JPH05226395A - Injection of resin - Google Patents

Injection of resin

Info

Publication number
JPH05226395A
JPH05226395A JP10308591A JP10308591A JPH05226395A JP H05226395 A JPH05226395 A JP H05226395A JP 10308591 A JP10308591 A JP 10308591A JP 10308591 A JP10308591 A JP 10308591A JP H05226395 A JPH05226395 A JP H05226395A
Authority
JP
Japan
Prior art keywords
resin
discharge nozzle
molding die
mold
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10308591A
Other languages
Japanese (ja)
Other versions
JP2839744B2 (en
Inventor
Mitsuo Sato
満雄 佐藤
Hajime Shiyaura
肇 社浦
Hitoshi Tateishi
仁 立石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP3103085A priority Critical patent/JP2839744B2/en
Publication of JPH05226395A publication Critical patent/JPH05226395A/en
Application granted granted Critical
Publication of JP2839744B2 publication Critical patent/JP2839744B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a resin from flowing out and remaining outside of a resin injection hole when a resin discharge nozzle is separated from a molding die and to solve problems, which are accompanied by an automation of a manufacturing device, by a method wherein after the injected resin is solidified until a state that it does not flow out outside of the injection hole, the discharge nozzle is separated from the molding die and the like. CONSTITUTION:In a method of injecting a resin, which performs a resin molding on the peripheral edge part of a semiconductor substrate 1 of a semiconductor device, the substrate 1 is housed and pinched between a top force 21 and a bottom force 24 of a molding die and the forces 21 and 24 are closely adhered to each other and are clamped. Then, a resin discharge nozzle 11A is made contact to a resin injection hole 27 provided in the outer peripheral sidewall of the heated molding die and a resin 20 is injected in a cavity 30 wrapping the peripheral edge part of the substrate 1. Then, after the injected resin 2 is solidified until a state that it does not flow out outside of the hole 27, the nozzle 11A is separated from the molding die. For example, the resin 2 in the molding die is successively continued to heat until a state that it is solidified and stabilized and when the resin is brought in a stable state, a mold opening is performed and a molded article is taken out.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体装置の製造方法
に関するもので、特に加熱成形型を使用して、半導体基
板（ウェーハ）の周縁部に、レジン成形を施す半導体装
置のレジン注入方法に係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a resin injection method for a semiconductor device in which a peripheral edge of a semiconductor substrate (wafer) is resin-molded by using a heat molding die. It is related.

【０００２】[0002]

【従来の技術】大電力制御用の半導体装置、例えばＧＴ
Ｏ等の整流素子では、ウェーハ周縁部を保護するため、
該部にレジン成形を施す場合が多い。図５は、ウェーハ
１の周縁部に、レジン２を成形した状態を示す断面図で
ある。同図（ａ）は、ウェーハ側壁がシグマベベル構造
であり、同図（ｂ）は、ウェーハ側壁がテーパ構造を有
するものである。このように周縁部にレジンを成形した
半導体装置では、レジンの外形寸法を、後工程の組立て
位置決めに使用する目的もあり、寸法精度を出すため
に、成形型を用いている。2. Description of the Related Art A semiconductor device for high power control such as GT
With a rectifying element such as O, in order to protect the peripheral portion of the wafer,
In many cases, resin molding is applied to this portion. FIG. 5 is a cross-sectional view showing a state where the resin 2 is molded on the peripheral portion of the wafer 1. In the figure (a), the wafer side wall has a sigma bevel structure, and in the figure (b), the wafer side wall has a taper structure. In the semiconductor device in which the resin is formed on the peripheral edge portion in this manner, the outer shape of the resin is also used for assembling and positioning in a later step, and a molding die is used to obtain dimensional accuracy.

【０００３】次にウェーハ周縁部にレジンを成形する半
導体製造装置（特願平２−１５５７８１号参照）の概要
を、図６を参照して以下説明する。Next, an outline of a semiconductor manufacturing apparatus (see Japanese Patent Application No. 2-155781) for molding a resin on the peripheral portion of a wafer will be described below with reference to FIG.

