JPH05235595A - Packaging device for electronic component - Google Patents

Abstract

PURPOSE:To provide an optical means which is capable of eliminating adverse effect of other nozzles where no electronic component is attracted and monitoring large-sized electronic components clearly. CONSTITUTION:A light diffusion plate 14, which is driven by a taking-in and out drive means 40 and taken in and out behind and electronic component P attracted to a nozzle 4a, is installed to a recognition stage 50 using a camera 25. Other nozzles 4b-4a at rising positions are masked with the light diffusion plate 14 from the visual field.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer head for electronic parts, and more particularly to a light diffusing plate that scatters light emitted from a light source for observing electronic parts adsorbed by a nozzle with a camera. Regarding the arrangement structure.

[0002]

2. Description of the Related Art An electronic component is attracted to a nozzle of a transfer head, and the electronic component is observed by a camera to detect the positional deviation of the electronic component while being transferred and mounted on a substrate.

7 and 8 show a state in which an electronic component is observed by a conventional means. In the figure, 101 is a transfer head, which has a plurality of nozzles 102a to 102d.

From the plurality of nozzles 102a to 102d, a nozzle (for example, a nozzle 102a) most suitable for an electronic component (hereinafter referred to as a chip) P is selected, and the chip P is adsorbed to the nozzle 102a. 103 is a camera for observing the chip P from below, and 104 is a ring-shaped light source. A light diffusion plate 105 such as a white acrylic resin plate is attached to the lower part of the transfer head 101. The light emitted from the light source 104 is scattered by the light diffusion plate 105, and the silhouette of the chip P is observed to be black in a bright background. FIG. 8 shows an image observed by the camera 103. Q is the inspection frame of the camera 103, L is the chip P
Is the lead.

[0005]

However, in the above-mentioned conventional means, when the chip P is large, other unused nozzles 102b and 102d exist near the lead L as shown in the drawing, and these nozzles 102b and 102d 102d also leads L
It is observed as black as. Therefore, there is a problem that the nozzles 102b and 102d become obstacles, the lead L cannot be clearly observed, and the positional deviation of the chip P cannot be detected accurately.

Therefore, an object of the present invention is to provide an optical means capable of clearly observing a large electronic component by eliminating the adverse effects of other nozzles which are not sucking the electronic component.

[0007]

To this end, according to the present invention, a recognition stage by a camera is provided with a light diffusing plate which is driven by a loading / unloading drive means and is loaded / unloaded behind an electronic component sucked by a nozzle. The light diffusing plate is used to hide the other nozzles in the raised position from the field of view of the camera.

[0008]

According to the above construction, the selected nozzle is lowered by the lowering means to pick up the electronic component of the supply unit, and the transfer head in which the electronic component is adsorbed by this nozzle,
Move to the observation position by the camera of the recognition stage. Then, the light-diffusion plate is made to enter behind the electronic component adsorbed by the nozzle by the loading / unloading drive means, and light is emitted toward the light-diffusion plate, and the silhouette of the electronic component is observed by the camera. In this case, the other nozzles that are not picking up the electronic components are hidden from the camera's field of view by the light diffuser plate, so these nozzles are not observed by the camera at all, and in the bright background, the black silhouette of the electronic components Only can be clearly observed.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus. Two
0 is a rotary head, and along its circumferential direction,
A large number of transfer heads 1 are provided. A plurality of nozzles 4 are attached to the transfer head 1. Behind the rotary head 20, a supply unit 31 for the chips P is installed. Reference numeral 32 denotes a moving table on which a pallet 33 is placed. On the pallet 33, a large number of feeders 34 for the chips P such as tape feeders and tube feeders are placed. 35 is a ball screw, 30 is a ball screw 35
When the ball screw 35 rotates, the feeder 34 moves in the X direction and the predetermined feeder 3
4 is stopped at the pickup position a. An XY table 36 is provided on the front side of the rotary head 20. The XY table 36 moves the substrate 37 positioned by the positioning unit 38 in the XY directions.

In FIG. 1, reference numeral 50 denotes a recognition stage for the chip P. As will be described later, the chip P attracted to the nozzle 4 is observed by a camera 25 (see FIG. 4), and the lead L of the chip P is displaced. Recognize. Reference numeral 51 denotes a nozzle housing stage for housing the nozzle 4 in which the mounting of the chip P on the substrate 37 is completed in the transfer head 1, 52 denotes a nozzle selection stage for selecting the nozzle 4 suitable for the chip P to be picked up next, Reference numeral 53 is a nozzle projecting stage for projecting the selected nozzle 4 downward. Each transfer head 1 is index-rotated in the direction of arrow N,
The above stages 50 to 53 are circulated.

FIG. 2 is a sectional view of the transfer head 1 on the nozzle projecting stage 53. The transfer head 1 itself is well known, and its structure will be briefly described below. Reference numeral 2 denotes a main body case, in which a vertical rotating shaft 3 is provided. M is a motor for rotating the rotary shaft 3. A plurality of nozzles 4 (4a, 4b, 4) are provided around the rotary shaft 3.
c, 4d) are provided (see also FIG. 3). Nozzle 4
Are attached to the lower part of the nozzle shaft 5. A bracket 6 surrounds the nozzle shaft 5, and a lever 7 is pivotally mounted on the bracket 6 by a pin 10. A ring-shaped spring material 9 is attached to the lever 7, and a hook 7 a formed at the lower end of the lever 7 has an engaging portion 8 cut out in the nozzle 4 by the spring force of the ring-shaped spring material 9. Engage with.

A coil spring 11 is attached to the nozzle shaft 5. This coil spring 11
The nozzle 4 is biased downward. Reference numeral 12 is a block attached to the lower portion of the rotary shaft 3, and the nozzle 4 is fitted in the block 12 so as to be movable up and down. When the motor M is driven to rotate the rotary shaft 3 in the nozzle selection stage 52, the block 12 and the nozzles 4a to 4d fitted in the block 12 rotate around the rotary shaft 3 and are then picked up. The optimum nozzle (nozzle 4a in this embodiment) for the chip P to be selected is selected.

In FIG. 2, a cylinder 13 is provided on the side of the lever 7. Rod 1 of this cylinder 13
When 3a projects, the lever 7 rotates counterclockwise around the pin 10 and the hook 7a disengages from the engaging portion 8. Then, the nozzle 4 is lowered by the spring force of the coil spring 11 and projects from the lower surface of the block 12. That is, the cylinder 13 serves as a nozzle protruding means. Of course, instead of the cylinder 13, the lever 7 may be pressed by another means such as a cam means to lower the nozzle 4.

In FIG. 4, 25 is the recognition stage 5 described above.
A camera provided at 0 and a ring-shaped light source 26.
When the transfer head 1 moves above the camera 25, illumination light is emitted from the light source 26 toward the light diffusion plate 14,
The black silhouette of the chip P is clearly observed in a bright background with the light diffusion plate 14 as a back screen.

FIG. 5 shows the nozzle housing stage 51. Reference numeral 55 is a cylinder as a nozzle accommodating means, and when the rod 55a thereof rises, the nozzle 4a, which has finished mounting the chip P on the substrate 37, is pushed inward of the transfer head 1, and the hook 7a is engaged. By engaging with No. 8, the nozzle 4a is stored.

3 and 4 show the arrangement structure of the light diffusing plate 14. The light diffusion plate 14 is, for example, a milky white acrylic plate formed in a scoop shape. Light diffusion plate 1
A slit 14 a that fits into the nozzle 4 is formed on the outer edge of the nozzle 4. Reference numeral 40 denotes a cylinder serving as a loading / unloading driving unit that rotates the light diffusing plate 14 to move the light diffusing plate 14 in and out behind the chip P sucked by the nozzle 4a. Normally, as shown by the solid line in FIG. 3, the light diffusion plate 14 retreats to the side,
When the transfer head 1 reaches above the camera 1 and stops,
The cylinder 40 is driven to rotate the light diffusion plate 14 in the clockwise direction to the position indicated by the chain line so that the light diffusion plate 14 enters behind the chip P. In this state, the slit 14a is the nozzle 4a that adsorbs the chip P.
Other unused nozzles 4b to
4d is hidden from the field of view of the camera 25, and the other nozzles 4b-4
Make sure that d does not hinder the observation of the chip P.

