JPH05224229A - Method for connecting liquid crystal display panel and circuit board - Google Patents
Method for connecting liquid crystal display panel and circuit boardInfo
- Publication number
- JPH05224229A JPH05224229A JP5883292A JP5883292A JPH05224229A JP H05224229 A JPH05224229 A JP H05224229A JP 5883292 A JP5883292 A JP 5883292A JP 5883292 A JP5883292 A JP 5883292A JP H05224229 A JPH05224229 A JP H05224229A
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- insulating adhesive
- connection
- circuit board
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は液晶表示パネルと回路
基板との接続方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting a liquid crystal display panel and a circuit board.
【0002】[0002]
【従来の技術】ワードプロセッサ等の電子機器で使用さ
れる液晶表示装置では、液晶表示パネルの透明基板の接
続端子と回路基板の接続端子とを、導電性を有する金属
等からなる導電性微粒子を熱硬化型または光硬化型の樹
脂からなる絶縁性接着剤中に分散してなる異方導電性接
着剤を介して導電接続することがある。この場合、異方
導電性接着剤を液晶表示パネルの透明基板の接続端子を
含む接続部分と回路基板の接続端子を含む接続部分との
間に介在させ、熱圧着または光を当てながらにての圧着
をすると、異方導電性接着剤中の絶縁性接着剤の一部が
流動して逃げることにより、異方導電性接着剤中の導電
性微粒子の一部が液晶表示パネルの透明基板の接続端子
とこの接続端子と対向する回路基板の接続端子とに共に
接触し、これにより相対向する液晶表示パネルの透明基
板の接続端子と回路基板の接続端子とが導電接続され、
また隣り合う導電性微粒子間に介在された絶縁性接着剤
が硬化することにより、液晶表示パネルの透明基板の接
続端子を含む接続部分と回路基板の接続端子を含む接続
部分とが接着される。すなわち、このような異方導電性
接着剤は、接続状態において、厚さ方向には導電性を有
するが、面方向には絶縁性を有するものである。2. Description of the Related Art In a liquid crystal display device used in an electronic device such as a word processor, the connection terminals of a transparent substrate of a liquid crystal display panel and the connection terminals of a circuit board are heated with conductive fine particles made of a conductive metal or the like. In some cases, conductive connection is made via an anisotropic conductive adhesive dispersed in an insulating adhesive made of a curable or photocurable resin. In this case, an anisotropic conductive adhesive is interposed between the connection portion including the connection terminal of the transparent substrate of the liquid crystal display panel and the connection portion including the connection terminal of the circuit board, and thermocompression bonding or light irradiation is performed. When pressure bonding is applied, some of the insulating adhesive in the anisotropic conductive adhesive flows and escapes, causing some of the conductive fine particles in the anisotropic conductive adhesive to connect to the transparent substrate of the liquid crystal display panel. Both the terminals and the connection terminals of the circuit board facing the connection terminals are in contact with each other, so that the connection terminals of the transparent board of the liquid crystal display panel and the connection terminals of the circuit board facing each other are conductively connected,
Further, the insulating adhesive interposed between the adjacent conductive fine particles is cured, so that the connecting portion including the connecting terminal of the transparent substrate of the liquid crystal display panel and the connecting portion including the connecting terminal of the circuit substrate are bonded. That is, such an anisotropically conductive adhesive has conductivity in the thickness direction but has insulation in the surface direction in the connected state.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、従来の
このような接続方法で使用されている異方導電性接着剤
では、絶縁性接着剤中に導電性微粒子を分散させる際、
一般に、絶縁性接着剤中に導電性微粒子を混合した後練
っているが、導電性微粒子同士が付着して集合しやすい
性質があり、このため導電性微粒子を絶縁性接着剤中に
均一に分散させにくく、絶縁性接着剤中における導電性
微粒子の分散密度に差異が生じ、ひいては相対向する接
続端子間で接続不良が生じたり、相隣接する接続端子間
で短絡が生じたりすることがあるという問題があった。
例えば、図7に示すように、液晶表示パネル1の透明基
板2の接続端子3と回路基板4の接続端子5とを、導電
性微粒子6を絶縁性接着剤7中に分散してなる異方導電
性接着剤8を介して導電接続する際、同図の左側に示す
ように、絶縁性接着剤7中における導電性微粒子6の分
散密度が小さすぎて相対向する接続端子3、5間に導電
性微粒子6が1つも存在しない場合、相対向する接続端
子3、5間で接続不良が生じ、一方、同図の右側に示す
ように、絶縁性接着剤7中における導電性微粒子6の分
散密度が大きすぎて導電性微粒子6が数珠つなぎに付着
して集合した場合、相隣接する接続端子3、5間で短絡
が生じることになる。この発明の目的は、相対向する液
晶表示パネルの透明基板の接続端子と回路基板の接続端
子との間にのみ導電性微粒子を確実に介在させることの
できる液晶表示パネルと回路基板との接続方法を提供す
ることにある。However, in the anisotropic conductive adhesive used in such a conventional connecting method, when the conductive fine particles are dispersed in the insulating adhesive,
Generally, the conductive fine particles are mixed and kneaded in the insulating adhesive, but there is a property that the conductive fine particles are easily attached to each other and thus aggregate, and therefore the conductive fine particles are uniformly dispersed in the insulating adhesive. It is difficult to prevent the difference in the dispersion density of the conductive fine particles in the insulating adhesive, which may result in a connection failure between the opposing connection terminals or a short circuit between the adjacent connection terminals. There was a problem.
