JPH05224079A - Coupling structure of optical waveguide path and optical fiber - Google Patents

Coupling structure of optical waveguide path and optical fiber

Info

Publication number
JPH05224079A
JPH05224079A JP2829392A JP2829392A JPH05224079A JP H05224079 A JPH05224079 A JP H05224079A JP 2829392 A JP2829392 A JP 2829392A JP 2829392 A JP2829392 A JP 2829392A JP H05224079 A JPH05224079 A JP H05224079A
Authority
JP
Japan
Prior art keywords
optical waveguide
substrate
optical fiber
optical
guide pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2829392A
Other languages
Japanese (ja)
Other versions
JP3065159B2 (en
Inventor
Kazunori Kurima
一典 栗間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2829392A priority Critical patent/JP3065159B2/en
Publication of JPH05224079A publication Critical patent/JPH05224079A/en
Application granted granted Critical
Publication of JP3065159B2 publication Critical patent/JP3065159B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To make the constitution of an optical waveguide path base body lower in cost and superior in transmission characteristics, in the structure that the optical waveguide path base body and an optical fiber holding member are positioned via a guide pin and are coupled optically. CONSTITUTION:The optical waveguide path base body 13 is composed of a combination of a first base body 13a having an optical waveguide path 12 and being formed using a LiNbO3 crystal, and a second substrate 13b having a groove 16 for guide pin on the upper surface and being formed using Si. An optical fiber 8 and the guide pin 17 are clamped via V shaped grooves 14, 20 at the abutting surface of an upper side plate 18 and a lower side plate 19 which constitute the optical fiber holding member 11, and non-aligning mounting of the optical waveguide path 12 and the optical fiber 8 is carried out by being engaged the guide pin 17 with the groove 16 for guide of the optical waveguide path base body 13.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は光導波路基板に形成され
た光導波路と光ファイバとの光学的な結合構造に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling structure between an optical waveguide formed on an optical waveguide substrate and an optical fiber.

【0002】[0002]

【従来の技術】光導波路に光信号を入射したり、出射す
るには、光導波路の端面に光ファイバの端面を接続する
必要がある。この光接続には0.1μmの高精度が求め
られるため、接続時に光導波路と光ファイバの調心には
非常に多くの時間がかかり、作業効率が悪い。このため
従来種々の改善工夫がなされており、例えば本出願人に
かかる特開昭63−278471号が知られている。
2. Description of the Related Art In order to make an optical signal enter or exit an optical waveguide, it is necessary to connect an end face of an optical fiber to an end face of the optical waveguide. Since this optical connection requires a high accuracy of 0.1 μm, it takes a lot of time to align the optical waveguide and the optical fiber at the time of connection, resulting in poor work efficiency. For this reason, various improvements have been made in the past, and for example, JP-A-63-278471 of the present applicant is known.

【0003】この特開昭にかかる光導波路と光ファイバ
との結合構造では、図4に示すように光ファイバ保持部
材1に、光導波路2が上面に形成された光導波路基板3
を結合するものである。この光結合構造では、光ファイ
バ保持部材1は上側プレート4と下側プレート5と、両
プレートの接合面に形成した2つのV溝6,10によっ
て挾持された光ファイバ8およびガイドピン7とから構
成されている。
In the coupling structure of an optical waveguide and an optical fiber according to this Japanese Patent Laid-Open Publication No. Sho.
Is to combine. In this optical coupling structure, the optical fiber holding member 1 is composed of the upper plate 4 and the lower plate 5, and the optical fiber 8 and the guide pin 7 held by the two V grooves 6 and 10 formed on the joint surfaces of both plates. It is configured.

【0004】そして、光ファイバ8は光ファイバ保持部
材1が光導波路基板3に装着されたとき、光導波路2の
端面に光結合される構成である。この場合、光ファイバ
8のZ方向の位置決めは上側プレート4の下面4aと、
光導波路基板3の上面3aとが当接することによりなさ
れる。また、光ファイバ8のX方向(光軸方向)の位置
決めは光ファイバ保持部材1の下側プレート5の前面を
光導波路基板3の側面3bに当接させることによりなさ
れる。さらに、光ファイバ8のY方向の位置決めは、光
ファイバ保持部材1の上側プレート4と下側プレート5
の当接面に対向して形成されたV溝10,10aに保持
されたガイドピン7を、光導波路基板3の上面に間隔P
を有して平行に形成されたV字状のガイドピン用溝9に
係合することによりなされる。
The optical fiber 8 is constructed so as to be optically coupled to the end face of the optical waveguide 2 when the optical fiber holding member 1 is mounted on the optical waveguide substrate 3. In this case, the positioning of the optical fiber 8 in the Z direction is performed by the lower surface 4a of the upper plate 4,
This is done by contact with the upper surface 3a of the optical waveguide substrate 3. Further, the positioning of the optical fiber 8 in the X direction (optical axis direction) is performed by bringing the front surface of the lower plate 5 of the optical fiber holding member 1 into contact with the side surface 3b of the optical waveguide substrate 3. Further, the positioning of the optical fiber 8 in the Y direction is performed by the upper plate 4 and the lower plate 5 of the optical fiber holding member 1.
The guide pins 7 held in the V-shaped grooves 10 and 10a formed facing the contact surface of the optical waveguide substrate 3 on the upper surface of the optical waveguide substrate 3.
And is formed in parallel with the V-shaped guide pin groove 9 formed in parallel.

