JPH05245329A - Gaseous helium purifier and operating method thereof - Google Patents
Gaseous helium purifier and operating method thereofInfo
- Publication number
- JPH05245329A JPH05245329A JP4044911A JP4491192A JPH05245329A JP H05245329 A JPH05245329 A JP H05245329A JP 4044911 A JP4044911 A JP 4044911A JP 4491192 A JP4491192 A JP 4491192A JP H05245329 A JPH05245329 A JP H05245329A
- Authority
- JP
- Japan
- Prior art keywords
- helium gas
- adsorber
- heat exchanger
- low temperature
- purifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
- F25J3/00—Processes or apparatus for separating the constituents of gaseous or liquefied gaseous mixtures involving the use of liquefaction or solidification
- F25J3/08—Separating gaseous impurities from gases or gaseous mixtures or from liquefied gases or liquefied gaseous mixtures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
- F25J2205/00—Processes or apparatus using other separation and/or other processing means
- F25J2205/40—Processes or apparatus using other separation and/or other processing means using hybrid system, i.e. combining cryogenic and non-cryogenic separation techniques
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
- F25J2205/00—Processes or apparatus using other separation and/or other processing means
- F25J2205/60—Processes or apparatus using other separation and/or other processing means using adsorption on solid adsorbents, e.g. by temperature-swing adsorption [TSA] at the hot or cold end
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
- F25J2215/00—Processes characterised by the type or other details of the product stream
- F25J2215/30—Helium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
- F25J2245/00—Processes or apparatus involving steps for recycling of process streams
- F25J2245/02—Recycle of a stream in general, e.g. a by-pass stream
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
- F25J2270/00—Refrigeration techniques used
- F25J2270/90—External refrigeration, e.g. conventional closed-loop mechanical refrigeration unit using Freon or NH3, unspecified external refrigeration
- F25J2270/904—External refrigeration, e.g. conventional closed-loop mechanical refrigeration unit using Freon or NH3, unspecified external refrigeration by liquid or gaseous cryogen in an open loop
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/40—Capture or disposal of greenhouse gases of CO2
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ヘリウムガス精製装置
及びその運転方法に関し、詳しくは、各種冷凍装置に用
いられるヘリウムガス中に不純物として含まれる水分や
二酸化炭素、及び窒素，酸素等の空気成分を吸着器を用
いて除去するヘリウムガス精製装置及びその運転方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a helium gas refining apparatus and a method of operating the same, and more specifically, to water and carbon dioxide contained as impurities in helium gas used in various refrigeration systems, and air such as nitrogen and oxygen. TECHNICAL FIELD The present invention relates to a helium gas refining apparatus for removing components by using an adsorber and an operating method thereof.
【０００２】[0002]
【従来の技術】核融合装置用超電導マグネットや電力貯
蔵用超電導マグネット等の大型の超電導マグネットを冷
却する冷凍システムはヘリウムのホールドアップ量が多
いこと、高温ガス炉用ヘリウムガス冷却ループは炉材と
の反応によるガスの発生や放出ガス量が多いこと、ヘリ
ウム液化機は処理するヘリウムガス量が多いことから、
これらに使用するヘリウムガスを精製する装置が使用さ
れている。2. Description of the Related Art A refrigeration system for cooling a large superconducting magnet such as a superconducting magnet for a nuclear fusion device or a power storage superconducting magnet has a large hold-up amount of helium, and a helium gas cooling loop for a high temperature gas reactor is a furnace material. Because of the large amount of gas generated and emitted due to the reaction of, and the large amount of helium gas to be processed by the helium liquefier,
An apparatus for purifying the helium gas used for these is used.
【０００３】上記ヘリウムガスを精製する装置として
は、二酸化炭素の吸着効率を向上させるために、二酸化
炭素吸着用吸着器を−４０℃程度に冷却する形式のもの
が、高温ガス炉用ヘリウムガス冷却ループに採用されて
いる。As a device for purifying the helium gas, a device for cooling the adsorber for adsorbing carbon dioxide to about -40 ° C. in order to improve the adsorption efficiency of carbon dioxide is helium gas cooling for a high temperature gas reactor. It is used in loops.
