing the lid of the IC socket 1.

[Explanation of symbols]

 1 IC socket (IC socket with lid) 1A lid 1B notch 2 lid opening / closing mechanism 2A roller 2B push rod 3 socket board 4 test board 5 block 6 contact probe 7 supply buffer 8A block 8B cylinder 8C adsorption pad 9 accommodating buffer 10 IC

Claims (1)

[Claims] 1. With a lid that is attached to a socket board (3) and opens the lid (1A) by pressing the notch (1B), and locks the lid (1A) with the notch (1B) when closing the lid (1A). IC socket (1)
And an IC socket with a lid that has a roller (2A) and a push rod (2B)
The lid (1A) of the IC socket with lid (1) with the roller (2A) opened by moving over (1) closes the lid (1A) of the push rod (2B).
The notch (1B) locks the lid (1A) by pressing (A), and pushes the notch (1B) of the closed IC socket with lid (1) and push rod (2B).
The lid opening / closing mechanism (2) that opens the lid (1A) by pressing with, the block (5) attached to the test board (4), and the contact probe (6) embedded in the block (5) and supplied with the test signal. ), And put the IC (10) into the IC socket (1) with lid to open and close the lid.
Close the lid (1A) with (2), lower the socket board (3) onto the test board (4), press the IC socket with lid (1) against the contact probe (6), and test the IC (10). Then I
After the test of C (10) is completed, the socket board (3) is lifted from the test board (4) and the IC (10) is put together with the socket board (3).
The IC socket (1) lid (1A) with the lid opening / closing mechanism (2).
A lid opening / closing mechanism for an IC socket with a lid, characterized by opening the IC, taking out the IC (10), and circulating the socket board (3).