JPH05231833A - Image pick-up device of chip mounter - Google Patents

Abstract

PURPOSE:To improve working efficiency by reducing time required for mounting a work in a chip mounter drastically. CONSTITUTION:A camera 6 for picking up image and a reflection mirror 7 which consists of a fixing mirror 8 and a movable mirror 9 are provided at a head 3 for mounting a work of a chip mounter. The movable mirror 9 is positioned at a lower part of the head 3 and is retracted outside a traveling path of the head 3 when sucking and mounting a work W.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique effective when applied to an image pickup device of a chip mounter.

[0002]

2. Description of the Related Art Generally, in an electronic component such as a semiconductor integrated circuit device, that is, in a chip mounter for mounting a work on a printed wiring board or the like, a work is imaged by a camera in order to automatically and accurately pick up and mount the work. ,
The position and shape of the work are recognized.

In this case, in the conventional chip mounter, in order to recognize the position and shape of the work piece attracted to the head,
After the head is moved and stopped on a position-fixed camera and an image is picked up by the camera, the head is moved to the mounting position.

[0004]

Therefore, in the above-mentioned prior art, it is impossible to adsorb a work by the head and directly move the head directly to the mounting position.

Therefore, the moving distance of the head is increased,
Moreover, since the head stops on the camera, there is a problem that the time required for mounting the work is significantly increased as compared with the case where the image processing is not performed.

An object of the present invention is to significantly reduce the time required for mounting a work by the head and improve work efficiency.

Another object of the present invention is to provide an image pickup device of a chip mounter which has a simple structure but has a high work efficiency.

Still another object of the present invention is to provide an image pickup device of a chip mounter which is low in cost.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, an image pickup apparatus for a chip mounter according to the present invention comprises a head for mounting a work on the chip mounter, which is provided with an image pickup camera and a reflection mirror, and the reflection mirror is movable below the head. The movable mirror has a mirror, which is positioned below the head during image pickup, and is retracted out of the moving path of the head during suction and mounting of a workpiece.

[0012]

According to the above-described image pickup device of the chip mounter of the present invention, since the movable mirror of the reflecting mirror is retracted from the moving path of the head when the work is attracted and mounted, the head needs to detour and stop when moving. In addition, the camera can perform imaging while the head is moving from the suction position to the mounting position, which can shorten the working time and improve the working efficiency.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partially cutaway partial sectional view of an embodiment of an image pickup device of a chip mounter according to the present invention, FIG. 2 is a partial side view of a reflecting mirror and a camera, and FIG. 3 shows a retracted state of a movable mirror. FIG. 4 is a partial plan view, and FIG. 4 is an explanatory view of the swinging portion of the movable mirror.

In the present embodiment, the entire head assembly 1 of the chip mounter is movable on a carriage (not shown).

Inside the frame 2 of the head assembly 1, a head 3 for adsorbing and mounting the work W is vertically arranged. Usually, a pair of heads 3 are provided.

The head 3 has a suction bit 4 projecting downward from the center thereof, and the suction bit 4 sucks a work W such as a semiconductor integrated circuit device by a vacuum suction force. The head 3 is vertically movable by an air cylinder 5 in this example.

On the other hand, a pair of cameras 6 for picking up an image of the work W are installed on the side of the head 3 in the frame 2 of the head assembly 1 facing downward.

A reflecting mirror 7 for picking up an image of the position and shape of the work W sucked by the suction bit 4 of the head 3 is arranged in the image pickup optical path of the camera 6.

The reflecting mirror 7 of this embodiment is fixed below the camera 6 and is fixedly fixed to the fixed mirror 8. The reflecting mirror 7 is positioned below the head 3 at the time of image pickup, but when the head 3 moves or the work is adsorbed. At the time of mounting and mounting, the movable mirror 9 is retracted out of the moving path of the head 3.

In the reflection mirror 7, the image of the work W is first reflected by the movable mirror 9 in the direction of the fixed mirror 8 and then reflected again by the fixed mirror 8 to enter the camera 6 for imaging. Done.

The swing structure of the movable mirror 9 is shown in FIGS.
FIG. 4 will be described.

A pair of air cylinders 10 are used as the drive source of the swing structure of this embodiment. Each of the air cylinders 10 is adapted to horizontally cam the cam 12 by the tip of the piston rod 11.

The cam 12 is connected to the upper end of a swing shaft 13, and a mirror holder 14 is horizontally attached to the lower end of the swing shaft 13.

