JPH05243391A - Connecting method of optical ic to multilayer interconnection substrate - Google Patents
Connecting method of optical ic to multilayer interconnection substrateInfo
- Publication number
- JPH05243391A JPH05243391A JP4045152A JP4515292A JPH05243391A JP H05243391 A JPH05243391 A JP H05243391A JP 4045152 A JP4045152 A JP 4045152A JP 4515292 A JP4515292 A JP 4515292A JP H05243391 A JPH05243391 A JP H05243391A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- wiring board
- light
- multilayer wiring
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
Landscapes
- Optical Integrated Circuits (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光ＩＣを複数個搭載す
る多層配線基板に関し、特に光ＩＣと多層配線基板の接
続方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board on which a plurality of optical ICs are mounted, and more particularly to a method for connecting an optical IC and a multilayer wiring board.
【０００２】[0002]
【従来の技術】従来、多層配線基板の内部の信号伝達部
は、金属の導体材料及び誘電体の絶縁材料を用いて複数
の電気信号用の配線層を形成する構成となっていたが、
最近、コンピュータ等においては、信号の高周波化，配
線の高密度化に伴い配線関の電磁誘導によるクロストー
クノイズの増加等の問題が発生している。2. Description of the Related Art Conventionally, a signal transmission portion inside a multilayer wiring board has a structure in which a plurality of wiring layers for electric signals are formed by using a metal conductor material and a dielectric insulating material.
2. Description of the Related Art Recently, in computers and the like, problems such as an increase in crosstalk noise due to electromagnetic induction of wiring have occurred along with an increase in signal frequency and wiring density.
【０００３】そのため、現在の電気信号を入出力に用い
るＩＣと電気信号を伝送する多層配線基板に代わって、
光信号を入出力に用いる光ＩＣと光信号を伝送する配線
層を持つ多層配線基板を使用することによって、これら
の問題を解決することが考えられる。Therefore, in place of the current IC for inputting and outputting electric signals and the multilayer wiring board for transmitting electric signals,
It is conceivable to solve these problems by using an optical IC that uses an optical signal for input and output and a multilayer wiring board having a wiring layer that transmits the optical signal.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、光信号
を伝送する配線層を持つ多層配線基板に複数の光ＩＣを
高密度に搭載し、光ＩＣと多層配線基盤を接続しようと
した時、簡便で製造性の良い光ＩＣと多層配線基板の接
続方法がなかった。However, when a plurality of optical ICs are mounted at a high density on a multilayer wiring board having a wiring layer for transmitting an optical signal and an attempt is made to connect the optical ICs and the multilayer wiring board, it is simple and easy. There was no method of connecting the optical IC and the multilayer wiring board, which had good manufacturability.
【０００５】[0005]
【課題を解決するための手段】第１の本発明の方法は、
基板上に、電気伝送部と電気絶縁部からなる複数の電気
配線層，光絶縁部および光伝送部からなる複数の光配線
層を持つ多層配線基板と、光信号の入出力として複数の
光入力部と光出力部を持つ光ＩＣとの接続方法におい
て、前記多層配線基板の光ＩＣ実装面に設ける光伝送部
の入光部と出光部は、それぞれ前記光ＩＣの光出力部と
光入力部に向き合うように形成し、該入光部と出光部並
びに該光出力部と光入力部は、それぞれの周りに環形状
の金属パッドを形成し、多層配線基板と光ＩＣの金属パ
ッド間を筒形状の半田によりフリップチップ接続して、
光ＩＣと多層配線基板間の光信号の伝送を筒形状半田内
部の中空部により行なうことを特徴とする。The first method of the present invention comprises:
A multilayer wiring board having a plurality of electric wiring layers composed of an electric transmission section and an electric insulation section, and a plurality of optical wiring layers composed of an optical insulation section and an optical transmission section, and a plurality of optical inputs for inputting and outputting optical signals. In the method of connecting an optical IC having a light emitting section and an optical output section, the light input section and the light output section of the optical transmission section provided on the optical IC mounting surface of the multilayer wiring board are respectively the optical output section and the optical input section of the optical IC. To form a ring-shaped metal pad around each of the light input portion and the light output portion, and the light output portion and the light input portion. Flip chip connection with shaped solder,
The optical signal is transmitted between the optical IC and the multilayer wiring board by the hollow portion inside the cylindrical solder.
