JPH05235261A - Surface-mounting type hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To allow mounting with good positional accuracy and low-priced manufacture also in aspect of the cost at the time of mounting a hybrid integrated circuit device on a printed wiring board in the surface mounting type hybrid integrated circuit device. CONSTITUTION:This surface-mounting type hybrid integrated circuit device has a structural body 14 having a flat surface allowing surface mounting so as to make it possible to adsorb by means of an adsorbing nozzle of a loading machine at the time of automatic surface mounting of this hybrid integrated circuit device on a printed wiring board together with mounting a minimold transistor 12 and a laminated ceramic chip capacitor 13 on a hybrid integrated circuit board 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device having electronic components mounted thereon, and more particularly to a surface mount type hybrid integrated circuit device.

[0002]

2. Description of the Related Art In recent years, as surface mounting of electronic parts has progressed, there has been an increasing demand for surface mounting compatible hybrid integrated circuit devices, and various surface mounting type hybrid integrated circuit devices have been developed.

For example, as an example of a conventional structure, as shown in FIG. 4, electronic components such as a multilayer ceramic chip capacitor 13 and a mini mold transistor 12 are mounted on a thick film ceramic circuit board 11, and lead terminals 15 are formed as described above. There is a structure in which the case 16 is entirely attached to the thick film ceramic circuit board 11 so that it can be adsorbed by an adsorption nozzle when it is mounted on a printed circuit board of an apparatus, and a resin 17 is filled in the case.

Further, as shown in FIG. 5, a mini-mold transistor 12 and a laminated ceramic chip capacitor 13 are mounted on a thick film ceramic circuit board 11, and lead terminals 15 are attached to the board 11, and then a printed wiring board of the device is mounted. Thick film ceramic circuit board 1 so that the surface can be adsorbed by the nozzle in the same way as other surface mounting parts when mounted on
There is a structure in which a resin frame 18 is attached to the resin 1, the resin 17 is injected into the resin frame 18, and the upper surface is flattened.

[0005]

However, in the hybrid integrated circuit device having the above structure, for example, in the case of a case structure, when the device is mounted on a printed circuit board, a space is provided between the case and the internal wiring board. , When you put the board in the case, there is some margin, so that part becomes loose,
The relative positional accuracy of the case and the board deteriorates, and when automatically mounting according to the outer shape of the case, there is a problem that the position is likely to be displaced, and the method of covering the case and injecting the resin is also costly. It was by no means an advantage.

The resin frame structure shown in FIG. 5 has a problem that when the nozzle is sucked onto the printed circuit board for automatic mounting, the flatness is poor due to dents and undulations on the resin surface, and a suction error easily occurs. .. Also in this case, since it includes a step of adsorbing the resin frame on the substrate, it cannot be said that it is advantageous in terms of cost.

An object of the present invention is to provide a surface-mounting type hybrid integrated circuit device which solves the mountability on a printed board and the cost.

[0008]

In order to achieve the above object, a surface mount type hybrid integrated circuit device according to the present invention is a surface mount type hybrid integrated circuit device in which electronic parts are mounted on a wiring board. , Having a mounting part having a flat upper surface.

Further, the mounted parts having the flat upper surface are
A structure that can be surface-mounted on the wiring board of the surface-mount type hybrid integrated circuit device.

The structure that can be surface-mounted on the wiring board is an electronic component.

The structure that can be surface-mounted on the wiring board is configured to cover electronic components and the like.

[0012]

The mounting part is provided at the center of the wiring board, and the top surface of the mounting part is flat.

[0013]

The present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing a surface mount type hybrid integrated circuit device according to Embodiment 1 of the present invention.

Referring to FIG. 1, in manufacturing the surface mount type hybrid integrated circuit device according to this embodiment, first, a high melting point solder cream (Su 96.5%, Su 96.5%, Ag 3.5%)
Is supplied by screen printing, the mini-mold transistor 12 and the multilayer ceramic chip capacitor 13 are mounted, and fusion bonding is performed by the reflow method.

Next, similarly, a high melting point solder cream is supplied to the component mounting land on the front surface, and the mini mold transistor 12 and the multilayer ceramic chip capacitor 13 are mounted by the automatic mounting machine in the same manner as on the back surface.