On the outer end side of the mirror holder 14, the movable mirror 9 is held at an angle of about 45 degrees with respect to the horizontal direction.

The movable mirror 9 swings in the horizontal direction as shown in FIG. 3 according to the protrusion and retreat of the piston rod 11 of the air cylinder 10.

Next, the operation of this embodiment will be described.

First, the suction bit 4 of the head 3 is moved to the work W.
The case where the position and the shape of the work W are picked up by the camera 6 after adsorbing the work W will be described.
As shown in FIG. 3, the light is reflected by the movable mirror 9 and is incident on the fixed mirror 8, and is further reflected by the fixed mirror 8 and is incident on the camera 6.

As a result, the position and shape of the work W can be picked up by the camera 6.

The image pickup by the camera 6 in this embodiment is executed while the head 3 is moving from the workpiece suction position to the mounting position.

On the other hand, when the work is picked up by the head 3 and mounted, the air cylinder 10 is operated and the piston rod 11 is shown on the other side of FIG.
When retracted as described above, the movable mirror 9 swings from the outer position to the inner position.

As a result, the movable mirror 9 is retracted from the movement path of the head 3 and does not interfere with the movement of the head 3.

Therefore, in the present embodiment, the camera 6 can execute the image pickup of the work W while the head 3 is moving directly from the work suction position to the work mounting position on the printed wiring board (not shown) or the like, and the head Since the movable mirror 9 does not interfere with the movement of the movable mirror 9, it is not necessary to detour or stop the movement of the movable mirror 9, and the required work time can be greatly shortened.

Further, in this embodiment, the image pickup optical path of the camera 6 has a reflecting mirror 7 composed of a fixed mirror 8 and a movable mirror 9.
It is possible to image a plurality of works W with one camera 6 by dividing into a plurality of parts by, and it is possible to improve work efficiency.

The invention made by the present inventor has been specifically described above based on the embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, it is possible to change the arrangement of the reflecting mirror and its movable structure to another structure.

In the above description, the case where the invention made by the present inventor is mainly applied to the image pickup of the semiconductor integrated circuit device, which is the field of use thereof, has been described, but the invention is not limited to this and, for example, another electronic component. It can also be applied to the imaging of.

[0037]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1) According to the imaging device of the chip mounter of the present invention, since the movable mirror of the reflecting mirror is retracted from the moving path of the head when the work is attracted and mounted, the head is detoured and stopped during the movement. Moreover, the camera can perform imaging while the head is moving from the suction position to the mounting position, which can shorten the working time and improve the working efficiency.

(2) The image pickup optical path of the camera is divided into a plurality of parts by the reflecting mirror, and a plurality of works can be picked up by one camera at the same time, so that the working efficiency can be improved.

(3). Due to the above (1) and (2), high working efficiency can be obtained despite the simple structure.

(4). The image pickup device of the chip mounter of the present invention is low in cost.

[Brief description of drawings]

FIG. 1 is a partially cutaway partial sectional view of an embodiment of an image pickup device of a chip mounter according to the present invention.

FIG. 2 is a partial side view of a reflection mirror and a camera.

FIG. 3 is a partial plan view showing a retracted state of a movable mirror.

FIG. 4 is an explanatory diagram of a swinging portion of a movable mirror.

[Explanation of symbols]

 1 Head Assembly 2 Frame 3 Head 4 Adsorption Bit 5 Air Cylinder 6 Camera 7 Reflector Mirror 8 Fixed Mirror 9 Movable Mirror 10 Air Cylinder 11 Piston Rod 12 Cam 13 Swing Axis 14 Mirror Holder W Work

Claims (4)

[Claims] 1. A head for mounting a work on a chip mounter is provided with an imaging camera and a reflection mirror, and the reflection mirror has a movable mirror provided below the head, and the movable mirror comprises: An image pickup apparatus for a chip mounter, which is positioned below the head during image pickup, and is retracted outside a movement path of the head during picking up and mounting a work. 2. The reflection mirror has a fixed mirror that is fixedly positioned below the camera and relays an image reflected from the movable mirror to reflect the image to the camera. The imaging device of the described chip mounter. 3. The imaging device of a chip mounter according to claim 1, wherein the camera performs imaging while the head is moving from the workpiece suction position to the mounting position. 4. The image pickup optical path of the camera is divided into a plurality of parts by the reflection mirror, and one camera can pick up a plurality of workpieces at the same time.
Alternatively, the imaging device of the chip mounter described in 3.