JPH0524166B2 - - Google Patents
Info
- Publication number
- JPH0524166B2 JPH0524166B2 JP58098212A JP9821283A JPH0524166B2 JP H0524166 B2 JPH0524166 B2 JP H0524166B2 JP 58098212 A JP58098212 A JP 58098212A JP 9821283 A JP9821283 A JP 9821283A JP H0524166 B2 JPH0524166 B2 JP H0524166B2
- Authority
- JP
- Japan
- Prior art keywords
- melamine
- resin
- epoxy
- epoxy resin
- formaldehyde
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920000877 Melamine resin Polymers 0.000 claims description 37
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 32
- 239000004640 Melamine resin Substances 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 15
- 150000007974 melamines Chemical class 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は配線器具、電気器具等に用いられるメ
ラミン樹脂成形材料用のエポキシ変性メラミン樹
脂の製造技術に関するものである。
〔背景技術〕
従来、メラミン樹脂成形材料に用いられるメラ
ミン樹脂は吸湿性が大きく且つポツトライフが短
かくその取扱性はやつかいなものであつた。
〔発明の目的〕
本発明の目的とするところは、メラミン樹脂の
吸湿性及びポツトライフを改良しその取扱性を容
易なものにすることにある。
〔発明の開示〕
本発明はエポキシ当量500〜1000のビスフエノ
ール系エポキシ樹脂を10〜70重量％（以下単に％
と記す）含むメラミン水溶液を加熱してから該水
溶液のメラミン１モルに対しホルムアルデヒド
1.2〜2.5モルを加え反応させることを特徴とする
エポキシ変性メラミン樹脂の製造方法で以下本発
明を詳細に説明する。本発明に用いるエポキシ樹
脂はビスフエノール系エポキシ樹脂、ノボラツク
型エポキシ樹脂、グリシジルエステル型エポキシ
樹脂、高分子型エポキシ樹脂、可撓性エポキシ樹
脂、臭素化エポキシ樹脂等が用いられ特に限定す
るものではないがエポキシ当量500〜1000のビス
フエノール型エポキシ樹脂を用いることが相溶性
の点からみて必要である。エポキシ樹脂とメラミ
ンとの比率はエポキシ樹脂10〜70％に対しメラミ
ン90〜30％である。即ち、エポキシ樹脂の量が10
％未満では変性メラミン樹脂の吸湿性、ポツトラ
イフが改良されず、70％をこえると反応性が極度
に低下するためである。メラミンに対するホルム
アルデヒドの量はメラミン１モルに対しホルムア
ルデヒド1.2〜2.5モルである。即ちホルムアルデ
ヒドの量が1.2モル未満では変性メラミン樹脂の
反応性が低下し、2.5モルをこえると吸湿性が大
きくなるからである。このように本発明ではエポ
キシ変性メラミン樹脂を得ようとして硬化の遅く
なるブチルエーテル化メラミン樹脂を用いること
もなく又、吸湿性、ポツトライフが大きく改良さ
れない単にメラミン樹脂とエポキシ樹脂を混合し
たものでなく、更にメラミン樹脂と芳香族アミン
と反応させてからエポキシ樹脂と混合するような
手間のかかる混合物でもなくエポキシ変性メラミ
ン樹脂のため吸湿性、ポツトライフを大巾に改良
することができたものである。更に本発明のエポ
キシ変性メラミン樹脂は脱水することにより容易
に固形化するので更に取扱性を改善することがで
きるものである。以下本発明の実施例を従来例と
併せて説明する。
実施例 １
エポキシ樹脂（シエル化学株式会社製、エピコ
ート1002、エポキシ当量600〜700）10重量部（以
下単に部と記す）、メラミン90部、水100部からな
るメラミン水溶液を還流温度で100分間加熱して
から温度を90℃にし、次にメラミン１モルに対し
ホルムアルデヒド1.2モルを40％ホルマリンで加
えてから水酸化ナトリウムでPH10に調整し還流温
度で60分間反応させエポキシ変性メラミン樹脂を
得、更に脱水して固形樹脂とした。
実施例 ２
エポキシ樹脂（シエル化学株式会社製、エピコ
ート1004、エポキシ当量875〜975）70部、メラミ
ン30部、水100部からなるメラミン水溶液を還流
温度で120分間加熱してから温度を90℃にし、次
にメラミン１モルに対しホルムアルデヒド2.5モ
ルを37％ホルマリンで加えてからアンモニア水で
PH10に調整し還流温度で60分間反応させエポキシ
変性メラミン樹脂を得た。
従来例 １
メラミン１モルに対しホルムアルデヒド1.2モ
ルを40％ホルマリンで加え水酸化ナトリウムでPH
10に調整してから還流温度で60分間反応させてメ
ラミン樹脂を得、更に脱水して固形樹脂とした。
従来例 ２
メラミン１モルに対しホルムアルデヒド2.5モ
ルを37％ホルマリンで加えアンンモニア水でPH10
に調整し還流温度で60分間反応させてメラミン樹
脂を得た。
〔発明の効果〕
実施例１及び２のエポキシ変性メラミン樹脂と
従来例１及び２のメラミン樹脂の吸湿性、ポツト
ライフは第１表で明白なように本発明のエポキシ
変性メラミン樹脂の吸湿度は少なく且つポツトラ
イフは長く本発明の優れていることを確認した。
【表】DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technology for producing an epoxy-modified melamine resin for use as a melamine resin molding material used in wiring devices, electrical appliances, and the like. [Background Art] Conventionally, melamine resins used in melamine resin molding materials have high hygroscopicity and a short pot life, making them difficult to handle. [Object of the Invention] An object of the present invention is to improve the hygroscopicity and pot life of melamine resin and to make it easier to handle. [Disclosure of the Invention] The present invention uses a bisphenol epoxy resin having an epoxy equivalent of 500 to 1000 in an amount of 10 to 70% by weight (hereinafter simply %).
After heating an aqueous melamine solution containing
