JPH05237685A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPH05237685A JPH05237685A JP4039205A JP3920592A JPH05237685A JP H05237685 A JPH05237685 A JP H05237685A JP 4039205 A JP4039205 A JP 4039205A JP 3920592 A JP3920592 A JP 3920592A JP H05237685 A JPH05237685 A JP H05237685A
- Authority
- JP
- Japan
- Prior art keywords
- supporting rod
- laser beam
- support rod
- workpiece
- piston
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、レーザ光を用いて被加
工物を切断または穴あけするレーザ加工機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam machine for cutting or boring a workpiece by using a laser beam.
【０００２】[0002]
【従来の技術】従来のレーザ加工機の例として、特許公
報平2−60439号公報に示された被加工物の支持方法を図
２に示す。レーザ発振器(図示せず)から出たレーザ光１
は対物レンズ２によって被加工物３の加工部４に集光照
射される。被加工物３は載物台５に設けられた支持棒６
によって支えられている。2. Description of the Related Art As an example of a conventional laser beam machine, FIG. 2 shows a method of supporting a workpiece shown in Japanese Patent Laid-Open No. 60439/1990. Laser light emitted from a laser oscillator (not shown) 1
Is focused and irradiated onto the processed portion 4 of the workpiece 3 by the objective lens 2. The workpiece 3 is a support rod 6 provided on the stage 5.
Supported by.
【０００３】加工部が支持棒の上にない場合は正常な加
工が行われるが、支持棒が加工部にある場合、材料の除
去に支持棒が影響を与え、正常な加工を妨げる。特にガ
スアシスト加工を行っている時はこの影響は顕著であ
る。If the processed portion is not on the support rod, normal processing is performed, but if the support rod is on the processed portion, the support rod influences the removal of the material and prevents normal processing. This effect is particularly remarkable when performing gas-assisted processing.
【０００４】この問題は加工部の品質に対する要求が高
くなり、きびしくなるに従い、重大となり、解決の手段
が求められていた。This problem becomes more serious as the demands on the quality of the machined portion become higher and more severe, and a means for solving the problem has been required.
【０００５】[0005]
【発明が解決しようとする課題】上記従来技術の欠陥を
解決し、レーザ加工部の品質に影響を与えない加工物の
支持手段を提供するのが本発明の目的である。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned drawbacks of the prior art and to provide a means for supporting a workpiece which does not affect the quality of the laser-machined portion.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、支持棒を可動とし、加工部の下に支持棒がきたら支
持棒が被加工物から離れる構造とした。In order to achieve the above object, the support rod is made movable, and when the support rod comes under the processing portion, the support rod is separated from the workpiece.
【０００７】[0007]
【作用】支持棒をシリンダとピストンの組合せとし、普
段はバネで所定位置まで押し上げてあり、加工部に来た
ら、下にあいた穴からエアが吸引され、吸引力で支持棒
のピストンが下り、支持棒が被加工物から離れる。[Operation] A support rod is a combination of a cylinder and a piston, and it is normally pushed up to a predetermined position by a spring. When it comes to the processing part, air is sucked from the hole below and the piston of the support rod descends due to the suction force. The support bar moves away from the work piece.
【０００８】[0008]
【実施例】以下、本発明の一実施例を図１により説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
【０００９】図１において、被加工物３を支える支持棒
６は、ピストン 6-1とシリンダ 6-2とバネ 6-3とにより
なっており、普段はバネ 6-3により、上端まで上がって
被加工物を支えている。そして加工部４が支持棒６の位
置にくると、載物台５の支持棒の下に設けられた吸引穴
７から、加工部４の下に設けられた吸引配管８によって
空気を吸引する。吸引配管８には吸引ポンプ(図示せず)
が接続されている。シリンダ 6-2の内部は減圧され、バ
ネ 6-3の力に抗してピストン 6-1が下り、被加工物３か
ら支持棒が離れる。In FIG. 1, the support rod 6 for supporting the work piece 3 is composed of a piston 6-1, a cylinder 6-2 and a spring 6-3. Normally, the spring 6-3 raises the support rod 6 to its upper end. Supports the work piece. Then, when the processing unit 4 comes to the position of the support rod 6, air is sucked from the suction hole 7 provided under the support rod of the stage 5 by the suction pipe 8 provided below the processing unit 4. A suction pump (not shown) is provided in the suction pipe 8.
Are connected. The inside of the cylinder 6-2 is decompressed, the piston 6-1 descends against the force of the spring 6-3, and the support rod separates from the workpiece 3.
【００１０】このようにすることにより、加工部での除
去物のガスアシスト等による排出は支持棒のない部分と
同様にスムーズに行われ、品質の高い加工を実現するこ
とができた。By doing so, the removal of the removed material by the gas assist or the like in the processing portion can be performed smoothly as in the portion without the support rod, and high quality processing can be realized.
【００１１】図３は本発明の他の一実施例の断面図であ
る。FIG. 3 is a sectional view of another embodiment of the present invention.
【００１２】レーザ加工により加工部４から排出される
被加工物材料は支持棒６のピストン 6-1とシリンダ 6-2
の間に入り込みピストン 6-1の動作を妨げる恐れがあ
る。このため、ピストンの上部の形状を、ピストン 6-1
とシリンダ 6-2のすきまをおおうように、ピストン 6-1
の上部の外径を、摺動部 6-4より大きくした。このよう
にすることにより、加工物４から排出される被加工物の
加工くずの摺動部 6-4への侵入を防ぐことができ、長時
間連続で運転できるようになった。The workpiece material discharged from the processing section 4 by laser processing is the piston 6-1 and the cylinder 6-2 of the support rod 6.
There is a risk that it may get in the way and interfere with the operation of piston 6-1. Therefore, the shape of the upper part of the piston should be
Piston 6-1 so that the clearance between
The outer diameter of the upper part of was larger than that of the sliding part 6-4. By doing so, it is possible to prevent the processing scraps of the workpiece discharged from the workpiece 4 from entering the sliding portion 6-4, and it is possible to continuously operate for a long time.
【００１３】[0013]
【発明の効果】本発明は以上説明したように構成されて
いるため、以下に示す効果を有する。Since the present invention is constructed as described above, it has the following effects.
【００１４】支持棒を有する載物台に被加工物を載せて
加工を行うレーザ加工機において、支持棒部にレーザ加
工部が来た時に生ずる加工品質の支持棒による影響を、
支持棒が被加工物から離れることによるさけられるよう
になり、レーザ加工の品質を向上させることができるよ
うになった。In a laser processing machine for performing processing by placing a workpiece on a stage having a support rod, the influence of the support rod on the processing quality that occurs when the laser processing portion comes to the support rod is
It became possible to avoid the support rod from moving away from the workpiece, and it became possible to improve the quality of laser processing.
【図１】本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.
【図２】従来の実施例の断面図である。FIG. 2 is a cross-sectional view of a conventional example.
【図３】本発明の他の一実施例の断面図である。FIG. 3 is a sectional view of another embodiment of the present invention.
１…レーザ光、 ２…対物レンズ、 ３…被加工物、 ４…加工部、 ５…載物台、 ６…支持棒、 6-1…ピストン、 6-2…シリンダ、 6-3…バネ、 6-4…摺動部、 ７…吸引穴、 ８…吸引配管。 1 ... Laser light, 2 ... Objective lens, 3 ... Workpiece, 4 ... Processing part, 5 ... Mounting stage, 6 ... Support rod, 6-1 ... Piston, 6-2 ... Cylinder, 6-3 ... Spring, 6-4 ... sliding part, 7 ... suction hole, 8 ... suction pipe.
フロントページの続き (72)発明者 水越 克郎 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内 (72)発明者 本郷 幹雄 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内Front Page Continuation (72) Inventor Katsuro Mizukoshi 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Stock Production Research Laboratory, Hitachi, Ltd. (72) Inventor Mikio Hongo 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Hitachi, Ltd. Production Technology Laboratory
Claims (3)
レーザ加工を行うレーザ加工装置において、レーザ加工
点に支柱がきた時、支柱が被加工物から離れることを特
徴とするレーザ加工装置。1. A work piece is placed on a pillar that supports the work piece,
A laser processing apparatus for performing laser processing, wherein when the support pillar comes to a laser processing point, the support pillar separates from the workpiece.
により可動となっており、下からの吸引で下るようにし
たことを特徴とするレーザ加工装置。2. The laser processing apparatus according to claim 1, wherein the column is movable by a cylinder, and is lowered by suction from below.
ンダとピストンの間に入らないように、ピストンの上部
がシリンダとピストンの摺動部より大きくなっているこ
とを特徴とするレーザ加工装置。3. The laser processing apparatus according to claim 2, wherein an upper portion of the piston is larger than a sliding portion between the cylinder and the piston so that a cutting waste does not enter between the cylinder and the piston. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4039205A JPH05237685A (en) | 1992-02-26 | 1992-02-26 | Laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4039205A JPH05237685A (en) | 1992-02-26 | 1992-02-26 | Laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05237685A true JPH05237685A (en) | 1993-09-17 |
Family
ID=12546633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4039205A Pending JPH05237685A (en) | 1992-02-26 | 1992-02-26 | Laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05237685A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1340584A1 (en) * | 2002-02-16 | 2003-09-03 | Trumpf Werkzeugmaschinen GmbH + Co. KG | Apparatus for thermal cutting of workpieces in particular using laser |
| US6970042B2 (en) | 2002-10-29 | 2005-11-29 | Huettinger Elektronik Gmbh & Co. Kg | Power control for high frequency amplifiers |
| JP2013136088A (en) * | 2011-12-28 | 2013-07-11 | Mitsubishi Electric Corp | Holding device |
| EP2626165A1 (en) | 2012-02-07 | 2013-08-14 | Bystronic Laser AG | Work piece support |
-
1992
- 1992-02-26 JP JP4039205A patent/JPH05237685A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1340584A1 (en) * | 2002-02-16 | 2003-09-03 | Trumpf Werkzeugmaschinen GmbH + Co. KG | Apparatus for thermal cutting of workpieces in particular using laser |
| US7429034B2 (en) | 2002-02-16 | 2008-09-30 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Apparatus and method for thermal cutting of a workpiece |
| US6970042B2 (en) | 2002-10-29 | 2005-11-29 | Huettinger Elektronik Gmbh & Co. Kg | Power control for high frequency amplifiers |
| JP2013136088A (en) * | 2011-12-28 | 2013-07-11 | Mitsubishi Electric Corp | Holding device |
| EP2626165A1 (en) | 2012-02-07 | 2013-08-14 | Bystronic Laser AG | Work piece support |
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