【0005】上記の光導波路と光ファイバの結合構造に
よると、光ファイバ保持部材1に装着されたガイドピン
7を光導波路基板3のガイドピン用溝9に係合し、さら
に光ファイバ保持部材1の2面を光導波路基板3の2面
にそれぞれ当接させることにより、光導波路3に形成さ
れた光導波路2の入出力端部と光ファイバ8とを無調心
で実装することができる。
According to the above-described optical waveguide / optical fiber coupling structure, the guide pin 7 mounted on the optical fiber holding member 1 is engaged with the guide pin groove 9 of the optical waveguide substrate 3, and the optical fiber holding member 1 is further provided. By contacting the two surfaces of the optical waveguide substrate 3 with the two surfaces of the optical waveguide substrate 3, the input / output ends of the optical waveguide 2 formed in the optical waveguide 3 and the optical fiber 8 can be mounted without alignment.

【0006】[0006]

【発明が解決しようとする課題】本発明者は、上述の光
導波路と光ファイバの結合構造をさらに改良すべく研究
を重ねた結果、次の問題点にぶつかった。すなわち、光
導波路基体3の材質には一般にLiNbO3 (ニオブ酸
リチウム)結晶が用いられている。このLiNbO3
晶はコストが大変高価であるにもかかわらず、光導波路
基体3の上面にガイドピン用溝9を形成するためこの光
導波路基体3が大きくなる。したがって、LiNbO3
結晶のサイズが大きくなり、コスト増加につながるとい
う欠点があった。また、LiNbO3 結晶によっては脆
く、光導波路基体3にガイドピン用溝9を加工するのが
困難であった。
The present inventor has conducted the research to further improve the above-mentioned coupling structure between the optical waveguide and the optical fiber, and has encountered the following problems. That is, LiNbO 3 (lithium niobate) crystal is generally used as the material of the optical waveguide substrate 3. Although this LiNbO 3 crystal is very expensive, since the guide pin groove 9 is formed on the upper surface of the optical waveguide substrate 3, the optical waveguide substrate 3 becomes large. Therefore, LiNbO 3
There is a drawback that the size of the crystal becomes large and the cost increases. Further, depending on the LiNbO 3 crystal, it was fragile, and it was difficult to form the guide pin groove 9 in the optical waveguide substrate 3.

【0007】本発明は上述の欠点を改良した光導波路と
光ファイバとの結合構造を提供することを目的とする。
It is an object of the present invention to provide a coupling structure for an optical waveguide and an optical fiber, which has improved the above drawbacks.

【0008】[0008]

【課題を解決するための手段】本発明は、光導波路基板
と光ファイバ保持部材との位置決めをガイドピンを介し
て行ない、光導波路の端面に光ファイバを結合してなる
光導波路と光ファイバとの結合構造において、光導波路
基板を、光導波路を形成した第1の基板と、第1の基板
とは異なる材質によって形成されており、かつ第1の基
板を装着した第2の基板とから構成し、第1の基板と第
2の基板は表面研磨により平坦化されており、さらに第
2の基板にガイドピン用の溝が形成されていることを特
徴とする。
SUMMARY OF THE INVENTION According to the present invention, an optical waveguide and an optical fiber are formed by positioning an optical waveguide substrate and an optical fiber holding member through a guide pin and coupling the optical fiber to an end face of the optical waveguide. In the coupling structure of 1., the optical waveguide substrate comprises a first substrate on which the optical waveguide is formed, and a second substrate formed of a material different from that of the first substrate and having the first substrate mounted thereon. However, the first substrate and the second substrate are flattened by surface polishing, and a groove for a guide pin is formed in the second substrate.

【0009】前述の第1の基板はLiNbO3 結晶を用
いて形成し、第2の基板はSi材を用いて形成するもの
である。
The above-mentioned first substrate is formed of LiNbO 3 crystal, and the second substrate is formed of Si material.

【0010】[0010]

【作用】第1の基板には、コストが高価であるが光導波
路を形成するうえで最適のLiNbO3 結晶などの材料
を使用し、第2の基板には第1の基板を保持するととも
に、ガイドピン用溝を形成するに適した例えばSiを使
用できる。しかも、第1、第2の基板の組合わせからな
る光導波路基体と光ファイバ保持部材をガイドピンを介
して結合することにより、光導波路端面に光ファイバを
簡単な作業で光結合できる。
The first substrate is made of a material such as LiNbO 3 crystal which is expensive but is optimal for forming an optical waveguide. The second substrate holds the first substrate and For example, Si suitable for forming the guide pin groove can be used. Moreover, the optical fiber can be optically coupled to the end face of the optical waveguide by a simple operation by coupling the optical waveguide base made of the combination of the first and second substrates and the optical fiber holding member via the guide pin.

【0011】[0011]

【実施例】以下、本発明の実施例を図1ないし図3を参
照して説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

【0012】図1は本発明に係る光導波路基体13と光
ファイバ保持部材11の斜視図、図2A,B,Cと図3
A,B,Cは光導波路基体13の製造工程を示す斜視図
である。
FIG. 1 is a perspective view of an optical waveguide substrate 13 and an optical fiber holding member 11 according to the present invention, and FIGS. 2A, 2B, 2C and 3 are shown.
8A, 8B and 8C are perspective views showing the manufacturing process of the optical waveguide substrate 13.

【0013】図1において、光導波路基体13は光導波
路12を有する第1の基板13aと、ガイドピン用溝1
6を有する第2の基板13bを組合せ結合することによ
って構成されている。しかも、第1の基板13aと第2
の基板13bにはそれぞれ異なる材質が使用されるもの
で、第1の基板13aにはコストが高く、強度的にも脆
いが光導波路12を形成するうえで最適な材料であるL
iNbO3 結晶が使用されている。第2の基板13bに
はLiNbO3 ほど高価でなく、また、ガイドピン用溝
16を作製するうえで加工性がよく、しかもその加工精
度の向上も期待できるSiが使用されている。
In FIG. 1, an optical waveguide substrate 13 has a first substrate 13a having an optical waveguide 12, and a guide pin groove 1
It is configured by combining and coupling the second substrate 13b having 6 together. Moreover, the first substrate 13a and the second substrate 13a
Since different materials are used for the substrate 13b, the first substrate 13a is expensive and fragile in strength, but it is an optimal material for forming the optical waveguide 12.
iNbO 3 crystals have been used. The second substrate 13b instead of expensive than LiNbO 3, also good workability in manufacturing the guide pin grooves 16, moreover the Si that can be expected improvement of the machining accuracy are used.

【0014】上記第1の基板13aと第2の基板13b
を組合せて光導波路基体13を製造する工程を図2と図
3によって順に説明する。
The first substrate 13a and the second substrate 13b
A process of manufacturing the optical waveguide substrate 13 by combining the above will be sequentially described with reference to FIGS.

【0015】まず、図2Aに示すように幅10mm、長
さ30mm、厚さ2mmのSi材からなる長方形状の第
2の基材13bの上面中央部にカッタブレード(図示せ
ず)を用いて所定幅の凹溝20を座ぐり加工する。つぎ
に、図2Bに示すように凹溝20に幅3mm、長さ30
mm、厚さ0.5mmのLiNbO3 結晶からなる第1
の基板13aを張り付ける。その後、図2Cに示すよう
に各基板13bの表面の平坦化を行なう。その後、図3
A示すように第2の基板13b上にガイドピン挿入用の
溝16を切削加工する。さらに、図3Bに示すように、
第2の基板13bであるLiNbO3 結晶上にTi拡散
法により光導波路12を作製して光導波路基体13を製
造する。
First, as shown in FIG. 2A, a cutter blade (not shown) is used at the center of the upper surface of a rectangular second base material 13b made of a Si material having a width of 10 mm, a length of 30 mm and a thickness of 2 mm. The recessed groove 20 having a predetermined width is counterbored. Next, as shown in FIG. 2B, the groove 20 has a width of 3 mm and a length of 30 mm.
mm made of LiNbO 3 crystal with a thickness of 0.5 mm
The substrate 13a is attached. Thereafter, as shown in FIG. 2C, the surface of each substrate 13b is flattened. After that, FIG.
As shown in A, the groove 16 for inserting the guide pin is cut on the second substrate 13b. Further, as shown in FIG. 3B,
The optical waveguide 12 is produced on the LiNbO 3 crystal that is the second substrate 13b by the Ti diffusion method to produce the optical waveguide base 13.

【0016】前述のようにして作製した光導波路基体1
3に光ファイバ保持部材11を結合して、光導波路12
の端面に光ファイバ8を光結合することができる。(図
1参照)光ファイバ保持部材11は従来と同様シリコン
チップやプラスチックなどで形成された上側プレート1
8と下側プレート19を接合して構成されており、上側
プレート18は下側プレート19よりも長く設けられて
いる。上側プレート18と下側プレート19の当接面に
対向して光ファイバ用のV溝20とガイドピン用の溝1
4が形成されている。そして、前述のV溝20内に外被
8aを剥離した光ファイバ8を挾持して固定し、ガイド
ピン用溝14にガイドピン17を挾持して固定してい
る。
Optical waveguide substrate 1 produced as described above
3, the optical fiber holding member 11 is coupled to the optical waveguide 12
The optical fiber 8 can be optically coupled to the end face of the. (Refer to FIG. 1) The optical fiber holding member 11 is the upper plate 1 formed of a silicon chip or plastic as in the conventional case.
8 and the lower plate 19 are joined together, and the upper plate 18 is provided longer than the lower plate 19. The V groove 20 for the optical fiber and the groove 1 for the guide pin facing the contact surfaces of the upper plate 18 and the lower plate 19
4 are formed. Then, the optical fiber 8 from which the outer cover 8a is peeled off is clamped and fixed in the V groove 20 and the guide pin 17 is clamped and fixed in the guide pin groove 14.

【0017】そして、前述の光ファイバ保持部材11を
光導波路基体13の端部に結合することで光導波路の端
面に光ファイバ8を結合できる。この場合、従来同様上
側プレート18の下面を光導波路基体13の上面に当接
することにより光ファイバ8の図1における上方向の位
置決めがなされる。また、下側プレート19の前端面を
光導波路本体13の端面に当接することで光ファイバ8
の光軸方向の位置決めがなされる。さらに、ガイドピン
17をガイドピン用溝16に係合することで光ファイバ
8の横方向の位置決めを行なうことができる。このよう
にして、本実施例においてもガイドピン17をガイドピ
ン用溝16に係合して光導波路基体13と光ファイバ保
持部材11を結合することにより、無調心で光導波路1
2と光ファイバ8を実装できる。
By coupling the above-mentioned optical fiber holding member 11 to the end of the optical waveguide base 13, the optical fiber 8 can be coupled to the end face of the optical waveguide. In this case, as in the conventional case, the lower surface of the upper plate 18 is brought into contact with the upper surface of the optical waveguide substrate 13 to position the optical fiber 8 in the upward direction in FIG. In addition, by bringing the front end face of the lower plate 19 into contact with the end face of the optical waveguide body 13,
Is positioned in the optical axis direction. Further, by engaging the guide pin 17 with the guide pin groove 16, the optical fiber 8 can be positioned in the lateral direction. In this way, in the present embodiment as well, the guide pin 17 is engaged with the guide pin groove 16 to couple the optical waveguide base 13 and the optical fiber holding member 11 to each other, whereby the optical waveguide 1 is non-aligned.
2 and the optical fiber 8 can be mounted.

【0018】[0018]

【発明の効果】以上説明したように、本発明によると光
導波路基体を、第1の基板と第2の基板の組合せにより
構成しているので、各基板にそれぞれ材質の異なるもの
を使用することが可能であり、コスト面および伝達特性
の面で最も有利な光導波路基体を構成できる。とくに、
光導波路を形成する第1の基板には高価でかつ脆いが、
光導波路形成のうえで最適なLiNbO3 結晶を用いて
必要最小限の大きさに形成し、一方、第2の基板には低
コストで、光導波路基体と光ファイバ保持部材を位置決
めするガイドピン用の溝を簡易かつ高精度に加工できる
Siを使用し、この第2の基板に第1の基板を張り付け
て光導波路基板を構成することが可能となり、よって安
価で高性能の光導波路と光ファイバとの結合構造を実現
することができる。
As described above, according to the present invention, the optical waveguide substrate is composed of the combination of the first substrate and the second substrate. Therefore, each substrate should be made of a different material. It is possible to construct an optical waveguide substrate that is most advantageous in terms of cost and transfer characteristics. Especially,
The first substrate forming the optical waveguide is expensive and brittle,
For the guide pin for positioning the optical waveguide base and the optical fiber holding member at a low cost on the second substrate while forming it to the minimum necessary size by using the optimal LiNbO 3 crystal for forming the optical waveguide. It is possible to construct an optical waveguide substrate by using Si, which can easily and accurately process the groove of, and attach the first substrate to the second substrate. Therefore, an inexpensive and high-performance optical waveguide and optical fiber can be formed. It is possible to realize a coupling structure with.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例にかかる光導波路と光ファイバ
との結合構造の斜視図である。
FIG. 1 is a perspective view of a coupling structure of an optical waveguide and an optical fiber according to an embodiment of the present invention.

【図2】第2の基板に第1の基板を張り付けて光導波路
を作製する状態の斜視図である。
FIG. 2 is a perspective view showing a state in which an optical waveguide is manufactured by pasting a first substrate on a second substrate.

【図3】第2の基板と第1の基板にそれぞれガイドピン
用溝と光導波路を形成して光導波路を作製する状態の斜
視図である。
FIG. 3 is a perspective view showing a state in which a guide pin groove and an optical waveguide are formed on a second substrate and a first substrate, respectively, to produce an optical waveguide.

【図4】従来の光導波路と光ファイバの結合構造を示す
斜視図である。
FIG. 4 is a perspective view showing a conventional coupling structure of an optical waveguide and an optical fiber.

【符号の説明】[Explanation of symbols]

8…光ファイバ、11…光ファイバ保持部材、12…光
導波路、13…光導波路基体、13a…第1の基板、1
3b…第2の基体、16…ガイドピン用溝、17…ガイ
ドピン、18…上側プレート、19…下側プレート。
8 ... Optical fiber, 11 ... Optical fiber holding member, 12 ... Optical waveguide, 13 ... Optical waveguide base, 13a ... First substrate, 1
3b ... 2nd base | substrate, 16 ... Groove for guide pins, 17 ... Guide pin, 18 ... Upper plate, 19 ... Lower plate.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 光導波路基板と光ファイバ保持部材との
位置決めをガイドピンを介して行ない、光導波路の端面
に光ファイバを結合してなる光導波路と光ファイバとの
結合構造において、 前記光導波路基板を、光導波路を形成した第1の基板
と、第1の基板とは異なる材質によって形成されてお
り、かつ第1の基板を装着した第2の基板とから構成
し、第1の基板と第2の基板は表面研磨により平坦化さ
れており、さらに第2の基板にガイドピン用の溝が形成
されていることを特徴とする光導波路と光ファイバとの
結合構造。
1. A coupling structure of an optical waveguide and an optical fiber, wherein the optical waveguide substrate and the optical fiber holding member are positioned via a guide pin and the optical fiber is coupled to an end face of the optical waveguide. The substrate comprises a first substrate having an optical waveguide and a second substrate made of a material different from that of the first substrate and having the first substrate mounted thereon. The coupling structure of an optical waveguide and an optical fiber, wherein the second substrate is flattened by surface polishing, and a groove for a guide pin is further formed in the second substrate.
【請求項2】 前記第1の基板はLiNbO3 結晶を用
いて形成され、第2の基板はSiを用いて形成されてい
ることを特徴とする請求項第1記載の光導波路と光ファ
イバとの結合構造。
2. The optical waveguide and the optical fiber according to claim 1, wherein the first substrate is made of LiNbO 3 crystal and the second substrate is made of Si. Bond structure.
JP2829392A 1992-02-14 1992-02-14 Coupling structure between optical waveguide and optical fiber Expired - Fee Related JP3065159B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990061766A (en) * 1997-12-31 1999-07-26 윤종용 Optical fiber and optical waveguide device connection structure
US6226429B1 (en) 1998-04-14 2001-05-01 Nippon Telegraph And Telephone Corporation Manufacturing method for optical waveguide device
JP2009031780A (en) * 2007-06-26 2009-02-12 Panasonic Electric Works Co Ltd Optical module
WO2014095391A1 (en) * 2012-12-19 2014-06-26 Reichle & De-Massari Ag Optical printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990061766A (en) * 1997-12-31 1999-07-26 윤종용 Optical fiber and optical waveguide device connection structure
US6226429B1 (en) 1998-04-14 2001-05-01 Nippon Telegraph And Telephone Corporation Manufacturing method for optical waveguide device
JP2009031780A (en) * 2007-06-26 2009-02-12 Panasonic Electric Works Co Ltd Optical module
US20100220957A1 (en) * 2007-06-26 2010-09-02 Panasonic Electric Works Co., Ltd. Optical module
US8391657B2 (en) 2007-06-26 2013-03-05 Panasonic Corporation Optical module
WO2014095391A1 (en) * 2012-12-19 2014-06-26 Reichle & De-Massari Ag Optical printed circuit board

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