The present invention will be described in detail below using a method for producing an epoxy-modified melamine resin, which is characterized by adding 1.2 to 2.5 moles and reacting. The epoxy resin used in the present invention includes bisphenol epoxy resin, novolac type epoxy resin, glycidyl ester type epoxy resin, polymer type epoxy resin, flexible epoxy resin, brominated epoxy resin, etc., and is not particularly limited. From the viewpoint of compatibility, it is necessary to use a bisphenol type epoxy resin having an epoxy equivalent of 500 to 1000. The ratio of epoxy resin to melamine is 10-70% epoxy resin and 90-30% melamine. That is, the amount of epoxy resin is 10
This is because if it is less than 70%, the hygroscopicity and pot life of the modified melamine resin will not be improved, and if it exceeds 70%, the reactivity will be extremely reduced. The amount of formaldehyde relative to melamine is 1.2 to 2.5 moles of formaldehyde per mole of melamine. That is, if the amount of formaldehyde is less than 1.2 moles, the reactivity of the modified melamine resin will decrease, and if it exceeds 2.5 moles, the hygroscopicity will increase. In this way, the present invention does not use a butyl etherified melamine resin which cures slowly in order to obtain an epoxy-modified melamine resin, nor does it simply mix a melamine resin and an epoxy resin, which does not significantly improve hygroscopicity and pot life. Furthermore, since the melamine resin is an epoxy-modified melamine resin, it does not need to be a time-consuming mixture in which the melamine resin is reacted with an aromatic amine and then mixed with an epoxy resin, so the hygroscopicity and pot life can be greatly improved. Furthermore, since the epoxy-modified melamine resin of the present invention is easily solidified by dehydration, the handling properties can be further improved. Embodiments of the present invention will be described below together with conventional examples. Example 1 A melamine aqueous solution consisting of 10 parts by weight (hereinafter simply referred to as parts) of epoxy resin (manufactured by Ciel Kagaku Co., Ltd., Epicoat 1002, epoxy equivalent 600-700), 90 parts of melamine, and 100 parts of water was heated at reflux temperature for 100 minutes. Then, the temperature was raised to 90℃, and then 1.2 moles of formaldehyde was added to 1 mole of melamine in 40% formalin, the pH was adjusted to 10 with sodium hydroxide, and the reaction was carried out at reflux temperature for 60 minutes to obtain an epoxy-modified melamine resin. It was dehydrated to obtain a solid resin. Example 2 A melamine aqueous solution consisting of 70 parts of epoxy resin (manufactured by Ciel Kagaku Co., Ltd., Epicoat 1004, epoxy equivalent 875-975), 30 parts of melamine, and 100 parts of water was heated at reflux temperature for 120 minutes, and then the temperature was raised to 90°C. Next, add 2.5 moles of formaldehyde to 1 mole of melamine in 37% formalin, then add aqueous ammonia.
The pH was adjusted to 10 and the reaction was carried out at reflux temperature for 60 minutes to obtain an epoxy-modified melamine resin. Conventional example 1 Add 1.2 moles of formaldehyde to 1 mole of melamine in 40% formalin and PH with sodium hydroxide.
10 and reacted at reflux temperature for 60 minutes to obtain a melamine resin, which was further dehydrated to obtain a solid resin. Conventional example 2 Add 2.5 moles of formaldehyde to 1 mole of melamine with 37% formalin and adjust the pH to 10 with ammonia water.
A melamine resin was obtained by adjusting the temperature and reacting at reflux temperature for 60 minutes. [Effects of the Invention] As is clear from Table 1, the hygroscopicity and pot life of the epoxy-modified melamine resins of Examples 1 and 2 and the melamine resins of Conventional Examples 1 and 2 are low. Moreover, it was confirmed that the present invention has a long pot life. 【table】
Claims (1)
エポキシ樹脂を10〜70重量％含むメラミン水溶液
を加熱してから該水溶液のメラミン１モルに対し
ホルムアルデヒド1.2〜2.5モルを加えアルカリ性
下で反応させることを特徴とするエポキシ変性メ
ラミン樹脂の製造方法。1. A melamine aqueous solution containing 10 to 70% by weight of a bisphenol epoxy resin having an epoxy equivalent of 500 to 1000 is heated, and then 1.2 to 2.5 mol of formaldehyde is added to 1 mol of melamine in the aqueous solution and reacted under alkaline conditions. A method for producing epoxy-modified melamine resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9821283A JPS59221320A (en) | 1983-06-01 | 1983-06-01 | Preparation of epoxy modified melamine resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9821283A JPS59221320A (en) | 1983-06-01 | 1983-06-01 | Preparation of epoxy modified melamine resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59221320A JPS59221320A (en) | 1984-12-12 |
| JPH0524166B2 true JPH0524166B2 (en) | 1993-04-07 |
Family
ID=14213667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9821283A Granted JPS59221320A (en) | 1983-06-01 | 1983-06-01 | Preparation of epoxy modified melamine resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59221320A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305117A (en) * | 1987-06-05 | 1988-12-13 | Matsushita Electric Works Ltd | Melamine resin, its production and melamine resin molding material |
| JPH01272615A (en) * | 1988-04-25 | 1989-10-31 | Matsushita Electric Works Ltd | Production of solid melamine resin |
| CN110358036A (en) * | 2019-08-27 | 2019-10-22 | 四川构聚高分子材料有限公司 | A kind of modified melamine resin and production method |
-
1983
- 1983-06-01 JP JP9821283A patent/JPS59221320A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59221320A (en) | 1984-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3200172A (en) | Moulding compositions comprising epoxidized novolak, novolak and amine | |
| US3896081A (en) | Rapid curing resin compositions employing aminoplast condensation polymer modified with a di-substituted bis-aryl amine | |
| US4036787A (en) | Process for the production of epoxy silicate compounds and polymers | |
| JPH0524166B2 (en) | ||
| CN108314987B (en) | High-temperature-resistant adhesive containing graphite powder and preparation method thereof | |
| GB597285A (en) | Process for the preparation of synthetic resin-modified n-alkoxymethyl polyamide compositions | |
| US2617785A (en) | Novolak resin preparation | |
| JPS61152717A (en) | Phenolic resin composition modified with boric acid | |
| US2538883A (en) | Phenol-modified acetone resins | |
| JPH0362822A (en) | Encapsulated semiconductor | |
| JPS5814450B2 (en) | Manufacturing method of novolac type phenolic resin | |
| JPS63275620A (en) | Production of polyhydroxy compound | |
| JPS5823413B2 (en) | phenol resin products | |
| JPS6051496B2 (en) | Method for producing phenolic resin for laminates | |
| JPH05295643A (en) | Laminated board, glass fiber nonwoven fabric for laminated board and production of glass fiber nonwoven fabric | |
| JPS6279216A (en) | Production of solid amino resin | |
| JP2654958B2 (en) | Phenol-modified melamine resin adhesive | |
| JPS6261215B2 (en) | ||
| JPH0236125B2 (en) | KAIRYOSARETAINIONKOKANJUSHINOSEIZOHOHO | |
| JPH0344094B2 (en) | ||
| JPS6159328B2 (en) | ||
| JP3268816B2 (en) | Allyl group-containing phenolic resin and method for producing the same | |
| JPH0627169B2 (en) | Epoxy resin manufacturing method | |
| JPH03195716A (en) | Production of melamine resin | |
| JPH04294839A (en) | Binder for molding sand and its manufacture |