【０００６】第２の本発明の方法は、基板上に、電気伝
送部と電気絶縁部からなる複数の電気配線層，光絶縁部
および光伝送部からなる複数の光配線層を持つ多層配線
基板と、光信号の入出力として複数の光入力部と光出力
部を持つ光ＩＣとの接続方法において、前記多層配線基
板の光ＩＣ実装面に設ける光伝送部の入光部と出光部
は、それぞれ前記光ＩＣの光出力部と光入力部に組み合
うように形成し、該入光部と出光部並びに該光出力部と
光入力部は、それぞれその周りに環形状の金属パッドを
形成し、またその側面に金属膜を形成した柱形状の光フ
ァイバーを形成し、該光ファイバー上面と前記光ＩＣの
光出力部または光入力部が接するように置き、前記光Ｉ
Ｃの環形状の金属パッドと該光ファイバー側面の金属膜
を半田により接続すると共に、該光ファイバー下面と前
記多層配線基板の入光部または出光部が接するように置
き、前記多層配線基板の環形状の金属パッドと該光ファ
イバー側面の金属膜を半田によりフリップチップ接続し
て、光Ｃと多層配線基板間の光信号の伝送を該光ファイ
バーにより行なうことを特徴とする。A second method of the present invention is a multi-layer wiring board having a plurality of electric wiring layers composed of an electric transmission section and an electric insulation section, and a plurality of optical wiring layers composed of an optical insulation section and an optical transmission section on a substrate. In the method of connecting an optical IC having a plurality of optical input sections and optical output sections for inputting and outputting optical signals, the light input section and the light output section of the optical transmission section provided on the optical IC mounting surface of the multilayer wiring board are: Formed so as to be combined with a light output portion and a light input portion of the optical IC, respectively, and the light input portion and the light output portion, and the light output portion and the light input portion each have a ring-shaped metal pad formed around them. Further, a pillar-shaped optical fiber having a metal film formed on its side surface is formed, and the optical fiber is placed so that the upper surface of the optical fiber is in contact with the optical output portion or the optical input portion of the optical IC.
The ring-shaped metal pad of C and the metal film on the side surface of the optical fiber are connected by solder, and the lower surface of the optical fiber is placed so as to contact the light input portion or the light output portion of the multilayer wiring board. The metal pad and the metal film on the side surface of the optical fiber are flip-chip connected by soldering, and the optical signal is transmitted between the light C and the multilayer wiring board by the optical fiber.
【０００７】[0007]
【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【０００８】図１は本発明の第一の実施例を切断して示
す斜視図であり、図２は、本例における光ＩＣと多層配
線基板の接続部の詳細を示す断面図である。FIG. 1 is a perspective view showing a first embodiment of the present invention in a cut state, and FIG. 2 is a sectional view showing details of a connecting portion between an optical IC and a multilayer wiring board in the present embodiment.
【０００９】図１において、多層配線層１は石英ガラス
基板２上に設けられた厚さ数十ミクロンのＳｉＯ2 （二
酸化ケイ素）で形成されている。多層配線層１には、光
絶縁部４中に光伝送部３が直径５０μｍ，パッチ１５０
μｍで形成され、必要に応じて曲部が設けられている。In FIG. 1, the multilayer wiring layer 1 is made of SiO 2 (silicon dioxide) provided on a quartz glass substrate 2 and having a thickness of several tens of microns. In the multilayer wiring layer 1, the optical transmission part 3 has a diameter of 50 μm and a patch 150
μm, and a curved portion is provided if necessary.
【００１０】光伝送部３と光絶縁部４は、ＳｉＯ2 中に
含まれる不純物濃度による光の屈折率の違いにより分け
られ、伝送部３の方が光絶縁部４より屈折率が大きくな
るようにＳｉＯ2 中の不純物濃度を調整してある。それ
により、光は光伝送部３と光絶縁部４の境界面で全反射
し、光伝送部３の内部を進行していく。The optical transmission section 3 and the optical insulation section 4 are separated by the difference in the refractive index of light due to the concentration of impurities contained in SiO 2 , so that the transmission section 3 has a higher refractive index than the optical insulation section 4. Further, the impurity concentration in SiO 2 is adjusted. As a result, the light is totally reflected at the boundary surface between the optical transmission unit 3 and the optical insulation unit 4, and travels inside the optical transmission unit 3.
【００１１】光伝送部３は、多層にして設けられ、異な
る層の光伝送部３はコンタクトホール５で結合され、こ
のコンタクトホール５の材料組成は光伝送部３と同一で
ある。コンタクトホール５により、複数層におよび光伝
送部３を結合することが可能になり、光信号を伝送する
多層配線層１が形成される。The optical transmission parts 3 are provided in multiple layers, and the optical transmission parts 3 of different layers are connected by a contact hole 5, and the material composition of the contact hole 5 is the same as that of the optical transmission part 3. The contact hole 5 enables the optical transmission part 3 to be coupled to a plurality of layers, and the multilayer wiring layer 1 for transmitting an optical signal is formed.
【００１２】この多層配線層１の表面に出るコンタクト
ホール５が入光部または出光部となり、多層配線基板に
実装される光ＩＣ６の光入力部または光出力部と向き合
うように直径３０μｍの円柱形状に形成される。The contact hole 5 on the surface of the multilayer wiring layer 1 serves as a light incident portion or a light emitting portion, and has a cylindrical shape with a diameter of 30 μm so as to face the light input portion or the light output portion of the optical IC 6 mounted on the multilayer wiring board. Is formed.
【００１３】この多層配線層１の入光部，出光部または
光ＩＣ６の光入力部，光出力部の回りには、図２に詳細
を示すように、内径３０μｍ，幅２５μｍ，厚さ数μｍ
の環形状の金属パッド７が形成されており、筒形状の半
田８により多層配線層１と光ＩＣ６が接続されている。As shown in detail in FIG. 2, around the light entering portion, the light emitting portion of the multilayer wiring layer 1 or the light input portion and the light output portion of the optical IC 6, an inner diameter of 30 μm, a width of 25 μm, and a thickness of several μm.
The ring-shaped metal pad 7 is formed, and the multilayer wiring layer 1 and the optical IC 6 are connected by the cylindrical solder 8.
【００１４】ここで光ＩＣ６の光出力部から出力された
光信号は、直接または半田８の内壁に反射され、入光部
であるコンタクトホール５に向かい光伝送部３により伝
送される。同様に光伝送部３により伝送され出光部であ
るコンタクトホール５から出力された光信号は、直接ま
たは半田８の内壁に反射され光ＩＣの光入力部に向か
う。The optical signal output from the optical output section of the optical IC 6 is directly or reflected on the inner wall of the solder 8 and is transmitted by the optical transmission section 3 toward the contact hole 5 which is a light input section. Similarly, an optical signal transmitted by the optical transmission unit 3 and output from the contact hole 5 serving as a light output unit is directed to the optical input unit of the optical IC directly or by being reflected by the inner wall of the solder 8.
【００１５】この半田８の中空部を伝送または内壁で反
射する光信号は光伝送部３での伝送または反射とは異な
り減衰が大きくなるがその距離は数十μｍでありほとん
ど問題にならない。The optical signal transmitted through the hollow portion of the solder 8 or reflected by the inner wall is greatly attenuated, unlike the transmission or reflection by the optical transmission portion 3, but its distance is several tens of μm, which is hardly a problem.
【００１６】次に多層配線層１の内部には電気配線層９
が金属導体により形成され、多層配線層１の表面におい
て多層配線層１の金属パッド７に接続されており、光Ｉ
Ｃ６に電力または電気信号を供給するために用いられ
る。そのため光ＩＣ６においても金属パッド７は、の内
部の給電配線または電気信号配線に接続される。Next, the electric wiring layer 9 is provided inside the multilayer wiring layer 1.
Is formed of a metal conductor and is connected to the metal pad 7 of the multilayer wiring layer 1 on the surface of the multilayer wiring layer 1.
Used to supply power or electrical signals to C6. Therefore, also in the optical IC 6, the metal pad 7 is connected to the internal power supply wiring or electric signal wiring.
