JPH0521816A - Manufacture of optical element - Google Patents
Manufacture of optical elementInfo
- Publication number
- JPH0521816A JPH0521816A JP16965391A JP16965391A JPH0521816A JP H0521816 A JPH0521816 A JP H0521816A JP 16965391 A JP16965391 A JP 16965391A JP 16965391 A JP16965391 A JP 16965391A JP H0521816 A JPH0521816 A JP H0521816A
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- light source
- optical
- light
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Optical Head (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、光を用いて情報を記
録、再生する光記憶の分野において、光ヘッドを構成す
る光素子の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an optical element constituting an optical head in the field of optical storage for recording and reproducing information by using light.
【0002】[0002]
【従来の技術】従来、光記憶媒体からの光を4つの光電
変換素子の方向へ分割する2つの不等周期回折格子領域
から成る回折手段と、該回折手段と集光レンズとから成
る非点収差発生手段と、前記回折手段の0次回折光の光
軸を中心として放射状に長軸方向が配置された帯状の4
つの前記光電変換素子と、光源とを有する光素子の製造
方法において、前記光源の実装方法に関しては、何等限
定されていなかった。2. Description of the Related Art Conventionally, a diffractive means composed of two unequal periodic diffraction grating regions for dividing light from an optical storage medium in the direction of four photoelectric conversion elements, and an astigmatism composed of the diffractive means and a condenser lens. Aberration generating means and a strip-shaped 4 in which the major axis direction is arranged radially about the optical axis of the 0th-order diffracted light of the diffracting means.
In the method of manufacturing an optical element having two photoelectric conversion elements and a light source, the mounting method of the light source is not limited in any way.
【0003】[0003]
【発明が解決しようとする課題】しかし、上述したよう
な、光源と光電変換素子等を1つのパッケージに実装す
る光ヘッドの場合、光電変換素子と光源を互いに極めて
高い位置精度で実装しないとフォーカシングエラーとト
ラッキングエラー信号を得ることができなくなる。However, in the case of the optical head in which the light source, the photoelectric conversion element and the like are mounted in one package as described above, the photoelectric conversion element and the light source must be mounted with extremely high positional accuracy for focusing. The error and tracking error signals cannot be obtained.
【0004】そこで本発明はこのような課題を解決する
もので、その目的とするところは極めて高い位置精度で
光源を実装可能とする光素子の製造方法を提供するとこ
ろにある。Therefore, the present invention solves such a problem, and an object of the present invention is to provide a method of manufacturing an optical element capable of mounting a light source with extremely high positional accuracy.
【0005】[0005]
【課題を解決するための手段】このような課題を解決す
るために本発明は、光記憶媒体からの光を4つの光電変
換素子の方向へ分割する2つの不等周期回折格子領域か
ら成る回折手段と、該回折手段と集光レンズとから成る
非点収差発生手段と、前記回折手段の0次回折光の光軸
を中心として放射状に長軸方向が配置された帯状の4つ
の前記光電変換素子と、光源とを有する光素子の製造方
法において、前記光電変換素子が実装される台座面を基
準として前記光源を実装することを特徴とする。SUMMARY OF THE INVENTION In order to solve such a problem, the present invention provides a diffraction consisting of two unequal periodic diffraction grating regions for dividing light from an optical storage medium into four photoelectric conversion elements. Means, astigmatism generating means including the diffracting means and a condenser lens, and four strip-shaped photoelectric conversion elements in which the major axis direction is arranged radially around the optical axis of the 0th-order diffracted light of the diffracting means. And a light source, wherein the light source is mounted on the basis of a pedestal surface on which the photoelectric conversion element is mounted.
【0006】[0006]
【実施例】図1は本発明の実施例を示す光素子の正面図
(a)と上視図(b)である。台座104はパッケージ
の一部で、パッケージ底面が図1(a)の紙面と平行に
あり台座104が底面上に突起している。この台座10
4に光源及び光電変換素子を実装する方法を以下に述べ
る。FIG. 1 is a front view (a) and a top view (b) of an optical element showing an embodiment of the present invention. The pedestal 104 is a part of the package, the bottom surface of the package is parallel to the paper surface of FIG. 1A, and the pedestal 104 is projected on the bottom surface. This pedestal 10
A method of mounting the light source and the photoelectric conversion element on the optical disc 4 will be described below.
【0007】まずサブマウント103をy軸方向から台
座104にダイボンドする。この時、実装装置のモニタ
ー画面にはx軸と平行に2本の直線107、108が表
示されており、その間隔は、光源と1次回折光の受光面
のz軸方向の距離と、1次回折光を受光する光電変換素
子基板の厚みを加えたものに、画面上の倍率で等しくな
っている。まずモニタ画面で直線107と台座104の
光電変換素子基板実装面を一致させ、次にサブマウント
103の端面が直線108と一致するようにy軸方向か
ら台座104にダイボンドする。ダイボンドはサブマウ
ント103の実装面に蒸着された融着用金属に熱を加え
溶かしながら押し付けることによって行なわれる。First, the submount 103 is die-bonded to the pedestal 104 from the y-axis direction. At this time, two straight lines 107 and 108 are displayed in parallel with the x-axis on the monitor screen of the mounting apparatus, and the distance between them is the distance between the light source and the light-receiving surface of the first-order diffracted light in the z-axis direction and the next time. The magnification on the screen is equal to the thickness of the photoelectric conversion element substrate that receives the folded light. First, on the monitor screen, the straight line 107 is aligned with the photoelectric conversion element substrate mounting surface of the pedestal 104, and then die-bonded from the y-axis direction to the pedestal 104 so that the end surface of the submount 103 is aligned with the straight line 108. Die bonding is performed by applying heat to the fusing metal vapor-deposited on the mounting surface of the submount 103 while pressing it while melting.
【0008】次に光源となる半導体レーザ102をサブ
マウント103へy軸方向からダイボンドする。この時
にも半導体レーザ102の出射端面と直線108が一致
するように位置決めし、半導体レーザ102の面に蒸着
された融着用金属に熱を加え溶かしながら押し付けるこ
とによって行なわれる。Next, the semiconductor laser 102 serving as a light source is die-bonded to the submount 103 in the y-axis direction. Also at this time, positioning is performed so that the emission end face of the semiconductor laser 102 and the straight line 108 are aligned with each other, and heat is applied to the fusion metal deposited on the surface of the semiconductor laser 102 while being melted and pressed.
【0009】この様に位置決めされたことにより、たと
えz軸方向に台座104の光源用台座端と光電変換素子
台座面の位置がずれていても、光源は光電変換素子の台
座面を基準に実装されるので、光電変換素子基板のz軸
方向の厚さのみ管理すれば、光源と光電変換素子受光面
の距離は必ず正しい位置関係で実装できる。Due to such positioning, the light source is mounted on the basis of the pedestal surface of the photoelectric conversion element even if the light source pedestal end of the pedestal 104 and the photoelectric conversion element pedestal surface are displaced in the z-axis direction. Therefore, by managing only the thickness of the photoelectric conversion element substrate in the z-axis direction, the distance between the light source and the photoelectric conversion element light-receiving surface can be mounted in a correct positional relationship without fail.
【0010】この後、半導体レーザ102とパッケージ
に設けられた端子間をワイヤボンドし半導体レーザ10
2を駆動できるようにする。Thereafter, the semiconductor laser 102 and the terminals provided on the package are wire-bonded to each other to form the semiconductor laser 10.
2 can be driven.
【0011】光電変換素子となる4つのフォトダイオー
ド105A、105B、105C、105Dはそれぞ
れ、基板106Aにフォトダイオード105Aと105
B、基板106Bにフォトダイオード105Cと105
Dが形成されている。The four photodiodes 105A, 105B, 105C and 105D serving as photoelectric conversion elements are provided on the substrate 106A, respectively.
B, the photodiodes 105C and 105 on the substrate 106B.
D is formed.
【0012】基板106A、106Bを実装する際、半
導体レーザ102を駆動し発光させる。実装装置のモニ
ター画面を観ながら4つのフォトダイオードが発光点1
01をとおるy軸に対象でかつ放射状に配列するように
基板106A、106Bをz軸方向からダイボンドす
る。When mounting the substrates 106A and 106B, the semiconductor laser 102 is driven to emit light. Four photodiodes emit light 1 while looking at the monitor screen of the mounting device.
The substrates 106A and 106B are die-bonded from the z-axis direction so as to be symmetrically arranged in the y-axis passing through 01.
【0013】図2は本発明の実施例の実装後のパッケー
ジを示す斜視図である。この様に半導体レーザ102、
及びフォトダイオードを備えた基板106A、106B
を実装した後、各素子の電極と端子をワイヤボンドす
る。さらに検光子として偏光板を基板106A、106
Bの前に配置し、集光レンズと不等周期回折光子からな
る非点収差発生手段を配置して光素子を完成する。FIG. 2 is a perspective view showing a package after mounting according to the embodiment of the present invention. In this way, the semiconductor laser 102,
And substrates 106A and 106B provided with photodiodes
After mounting, the electrodes and terminals of each element are wire-bonded. Further, polarizing plates are used as analyzers for the substrates 106A and 106A.
The optical element is completed by arranging it in front of B and arranging an astigmatism generating means composed of a condenser lens and unequal period diffracted photons.
【0014】この様にして製造された光素子は、光信
号、エラー信号を検出するのに必要な光学部品が回折手
段だけで済むため極めて小型の光ヘッドを構成できる。The optical element manufactured in this manner can constitute an extremely small-sized optical head because the optical parts necessary for detecting the optical signal and the error signal only need the diffraction means.
【0015】[0015]
【発明の効果】以上述べたように本発明によれば、光電
変換素子を光源に対し極めて高い位置精度をもって実装
できるという効果を有する。同一パッケージに実装する
この様な光素子では、光電変換素子の面積も小さいう
え、製造後位置調整をすることができない。従って実装
の位置ずれの許容範囲がきびしい。しかし本発明では、
たとえ光軸方向に光源用台座端と光電変換素子台座面の
位置がずれていても、光源は光電変換素子の台座面を基
準に実装されるので、光電変換素子基板の光軸方向の厚
さのみ管理すれば、光源と光電変換素子受光面の距離は
必ず正しい位置関係で実装できる。即ち台座面の位置精
度をゆるくでき、パッケージ加工費用を大幅に安くでき
る。As described above, according to the present invention, the photoelectric conversion element can be mounted on the light source with extremely high positional accuracy. In such an optical element mounted in the same package, the area of the photoelectric conversion element is small and the post-manufacturing position adjustment cannot be performed. Therefore, the allowable range of mounting positional deviation is severe. However, in the present invention,
Even if the pedestal end for the light source and the photoelectric conversion element pedestal surface are misaligned in the optical axis direction, the light source is mounted with the pedestal surface of the photoelectric conversion element as a reference, so the thickness of the photoelectric conversion element substrate in the optical axis direction If managed only, the distance between the light source and the light receiving surface of the photoelectric conversion element can always be mounted in a correct positional relationship. That is, the position accuracy of the pedestal surface can be loosened, and the package processing cost can be significantly reduced.
【図面の簡単な説明】[Brief description of drawings]
【図1】本発明の実施例における光素子の正面図(a)
と上視図(b)である。FIG. 1 is a front view of an optical element according to an embodiment of the present invention (a).
Is a top view (b).
【図2】本発明の実施例における実装後のパッケージを
示す斜視図である。FIG. 2 is a perspective view showing a package after mounting in the embodiment of the present invention.
101 発光点 102 半導体レーザ 103 サブマウント 104 台座 105A、105B、105C、105D フォトダイ
オード 106A、106B 基板 107、108 モニタ上に描かれた直線101 light emitting point 102 semiconductor laser 103 submount 104 pedestal 105A, 105B, 105C, 105D photodiode 106A, 106B substrate 107, 108 straight line drawn on monitor
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01L 33/00 N 8934−4M H01S 3/18 9170−4M ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical indication H01L 33/00 N 8934-4M H01S 3/18 9170-4M
Claims (1)
子の方向へ分割する2つの不等周期回折格子領域から成
る回折手段と、該回折手段と集光レンズとから成る非点
収差発生手段と、前記回折手段の0次回折光の光軸を中
心として放射状に長軸方向が配置された帯状の4つの前
記光電変換素子と、光源とを有する光素子の製造方法に
おいて、前記光電変換素子が実装される台座面を基準と
して前記光源を実装することを特徴とする光素子の製造
方法。Claim: What is claimed is: 1. A diffractive means comprising two unequal-period diffraction grating regions for dividing light from an optical storage medium in the direction of four photoelectric conversion elements, the diffractive means and a condenser lens. A method of manufacturing an optical element comprising: an astigmatism generating means, and four strip-shaped photoelectric conversion elements whose major axis direction is arranged radially around the optical axis of the 0th-order diffracted light of the diffracting means. 2. The method for manufacturing an optical element according to, wherein the light source is mounted on the basis of a pedestal surface on which the photoelectric conversion element is mounted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16965391A JPH0521816A (en) | 1991-07-10 | 1991-07-10 | Manufacture of optical element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16965391A JPH0521816A (en) | 1991-07-10 | 1991-07-10 | Manufacture of optical element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0521816A true JPH0521816A (en) | 1993-01-29 |
Family
ID=15890458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16965391A Pending JPH0521816A (en) | 1991-07-10 | 1991-07-10 | Manufacture of optical element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0521816A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07228428A (en) * | 1994-02-17 | 1995-08-29 | Nikko Kinzoku Kk | Spacer for continuous coil |
-
1991
- 1991-07-10 JP JP16965391A patent/JPH0521816A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07228428A (en) * | 1994-02-17 | 1995-08-29 | Nikko Kinzoku Kk | Spacer for continuous coil |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910004265B1 (en) | Semiconductor laser system and manufacture method and light head | |
JP2004227746A (en) | Optical pickup device and semiconductor laser device | |
US7292519B2 (en) | Optical head with lasers and mirrors in a recess formed in a substrate | |
US20010048654A1 (en) | Optical pickup apparatus | |
JPH0521816A (en) | Manufacture of optical element | |
JP2002025104A (en) | Integrated optical head device | |
JP3361335B2 (en) | Semiconductor laser device | |
JP3261794B2 (en) | Light head | |
JP2796226B2 (en) | Integrated optical element | |
JP2001143297A (en) | 3-laser module and optical head or optical information medium recorder-reproducer using the module | |
JPH05181026A (en) | Optical integrated circuit and its manufacture | |
JP3457982B2 (en) | Optical semiconductor device and method of manufacturing the same | |
JPH01303638A (en) | Optical pickup device | |
JPH1027374A (en) | Semiconductor laser module | |
JPH04349233A (en) | Optical element and its packaging method | |
JPH0521815A (en) | Manufacture of optical element | |
JPH04348576A (en) | Method for mounting optical element | |
JPH04348578A (en) | Optical element | |
JPS62145546A (en) | Optical disk information reproducing device | |
JP3351863B2 (en) | Semiconductor laser device | |
JPH0765398A (en) | Light emitting and receiving element device | |
Kim et al. | Ultra Small Optical Pick-up Module | |
JPH01102509A (en) | Adjusting and fixing method for light receiving element | |
JPH0821754B2 (en) | Optical device | |
JPH04349234A (en) | Optical element |