This apparatus has the above-mentioned structure, and its operation will be described below. In FIG. 1, the transfer head 1 that picks up the chip P at the pickup position a moves to the recognition stage 50. Then, the cylinder 40 drives,
As described with reference to FIG. 3, the light diffusing plate 14 rotates to the position indicated by the chain line in the figure to hide the other nozzles 4b to 4d.
Therefore, the other nozzles 4b to 4d do not hinder the observation by the camera 25, and only the chip P is clearly observed in black in the bright background, as shown in FIG. By observing, the positional deviation can be accurately detected. Q is an inspection frame of the camera 25.

When the observation is completed, the cylinder 40 is driven as shown in FIG. 3 to return the light diffusing plate 14 to the original position shown by the solid line in FIG. Next, while the transfer head 1 is moving on the XY table 36, the motor M is driven to rotate the nozzle 4a about the rotation shaft 3 to correct the positional deviation of the chip P in the θ direction. The positional deviation of the chip P in the XY directions is corrected by driving the XY table 36 and moving the substrate 37 in the XY directions.

In FIG. 1, when the transfer head 1 reaches the XY table 36, the transfer head 1 moves up and down and the chip P is bonded to the substrate 37. Next, the transfer head 1 moves to the nozzle storage stage 51. Here, as shown in FIG. 5, the rod 55 a of the cylinder 55 projects and the nozzle 4 a is housed in the transfer head 1. Next, the transfer head 1 moves to the nozzle selection stage 52. Here, the nozzle 4 is driven by driving the motor M.
a to 4d rotate about the rotary shaft 3 and are suitable for the chip P to be picked up next (for example, the nozzle 4).
b) is selected.

Next, the transfer head 1 moves to the nozzle projecting stage 53. Here, the nozzle 4b descends as the rod 13a of the cylinder 13 projects. Next, the transfer head 1 moves to the pickup position a, and picks up the chip P by sucking the chip P by the selected nozzle 4b. By repeating the above operation, the chips P of the feeder 34 are sequentially bonded to the substrate 37.

The present invention is not limited to the above embodiment. For example, in addition to the rotary head type electronic component mounting apparatus as in the embodiment, the transfer head is reciprocated in the XY directions from the supply unit to the substrate. The present invention can also be applied to an electronic component mounting device of a type in which a chip is bonded to a substrate.

[0022]

As described above, according to the present invention, the recognition stage by the camera is provided with the light diffusing plate which is driven by the loading / unloading driving means and is loaded / unloaded behind the electronic component sucked by the nozzle. The light diffusing plate hides the other nozzles in the raised position from the field of view of the camera, eliminating the adverse effects of the other nozzles that are not picking up the electronic components and allowing clear observation of large electronic components. ..

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a sectional view of a transfer head in a nozzle projecting stage according to the present invention.

FIG. 3 is an explanatory diagram during observation of the electronic component according to the present invention.

FIG. 4 is a side view during observation of an electronic component by the camera according to the present invention.

FIG. 5 is a cross-sectional view of a main part of a nozzle storage stage according to the present invention.

FIG. 6 is an observation view of an electronic component according to the present invention.

FIG. 7 is a front view of an electronic component according to a conventional means during observation.

FIG. 8 is an observation view of an electronic component according to a conventional means.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer head 4 Nozzle 13 Nozzle protrusion means 14 Light diffusion plate 25 Camera 26 Light source 31 Supply part 36 XY table 37 Substrate 40 Loading / unloading drive means 50 Recognition stage P Electronic component

Claims (1)

[Claims] 1. An XY table for moving a substrate in XY directions, an electronic component supply unit, and a plurality of nozzles, and the electronic components of the supply unit are picked up and transferred to a substrate on the XY table. A transfer head, a nozzle projecting means for projecting a nozzle selected from the plurality of nozzles downward, and an electronic component adsorbed by the nozzle projecting downward in the moving path of the transfer head. In an electronic component mounting apparatus equipped with a camera and a light source for observing from below, a recognition stage by the camera is provided with a light diffusion plate driven by a loading / unloading driving means and loaded / unloaded behind the electronic component adsorbed by the nozzle. An electronic component mounting apparatus, characterized in that this light diffusing plate is used to hide other nozzles in a raised position from the field of view of the camera.