At the same time, the cylindrical structure 14 of Al having a flat upper surface of 7 mmφ and a height of 1.5 mm, which is a feature of the present invention, is adsorbed by an adsorption nozzle of a mounting machine, and the substrate 11 is adsorbed. It is automatically mounted in the central part of and soldered by the reflow method.

After that, in order to enable surface mounting, the lead terminals 15 are attached to the substrate 11 by the solder dipping method and lead molding is performed.

(Second Embodiment) FIG. 2 is a sectional view showing a second embodiment of the present invention.

In FIG. 2, the thick film ceramic circuit board 1
A mini mold transistor 12 and a monolithic ceramic chip capacitor 13 are mounted on the front surface and the back surface of 1 and solder-bonded.

Further, a 64-pin QFP type IC 19, which is a feature of the present invention, is mounted on the central portion of the surface of the substrate 11. Here, the QFP type IC 19 has a flat upper surface and can be sucked by a suction nozzle of a mounting machine.

(Embodiment 3) FIG. 3 is a sectional view showing Embodiment 3 of the present invention.

In FIG. 3, the thick film ceramic circuit board 1
A mini-molded transistor 12 and a monolithic ceramic chip capacitor 13 are mounted on the device 1. Further, the substrate 11
The structure 20, which is a feature of the present invention, is mounted in the central portion of the.
The structure 20 has a flat upper surface and a size of 2
It is 0 mm □, the height is 2 mm, and the supporting column is 4 mmφ
The material is made of metal such as iron, and the mini-mold transistor 12 and the monolithic ceramic chip capacitor 13 are attached with the upper surface portion thereof.

In the above three embodiments, the mounting parts (the cylindrical structures 14 and Q of Al, which are the features of the present invention, are provided in the central portion of the substrate.
FP type IC19, metal structure 20, etc.
This is because if the hybrid integrated circuit device of the present invention is actually mounted on a printed circuit board by sucking the upper surface of the mounting component with a suction nozzle of a mounting machine, the position is within a range where the balance of the hybrid integrated circuit device is not lost. For example, the range may be slightly off the center.

Further, although the hybrid integrated circuit device is not particularly packaged in the above-mentioned three embodiments, resin packaging may be carried out as long as the flatness of the central portion of the substrate, which is a feature of the present invention, can be maintained.

[0026]

As described above, since the surface-mounting type hybrid integrated circuit device according to the present invention has the surface mountable mounting component having a flat upper surface on the surface thereof, the hybrid integration of the present invention on the printed circuit board. When mounting the circuit device, not only can it be mounted at the same time with the suction nozzle as with other electronic components,
Unlike the case structure, there is no difference in the positional accuracy between the case and the internal board, so the mounting accuracy is improved, the misalignment is reduced, and the surface flatness is superior to that of the resin frame structure. Therefore, there is no adsorption error. Furthermore, according to the fourth aspect, since the electronic component is covered by the mounted component, the shield effect can be obtained.

Further, according to the present invention, when using and manufacturing the hybrid integrated circuit device of the present invention,
Significant effects can be obtained in terms of cost and characteristics. For example,
Comparing the manufacturing cost with the conventional case type, the processing cost is reduced by 5-10%.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing a third embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a conventional example.

FIG. 5 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 11 Thick Film Ceramic Circuit Board 12 Mini Molded Transistor 13 Multilayer Ceramic Chip Capacitor 14 Al Cylindrical Structure 15 Lead Terminal 19 QFP Type IC 20 Metal Structure

Claims (4)

[Claims] 1. A surface-mount type hybrid integrated circuit device in which electronic components are mounted on a wiring board, wherein the wiring board has a mounting component having a flat upper surface. 2. The mounting component having a flat upper surface is a structure that can be surface-mounted on a wiring board of the surface-mounting hybrid integrated circuit device.
The surface-mounted hybrid integrated circuit device according to 1. 3. The surface mount type hybrid integrated circuit device according to claim 2, wherein the surface mountable structure on the wiring board is an electronic component. 4. The surface mount type hybrid integrated structure according to claim 2, wherein the structure body which can be surface mounted on the wiring board is configured to cover an electronic component or the like. Circuit device.