JPH05242934A - High frequency connector - Google Patents

High frequency connector

Info

Publication number
JPH05242934A
JPH05242934A JP4044037A JP4403792A JPH05242934A JP H05242934 A JPH05242934 A JP H05242934A JP 4044037 A JP4044037 A JP 4044037A JP 4403792 A JP4403792 A JP 4403792A JP H05242934 A JPH05242934 A JP H05242934A
Authority
JP
Japan
Prior art keywords
dielectric
high frequency
circuit board
frequency connector
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4044037A
Other languages
Japanese (ja)
Inventor
Hirohito Tanaka
博仁 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4044037A priority Critical patent/JPH05242934A/en
Publication of JPH05242934A publication Critical patent/JPH05242934A/en
Pending legal-status Critical Current

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

PURPOSE:To facilitate conforming of high frequency signals at a connection point between a dielectric and a circuit base board. CONSTITUTION:In a central conductor 14, clearance between it and a frame 10 becomes smaller as it approaches a circuit substrate 13, and a tip 14A thereof is connected to a micro-strip line 13A (or coplanar line). A part of outer circumferential surface of dielectric 15 is cut off and a sectional area thereof becomes gradually smaller toward the circuit substrate 13 side.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は高周波コネクタに係わ
り、特に伝送線路変換用コネクタに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency connector, and more particularly to a transmission line converting connector.

【0002】[0002]

【従来の技術】従来から既に提案されている高周波コネ
クタは、図3に示すように、伝送線路の接地側導体であ
るケース1に接続されるフレーム2と、ケース1上に配
置された回路基板3上に形成される信号側導体に接続さ
れる中心導体4と、フレーム2と中心導体4との間に特
性インピーダンスを一定に保つために設けられかつ中心
導体4を支持するための円筒状の誘電体5とを備えた構
成となっている。
2. Description of the Related Art As shown in FIG. 3, a high-frequency connector which has been already proposed has a frame 2 connected to a case 1 which is a ground side conductor of a transmission line, and a circuit board arranged on the case 1. A center conductor 4 connected to the signal-side conductor formed on 3 and a cylindrical shape for maintaining the characteristic impedance constant between the frame 2 and the center conductor 4 and supporting the center conductor 4. The dielectric 5 is provided.

【0003】[0003]

【発明が解決しようとする課題】このような従来の高周
波コネクタは、誘電体5の断面積と回路基板3の断面積
との間に大きな差が存在する。このため誘電体5からの
高周波信号が回路基板3上のマイクロストリップライン
またはコプレナライン等の伝送線路に形態を変える時、
この接続点(誘電体5と回路基板3との接続部分)で電
磁界分布が急激に変化する。したがって、この接続部分
での高周波信号の整合が取れないという問題があった。
In such a conventional high-frequency connector, there is a large difference between the cross-sectional area of the dielectric 5 and the cross-sectional area of the circuit board 3. Therefore, when the high-frequency signal from the dielectric 5 changes its form into a transmission line such as a microstrip line or a coplanar line on the circuit board 3,
At this connection point (the connection between the dielectric 5 and the circuit board 3), the electromagnetic field distribution changes abruptly. Therefore, there is a problem that the high frequency signals cannot be matched at this connection portion.

【0004】本発明は上述した問題に鑑みなされたもの
で、誘電体と回路基板との接続点での高周波信号の整合
を取りやすくした高周波コネクタを提供することをその
目的とする。
The present invention has been made in view of the above problems, and an object of the present invention is to provide a high-frequency connector that facilitates matching of high-frequency signals at a connection point between a dielectric and a circuit board.

【0005】[0005]

【課題を解決するための手段】請求項1記載の発明の高
周波コネクタは、高周波信号を伝送する同軸線の外導体
に接続されるフレームと、同軸線の内導体に接続され、
かつフレームとの距離が変化する中心導体と、中心導体
と接地との間の間隔を保持する誘電体とを備えて成り、
この誘電体はその外周面の一部が削り取られ、高周波信
号が伝送される回路基板側に向かって断面積が減少する
よう構成したものである。
A high frequency connector of the invention according to claim 1 is connected to a frame connected to an outer conductor of a coaxial line for transmitting a high frequency signal and to an inner conductor of the coaxial line,
And a center conductor whose distance from the frame changes, and a dielectric body which maintains the distance between the center conductor and the ground,
A part of the outer peripheral surface of this dielectric is shaved off, and the cross-sectional area is reduced toward the circuit board side where a high frequency signal is transmitted.