【０００４】図２は、従来のヘリウムガス精製装置の一
例を示すものである。このヘリウムガス精製装置は、ヘ
リウムガス中に含まれる不純物を除去する手段として、
乾燥器、即ち水分除去用の常温吸着器１と、二酸化炭素
除去用の低温吸着器２と、液体窒素で冷却される空気成
分除去用の低温精製器３とを備えるとともに、それぞれ
の処理温度に冷却するための第１及び第２熱交換器４，
５と、フロン冷凍機６及び冷却器６ａとが設けられてい
る。また、吸着器再生設備として、加熱器７ａを備えた
再生用窒素ガス導入管７と真空ポンプ８とが設けられて
いる。FIG. 2 shows an example of a conventional helium gas refining apparatus. This helium gas refining device is a means for removing impurities contained in helium gas,
A dryer, that is, a room temperature adsorber 1 for removing water, a low temperature adsorber 2 for removing carbon dioxide, and a low temperature purifier 3 for removing air components cooled by liquid nitrogen are provided, and each of them has a different processing temperature. First and second heat exchangers 4 for cooling
5, a CFC refrigerator 6 and a cooler 6a are provided. Further, as the adsorber regenerating equipment, a regenerating nitrogen gas introducing pipe 7 having a heater 7a and a vacuum pump 8 are provided.
【０００５】なお、図中、Ｔ及びＰは、必要に応じて設
けられる温度計及び圧力計であり、各流路には、必要に
応じて開閉される弁が設けられている。また、第２熱交
換器５は、低温精製器３に組込まれて使用されることも
ある。さらに、両吸着器１，２は、通常、複数基併設し
て吸着工程と再生工程とに切換えられるように構成して
いる。In the figure, T and P are a thermometer and a pressure gauge, which are provided as needed, and each passage is provided with a valve that is opened and closed as needed. Further, the second heat exchanger 5 may be incorporated in the low temperature purifier 3 and used. Further, both of the adsorbers 1 and 2 are usually arranged so that a plurality of adsorbers are provided side by side so that the adsorption process and the regeneration process can be switched.
【０００６】精製処理されるヘリウムガスは、管１１か
ら常温吸着器１に導入されて含有する水分を吸着除去さ
れた後、第１熱交換器４で後述する戻りヘリウムガスと
熱交換を行って冷却され、さらにフロン冷凍機６の冷却
器６ａで冷却されて約−４０℃となり、低温吸着器２に
導入される。The helium gas to be purified is introduced from the pipe 11 to the room temperature adsorber 1 to adsorb and remove the contained water, and then the first heat exchanger 4 exchanges heat with the return helium gas described later. It is cooled and further cooled by the cooler 6a of the Freon refrigerator 6 to about −40 ° C. and introduced into the low temperature adsorber 2.
【０００７】低温吸着器２で含有する二酸化炭素を吸着
除去されたヘリウムガスは、第２熱交換器５で冷却され
て約１００Ｋとなった後、液体窒素で冷却されている低
温精製器３に導入される。この低温精製器３では、ヘリ
ウムガス中の空気成分、即ち窒素や酸素が吸着除去され
る。なお、空気成分の含有量が多く、液体空気が多量に
発生する場合には、気液分離器を設けて分離する。The helium gas from which the carbon dioxide contained in the low temperature adsorber 2 has been adsorbed and removed is cooled by the second heat exchanger 5 to about 100 K, and then is transferred to the low temperature purifier 3 which is cooled by liquid nitrogen. be introduced. In this low temperature purifier 3, air components in helium gas, that is, nitrogen and oxygen are adsorbed and removed. When the air component content is large and a large amount of liquid air is generated, a gas-liquid separator is provided for separation.
【０００８】低温精製器３を導出した精製されたヘリウ
ムガスは、戻りヘリウムガスとして前記第２熱交換器５
及び第１熱交換器４で、前記精製処理されるヘリウムガ
スを冷却する冷却源となり、寒冷回収されて管１２から
導出される。The purified helium gas discharged from the low temperature purifier 3 is returned as helium gas to the second heat exchanger 5
Also, in the first heat exchanger 4, it serves as a cooling source for cooling the helium gas to be purified, and is recovered by cooling and led out from the pipe 12.
【０００９】このように、ヘリウムガス中の二酸化炭素
を、低温吸着器２で吸着除去するようにすることによ
り、二酸化炭素除去用の吸着剤使用量を大幅に低減する
ことができる。吸着剤量は、含有される水分や二酸化炭
素の量により異なるが、例えば、モレキュラシーブ４Ａ
を用いて３０℃で水分と二酸化炭素を同時に除去しよう
とした場合に、約４４トンもの量が必要であるのに対
し、これを常温の水分除去用吸着器と、約−４０℃に冷
却した二酸化炭素除去用吸着器とに分けた構成にするこ
とにより、モレキュラシーブ４Ａの使用量を、水分除去
用としての３０ｋｇと、二酸化炭素除去用の６４ｋｇと
にできるという報告がある。Thus, by adsorbing and removing carbon dioxide in the helium gas by the low temperature adsorber 2, the amount of adsorbent used for removing carbon dioxide can be greatly reduced. The amount of adsorbent varies depending on the amount of water and carbon dioxide contained, but for example, molecular sieve 4A
When it was attempted to remove water and carbon dioxide at 30 ° C. at the same time, while about 44 tons was required, this was cooled to about −40 ° C. with a room temperature water-removing adsorber. It has been reported that the use of the molecular sieve 4A can be set to 30 kg for removing water and 64 kg for removing carbon dioxide by using a separate structure for the carbon dioxide removing adsorber.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、従来の
装置のように、低温吸着器２に導入するヘリウムガスの
温度をフロン冷凍機６で制御するようにした場合、低温
吸着器２の温度及び吸着剤再生後の低温吸着器２の予冷
時間が、フロン冷凍機６の性能により決定されるので、
精製装置の個々の仕様に合わせてフロン冷凍機６の性能
を設定する必要がある。However, when the temperature of the helium gas introduced into the low temperature adsorber 2 is controlled by the Freon refrigerator 6 as in the conventional apparatus, the temperature and the adsorption of the low temperature adsorber 2 are reduced. Since the pre-cooling time of the low temperature adsorber 2 after agent regeneration is determined by the performance of the Freon refrigerator 6,
It is necessary to set the performance of the CFC refrigerator 6 according to the individual specifications of the refining device.
【００１１】また、フロン冷凍機６は、設置のための費
用が必要なだけでなく、フロン冷凍機６を設置するため
のスペースも確保する必要がある。Further, the CFC refrigerator 6 needs not only the cost for installation but also the space for installing the CFC refrigerator 6.
【００１２】そこで本発明は、上記フロン冷凍機を設け
ることなく装置を構成でき、しかも、低温吸着器の入口
温度を、約９０Ｋの低温から常温まで任意に設定するこ
とが可能で、吸着剤再生後の低温吸着器の予冷時間も、
短縮することが可能なヘリウムガス精製装置及びその運
転方法を提供することを目的としている。Therefore, according to the present invention, the apparatus can be constructed without providing the CFC refrigerator, and the inlet temperature of the low temperature adsorber can be arbitrarily set from a low temperature of about 90 K to normal temperature, and the adsorbent regeneration can be performed. The pre-cooling time of the low temperature adsorber afterwards,
An object of the present invention is to provide a helium gas refining device that can be shortened and an operating method thereof.
【００１３】[0013]
【課題を解決するための手段】上記した目的を達成する
ため、本発明のヘリウムガス精製装置は、ヘリウムガス
中の水分を吸着除去する常温吸着器と、該常温吸着器を
導出したヘリウムガスを戻りヘリウムガスと熱交換させ
て冷却する第１熱交換器と、該第１熱交換器で冷却した
ヘリウムガス中の二酸化炭素を吸着除去する低温吸着器
と、該低温吸着器を導出したヘリウムガスを戻りヘリウ
ムガスと熱交換させてさらに冷却する第２熱交換器と、
該第２熱交換器を導出したヘリウムガスを液体窒素で冷
却して含有する空気成分を分離する低温精製器と、該低
温精製器を導出したヘリウムガスを戻りヘリウムガスと
して前記第２熱交換器，第１熱交換器に導入して前記導
入されるヘリウムガスの冷却源として導出するヘリウム
ガス精製装置において、前記戻りヘリウムガスの第２熱
交換器経路に、該第２熱交換器をバイパスするバイパス
流路を設けるとともに、該バイパス流路を流れる戻りヘ
リウムガスの流量を制御する流量制御弁を設けたことを
特徴としている。In order to achieve the above object, the helium gas purifying apparatus of the present invention comprises a room temperature adsorber for adsorbing and removing water in helium gas and a helium gas discharged from the room temperature adsorber. A first heat exchanger for heat exchange with the returned helium gas for cooling, a low temperature adsorber for adsorbing and removing carbon dioxide in the helium gas cooled by the first heat exchanger, and a helium gas led out of the low temperature adsorber And a second heat exchanger for returning the helium gas to exchange heat with the helium gas for further cooling,
A low-temperature purifier for cooling the helium gas discharged from the second heat exchanger with liquid nitrogen to separate contained air components, and the second heat exchanger using the helium gas discharged from the low-temperature purifier as return helium gas. , A helium gas refining device which is introduced into a first heat exchanger and is led out as a cooling source of the introduced helium gas, wherein the second heat exchanger is bypassed to a second heat exchanger path of the returned helium gas It is characterized in that a bypass flow path is provided and a flow rate control valve that controls the flow rate of the return helium gas flowing through the bypass flow path is provided.
【００１４】また、本発明の運転方法は、上記構成のヘ
リウムガス精製装置の運転方法であって、前記バイパス
流路を流れる戻りヘリウムガスの流量を、前記低温吸着
器の温度に応じて制御することを特徴としている。Further, the operating method of the present invention is the operating method of the helium gas refining apparatus having the above-mentioned structure, wherein the flow rate of the return helium gas flowing through the bypass flow passage is controlled according to the temperature of the low temperature adsorber. It is characterized by
【００１５】[0015]
【作 用】上記構成によれば、低温精製器を導出した極
低温の戻りヘリウムガスの一部を、第２熱交換器で昇温
することなく第１熱交換器に寒冷源として導入すること
ができ、バイパス流路を流れる戻りヘリウムガスを調節
することにより、第１熱交換器で冷却するヘリウムガス
の温度を、戻りヘリウムガスに許容される第２熱交換器
バイパス量の許す範囲で任意に設定することができる。[Operation] According to the above configuration, a part of the cryogenic return helium gas discharged from the cryogenic purifier is introduced into the first heat exchanger as a cold source without being heated in the second heat exchanger. By adjusting the return helium gas flowing through the bypass passage, the temperature of the helium gas cooled by the first heat exchanger can be set within the range permitted by the second heat exchanger bypass amount allowed for the return helium gas. Can be set to.
【００１６】[0016]
【実施例】以下、本発明を、図面に示す一実施例に基づ
いて、さらに詳細に説明する。なお、前記従来例と同一
要素のものには同一符号を付して、その詳細な説明は省
略する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below based on an embodiment shown in the drawings. The same elements as those of the conventional example are designated by the same reference numerals, and detailed description thereof will be omitted.
【００１７】本実施例に示すヘリウムガス精製装置は、
基本的に前記従来装置と同様の構成を有するもので、前
記同様、ヘリウムガス中に含まれる不純物を除去する手
段として、水分除去用の常温吸着器１と、二酸化炭素除
去用の低温吸着器２と、液体窒素で冷却される空気成分
除去用の低温精製器３とを備えるとともに、それぞれの
処理温度に冷却するための第１及び第２熱交換器４，５
と、吸着器再生設備としての再生用窒素ガス導入管７及
び真空ポンプ８とが設けられている。The helium gas purifying apparatus shown in this embodiment is
Basically, it has the same structure as that of the conventional device, and like the above, as a means for removing impurities contained in helium gas, a room temperature adsorber 1 for removing water and a low temperature adsorber 2 for removing carbon dioxide. And a low temperature purifier 3 for removing air components cooled by liquid nitrogen, and first and second heat exchangers 4, 5 for cooling to respective processing temperatures.
And a regeneration nitrogen gas introduction pipe 7 and a vacuum pump 8 as the adsorption device regeneration equipment.
【００１８】そして本実施例装置では、前記フロン冷凍
機６に代わる設備として、前記低温精製器３を導出した
低温の戻りヘリウムガスの第２熱交換器５の経路に、該
第２熱交換器５をバイパスさせるためのバイパス流路２
１を設け、該バイパス流路２１を流れる戻りヘリウムガ
スの流量を制御する流量制御弁２２を設けるとともに、
低温吸着器２の入口部に、流量制御弁２２の開度を制御
する温度指示調節計（ＴＩＣ）２３を設けている。In the apparatus of the present embodiment, as a substitute for the Freon refrigerator 6, the second heat exchanger 5 is provided in the path of the second heat exchanger 5 of the low-temperature return helium gas that has led out the low-temperature purifier 3. Bypass channel 2 for bypassing 5
1 is provided, and a flow rate control valve 22 that controls the flow rate of the return helium gas that flows through the bypass flow passage 21 is provided.
At the inlet of the low temperature adsorber 2, a temperature indicating controller (TIC) 23 that controls the opening of the flow control valve 22 is provided.
【００１９】このようにヘリウムガス精製装置を構成す
ることにより、低温精製器３を導出した極低温の戻りヘ
リウムガスの一部を、第２熱交換器５で昇温することな
く第１熱交換器４に寒冷源として導入することができ、
該第１熱交換器４で冷却するヘリウムガスの温度を、低
温吸着器２で処理するのに最適な温度、例えば−４０℃
以下に調節することができる。By constructing the helium gas refining apparatus in this way, a part of the cryogenic return helium gas discharged from the low temperature purifier 3 is not heated in the second heat exchanger 5 and the first heat exchange is performed. Can be introduced into the vessel 4 as a cold source,
The temperature of the helium gas cooled in the first heat exchanger 4 is the optimum temperature for processing in the low temperature adsorber 2, for example, -40 ° C.
It can be adjusted to:
【００２０】上記バイパス流路２１を通す戻りヘリウム
ガス量の調節は、前記低温吸着器２の入口部に設けた温
度指示調節計２３の検出温度により行われる。このよう
に、低温吸着器２の入口温度に応じてバイパス流量を制
御することにより、低温吸着器２に導入するヘリウムガ
スを常に最適な温度に保つことができる。The amount of return helium gas passing through the bypass passage 21 is adjusted by the temperature detected by a temperature indicating controller 23 provided at the inlet of the low temperature adsorber 2. In this way, by controlling the bypass flow rate according to the inlet temperature of the low temperature adsorber 2, the helium gas introduced into the low temperature adsorber 2 can always be maintained at the optimum temperature.
【００２１】なお、本実施例では、低温吸着器２の入口
部に温度指示調節計を設けたが、該低温吸着器２におけ
る処理温度を検出できる位置、例えば第１熱交換器４の
冷端側や低温吸着器２の出口部に温度指示調節計を設け
て、上記バイパス流量を制御するようにしてもよい。In this embodiment, a temperature indicating controller is provided at the inlet of the low temperature adsorber 2, but a position where the processing temperature in the low temperature adsorber 2 can be detected, for example, the cold end of the first heat exchanger 4. The bypass flow rate may be controlled by providing a temperature indicating controller on the side or at the outlet of the low temperature adsorber 2.
【００２２】さらに、低温吸着器２を昇温して吸着剤を
再生した後の予冷も、上記バイパス流量を増加させて、
予冷ガスとして該低温吸着器２に導入するガスを通常よ
り低温まで冷却することにより、急速に所定の温度まで
冷却することができる。Further, in the pre-cooling after the temperature of the low temperature adsorber 2 is raised to regenerate the adsorbent, the bypass flow rate is increased,
By cooling the gas introduced into the low temperature adsorber 2 as a precooling gas to a temperature lower than usual, it is possible to rapidly cool the gas to a predetermined temperature.
【００２３】また、上記バイパス流路２１を流れるバイ
パス流量を多くすると、第２熱交換器５で冷却して低温
精製器３に導入するヘリウムガスを十分に冷却すること
ができなくなるため、第２熱交換器５をバイパスさせて
バイパス流路２１を通す戻りヘリウムガスの最大量は、
低温精製器３の負担を考慮して設定される。If the bypass flow rate flowing through the bypass passage 21 is increased, the helium gas cooled by the second heat exchanger 5 and introduced into the low temperature purifier 3 cannot be cooled sufficiently, so that the second The maximum amount of return helium gas that bypasses the heat exchanger 5 and passes through the bypass passage 21 is
It is set in consideration of the load on the low temperature purifier 3.
【００２４】なお、ヘリウムガスの精製や吸着器の再生
の手順は、従来と同様に行えるので、その説明は省略す
る。Since the procedure for purifying helium gas and regenerating the adsorber can be performed in the same manner as in the conventional case, the description thereof will be omitted.
【００２５】[0025]
【発明の効果】以上説明したように、本発明によれば、
第２熱交換器経路に流量制御弁を有するバイパス流路を
設けたので、従来装置のフロン冷凍機を省略することが
でき、装置コストの低減や設置スペースの縮小が図れる
だけでなく、低温吸着器の運転温度をフロン冷凍機の性
能に影響されずに任意に設定することができ、吸着器温
度を下げて吸着効率を高め、吸着剤使用量を低減すると
ともに、吸着器の小型化も図ることができる。As described above, according to the present invention,
Since the bypass passage having the flow rate control valve is provided in the second heat exchanger path, the CFC refrigerator of the conventional device can be omitted, and not only the device cost and the installation space can be reduced, but also the low temperature adsorption can be achieved. The operating temperature of the adsorber can be set arbitrarily without being affected by the performance of the CFC refrigerator, and the adsorber temperature can be lowered to increase the adsorption efficiency, reduce the amount of adsorbent used, and reduce the size of the adsorber. be able to.
【００２６】さらに、再生後の予冷時間の短縮も図れ、
効率のよい運転を行うことができ、運転コストを低減す
ることも可能である。Furthermore, the pre-cooling time after regeneration can be shortened,
It is possible to perform efficient operation and reduce operating costs.
【図１】 本発明の一実施例を示すヘリウムガス精製装
置の系統図である。FIG. 1 is a system diagram of a helium gas purification device showing an embodiment of the present invention.
【図２】 従来のヘリウムガス精製装置の一例を示す系
統図である。FIG. 2 is a system diagram showing an example of a conventional helium gas purification device.
１…常温吸着器 ２…低温吸着器 ３…低温精製器
４…第１熱交換器 ５…第２熱交換器 ２１…バイパス流路 ２２…流
量制御弁 ２３…温度指示調節計1 ... Room temperature adsorber 2 ... Low temperature adsorber 3 ... Low temperature purifier 4 ... First heat exchanger 5 ... Second heat exchanger 21 ... Bypass flow path 22 ... Flow control valve 23 ... Temperature indicating controller
Claims (2)
温吸着器と、該常温吸着器を導出したヘリウムガスを戻
りヘリウムガスと熱交換させて冷却する第１熱交換器
と、該第１熱交換器で冷却したヘリウムガス中の二酸化
炭素を吸着除去する低温吸着器と、該低温吸着器を導出
したヘリウムガスを戻りヘリウムガスと熱交換させてさ
らに冷却する第２熱交換器と、該第２熱交換器を導出し
たヘリウムガスを液体窒素で冷却して含有する空気成分
を分離する低温精製器と、該低温精製器を導出したヘリ
ウムガスを戻りヘリウムガスとして前記第２熱交換器，
第１熱交換器に導入して前記導入されるヘリウムガスの
冷却源として導出するヘリウムガス精製装置において、
前記戻りヘリウムガスの第２熱交換器経路に、該第２熱
交換器をバイパスするバイパス流路を設けるとともに、
該バイパス流路を流れる戻りヘリウムガスの流量を制御
する流量制御弁を設けたことを特徴とするヘリウムガス
精製装置。1. A room temperature adsorber for adsorbing and removing water in helium gas, a first heat exchanger for cooling the helium gas discharged from the room temperature adsorber by returning it to helium gas for heat exchange, and the first heat exchanger. A low temperature adsorber for adsorbing and removing carbon dioxide in the helium gas cooled by the exchanger; a second heat exchanger for further cooling the helium gas discharged from the low temperature adsorber by exchanging heat with the returned helium gas; 2 a low temperature purifier for cooling the helium gas led out of the heat exchanger with liquid nitrogen to separate contained air components, the second heat exchanger for returning the helium gas led out of the low temperature purifier as return helium gas,
In a helium gas refining device which is introduced into the first heat exchanger and is led out as a cooling source of the introduced helium gas,
In the second heat exchanger path of the return helium gas, a bypass flow path that bypasses the second heat exchanger is provided,
A helium gas refining apparatus comprising a flow rate control valve for controlling a flow rate of return helium gas flowing through the bypass flow path.
運転方法であって、前記バイパス流路を流れる戻りヘリ
ウムガスの流量を、前記低温吸着器の温度に応じて制御
することを特徴とするヘリウムガス精製装置の運転方
法。2. The method for operating the helium gas purification device according to claim 1, wherein the flow rate of the return helium gas flowing through the bypass channel is controlled according to the temperature of the low temperature adsorber. How to operate the helium gas purifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04044911A JP3143757B2 (en) | 1992-03-02 | 1992-03-02 | Helium gas purification apparatus and operating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04044911A JP3143757B2 (en) | 1992-03-02 | 1992-03-02 | Helium gas purification apparatus and operating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05245329A true JPH05245329A (en) | 1993-09-24 |
| JP3143757B2 JP3143757B2 (en) | 2001-03-07 |
Family
ID=12704646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04044911A Expired - Fee Related JP3143757B2 (en) | 1992-03-02 | 1992-03-02 | Helium gas purification apparatus and operating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3143757B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107413524A (en) * | 2017-08-03 | 2017-12-01 | 可迪尔空气技术（北京）有限公司 | A kind of controlling device of mist of oil containing paraffin |
| WO2021204422A1 (en) * | 2020-04-07 | 2021-10-14 | Linde Kryotechnik Ag | Method and device for separating undesired components from a helium flow |
| CN113731107A (en) * | 2021-10-11 | 2021-12-03 | 北京中科富海低温科技有限公司 | Online regeneration system |
-
1992
- 1992-03-02 JP JP04044911A patent/JP3143757B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107413524A (en) * | 2017-08-03 | 2017-12-01 | 可迪尔空气技术（北京）有限公司 | A kind of controlling device of mist of oil containing paraffin |
| CN107413524B (en) * | 2017-08-03 | 2024-02-02 | 可迪尔空气技术（北京）有限公司 | Paraffin-containing oil mist treatment device |
| WO2021204422A1 (en) * | 2020-04-07 | 2021-10-14 | Linde Kryotechnik Ag | Method and device for separating undesired components from a helium flow |
| CN113731107A (en) * | 2021-10-11 | 2021-12-03 | 北京中科富海低温科技有限公司 | Online regeneration system |
| CN113731107B (en) * | 2021-10-11 | 2023-06-16 | 北京中科富海低温科技有限公司 | Online regeneration system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3143757B2 (en) | 2001-03-07 |
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