【０００４】ウェーハ供給ユニット３内のキャリアに載
置された、複数枚のウェーハ１は、移送ユニット４のバ
キュームチャックにより、１枚ずつ取り上げられ、一点
鎖線で示すウェーハ搬送ライン１６に沿って、位置合わ
せユニット８、成形ユニット５に順次送られ、レジン成
形を施された後、ウェーハ収納ユニット１５に納められ
る。位置合わせユニット８においては、位置認識ユニッ
ト９でウェーハ１の中心を求め、ＸＹテーブル７により
中心位置を補正する。すなわちウェーハ１には位置検出
パターンが設けられ、この位置検出パターンを用い、位
置認識ユニット９の中心に合わせる。位置決めされたウ
ェーハ１は、成形ユニット５に送られる。The plurality of wafers 1 placed on the carrier in the wafer supply unit 3 are picked up one by one by the vacuum chuck of the transfer unit 4 and are moved along the wafer transfer line 16 indicated by a chain line. After being sequentially sent to the aligning unit 8 and the molding unit 5 and subjected to resin molding, they are stored in the wafer storage unit 15. In the alignment unit 8, the position recognition unit 9 finds the center of the wafer 1 and the XY table 7 corrects the center position. That is, the wafer 1 is provided with a position detection pattern, and this position detection pattern is used to align with the center of the position recognition unit 9. The positioned wafer 1 is sent to the molding unit 5.

【０００５】図１は、成形ユニット５の概要を示す部分
断面図である。また図２は、レジンの注入状態の概要を
示す注入口近傍の部分断面図である。同図において、上
型２１は、上型ホルダー２０に嵌合し、上型用ヒーター
ブロック１９に固定される。下型２４は、下型ホルダー
２３に嵌合し、下型用ヒーターブロック２２に結合す
る。成形型は、この従来例では、上型ホルダー２０及び
下型ホルダー２３を含む上型２１及び下型２４より構成
される。ウェーハ１は上型２１と下型２４との間に収納
挟持される。成形型には、ウェーハ１の周縁部を包むレ
ジン成形領域（キャビティと呼ぶ）３０が形成される。
成形型の側壁には、レジン注入口２７及びレジン排出口
２８が設けられる。FIG. 1 is a partial sectional view showing an outline of the molding unit 5. Further, FIG. 2 is a partial cross-sectional view in the vicinity of the injection port showing an outline of the injection state of the resin. In the figure, the upper die 21 is fitted into the upper die holder 20 and fixed to the upper die heater block 19. The lower die 24 is fitted into the lower die holder 23 and is joined to the lower die heater block 22. In this conventional example, the molding die is composed of an upper die 21 and a lower die 24 including an upper die holder 20 and a lower die holder 23. The wafer 1 is housed and sandwiched between the upper mold 21 and the lower mold 24. A resin molding region (called a cavity) 30 that encloses the peripheral portion of the wafer 1 is formed in the molding die.
A resin injection port 27 and a resin discharge port 28 are provided on the side wall of the mold.

【０００６】以下、図１、図２及び図６を参照して、レ
ジン注入手順の概要を説明する。移送ユニット４のバキ
ュームチャックに保持されたウェーハ１は、図１に示す
ように、成形型の下型２４上にこれとほぼ同心に載置さ
れ、真空吸着機構２９により、下型２４に吸着される。
次に待機位置にある上型２１等（２点鎖線で図示）を型
締めストロークだけ下降し型締めを行なう。An outline of the resin injection procedure will be described below with reference to FIGS. 1, 2 and 6. As shown in FIG. 1, the wafer 1 held by the vacuum chuck of the transfer unit 4 is placed on the lower mold 24 of the mold substantially concentrically with the lower mold 24, and is attracted to the lower mold 24 by the vacuum suction mechanism 29. It
Next, the upper mold 21 and the like (illustrated by a chain double-dashed line) at the standby position are lowered by the mold clamping stroke to perform the mold clamping.

【０００７】次に、図６に示すレジン供給ユニット１０
に設けられたレジン吐出ノズル１１Ａが、ユニット１０
の動作により、図１または図２に示すように、成形型側
壁のレジン注入口２７に当接するとともに、レジン排出
ユニット１２に設けられたレジン排出ノズル１３が、ユ
ニット１２の動作により、側壁のレジン排出口２８に当
接する。Next, the resin supply unit 10 shown in FIG.
The resin discharge nozzle 11A provided in
1 or 2, the resin discharge nozzle 13 provided in the resin discharge unit 12 is brought into contact with the resin injection port 27 on the side wall of the mold, and the operation of the unit 12 causes the resin discharge nozzle 13 of the side wall to move. It contacts the discharge port 28.