【0006】請求項2記載の発明の高周波コネクタは、
誘電体がテフロンにより作製されて成ることを特徴とす
る。
The high frequency connector of the invention according to claim 2 is
It is characterized in that the dielectric is made of Teflon.

【0007】[0007]

【作用】このように本発明によれば、誘電体の外周面の
一部を削り取り、回路基板側に向けて断面積が減少する
ようにしたので、誘電体と回路基板との接続点における
断面積の差が縮小される。したがって、誘電体の電磁界
分布から回路基板のマイクロストリップ線路またはコプ
レナ線路の電磁界分布への遷移をゆるやかに行うことが
可能となり、高周波信号の整合が取りやすくなった。
As described above, according to the present invention, a part of the outer peripheral surface of the dielectric is shaved off so that the cross-sectional area is reduced toward the circuit board side. The difference in area is reduced. Therefore, the transition from the electromagnetic field distribution of the dielectric material to the electromagnetic field distribution of the microstrip line or the coplanar line of the circuit board can be performed gently, and it becomes easy to match the high frequency signal.

【0008】[0008]

【実施例】次に、本発明について図面を参照して説明す
る。図1は本発明に係わる高周波コネクタの一実施例を
示す平面図、図2は同高周波コネクタの断面図である。
フレーム10はねじ11によって伝送線路の接地側導体
であるケース12に接続されている。このケース12は
アルミナ製の回路基板13上に形成されるマイクロスト
リップ線路13A(またはコプレナ線路)の接地側に接
続されている。また、中心導体14は回路基板13に近
づくにしたがってフレーム10との間隔が縮まるように
なっており、その先端部14Aは回路基板13上のマイ
クロストリップ線路13A(またはコプレナ線路)に接
続されるようになっている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1 is a plan view showing an embodiment of a high-frequency connector according to the present invention, and FIG. 2 is a sectional view of the same high-frequency connector.
The frame 10 is connected by screws 11 to a case 12 which is a ground side conductor of the transmission line. The case 12 is connected to the ground side of a microstrip line 13A (or a coplanar line) formed on a circuit board 13 made of alumina. Further, the center conductor 14 is configured so that the distance between the center conductor 14 and the frame 10 is reduced as it approaches the circuit board 13, and its tip portion 14A is connected to the microstrip line 13A (or the coplanar line) on the circuit board 13. It has become.

【0009】一方、中心導体14を保持する誘電体15
はテフロンを用い、ほぼ円筒状に作製されている。すな
わち、この誘電体15はその外周面の一部を図2に示す
ように削り取られており、この誘電体15の断面積を回
路基板13側に向かって漸次小さくなるように構成して
いる。したがって、この誘電体15と回路基板13との
接続点における断面積は従来に比べてそれほど大きな差
は存在せず、よって誘電体15の電磁界分布から回路基
板13のマイクロストリップ線路13A(またはコプレ
ナ線路)の電磁界分布への遷移をゆるやかに行うことが
可能となる。また、中心導体14がフレーム10に近づ
くにしたがって減少する特性インピーダンスは、中心導
体14とケース12との間に空気層16が存在するよう
に誘電体15の一部を削り取ることによって、一定にす
ることが可能となる。
On the other hand, the dielectric 15 holding the central conductor 14
Is made of Teflon and has a substantially cylindrical shape. That is, a part of the outer peripheral surface of the dielectric 15 is cut away as shown in FIG. 2, and the cross-sectional area of the dielectric 15 is gradually reduced toward the circuit board 13 side. Therefore, the cross-sectional area at the connection point between the dielectric 15 and the circuit board 13 is not so different from the conventional one, and therefore the electromagnetic field distribution of the dielectric 15 causes the microstrip line 13A (or the coplanar line) of the circuit board 13 to be different. It is possible to make a gradual transition to the electromagnetic field distribution of the line. Further, the characteristic impedance that decreases as the center conductor 14 approaches the frame 10 is made constant by scraping off a part of the dielectric 15 so that the air layer 16 exists between the center conductor 14 and the case 12. It becomes possible.

【0010】[0010]

【発明の効果】以上説明したように本発明に係わる高周
波コネクタによれば、中心導体と接地との間の間隔を保
持する誘電体の外周面の一部を削り取り、回路基板側に
向けて断面積が減少するよう構成したので、誘電体と回
路基板との接続点における断面積の差が縮小され、これ
によって、誘電体の電磁界分布から回路基板のマイクロ
ストリップ線路またはコプレナ線路の電磁界分布への遷
移をゆるやかに行うことが可能となった。したがって、
誘電体と回路基板との接続点での高周波信号の整合が取
りやすくなったという優れた効果を奏する。
As described above, according to the high frequency connector of the present invention, a part of the outer peripheral surface of the dielectric body that holds the space between the central conductor and the ground is scraped off and cut toward the circuit board side. Since it is configured to reduce the area, the difference in the cross-sectional area at the connection point between the dielectric and the circuit board is reduced, and this reduces the electromagnetic field distribution of the dielectric from that of the microstrip line or coplanar line It has become possible to make a smooth transition to. Therefore,
The excellent effect that the high frequency signal can be easily matched at the connection point between the dielectric and the circuit board is achieved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係わる高周波コネクタの一実施例を示
す平面図である。
FIG. 1 is a plan view showing an embodiment of a high frequency connector according to the present invention.

【図2】同高周波コネクタの断面図である。FIG. 2 is a sectional view of the high-frequency connector.

【図3】従来の高周波コネクタの一例を示す断面図であ
る。
FIG. 3 is a cross-sectional view showing an example of a conventional high frequency connector.

【符号の説明】[Explanation of symbols]

10 フレーム 12 ケース 13 回路基板 14 中心導体 15 誘電体 10 frame 12 case 13 circuit board 14 center conductor 15 dielectric

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 高周波信号を伝送する同軸線の外導体に
接続されるフレームと、前記同軸線の内導体に接続さ
れ、かつ前記フレームとの距離が変化する中心導体と、
前記中心導体と接地との間の間隔を保持する誘電体とを
備えて成り、この誘電体はその外周面の一部が削り取ら
れ、高周波信号が伝送される回路基板側に向かって断面
積が減少するよう構成されたことを特徴とする高周波コ
ネクタ。
1. A frame connected to an outer conductor of a coaxial line that transmits a high-frequency signal, and a center conductor that is connected to an inner conductor of the coaxial line and has a variable distance from the frame.
A dielectric for maintaining a space between the central conductor and the ground is provided, and a part of the outer peripheral surface of the dielectric is shaved off so that the cross-sectional area is toward the circuit board side where a high frequency signal is transmitted. A high frequency connector characterized by being configured to reduce.
【請求項2】 誘電体はテフロンにより作製されて成る
ことを特徴とする請求項1記載の高周波コネクタ。
2. The high frequency connector according to claim 1, wherein the dielectric is made of Teflon.
JP4044037A 1992-02-28 1992-02-28 High frequency connector Pending JPH05242934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4044037A JPH05242934A (en) 1992-02-28 1992-02-28 High frequency connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4044037A JPH05242934A (en) 1992-02-28 1992-02-28 High frequency connector

Publications (1)

Publication Number Publication Date
JPH05242934A true JPH05242934A (en) 1993-09-21

Family

ID=12680430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4044037A Pending JPH05242934A (en) 1992-02-28 1992-02-28 High frequency connector

Country Status (1)

Country Link
JP (1) JPH05242934A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045514A (en) * 2001-07-27 2003-02-14 Matsushita Electric Works Ltd F-type connector core wire connecting structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045514A (en) * 2001-07-27 2003-02-14 Matsushita Electric Works Ltd F-type connector core wire connecting structure

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