For example, as shown in FIG. 7, an anisotropic structure in which the conductive fine particles 6 are dispersed in the insulating adhesive 7 for the connection terminals 3 of the transparent substrate 2 and the connection terminals 5 of the circuit board 4 of the liquid crystal display panel 1. When conducting the conductive connection via the conductive adhesive 8, as shown on the left side of the figure, the dispersion density of the conductive fine particles 6 in the insulating adhesive 7 is too small and the connection terminals 3 and 5 face each other. When no conductive fine particles 6 are present, a connection failure occurs between the connecting terminals 3 and 5 facing each other, while the conductive fine particles 6 are dispersed in the insulating adhesive 7 as shown on the right side of FIG. When the density is too high and the conductive fine particles 6 are attached and aggregated in a daisy chain, a short circuit occurs between the adjacent connection terminals 3 and 5. An object of the present invention is to provide a method of connecting a liquid crystal display panel and a circuit board, in which conductive particles can be surely interposed only between the connection terminal of the transparent substrate and the connection terminal of the circuit board of the liquid crystal display panel facing each other. To provide.
【0004】[0004]
【課題を解決するための手段】この発明は、液晶表示パ
ネルの透明基板の接続端子と回路基板の接続端子とを互
いに対向させた状態で導電接続する際、前記両基板のい
ずれか一方の基板の接続端子を含む接続部分の上面に光
硬化型樹脂からなる絶縁性接着剤を設け、前記接続部分
における前記接続端子以外の部分の上面に位置する前記
絶縁性接着剤を露光により硬化するとともに、前記接続
端子の上面に位置する前記絶縁性接着剤は露光せずに未
硬化とし、前記接続端子の上面に位置する前記未硬化の
絶縁性接着剤の上に導電性微粒子を配置し、前記導電性
微粒子の上に前記両基板のうち他方の基板の接続端子を
載置し、圧着して露光をすることにより、前記一方の基
板の接続端子と前記他方の基板の接続端子とを前記導電
性微粒子を介して導電接続するとともに、前記未硬化の
絶縁性接着剤を硬化させるようにしたものである。SUMMARY OF THE INVENTION According to the present invention, when conductively connecting a connection terminal of a transparent substrate of a liquid crystal display panel and a connection terminal of a circuit board in a state of facing each other, one of the two substrates is connected. An insulating adhesive made of a photo-curing resin is provided on the upper surface of the connection portion including the connection terminal, and the insulating adhesive located on the upper surface of the connection portion other than the connection terminals is cured by exposure, The insulating adhesive located on the upper surface of the connection terminal is uncured without being exposed, and conductive fine particles are arranged on the uncured insulating adhesive located on the upper surface of the connection terminal. The connection terminals of the other substrate of the both substrates are placed on the conductive fine particles, and the connection terminals of the one substrate and the connection terminals of the other substrate are electrically conductive by exposing the connection terminals of the other substrate by pressure bonding. Through the particles As well as electric connection is obtained by the cure the insulating adhesive of the uncured.
【0005】[0005]
【作用】この発明によれば、一方の基板の接続端子上に
設けた光硬化型樹脂からなる絶縁性接着剤を未硬化と
し、この未硬化の絶縁性接着剤の上に導電性微粒子を配
置し、この導電性微粒子の上に他方の基板の接続端子を
載置し、圧着して露光をすると、未硬化の絶縁性接着剤
の一部が流動して逃げても、導電性微粒子がほぼそのま
まの位置に保持され、したがって相対向する液晶表示パ
ネルの透明基板の接続端子と回路基板の接続端子との間
にのみ導電性微粒子を確実に介在させることができる。According to the present invention, the insulating adhesive made of the photo-curing resin provided on the connection terminal of the one substrate is uncured, and the conductive fine particles are arranged on the uncured insulating adhesive. Then, the connection terminal of the other substrate is placed on the conductive fine particles, and when pressure bonding and exposure are performed, even if a part of the uncured insulating adhesive flows and escapes, the conductive fine particles are almost removed. Therefore, the conductive fine particles can be reliably interposed only between the connection terminal of the transparent substrate and the connection terminal of the circuit substrate of the liquid crystal display panel which are held in the same position and are opposed to each other.
【0006】[0006]
【実施例】図1〜図6はそれぞれこの発明の一実施例に
おける液晶表示パネルと回路基板との各接続工程を示し
たものである。そこで、これらの図を順に参照しなが
ら、液晶表示パネルと回路基板との接続方法について説
明する。1 to 6 show respective steps of connecting a liquid crystal display panel and a circuit board in an embodiment of the present invention. Therefore, a method of connecting the liquid crystal display panel and the circuit board will be described with reference to these drawings in order.
【0007】まず、図1に示すような回路基板11を用
意する。この回路基板11は、樹脂等からなるフレキシ
ブルな基板本体12の上面に銅やアルミニウム等の金属
からなる接続端子13が20〜40μ程度の膜厚でパタ
ーン形成された構造となっている。また、この回路基板
11の接続端子13を含む接続部分の上面には紫外線等
の光硬化型樹脂からなる絶縁性接着剤14がスクリーン
印刷や凸版印刷等の印刷により塗布されている。絶縁性
接着剤14の膜厚は、回路基板11の接続端子13の膜
厚よりも5μ程度厚く、25〜45μ程度となってい
る。First, a circuit board 11 as shown in FIG. 1 is prepared. The circuit board 11 has a structure in which a connection terminal 13 made of a metal such as copper or aluminum is patterned on the upper surface of a flexible board body 12 made of resin or the like with a film thickness of about 20 to 40 μm. An insulating adhesive 14 made of a photocurable resin such as ultraviolet rays is applied to the upper surface of the connection portion including the connection terminals 13 of the circuit board 11 by screen printing, letterpress printing or the like. The film thickness of the insulating adhesive 14 is about 5 μm thicker than the film thickness of the connection terminal 13 of the circuit board 11 and is about 25 to 45 μm.
【0008】次に、図2に示すように、回路基板11の
接続端子13に対応する部分を遮光する遮光部15を有
した所定のパターンのフォトマスク16を回路基板11
の上方に位置合わせして配置し、フォトマスク16の上
方から紫外線等の光16aを照射する。すると、図3に
示すように、絶縁性接着剤14のうち回路基板11の接
続端子13の上部を除いた部分が露光されて硬化するこ
とにより硬化部14aを形成し、それ以外の部分、つま
り絶縁性接着剤14のうち回路基板11の接続端子13
の上部が未硬化のままで未硬化部14bを形成する。Next, as shown in FIG. 2, the circuit board 11 is provided with a photomask 16 having a predetermined pattern, which has a light shielding portion 15 for shielding the portion of the circuit board 11 corresponding to the connection terminal 13.
The photomask 16 is positioned above the photomask 16 and is irradiated with light 16a such as ultraviolet light from above the photomask 16. Then, as shown in FIG. 3, a portion of the insulating adhesive 14 excluding the upper portions of the connection terminals 13 of the circuit board 11 is exposed and cured to form a cured portion 14a, and the other portion, that is, the cured portion 14a is formed. Of the insulating adhesive 14, the connection terminal 13 of the circuit board 11
The uncured portion 14b is formed while the upper part of the uncured portion remains uncured.
【0009】次に、図4に示すように、絶縁性接着剤1
4の未硬化部14bの上面のみに導電性微粒子17を配
置する。導電性微粒子17は、導電性を有する金属から
なる微粒子、あるいは樹脂微粒子の表面に導電性を有す
る金属薄膜をメッキや蒸着等により被膜してなるもの等
からなっている。絶縁性接着剤14の未硬化部14bの
上面のみに導電性微粒子17を配置する方法としては、
絶縁性接着剤14の上面全体に多数の導電性微粒子17
を転がし、粘着性を有する未硬化部14bの上面のみに
導電性微粒子17を付着させて配置する方法があり、ま
た絶縁性接着剤14の上面全体に多数の導電性微粒子1
7をスプレー等を用いて散布した後、エアー等によって
粘着性を有しない硬化部14a上の導電性微粒子17を
吹き飛ばして除去することにより、粘着性を有する未硬
化部14bの上面のみに導電性微粒子17を付着させて
配置する方法がある。Next, as shown in FIG. 4, the insulating adhesive 1
The conductive fine particles 17 are arranged only on the upper surface of the uncured portion 14b of No. 4. The conductive fine particles 17 include fine particles made of conductive metal, or resin fine particles coated with a conductive thin metal film by plating, vapor deposition, or the like. As a method of disposing the conductive fine particles 17 only on the upper surface of the uncured portion 14b of the insulating adhesive 14,
A large number of conductive fine particles 17 are formed on the entire upper surface of the insulating adhesive 14.
There is a method in which the conductive fine particles 17 are adhered and arranged only on the upper surface of the uncured portion 14b having adhesiveness, and a large number of conductive fine particles 1 are formed on the entire upper surface of the insulating adhesive 14.
After spraying 7 using a spray or the like, the conductive fine particles 17 on the non-adhesive cured portion 14a are blown away by air or the like to remove the conductive fine particles 17 on the upper surface of the adhesive non-cured portion 14b. There is a method in which the fine particles 17 are attached and arranged.
【0010】次に、図5に示すような液晶表示パネル1
8を用意する。この液晶表示パネル18は、ガラスや樹
脂等からなる透明基板19の下面にITO等の透光性を
有する導体からなる接続端子20がパターン形成された
構造となっている。また、この液晶表示パネル18の透
明基板19の接続端子20を含む接続部分の下面には紫
外線等の光硬化型の樹脂からなる絶縁性接着剤21がス
クリーン印刷や凸版印刷等の印刷により塗布されてい
る。そして、この液晶表示パネル18の透明基板19の
接続端子20を含む接続部分の下面を、この下面に設け
られた絶縁性接着剤21を介して、絶縁性接着剤14の
未硬化部14bの上面に付着されて配置された導電性微
粒子17の上面に位置合わせして載置する。Next, a liquid crystal display panel 1 as shown in FIG.
Prepare 8. The liquid crystal display panel 18 has a structure in which a connection terminal 20 made of a translucent conductor such as ITO is patterned on a lower surface of a transparent substrate 19 made of glass or resin. An insulating adhesive 21 made of a photocurable resin such as ultraviolet rays is applied to the lower surface of the connection portion of the transparent substrate 19 of the liquid crystal display panel 18 including the connection terminals 20 by printing such as screen printing or letterpress printing. ing. Then, the lower surface of the connection portion including the connection terminal 20 of the transparent substrate 19 of the liquid crystal display panel 18 is placed on the upper surface of the uncured portion 14b of the insulating adhesive 14 via the insulating adhesive 21 provided on the lower surface. The conductive fine particles 17 attached and arranged on the upper surface of the conductive fine particles 17 are aligned and placed.
【0011】次に、図6に示すように、回路基板11と
液晶表示パネル18とを圧着し、その状態で液晶表示パ
ネル18の上方から紫外線等の光16aを照射して露光
をすると、絶縁性接着剤14の未硬化部14b(図5参
照)および絶縁性接着剤21の各一部が流動して逃げる
ことにより、導電性微粒子17が液晶表示パネル18の
透明基板19の接続端子20とこの接続端子20と対向
する回路基板11の接続端子13とに共に接触し、これ
により相対向する液晶表示パネル18の透明基板19の
接続端子20と回路基板11の接続端子13とが導電接
続され、また透明基板19および接続端子20は光16
aを透過させるので、絶縁性接着剤14の未硬化部14
b(図5参照)および絶縁性接着剤21が硬化して両絶
縁性接着剤14、21が一体化することにより、液晶表
示パネル18の透明基板19の接続端子20を含む接続
部分と回路基板11の接続端子13を含む接続部分とが
接着される。Next, as shown in FIG. 6, when the circuit board 11 and the liquid crystal display panel 18 are pressure-bonded to each other and exposed to light 16a such as ultraviolet rays from above the liquid crystal display panel 18, exposure is performed. The uncured portion 14b (see FIG. 5) of the conductive adhesive 14 and each part of the insulating adhesive 21 flow and escape, so that the conductive fine particles 17 are connected to the connection terminals 20 of the transparent substrate 19 of the liquid crystal display panel 18. The connection terminal 20 and the connection terminal 13 of the circuit board 11 facing each other are brought into contact with each other, so that the connection terminal 20 of the transparent substrate 19 of the liquid crystal display panel 18 and the connection terminal 13 of the circuit board 11 which are opposite to each other are conductively connected. , The transparent substrate 19 and the connection terminal 20 are light 16
Since a is transmitted, the uncured portion 14 of the insulating adhesive 14
b (see FIG. 5) and the insulative adhesive 21 are cured and both insulative adhesives 14 and 21 are integrated, so that the connection portion including the connection terminal 20 of the transparent substrate 19 of the liquid crystal display panel 18 and the circuit board. 11 and the connection portion including the connection terminal 13 are bonded.
【0012】ところで、絶縁性接着剤14の未硬化部1
4bおよび絶縁性接着剤21の各一部が流動して逃げて
も、導電性微粒子17がほぼそのままの位置に保持さ
れ、したがって相対向する液晶表示パネル18の透明基
板19の接続端子20と回路基板11の接続端子13と
の間にのみ導電性微粒子17を確実に介在させることが
できる。この結果、相対向する接続端子20、13間に
導電性微粒子17を確実に介在させることができ、ひい
ては相対向する接続端子20、13間で接続不良が生じ
ないようにすることができ、また相隣接する接続端子2
0、13間に導電性微粒子17が存在しないようにする
ことができ、ひいては相隣接する接続端子20、13間
で短絡が生じないようにすることができ、異方導電接続
の信頼性が向上する。By the way, the uncured portion 1 of the insulating adhesive 14
4b and each part of the insulating adhesive 21 flow and escape, the conductive fine particles 17 are held in almost the same positions, and therefore the connection terminals 20 and the circuit of the transparent substrate 19 of the liquid crystal display panel 18 facing each other. The conductive fine particles 17 can be reliably interposed only between the connection terminals 13 of the substrate 11. As a result, the conductive fine particles 17 can be surely interposed between the connection terminals 20 and 13 facing each other, and eventually the connection failure can be prevented between the connection terminals 20 and 13 facing each other. Connection terminals 2 adjacent to each other
It is possible to prevent the conductive fine particles 17 from existing between 0 and 13 and to prevent a short circuit between the adjacent connection terminals 20 and 13, thus improving the reliability of anisotropic conductive connection. To do.
【0013】なお、上記実施例では、図2に示すよう
に、フォトマスク16を用いているが、回路基板11の
基板本体12がポリエチレンテレフタレートやポリエー
テルサルフォン等の透光性を有する樹脂からなる場合に
は、フォトマスク16を使用せず、回路基板11の金属
からなる不透明な接続端子13をフォトマスクとして用
いることにより、回路基板11の下方から紫外線等の光
16aを照射するようにしてもよい。また、上記実施例
では、図4に示すように、回路基板11の接続端子13
の上面に未硬化部14bを設け、この未硬化部14bの
上面に導電性微粒子17を配置し、この導電性微粒子1
7の上面に絶縁性接着剤21を介して液晶表示パネル1
8の透明基板19の接続端子20を含む接続部分を載置
しているが、これとは逆に、液晶表示パネル18の透明
基板19の接続端子20の上面に未硬化部を設け、この
未硬化部の上面に導電性微粒子を配置し、この導電性微
粒子の上面に絶縁性接着剤を介して回路基板11の接続
端子13を含む接続部分を載置するようにしてもよい。
また、回路基板11はフレキシブル基板である必要はな
く、ハード基板であってもよい。In the above embodiment, as shown in FIG. 2, the photomask 16 is used. However, the substrate body 12 of the circuit board 11 is made of a translucent resin such as polyethylene terephthalate or polyether sulfone. In such a case, the photomask 16 is not used, and the opaque connection terminal 13 made of metal of the circuit board 11 is used as a photomask so that the light 16a such as ultraviolet rays is irradiated from below the circuit board 11. Good. Further, in the above embodiment, as shown in FIG. 4, the connection terminal 13 of the circuit board 11 is
The uncured portion 14b is provided on the upper surface of the conductive fine particles 1 and the conductive fine particles 17 are arranged on the upper surface of the uncured portion 14b.
Liquid crystal display panel 1 with insulating adhesive 21 on the upper surface of 7.
Although the connection portion including the connection terminal 20 of the transparent substrate 19 of No. 8 is placed, on the contrary, the uncured portion is provided on the upper surface of the connection terminal 20 of the transparent substrate 19 of the liquid crystal display panel 18, and The conductive fine particles may be arranged on the upper surface of the cured portion, and the connection portion including the connection terminals 13 of the circuit board 11 may be placed on the upper surface of the conductive fine particles via an insulating adhesive.
The circuit board 11 does not have to be a flexible board and may be a hard board.
【0014】[0014]
【発明の効果】以上説明したように、この発明によれ
ば、一方の基板の接続端子上に設けた光硬化型樹脂から
なる絶縁性接着剤を未硬化とし、未硬化の絶縁性接着剤
の上に導電性微粒子を配置しているので、未硬化の絶縁
性接着剤の一部が流動して逃げても、導電性微粒子をほ
ぼそのままの位置に保持することができ、したがって相
対向する液晶表示パネルの透明基板の接続端子と回路基
板の接続端子との間にのみ導電性微粒子を確実に介在さ
せることができ、ひいては異方導電接続の信頼性を向上
させることができる。As described above, according to the present invention, the insulating adhesive made of the photo-curing resin provided on the connection terminal of the one substrate is uncured, and the uncured insulating adhesive is Since the conductive fine particles are arranged on the upper side, even if a part of the uncured insulating adhesive flows and escapes, the conductive fine particles can be held in almost the same position, and therefore the liquid crystal facing each other can be held. The conductive fine particles can be reliably interposed only between the connection terminals of the transparent substrate of the display panel and the connection terminals of the circuit board, and the reliability of anisotropic conductive connection can be improved.
【図1】この発明の一実施例における液晶表示パネルと
回路基板との接続に際し、回路基板の接続端子を含む接
続部分の上面に光硬化型樹脂からなる絶縁性接着剤を設
けた状態の断面図。FIG. 1 is a cross section of a state in which an insulating adhesive made of a photocurable resin is provided on the upper surface of a connection portion including a connection terminal of a circuit board when connecting a liquid crystal display panel and a circuit board according to an embodiment of the present invention. Fig.
【図2】同接続に際し、回路基板上に設けられた絶縁性
接着剤にフォトマスクを用いて光を照射した状態の断面
図。FIG. 2 is a cross-sectional view of a state in which light is irradiated on the insulating adhesive provided on the circuit board using a photomask during the connection.
【図3】同接続に際し、光の照射により、回路基板上に
設けられた絶縁性接着剤に硬化部と未硬化部とを形成し
た状態の断面図。FIG. 3 is a cross-sectional view showing a state in which a cured portion and an uncured portion are formed on an insulating adhesive provided on a circuit board by light irradiation during the same connection.
【図4】同接続に際し、回路基板上に設けられた絶縁性
接着剤の未硬化部の上面のみに導電性微粒子を付着させ
て配置した状態の断面図。FIG. 4 is a cross-sectional view showing a state in which conductive fine particles are adhered and arranged only on an upper surface of an uncured portion of an insulating adhesive provided on a circuit board during the same connection.