【０００８】レジン供給ユニット１０から供給されるレ
ジンは、レジン吐出ノズル１１Ａからウェーハ周縁部を
包むキャビティ３０に注入され、また余剰のレジンは、
レジン排出ノズル１３を介してレジン排出ユニット１２
に排出される。The resin supplied from the resin supply unit 10 is injected from the resin discharge nozzle 11A into the cavity 30 surrounding the peripheral edge of the wafer, and the excess resin is
The resin discharge unit 12 through the resin discharge nozzle 13
Is discharged to.

【０００９】注入されたレジン（例えばシリコーン等の
熱硬化性樹脂）は、一定温度に管理されている成形型に
より固化され、ウェーハ１の周縁部にレジン２がリング
状に成形される。次に上型２１を待機位置まで上昇し、
レジン成形を施されたウェーハ１は、下型２４より取り
出される。この際、注入口２７を埋める注入口レジン２
７ａ及び排出口レジンがリング状レジン２から突出して
形成されているが、成形品を取り出すとき、レジン２と
ともにこれら突出するレジンが排出されるのが理想であ
る。The injected resin (for example, thermosetting resin such as silicone) is solidified by a mold controlled at a constant temperature, and the resin 2 is formed in a ring shape on the peripheral portion of the wafer 1. Next, raise the upper mold 21 to the standby position,
The resin-molded wafer 1 is taken out from the lower mold 24. At this time, the injection port resin 2 filling the injection port 27
7a and the discharge port resin are formed so as to project from the ring-shaped resin 2, but it is ideal that these projecting resins are discharged together with the resin 2 when the molded product is taken out.

【００１０】図７は成形を終了し、成形品を取り出した
後、直ちに吐出ノズル１１Ａを成形型より離脱したとき
の下型２４及び下型ホルダー２３の断面図である。同図
では、注入口レジン２７ａが外に垂れ下がって残留して
いるのがわかる。この原因は、図２において、吐出ノズ
ル１１Ａからレジンの吐出が終了し、レジン供給ユニッ
トの動作により、吐出ノズル１１Ａが下型ホルダー２３
のレジン注入口２７から離れる際に、まだレジン２及び
注入口レジン２７ａは、流動できる状態にあるため、外
部に漏れ出してしまうことによる。従来上記成形工程は
主として手動で行なわれていたので、レジンの吐出が終
わると直ちに、吐出ノズル１１Ａは成形型より離脱して
いた。レジン注入口にレジンが垂れ下がって残留して
も、手動のため簡単に払拭できるので特に問題にはなら
なかった。FIG. 7 is a sectional view of the lower mold 24 and the lower mold holder 23 when the discharge nozzle 11A is immediately removed from the mold after the molding is completed and the molded product is taken out. In the figure, it can be seen that the injection port resin 27a hangs outside and remains. The reason for this is that in FIG. 2, the discharge of the resin from the discharge nozzle 11A is completed, and the discharge nozzle 11A is moved to the lower die holder 23 by the operation of the resin supply unit.
This is because the resin 2 and the injection port resin 27a are still in a state of being able to flow when the resin 2 and the injection port resin 27a are separated from the resin injection port 27. Conventionally, the above-mentioned molding process is mainly performed manually, so that the discharge nozzle 11A is separated from the mold immediately after the discharge of the resin is completed. Even if the resin hangs down and remains at the resin injection port, it can be easily wiped off by the manual operation, so there is no particular problem.

【００１１】[0011]

【発明が解決しようとする課題】半導体基板の周縁部の
保護のため、レジンを周縁部に成形する半導体装置の需
要は増加し、上記成形工程の自動化は重要な課題であ
る。図６に示す自動成形装置においては、図７で説明し
たように、成形品を取り出した後、レジンが成形型のレ
ジン注入口２７及びその外側に付着残留することは、大
きな問題点となる。There is an increasing demand for a semiconductor device in which a resin is molded on the peripheral portion of the semiconductor substrate to protect the peripheral portion of the semiconductor substrate, and automation of the molding process is an important issue. In the automatic molding apparatus shown in FIG. 6, after the molded product is taken out, the resin remains attached to and remains on the resin injection port 27 of the molding die and the outside thereof, as described with reference to FIG.

【００１２】即ち図７を参照して、次のサイクルでレジ
ンを注入する場合を考えてみると、レジン吐出ノズル１
１Ａを成形型のレジン注入口２７に当接するとき、吐出
ノズル１１Ａの先端テーパー部と下型ホルダー２３のレ
ジン注入口２７のテーパー部とに隙間を生ずることにな
り、この隙間よりレジンが外部に流出して、成形に必要
なレジンの量や、レジンの注入速度等のプロセス条件を
満たせなくなる。That is, referring to FIG. 7, considering the case of injecting resin in the next cycle, the resin discharge nozzle 1
When 1A is brought into contact with the resin injection port 27 of the molding die, a gap is created between the taper portion of the tip of the discharge nozzle 11A and the taper portion of the resin injection port 27 of the lower die holder 23. It will flow out and the process conditions such as the amount of resin necessary for molding and the injection speed of the resin cannot be satisfied.

【００１３】結果として、成形品は不良となり、歩留ま
りを低下させてしまう。またレジンの材料効率の低下と
なる。さらには、流出したレジンが型面を汚し、払拭す
るために余分の時間が必要で、自動化装置の稼働率を低
下する。As a result, the molded product becomes defective and the yield is reduced. Further, the material efficiency of the resin is reduced. Furthermore, the resin that has flowed out stains the mold surface, and extra time is required to wipe it off, which lowers the operating rate of the automation device.

【００１４】本発明は、上記課題に鑑みてなされたもの
で、半導体装置の製造過程で、ウェーハの周縁部にレジ
ンを成形する場合のレジン注入方法において、成形型に
レジンを注入した後、レジン吐出ノズルを離脱する際、
レジン注入口の外にレジンが流出残留するのを防止する
ことにより、製造装置の自動化に伴う課題を解決すると
ともに、歩留まり、信頼性、材料効率及び稼働率の向上
が得られる半導体装置のレジン注入方法を提供すること
である。The present invention has been made in view of the above problems, and in a resin injection method for molding a resin on a peripheral portion of a wafer in a process of manufacturing a semiconductor device, after the resin is injected into a molding die, the resin is injected. When leaving the discharge nozzle,
By preventing resin from flowing out and remaining outside the resin injection port, the problems associated with automation of manufacturing equipment can be solved, and resin injection into semiconductor devices that can improve yield, reliability, material efficiency, and operating rate can be achieved. It is to provide a method.

【００１５】[0015]

【課題を解決するための手段とその作用】請求項１に係
る本発明は、半導体基板の周縁部に，レジン成形を施す
半導体装置のレジン注入方法において、 成形型の上型
と下型との間に半導体基板を収納挟持し、上型と下型と
を密着して型締めする工程と、 加熱した前記成形型の
外周側壁に設けたレジン注入口に、レジン吐出ノズルを
当接し、レジンを前記半導体基板の周縁部を包むキャビ
ティに注入する工程と、 注入されたレジンが注入口の
外に流れ出ない状態まで固化した後、吐出ノズルを成形
型より離す工程とを、具備することを特徴とする半導体
装置のレジン注入方法である。SUMMARY OF THE INVENTION The present invention according to claim 1 is a resin injection method for a semiconductor device in which resin molding is performed on a peripheral portion of a semiconductor substrate. A semiconductor substrate is housed and sandwiched between the molds, and the upper mold and the lower mold are closely adhered to each other and the mold is clamped, and a resin discharge nozzle is brought into contact with a resin injection port provided on the outer peripheral side wall of the heated mold so as to remove the resin A step of injecting the resin into a cavity that surrounds the peripheral edge of the semiconductor substrate; and a step of separating the ejection nozzle from the molding die after the resin is solidified until it does not flow out of the injection port. A method of injecting resin into a semiconductor device.

【００１６】すなわちレジン吐出ノズルから加熱された
成形型に、必要量のレジンを注入した後、吐出ノズルは
そのままレジン注入口に当接し、レジンが外に流れ出さ
ないようにしておく。熱によりレジンの固化が進行し、
流出しない固化状態になってはじめて吐出ノズルを注入
口より離脱する。このため従来技術のように注入口及び
その外側にレジンが流出して残ることはなく、注入口及
びその外側は常に清浄に保たれる。That is, after a required amount of resin has been injected into the heated mold from the resin discharge nozzle, the discharge nozzle is kept in contact with the resin injection port so that the resin does not flow out. The heat causes the resin to solidify,
The discharge nozzle is separated from the injection port only when it is in a solidified state where it does not flow out. Therefore, unlike the prior art, the resin does not flow out and remain at the inlet and the outside thereof, and the inlet and the outside thereof are always kept clean.

