JPH05223340A - Water boiler - Google Patents
Water boilerInfo
- Publication number
- JPH05223340A JPH05223340A JP2240492A JP2240492A JPH05223340A JP H05223340 A JPH05223340 A JP H05223340A JP 2240492 A JP2240492 A JP 2240492A JP 2240492 A JP2240492 A JP 2240492A JP H05223340 A JPH05223340 A JP H05223340A
- Authority
- JP
- Japan
- Prior art keywords
- water
- heater
- water pipe
- semiconductor element
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 238000010276 construction Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Housings, Intake/Discharge, And Installation Of Fluid Heaters (AREA)
- Heat-Pump Type And Storage Water Heaters (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子を利用した
制御回路を有する湯沸器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water heater having a control circuit using semiconductor elements.
【０００２】[0002]
【従来の技術】近年、半導体素子を利用した制御回路を
有する湯沸器が広く用いられている。2. Description of the Related Art In recent years, a water heater having a control circuit using a semiconductor element has been widely used.
【０００３】従来、この種の湯沸器は図３に示すような
構成が一般的であった。以下、その構成について説明す
る。Conventionally, this kind of water heater has generally been constructed as shown in FIG. The configuration will be described below.
【０００４】図に示すように、湯沸器本体１は加熱ヒー
タ（図示せず）を有するタンク２と、前記タンク２内に
水を流入するための水パイプ１０と、前記水パイプ１０
の途中に設けた止水弁４と、前記止水弁４の２次側とな
るよう前記水パイプ１０に設けた流量検知手段５と、加
熱ヒータを制御するために加熱ヒータに直列につながれ
た半導体素子６を有して回路設計された制御回路７と、
加熱ヒータを制御中半導体素子６が発熱し冷却が必要な
ためアルミニウム等の放熱板１１とを有している。な
お、９は出湯パイプである。As shown in the figure, the water heater body 1 has a tank 2 having a heater (not shown), a water pipe 10 for introducing water into the tank 2, and the water pipe 10.
A water shutoff valve 4 provided in the middle of the water flow rate, a flow rate detection means 5 provided on the water pipe 10 so as to be on the secondary side of the water shutoff valve 4, and a heater connected in series to control the heater. A control circuit 7 having a semiconductor element 6 and having a circuit design,
Since the semiconductor element 6 generates heat during the control of the heater and needs to be cooled, the heat sink 11 is made of aluminum or the like. In addition, 9 is an outlet pipe.
【０００５】上記構成において、タンク２内の加熱ヒー
タが通電され、水パイプ１０より流入した水がタンク２
内で加熱され出湯パイプ９を通して湯が得られる。湯温
を調整するために設けられた制御回路７が加熱ヒータを
制御しているときは、加熱ヒータに直列につながれた半
導体素子６の通電率を制御することにより行っている。
このとき、半導体素子６が発熱するため冷却が必要で、
放熱板１１を介して大気に熱が奪われることにより冷却
されるようになっている。In the above structure, the heater in the tank 2 is energized, and the water flowing from the water pipe 10 flows into the tank 2.
It is heated inside and hot water is obtained through the hot water discharge pipe 9. When the control circuit 7 provided for adjusting the hot water temperature controls the heater, the control is performed by controlling the energization rate of the semiconductor element 6 connected in series with the heater.
At this time, since the semiconductor element 6 generates heat, cooling is required,
The heat is drawn to the atmosphere via the heat dissipation plate 11 to be cooled.
【０００６】[0006]
【発明が解決しようとする課題】このような従来の湯沸
器では、加熱ヒータの電気負荷が大きい場合には、半導
体素子６の発熱が大きくなるため冷却を充分しなければ
ならず、そのために放熱板１１を大きくしなければなら
なかったり、また、湯沸器本体１内部は、タンク２の放
熱により温かくなるので、大気放熱による冷却は充分行
いにくいという問題を有していた。In such a conventional water heater, when the electric load of the heater is large, the semiconductor element 6 generates a large amount of heat, and therefore must be sufficiently cooled. There is a problem that the radiator plate 11 must be made large, and the inside of the water heater body 1 becomes warm due to the heat radiation of the tank 2, so that it is difficult to sufficiently cool it by atmospheric heat radiation.