【図5】同接続に際し、導電性微粒子の上面に液晶表示
パネルの透明基板の接続端子を含む接続部分の下面をこ
の下面に設けられた絶縁性接着剤を介して載置した状態
の断面図。FIG. 5 is a cross-sectional view showing a state in which a lower surface of a connecting portion including a connecting terminal of a transparent substrate of a liquid crystal display panel is placed on an upper surface of conductive fine particles through an insulating adhesive provided on the lower surface during the same connection. ..
【図6】同接続に際し、液晶表示パネルの透明基板の接
続端子と回路基板の接続端子とを導電接続した状態の断
面図。FIG. 6 is a cross-sectional view showing a state in which the connection terminals of the transparent substrate of the liquid crystal display panel and the connection terminals of the circuit board are conductively connected during the same connection.
【図7】従来例の問題点を説明するために示す断面図。FIG. 7 is a cross-sectional view shown for explaining the problems of the conventional example.
11 回路基板 13 接続端子 14 絶縁性接着剤 14b 未硬化部 17 導電性微粒子 18 液晶表示パネル 19 透明基板 20 接続端子 21 絶縁性接着剤 11 Circuit Board 13 Connection Terminal 14 Insulating Adhesive 14b Uncured Part 17 Conductive Fine Particles 18 Liquid Crystal Display Panel 19 Transparent Substrate 20 Connection Terminal 21 Insulating Adhesive
Claims (1)
回路基板の接続端子とを互いに対向させた状態で導電接
続する際、 前記両基板のいずれか一方の基板の接続端子を含む接続
部分の上面に光硬化型樹脂からなる絶縁性接着剤を設
け、 前記接続部分における前記接続端子以外の部分の上面に
位置する前記絶縁性接着剤を露光により硬化するととも
に、前記接続端子の上面に位置する前記絶縁性接着剤は
露光せずに未硬化とし、 前記接続端子の上面に位置する前記未硬化の絶縁性接着
剤の上に導電性微粒子を配置し、 前記導電性微粒子の上に前記両基板のうち他方の基板の
接続端子を載置し、 圧着して露光をすることにより、前記一方の基板の接続
端子と前記他方の基板の接続端子とを前記導電性微粒子
を介して導電接続するとともに、前記未硬化の絶縁性接
着剤を硬化させる、 ことを特徴とする液晶表示パネルと回路基板との接続方
法。1. When conductively connecting a connection terminal of a transparent substrate of a liquid crystal display panel and a connection terminal of a circuit substrate in a state of being opposed to each other, a connection portion including a connection terminal of one of the two substrates is connected. An insulating adhesive made of a photo-curable resin is provided on the upper surface, and the insulating adhesive located on the upper surface of the connection portion other than the connection terminals is cured by exposure and located on the upper surface of the connection terminals. The insulating adhesive is uncured without being exposed to light, conductive fine particles are arranged on the uncured insulating adhesive located on the upper surface of the connection terminal, and the both substrates are provided on the conductive fine particles. The connection terminal of the other substrate is placed on the other substrate, and the connection terminal of the one substrate and the connection terminal of the other substrate are conductively connected through the conductive fine particles by exposing the connection terminals of the other substrate by pressure bonding and exposing. ,Previous Curing the uncured insulating adhesive, method of connecting the liquid crystal display panel and the circuit board, characterized in that.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5883292A JPH05224229A (en) | 1992-02-13 | 1992-02-13 | Method for connecting liquid crystal display panel and circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5883292A JPH05224229A (en) | 1992-02-13 | 1992-02-13 | Method for connecting liquid crystal display panel and circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05224229A true JPH05224229A (en) | 1993-09-03 |
Family
ID=13095626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5883292A Pending JPH05224229A (en) | 1992-02-13 | 1992-02-13 | Method for connecting liquid crystal display panel and circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05224229A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006208972A (en) * | 2005-01-31 | 2006-08-10 | Sekisui Chem Co Ltd | Liquid crystal display device and its manufacturing method |
JP2007094412A (en) * | 2005-09-27 | 2007-04-12 | Samsung Sdi Co Ltd | Plasma display device |
-
1992
- 1992-02-13 JP JP5883292A patent/JPH05224229A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006208972A (en) * | 2005-01-31 | 2006-08-10 | Sekisui Chem Co Ltd | Liquid crystal display device and its manufacturing method |
JP2007094412A (en) * | 2005-09-27 | 2007-04-12 | Samsung Sdi Co Ltd | Plasma display device |
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