【００１７】請求項２に係るレジン注入方法は、請求項
１に係るレジン注入方法において、吐出ノズルに冷却手
段を付加し、吐出ノズル内の液状レジンの温度を調整し
て、固化速度を制御し、成形型内のレジンを外に流れ出
さない固化状態にしたとき、吐出ノズル内のレジンの固
化を防止する。これにより、発明の効果をより確実にす
ることができる。A resin injecting method according to a second aspect is the resin injecting method according to the first aspect, wherein cooling means is added to the discharge nozzle and the temperature of the liquid resin in the discharge nozzle is adjusted to control the solidification rate. The resin in the discharge nozzle is prevented from solidifying when the resin in the molding die is in a solidified state that does not flow out. Thereby, the effect of the invention can be made more reliable.

【００１８】[0018]

【実施例】本発明の請求項１に係る実施例について、図
１、図２及び図３を参照して以下説明する。図３は、本
発明のレジン注入方法の実施例のタイミングチャート
で、横軸は時間、縦軸は各プロセスの進行状況を、模式
的に示すものである。ウェーハハンドリング４ａにおい
ては、ウェーハ１を成形ユニット５に供給し、下型２４
内にウェーハを載置保持した後、次の型動作５ａにおい
て、上型２１を型締めストロークだけ降下させ、型締め
する。次に吐出ノズル動作１０ａにおいて、型より離れ
て待機位置にあったレジン吐出ノズル１１Ａを移動さ
せ、型の外周側壁のレジン注入口２７に当接させる。次
にレジン吐出１１ａにおいて、型に吐出ノズル１１Ａを
当接した状態で、レジン２をウェーハ１の周縁部を包む
キャビティ３０に吐出させる。レジンの状態２ａにて、
キャビティ３０に注入されたレジンは、加熱された型の
温度により、液状から固化が進行する。レジンが注入口
２７から外部に流れ出ない固化状態になったら（時刻ｔ
1 ）、吐出ノズル動作１０ａにて、レジン吐出ノズル１
１Ａは、型から離脱させ、前記の待機位置まで戻す。型
内のレジンは引き続き固化安定状態まで（時刻ｔ2 ）加
熱を続ける。安定状態になったら、型開きし、成形品を
取り出す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to claim 1 of the present invention will be described below with reference to FIGS. 1, 2 and 3. FIG. 3 is a timing chart of an embodiment of the resin injection method of the present invention, in which the horizontal axis shows time and the vertical axis schematically shows the progress of each process. In the wafer handling 4a, the wafer 1 is supplied to the molding unit 5 and the lower mold 24
After the wafer is placed and held therein, in the next mold operation 5a, the upper mold 21 is lowered by the mold clamping stroke to clamp the mold. Next, in the discharge nozzle operation 10a, the resin discharge nozzle 11A that has been at the standby position apart from the mold is moved to be brought into contact with the resin injection port 27 on the outer peripheral side wall of the mold. Next, in the resin discharge 11a, the resin 2 is discharged into the cavity 30 enclosing the peripheral portion of the wafer 1 with the discharge nozzle 11A being in contact with the mold. In resin state 2a,
The resin injected into the cavity 30 is solidified from a liquid state depending on the temperature of the heated mold. When the resin enters a solidified state in which it does not flow out from the inlet 27 (time t
1 ), in the discharge nozzle operation 10a, the resin discharge nozzle 1
1A is released from the mold and returned to the standby position. The resin in the mold is continuously heated until the solidified stable state (time t 2 ). When stable, open the mold and take out the molded product.

【００１９】このようなレジン注入法によれば、レジン
吐出ノズル１１Ａは、レジンが外に流れない固化状態で
型から離脱するので、レジン注入口２７の外にレジンが
流れて付着することはなく、またレジンが安定した固化
状態になってから、成形品を取り出すので、注入口レジ
ン２７ａは、成形品とともに取り出される。したがっ
て、レジンを注入し、成形品を取り出した後において、
レジ注入口及びその外側に、レジンが付着残留すること
はなく、常に清浄な状態を維持できる。これにより繰り
返しレジン成形を実施でき、自動化成形装置に伴う課題
を解決することができた。According to such a resin injection method, since the resin discharge nozzle 11A is released from the mold in a solidified state in which the resin does not flow outside, the resin does not flow and adhere to the outside of the resin injection port 27. Also, since the molded product is taken out after the resin is in a stable solidified state, the injection port resin 27a is taken out together with the molded product. Therefore, after injecting the resin and taking out the molded product,
The resin does not adhere and remain on the cash register injection port and the outside thereof, and a clean state can be always maintained. As a result, the resin molding can be repeatedly carried out, and the problems associated with the automated molding apparatus can be solved.

【００２０】本発明の請求項２に係るレジン注入法の実
施例について図４を参照して説明する。この注入方法で
は、レジン吐出ノズル１１Ｂに冷却手段が付加されてい
る。冷却手段は、レジン吐出ノズルの外周面を取り囲む
円筒体を設け、すなわち二重円筒構造とし、外筒に供給
口３１及び排出口３２を設け、外筒内に温調した水また
は空気等を流し、吐出ノズル内の液状レジンの温度を調
整して、レジンの固化を防止する。レジン吐出ノズル１
１Ｂでは、ノズルの先端部が、図４に示すように、注入
口２７内に導入されている。この場合、ノズルの先端部
は、加熱された成形型の温度の影響を受けて、ノズル内
部のレジンは、型内のレジンよりも遅い速度ではあるが
固化が進行する。このため冷却手段によりノズル内部の
レジンを冷却することにより固化を防止できる。このノ
ズルは必要に応じ注入レジンの温度調整のための制御に
も利用できる。また図２に示すレジン吐出ノズル１１Ａ
に、上記と同様の冷却手段を付加してももちろん差し支
えない。An embodiment of the resin injection method according to the second aspect of the present invention will be described with reference to FIG. In this injection method, cooling means is added to the resin discharge nozzle 11B. The cooling means is provided with a cylindrical body that surrounds the outer peripheral surface of the resin discharge nozzle, that is, has a double cylindrical structure, the outer cylinder is provided with the supply port 31 and the discharge port 32, and the temperature-controlled water or air is flown into the outer cylinder. The temperature of the liquid resin in the discharge nozzle is adjusted to prevent the resin from solidifying. Resin discharge nozzle 1
In 1B, the tip of the nozzle is introduced into the inlet 27, as shown in FIG. In this case, the tip of the nozzle is affected by the temperature of the heated mold, and the resin inside the nozzle progresses to solidify at a slower speed than the resin inside the mold. Therefore, solidification can be prevented by cooling the resin inside the nozzle with the cooling means. This nozzle can also be used for control for adjusting the temperature of the injection resin, if necessary. Further, the resin discharge nozzle 11A shown in FIG.
Of course, it does not matter if a cooling means similar to the above is added.

【００２１】[0021]

【発明の効果】本発明により、成形型にレジンを注入し
た後、レジン吐出ノズルを注入口より離脱する際、注入
口の外にレジンが流出残留するのを防止することができ
た。これにより、製造装置の自動化に伴なう課題を解決
するとともに、歩留まり、信頼性、材料効率および稼働
率の向上が得られた。According to the present invention, it is possible to prevent the resin from flowing out and remaining outside the injection port when the resin discharge nozzle is removed from the injection port after the resin is injected into the mold. As a result, the problems associated with the automation of manufacturing equipment were solved, and the yield, reliability, material efficiency, and availability were improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明及び従来技術の実施に使用される成形ユ
ニットの構造の概要を示す部分断面図である。FIG. 1 is a partial cross-sectional view showing the outline of the structure of a molding unit used for carrying out the present invention and the prior art.

【図２】レジンの吐出状態の概要を示す部分断面図であ
る。FIG. 2 is a partial cross-sectional view showing an outline of a resin discharge state.

【図３】本発明のレジン注入法のタイミングチャートの
一例である。FIG. 3 is an example of a timing chart of the resin injection method of the present invention.

【図４】本発明の請求項２に係るレジン吐出ノズルの構
造を含む吐出状態の概要を示す部分断面図である。FIG. 4 is a partial cross-sectional view showing an outline of a discharge state including a structure of a resin discharge nozzle according to claim 2 of the present invention.

【図５】周縁部にレジン成形した半導体基板の断面図で
ある。FIG. 5 is a cross-sectional view of a semiconductor substrate having a peripheral portion resin-molded.