【０００７】本発明は上記問題を解決するもので、制御
回路の半導体素子を充分冷却できる湯沸器を提供するこ
とを目的としている。The present invention solves the above problems, and an object of the present invention is to provide a water heater capable of sufficiently cooling a semiconductor element of a control circuit.
【０００８】[0008]
【課題を解決するための手段】本発明は上記目的を達成
するために、放熱板の片面には半導体素子を取り付け、
もう片面を水パイプ表面に取り付ける構成とした。ま
た、前記水パイプ表面は、放熱板を取り付ける部分を平
らな面としてなるものである。In order to achieve the above object, the present invention has a semiconductor element mounted on one surface of a heat sink,
The other side was attached to the surface of the water pipe. In addition, the surface of the water pipe has a flat surface on which the heat dissipation plate is attached.
【０００９】[0009]
【作用】本発明は上記した構成において、制御回路の半
導体素子は水パイプを流れる水の水温を利用して充分に
冷却することとなる。According to the present invention, in the above structure, the semiconductor element of the control circuit is sufficiently cooled by utilizing the temperature of the water flowing through the water pipe.
【００１０】[0010]
【実施例】以下、本発明の一実施例について図１および
図２を参照しながら説明する。なお、従来例で説明した
ものと同一構成部材には同一番号を用いる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same numbers are used for the same components as those described in the conventional example.
【００１１】図に示すように、湯沸器本体１は加熱ヒー
タを有するタンク２と、前記タンク２内に水を流入する
ための水パイプ３と、前記水パイプ３の途中に設けた止
水弁４と、前記止水弁４の２次側となるよう前記水パイ
プ３に設けた流量検知手段５と、加熱ヒータを制御する
ために加熱ヒータに直列につながれた半導体素子６を有
して回路設計された制御回路７と、加熱ヒータを制御中
半導体素子６が発熱し冷却が必要なための放熱板８とを
有し、前記放熱板８の片面には前記半導体素子６を取り
付け、もう片面は水パイプ３表面の平らな面を有してい
る部分に取り付けられている。なお、９は出湯パイプで
ある。As shown in the figure, the water heater body 1 has a tank 2 having a heater, a water pipe 3 for flowing water into the tank 2, and a water stop provided in the middle of the water pipe 3. A valve 4, a flow rate detecting means 5 provided on the water pipe 3 so as to be on the secondary side of the water shutoff valve 4, and a semiconductor element 6 connected in series to the heater to control the heater. The semiconductor device 6 has a circuit-designed control circuit 7 and a heat dissipation plate 8 for cooling the semiconductor device 6 while the heater is being controlled, and the semiconductor device 6 is attached to one surface of the heat dissipation plate 8. One side is attached to a portion of the surface of the water pipe 3 having a flat surface. In addition, 9 is an outlet pipe.
【００１２】上記構成において、タンク２内の加熱ヒー
タが通電され、水パイプ３より流入した水がタンク２内
で加熱され出湯パイプ９を通して湯が得られる。湯温を
調整するために設けられた制御回路７が加熱ヒータを制
御しているときは、加熱ヒータに直列につながれた半導
体素子６の通電率を制御することにより行っている。こ
のとき、半導体素子６が発熱するため冷却が必要で、水
パイプ３に取り付けられた放熱板８を通して熱が奪われ
るため冷却される。また、水パイプ３は、放熱効果が大
きくなるように平らな面を有しており、そこに放熱板８
を取り付けているため、より充分な冷却が可能となる。In the above structure, the heater in the tank 2 is energized, the water flowing in from the water pipe 3 is heated in the tank 2, and hot water is obtained through the hot water discharge pipe 9. When the control circuit 7 provided for adjusting the hot water temperature controls the heater, the control is performed by controlling the energization rate of the semiconductor element 6 connected in series with the heater. At this time, the semiconductor element 6 generates heat and thus needs to be cooled, and heat is taken away through the heat dissipation plate 8 attached to the water pipe 3, so that the semiconductor element 6 is cooled. In addition, the water pipe 3 has a flat surface so that the heat radiation effect is large, and the heat radiation plate 8 is provided there.