【００１７】図３は本発明の第二の実施例を切断して示
す斜視図であり、図４は本例における光ＩＣと多層配線
基板の接続部の詳細を示す断面図である。FIG. 3 is a perspective view showing a second embodiment of the present invention in a cutaway view, and FIG. 4 is a sectional view showing details of a connecting portion between an optical IC and a multilayer wiring board in this embodiment.
【００１８】図３において多層配線層１は、石英ガラス
基板２上に設けられた厚さ数十ミクロンのＳｉＯ2 で形
成されており、その内部は図１に示した第一の実施例と
同一の構成を持つ。In FIG. 3, the multilayer wiring layer 1 is formed of SiO 2 having a thickness of several tens of microns provided on the quartz glass substrate 2, and the inside thereof is the same as that of the first embodiment shown in FIG. With the configuration of.
【００１９】この多層配線層１の表面に出るコンタクト
ホール５が第一の実施例と同じく入光部または出光部と
なり、多層配線基板に実装される光ＩＣ６の光入力部ま
たは光出力部と向き合うように直径３０μｍの円柱形状
に形成される。The contact hole 5 appearing on the surface of the multilayer wiring layer 1 serves as a light incident portion or a light emitting portion as in the first embodiment, and faces the light input portion or light output portion of the optical IC 6 mounted on the multilayer wiring board. Is formed in a cylindrical shape having a diameter of 30 μm.
【００２０】多層配線層１の入光部、出光部または光Ｉ
Ｃ６の光入力部、光出力部の回りには、図４に詳細を示
すように、内径５０μｍ，幅２５μｍ，厚さ数μｍの環
形状の金属パッド７が形成されている。The light entrance portion, the light exit portion or the light I of the multilayer wiring layer 1
As shown in detail in FIG. 4, a ring-shaped metal pad 7 having an inner diameter of 50 μm, a width of 25 μm, and a thickness of several μm is formed around the light input portion and the light output portion of C6.
【００２１】その中心部には、多層配線層１と同じくＳ
ｉＯ2 で形成され直径３０μｍの光伝送部３と、その外
周に設けられた幅１０μｍの光絶縁部４を持ち、その側
面に金属膜１１を形成した高さ数十μｍの光ファイバー
１０が半田８により多層配線層１の金属パッドならびに
光ＩＣ６の金属パッドと接続されている。At the center thereof, as in the multilayer wiring layer 1, S
An optical fiber 10 having a height of several tens of μm and having a light transmission part 3 made of iO 2 and having a diameter of 30 μm and an optical insulation part 4 having a width of 10 μm provided on the outer periphery of the optical transmission part 3 and having a metal film 11 formed on the side surface thereof is soldered. Are connected to the metal pad of the multilayer wiring layer 1 and the metal pad of the optical IC 6.
【００２２】ここで、光ＩＣ６の光出力部から出力され
た光信号は、多層配線基板の内部と同様に光ファイバー
１０の光伝送部３を進行し、入光部であるコンタクトホ
ール５に向かい、多層配線基板の光伝送部３により伝送
される。Here, the optical signal output from the optical output section of the optical IC 6 travels through the optical transmission section 3 of the optical fiber 10 in the same manner as inside the multilayer wiring board, and goes to the contact hole 5 which is a light input section. It is transmitted by the optical transmission unit 3 of the multilayer wiring board.
【００２３】同様に多層配線基板の光伝送部３により伝
送され出光部であるコンタクトホール５から出力された
光信号は、光ファイバー１０の光伝送部３を進行し光Ｉ
Ｃの光入力部に向かう。Similarly, an optical signal transmitted by the optical transmission unit 3 of the multilayer wiring board and output from the contact hole 5 which is a light output unit travels through the optical transmission unit 3 of the optical fiber 10 and the optical signal I.
It goes to the light input part of C.
【００２４】次に多層配線層１の内部には第一の実施例
と同様に、電気配線層９が金属導体により形成され、多
層配線層１の表面において多層配線層１の金属パッド７
に接続されており、光ＩＣ６に電力または電気信号を供
給するために用いられる。そのため光ＩＣ６においても
金属パッド７はその内部の給電配線または電気信号配線
に接続される。Next, as in the first embodiment, an electric wiring layer 9 is formed of a metal conductor inside the multilayer wiring layer 1, and the metal pad 7 of the multilayer wiring layer 1 is formed on the surface of the multilayer wiring layer 1.
And is used to supply electric power or electric signals to the optical IC 6. Therefore, also in the optical IC 6, the metal pad 7 is connected to the power supply wiring or the electric signal wiring inside thereof.
【００２５】尚、図１，図２，図３，図４において、電
気配線層９，金属パッド７，半田８の金属により形成さ
れる部分は斜線を付して表わし、光伝送部３，コンタク
トホール５は編目を付して表わしてある。1, FIG. 2, FIG. 3, and FIG. 4, the portions of the electric wiring layer 9, the metal pads 7, and the solder 8 formed by the metal are shown by hatching, and the optical transmission portion 3 and the contacts are shown. Hole 5 is shown with stitches.
【００２６】また、多層配線層１内部の光伝送部３は、
直径が数ミクロンから数十ミクロンの円柱上または角柱
上とすることができ、コンタクトホール５も同様に直径
ミクンロンから数上ミクロンにすることが出来る。Further, the optical transmission section 3 inside the multilayer wiring layer 1 is
It can be on a cylinder or prism with a diameter of a few microns to a few tens of microns, and the contact hole 5 can likewise be on the order of a few microns from the diameter Miklon.
【００２７】多層配線層１の表面に出るコンタクトホー
ル５並びに多層配線層１の金属パッド５，光ＩＣの金属
パッド５，光ファイバー１０の形状と大きさは、光ＩＣ
の光出力部と光入力部の形状，大きさにより定まり、直
径数十ミクロンの円上，角状になる。The shape and size of the contact hole 5 appearing on the surface of the multilayer wiring layer 1, the metal pad 5 of the multilayer wiring layer 1, the metal pad 5 of the optical IC 5, and the optical fiber 10 are as follows.
It is determined by the shape and size of the light output part and the light input part, and it becomes a square shape with a diameter of several tens of microns.
【００２８】[0028]
【発明の効果】以上説明したように本発明は、多層配線
基板の入光部，出光部と光ＩＣの光出力部，光出力部の
各々に環形状の金属パッドを設け、多層配線基板の金属
パッドと光ＩＣの金属パッド間を筒形状の半田により接
続するか、側面に金属膜を形成した光ファイバーを設
け、光ＩＣの金属パッドと光ファイバーの側面の金属
膜，光ファイバーの側面の金属膜と多層配線基板の金属
パッドを半田により接続することで、多層配線基板と光
ＩＣ間の光信号の伝送のための接続が得られると共に、
各々の金属パッドに電力供給用または電気信号用電気配
線に接続することで、金属パッドは給電用接続または電
気信号用接続も兼ねることもできるという効果がある。As described above, according to the present invention, a ring-shaped metal pad is provided in each of the light input portion, the light output portion of the multilayer wiring board and the light output portion, the light output portion of the optical IC. The metal pad and the metal pad of the optical IC are connected by a cylindrical solder, or an optical fiber having a metal film formed on the side surface is provided, and the metal pad of the optical IC and the metal film on the side surface of the optical fiber and the metal film on the side surface of the optical fiber are connected. By connecting the metal pads of the multilayer wiring board with solder, a connection for transmission of an optical signal between the multilayer wiring board and the optical IC can be obtained, and
By connecting each metal pad to the electric wiring for power supply or electric signal, there is an effect that the metal pad can also serve as a power supply connection or an electric signal connection.
【００２９】また、各々の金属パッドは現在一般に製造
されている金属の導体材料を用いた多層配線基板，ＩＣ
と同様に製造でき、半田により接続も一般に用いられて
いる半田ペースト塗布，リフロー半田付けと同様に製造
できる。Further, each metal pad is a multi-layer wiring board or IC using a metal conductor material which is generally manufactured at present.
Can be manufactured in the same manner as described above, and the connection by soldering can also be manufactured in the same manner as commonly used solder paste application and reflow soldering.
【００３０】その上、半田付け時には、溶融した半田の
表面張力によるセルフアライメント効果により、光ＩＣ
は多層配線基板の正しい位置に調整されるため、光ＩＣ
実装において高精度の位置決めも必要がない。したがっ
て、本発明による接続方式は、製造性の良いものであ
る。Moreover, at the time of soldering, the optical IC is produced by the self-alignment effect due to the surface tension of the molten solder.
Is adjusted to the correct position on the multilayer wiring board.
High-precision positioning is not necessary for mounting. Therefore, the connection method according to the present invention has good manufacturability.
【図１】本発明の第一の実施例を切断して示す斜視図で
ある。FIG. 1 is a perspective view showing a cutaway first embodiment of the present invention.
【図２】図１における光ＩＣと多層配線基板の接続部の
詳細を示す断面図である。FIG. 2 is a cross-sectional view showing details of a connecting portion between the optical IC and the multilayer wiring board in FIG.
【図３】本発明の第二の実施例を切断して示す斜視図で
ある。FIG. 3 is a perspective view showing a second embodiment of the present invention by cutting it.
【図４】図３における光ＩＣと多層配線基板の接続部の
詳細を示す断面図である。FIG. 4 is a cross-sectional view showing details of a connecting portion between the optical IC and the multilayer wiring board in FIG.
１ 多層配線層 ２ 石英ガラス基板 ３ 光伝送部 ４ 光絶縁部 ５ 光コンタクトホール ６ 光ＩＣ ７ 金属パッド ８ 半田 ９ 電気配線層 １０ 光ファイバー １１ 金属膜 DESCRIPTION OF SYMBOLS 1 Multi-layer wiring layer 2 Quartz glass substrate 3 Optical transmission part 4 Optical insulation part 5 Optical contact hole 6 Optical IC 7 Metal pad 8 Solder 9 Electric wiring layer 10 Optical fiber 11 Metal film
Claims (4)
なる複数の電気配線層，光絶縁部および光伝送部からな
る複数の光配線層を持つ多層配線基板と、光信号の入出
力として複数の光入力部と光出力部を持つ光ＩＣとの接
続方法において、 前記多層配線基板の光ＩＣ実装面に設ける光伝送部の入
光部と出光部は、それぞれ前記光ＩＣの光出力部と光入
力部に向き合うように形成し、 該入光部と出光部並びに該光出力部と光入力部は、それ
ぞれの周りに環形状の金属パッドを形成し、 多層配線基板と光ＩＣの金属パッド間を筒形状の半田に
よりフリップチップ接続して、光ＩＣと多層配線基板間
の光信号の伝送を筒形状半田内部の中空部により行なう
ことを特徴とする光ＩＣと多層配線基板の接続方法。1. A multilayer wiring board having a plurality of electric wiring layers composed of an electric transmission section and an electric insulation section, and a plurality of optical wiring layers composed of an optical insulation section and an optical transmission section, and an input / output of an optical signal. As a method for connecting an optical IC having a plurality of optical input sections and optical output sections, the light input section and the light output section of the optical transmission section provided on the optical IC mounting surface of the multilayer wiring board are respectively the optical output of the optical IC. And a light input part, and the light input part and the light output part, and the light output part and the light input part each have a ring-shaped metal pad formed around the light input part and the light input part. Connection between the optical IC and the multilayer wiring board, characterized in that the metal pads are flip-chip connected by the cylindrical solder and the optical signal is transmitted between the optical IC and the multilayer wiring board by the hollow portion inside the cylindrical solder. Method.
なる複数の電気配線層，光絶縁部および光伝送部からな
る複数の光配線層を持つ多層配線基板と、光信号の入出
力として複数の光入力部と光出力部を持つ光ＩＣとの接
続方法において、 前記多層配線基板の光ＩＣ実装面に設ける光伝送部の入
光部と出光部は、それぞれ前記光ＩＣの光出力部と光入
力部に組み合うように形成し、 該入光部と出光部並びに該光出力部と光入力部は、それ
ぞれその周りに環形状の金属パッドを形成し、 またその側面に金属膜を形成した柱形状の光ファイバー
を形成し、 該光ファイバー上面と前記光ＩＣの光出力部または光入
力部が接するように置き、 前記光ＩＣの環形状の金属パッドと該光ファイバー側面
の金属膜を半田により接続すると共に、 該光ファイバー下面と前記多層配線基板の入光部または
出光部が接するように置き、 前記多層配線基板の環形状の金属パッドと該光ファイバ
ー側面の金属膜を半田によりフリップチップ接続して、
光Ｃと多層配線基板間の光信号の伝送を該光ファイバー
により行なうことを特徴とする光ＩＣと多層配線基板の
接続方法。2. A multilayer wiring board having a plurality of electric wiring layers composed of an electric transmission section and an electric insulation section, and a plurality of optical wiring layers composed of an optical insulation section and an optical transmission section, and an input / output of an optical signal. As a method of connecting an optical IC having a plurality of optical input sections and optical output sections, the light input section and the light output section of the optical transmission section provided on the optical IC mounting surface of the multilayer wiring board are respectively the optical output of the optical IC. Are formed so as to be combined with the light input portion and the light input portion, and the light input portion and the light output portion, and the light output portion and the light input portion respectively have ring-shaped metal pads formed around them, and a metal film is formed on the side surface thereof. The formed pillar-shaped optical fiber is formed and placed so that the upper surface of the optical fiber is in contact with the optical output part or the optical input part of the optical IC, and the ring-shaped metal pad of the optical IC and the metal film on the side surface of the optical IC are soldered. When connecting the optical fiber Placed so that the bottom surface of the multi-layer wiring board is in contact with the light entrance portion or the light exit portion of the multilayer wiring board, and the ring-shaped metal pad of the multilayer wiring board and the metal film on the side surface of the optical fiber are flip-chip connected by soldering,
A method for connecting an optical IC and a multilayer wiring board, wherein an optical signal is transmitted between the light C and the multilayer wiring board by the optical fiber.
配線基板の電力供給用電気配線に接続すると共に、前記
光ＩＣの金属パッドは光ＩＣの素子に対する電力供給用
電気配線に接続して、前記金属パッドは給電用接続も兼
ねることを特徴とした請求項１および請求項２記載の光
ＩＣと多層配線基板の接続方法。3. The metal pad of the multi-layer wiring board is connected to the electric power supply wiring of the multi-layer wiring board, and the metal pad of the optical IC is connected to the electric power supply wiring of the element of the optical IC. 3. The method for connecting an optical IC and a multilayer wiring board according to claim 1, wherein the metal pad also serves as a power supply connection.
配線基板の電気信号用電気配線に接続すると共に、前記
光ＩＣの金属パッドは光ＩＣの電気信号用電気配線に接
続して、前記金属パッドは電気信号用接続も兼ねること
を特徴とした請求項１および請求項２記載の光ＩＣと多
層配線基板の接続方法。4. The metal pad of the multi-layer wiring board is connected to the electric signal electric wiring of the multi-layer wiring board, and the metal pad of the optical IC is connected to the electric signal electric wiring of the optical IC. 3. The method of connecting an optical IC and a multilayer wiring board according to claim 1, wherein the pad also serves as a connection for electric signals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4045152A JPH05243391A (en) | 1992-03-03 | 1992-03-03 | Connecting method of optical ic to multilayer interconnection substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4045152A JPH05243391A (en) | 1992-03-03 | 1992-03-03 | Connecting method of optical ic to multilayer interconnection substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05243391A true JPH05243391A (en) | 1993-09-21 |
Family
ID=12711302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4045152A Withdrawn JPH05243391A (en) | 1992-03-03 | 1992-03-03 | Connecting method of optical ic to multilayer interconnection substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05243391A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003298167A (en) * | 2002-03-29 | 2003-10-17 | Toshiba Corp | Optical semiconductor device |
| JP2006259730A (en) * | 2005-03-15 | 2006-09-28 | Fujitsu Ltd | Apparatus and method for coupling optical element |
| CN110579840A (en) * | 2018-06-09 | 2019-12-17 | 深南电路股份有限公司 | optical transmission device and optical transmission system |
-
1992
- 1992-03-03 JP JP4045152A patent/JPH05243391A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003298167A (en) * | 2002-03-29 | 2003-10-17 | Toshiba Corp | Optical semiconductor device |
| JP2006259730A (en) * | 2005-03-15 | 2006-09-28 | Fujitsu Ltd | Apparatus and method for coupling optical element |
| CN110579840A (en) * | 2018-06-09 | 2019-12-17 | 深南电路股份有限公司 | optical transmission device and optical transmission system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990518 |