【図６】自動成形装置の構成を示す模式図である。FIG. 6 is a schematic view showing a configuration of an automatic molding device.

【図７】従来技術の問題点を説明するための成形品取り
出し後の下型の部分断面図である。FIG. 7 is a partial cross-sectional view of the lower mold after taking out a molded product for explaining the problems of the conventional technique.

【符号の説明】[Explanation of symbols]

１ 半導体基板（ウェーハ） ２ レジン ４ 移送ユニット ５ 成形ユニット １０ レジン供給ユニット １１Ａ レジン吐出ノズル １１Ｂ レジン吐出ノズル １２ レジン排出ユニット １３ レジン排出ノズル １９ 上型用ヒータブロック ２０ 上型ホルダー ２１ 上型 ２２ 下型用ヒータブロック ２３ 下型ホルダー ２４ 下型 ２７ レジン注入口 ２７ａ 注入口レジン ３０ キャビティ 1 Semiconductor Substrate (Wafer) 2 Resin 4 Transfer Unit 5 Molding Unit 10 Resin Supply Unit 11A Resin Discharge Nozzle 11B Resin Discharge Nozzle 12 Resin Discharge Unit 13 Resin Discharge Nozzle 19 Upper Heater Block 20 Upper Die Holder 21 Upper Die 22 Lower Die Heater block 23 Lower mold holder 24 Lower mold 27 Resin injection port 27a Injection port resin 30 Cavity

───────────────────────────────────────────────────── フロントページの続き (72)発明者 立石 仁 神奈川県川崎市川崎区駅前本町25番地１ 東芝マイクロエレクトロニクス株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Hitoshi Tateishi 25-1 Ekimaehonmachi, Kawasaki-ku, Kawasaki-shi, Kanagawa 1 Toshiba Microelectronics Corporation

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】半導体基板の周縁部に，レジン成形を施す
半導体装置のレジン注入方法において、 成形型の上型
と下型との間に半導体基板を収納挟持し、上型と下型と
を密着して型締めする工程と、 加熱した前記成形型の
外周側壁に設けたレジン注入口に、レジン吐出ノズルを
当接し、レジンを前記半導体基板の周縁部を包むキャビ
ティに注入する工程と、 注入されたレジンが注入口の
外に流れ出ない状態まで固化した後、吐出ノズルを成形
型より離す工程とを、具備することを特徴とする半導体
装置のレジン注入方法。1. A method for injecting resin into a semiconductor device, wherein resin is formed on a peripheral portion of a semiconductor substrate, wherein a semiconductor substrate is housed and sandwiched between an upper mold and a lower mold of a molding die, and the upper mold and the lower mold are separated from each other. Intimately closing the mold, and injecting the resin into a cavity that encloses the peripheral portion of the semiconductor substrate by bringing a resin discharge nozzle into contact with a resin injection port provided on the outer peripheral side wall of the heated molding die, And a step of separating the discharge nozzle from the molding die after the resin is solidified until it does not flow out of the injection port. 【請求項２】レジン吐出ノズルに冷却手段を付加し、注
入されたレジンが注入口の外に流れ出ない状態まで固化
するとともに、前記冷却手段を制御して吐出ノズル内の
レジンの固化を防止した状態で、吐出ノズルを成形型よ
り離す工程を含む請求項１記載の半導体装置のレジン注
入方法。2. A cooling means is added to the resin discharge nozzle to solidify the injected resin until it does not flow out of the injection port, and the cooling means is controlled to prevent solidification of the resin in the discharge nozzle. 2. The resin injection method for a semiconductor device according to claim 1, further comprising a step of separating the discharge nozzle from the molding die in this state.
JP3103085A 1991-04-08 1991-04-08 Resin injection method Expired - Fee Related JP2839744B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3103085A JP2839744B2 (en) 1991-04-08 1991-04-08 Resin injection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3103085A JP2839744B2 (en) 1991-04-08 1991-04-08 Resin injection method

Publications (2)

Publication Number Publication Date
JPH05226395A true JPH05226395A (en) 1993-09-03
JP2839744B2 JP2839744B2 (en) 1998-12-16

Family

ID=14344800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3103085A Expired - Fee Related JP2839744B2 (en) 1991-04-08 1991-04-08 Resin injection method

Country Status (1)

Country Link
JP (1) JP2839744B2 (en)

Also Published As

Publication number Publication date
JP2839744B2 (en) 1998-12-16

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