Since it is attached, more sufficient cooling is possible.
【００１３】このように本発明の実施例の湯沸器によれ
ば、制御回路７の半導体素子６が、放熱板８を介し水パ
イプ３に取り付けられているので、水温を利用して充分
に冷却することができる。As described above, according to the water heater of the embodiment of the present invention, since the semiconductor element 6 of the control circuit 7 is attached to the water pipe 3 via the heat radiating plate 8, it is possible to sufficiently utilize the water temperature. Can be cooled.
【００１４】[0014]
【発明の効果】以上の実施例の説明から明らかなよう
に、本発明によれば制御回路の半導体素子が、放熱板を
介し水パイプに取り付けられているので、水温を利用し
て充分に冷却することができる。また、水で冷却するた
め大気放熱式の放熱板より小さく安価な放熱板で半導体
素子の冷却ができる。As is apparent from the above description of the embodiments, according to the present invention, the semiconductor element of the control circuit is attached to the water pipe through the heat radiating plate, so that the water temperature is utilized for sufficient cooling. can do. Further, since the cooling is performed with water, the semiconductor element can be cooled with a heat radiating plate which is smaller and less expensive than the heat radiating plate of the air radiating type.
【図１】本発明の一実施例の湯沸器の概略側面図FIG. 1 is a schematic side view of a water heater according to an embodiment of the present invention.
【図２】図１に示すＡ−Ａ′断面図FIG. 2 is a sectional view taken along the line AA ′ shown in FIG.
【図３】従来の湯沸器の概略側面図FIG. 3 is a schematic side view of a conventional water heater.
２ タンク ３ 水パイプ ４ 止水弁 ５ 流量検知手段 ６ 半導体素子 ７ 制御回路 ８ 放熱板 ９ 出湯パイプ 2 tank 3 water pipe 4 water stop valve 5 flow rate detection means 6 semiconductor element 7 control circuit 8 heat sink 9 hot water pipe
Claims (2)
内に水を流入するための水パイプと、この水パイプの途
中に設けた止水弁と、この止水弁の２次側となるよう前
記水パイプに設けた流量検知手段と、半導体素子を有し
前記加熱ヒータを制御する制御回路を備え、前記半導体
素子は放熱板の片面に取り付けられ、放熱板の他面を前
記水パイプ表面に取り付けてなる湯沸器。1. A tank having a heater, a water pipe for flowing water into the tank, a water stop valve provided in the middle of the water pipe, and a secondary side of the water stop valve. The water pipe has a flow rate detecting means and a control circuit having a semiconductor element for controlling the heater. The semiconductor element is attached to one surface of a heat radiating plate, and the other surface of the heat radiating plate is attached to the water pipe surface. An attached water heater.
らな面とした請求項１記載の湯沸器。2. A water heater according to claim 1, wherein the water pipe has a flat surface at a portion to which the heat radiating plate is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2240492A JP2888009B2 (en) | 1992-02-07 | 1992-02-07 | Water heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2240492A JP2888009B2 (en) | 1992-02-07 | 1992-02-07 | Water heater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05223340A true JPH05223340A (en) | 1993-08-31 |
| JP2888009B2 JP2888009B2 (en) | 1999-05-10 |
Family
ID=12081730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2240492A Expired - Fee Related JP2888009B2 (en) | 1992-02-07 | 1992-02-07 | Water heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2888009B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11141836B2 (en) | 2017-11-24 | 2021-10-12 | Jongduck CHAE | Method of fabricating sandpaper for grinding industrial parts and sandpaper fabricated by the method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101933170B1 (en) * | 2017-04-10 | 2019-02-01 | (주)디에스에이치 | Fluid heating device |
-
1992
- 1992-02-07 JP JP2240492A patent/JP2888009B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11141836B2 (en) | 2017-11-24 | 2021-10-12 | Jongduck CHAE | Method of fabricating sandpaper for grinding industrial parts and sandpaper fabricated by the method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2888009B2 (en) | 1999-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |