JPH05217750A - Chip inductor - Google Patents

Chip inductor

Info

Publication number
JPH05217750A
JPH05217750A JP5612992A JP5612992A JPH05217750A JP H05217750 A JPH05217750 A JP H05217750A JP 5612992 A JP5612992 A JP 5612992A JP 5612992 A JP5612992 A JP 5612992A JP H05217750 A JPH05217750 A JP H05217750A
Authority
JP
Japan
Prior art keywords
coil
liquid crystal
metal terminal
chip inductor
crystal polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5612992A
Other languages
Japanese (ja)
Inventor
Kuniji Mototani
国次 本谷
Tadashi Sato
匡 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FDK Corp
Original Assignee
FDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FDK Corp filed Critical FDK Corp
Priority to JP5612992A priority Critical patent/JPH05217750A/en
Publication of JPH05217750A publication Critical patent/JPH05217750A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To provide a heat-resistant inductor of good quality easy to produce in shorter molding time. CONSTITUTION:A coil 12 is attached to the heads of two T-shaped metallic terminal plates 10 and 11, which are on opposite sides of the coil 12 in such a manner that their heads are opposed. The coil ends 14a and 14b are spot- welded to terminals 10b, 10c, 11b, and 11c on the terminal plates. The coil and the whole or part of the terminal plates, including the terminals, are molded in a package 16. The mold package is made of heat-resistant liquid crystal polymer that contains 30-50% filling agent composed of inorganic filler and/or glass fibers. The liquid crystal polymer is of an I-type thermotropic liquid crystal polyester, which has strong molecular chains of linearly-linked benzene rings.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、チップインダクタに関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip inductor.

【0002】[0002]

【従来の技術】近年、電子機器の小型化にともない各種
電子部品のチップ化が図られている。そして、リードレ
ス(面実装タイプ)のチップ部品は、高密度自動実装技
術、リフロー半田付け技術の進展及び電子機器の多機能
化にともない、個々のチップ部品に対し従来よりいっそ
う高い信頼性が要求されるとともに、その仕様も多種の
ものとなる。そして、従来のチップインダクタの一例を
示すと、例えば特開昭62−5618号公報に開示され
たものがある。
2. Description of the Related Art In recent years, various electronic parts have been made into chips in accordance with the miniaturization of electronic devices. Leadless (surface mount type) chip parts require higher reliability than before due to the development of high-density automatic mounting technology, reflow soldering technology, and multifunction of electronic equipment. At the same time, the specifications will vary. An example of a conventional chip inductor is disclosed in Japanese Laid-Open Patent Publication No. 62-5618.

【0003】すなわち、図5に示すように、ドラムコア
1に巻線2を施すことによりコイル素子3が製造され
る。そして、このコイル素子3を相対する金属端子板4
の先端上面に跨がるようにして装着した後、巻線2の端
部であるコイル引出線5を金属端子板4の先端部に突出
形成した端子部6に半田付けにて電気・機械的に接続す
る。
That is, as shown in FIG. 5, a coil element 3 is manufactured by winding a winding 2 on a drum core 1. Then, the metal terminal plate 4 facing the coil element 3
After being mounted so as to straddle the upper surface of the tip of the wire, the coil lead wire 5 which is the end of the winding 2 is soldered to the terminal portion 6 projectingly formed at the tip of the metal terminal plate 4 for electrical and mechanical Connect to.

【0004】さらに、コイル素子3並びに金属端子板4
の一部(端子部6を含む)を外装成形体7で囲繞してい
る。この外装成形体7により、水分,振動などの外部環
境から保護するとともに電気絶縁を図るようになってい
る。なお、金属端子板4の基端側は略コ字状に折曲さ
れ、その端部4aは外装成形体7の底部外側に位置させ
ており、実装回路への取付面となる。
Further, the coil element 3 and the metal terminal plate 4
A part (including the terminal portion 6) of the above is surrounded by the exterior molded body 7. This exterior molded body 7 is designed to protect from the external environment such as moisture and vibration and to be electrically insulated. The base end side of the metal terminal plate 4 is bent into a substantially U-shape, and the end portion 4a is located outside the bottom portion of the exterior molded body 7 and serves as a mounting surface for a mounting circuit.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記し
た従来のチップインダクタでは、以下に示す問題を有し
ている。すなわち、外装成形体7は、通常エポキシ樹脂
やジアリルフタレート等の耐熱性の低い熱硬化性樹脂が
用いられていたため、成形時に時間を要し(50〜80
sec)、量産性が悪い。従って、量産性を上げるため
には、一回の成形に多数の製品を製造する必要がある
が、係る場合には、金型内での各部の成形圧のばらつき
が大きくなる(中央部分と周囲部分で充填圧力が均一で
ない)ため、最終的な製品の特性にもばらつきを生じ
る。
However, the above-mentioned conventional chip inductor has the following problems. That is, since the exterior molded body 7 is usually made of a thermosetting resin having low heat resistance such as epoxy resin or diallyl phthalate, it takes time at the time of molding (50 to 80).
sec), mass productivity is poor. Therefore, in order to improve mass productivity, it is necessary to manufacture a large number of products in one molding, but in such a case, there is a large variation in the molding pressure of each part in the mold (center part and surrounding parts). Since the filling pressure is not uniform in the part), the final product characteristics also vary.

【0006】また、エポキシ樹脂の場合には、成形時に
バリを生じてしまうため、そのバリを除去する後工程を
要してしまう。さらに、エポキシ樹脂は線膨張係数が大
きいため、成形時或いはその後の使用時における温度変
化にともなう外装成形体7の膨脹・収縮によりコイル引
出線5と端子部6とを接続している半田剥がれや,引出
し線の断線等が発生してしまい、接続不良となるおそれ
がある。
Further, in the case of an epoxy resin, burrs are generated during molding, so that a post process for removing the burrs is required. Further, since the epoxy resin has a large coefficient of linear expansion, the expansion / contraction of the exterior molded body 7 due to the temperature change during molding or during subsequent use causes peeling of the solder connecting the coil lead wire 5 and the terminal portion 6. , Breakage of the lead wire may occur, resulting in poor connection.

【0007】さらにまた、図3に示すように、温度変化
に対するインダクタンスの変化率が大きいため、設計が
煩雑のみならず使用温度環境の変化が大きいところでの
使用が困難となる。
Furthermore, as shown in FIG. 3, since the rate of change of the inductance with respect to the temperature change is large, not only is the design complicated, but it is difficult to use it in a place where the operating temperature environment changes greatly.

【0008】本発明は、上記した背景に鑑みてなされた
もので、その目的とするところは、成形時間が短いとと
もに製造が容易で、しかも熱に強く品質の良好なインダ
クタを提供することにある。
The present invention has been made in view of the above background, and an object of the present invention is to provide an inductor which is short in molding time, easy to manufacture, resistant to heat, and good in quality. ..

【0009】[0009]

【課題を解決するための手段】上記した目的を達成する
ため、本発明に係るチップインダクタでは、相対した一
対の金属端子板の対向する先端上面にコイル素子を装着
するとともに、そのコイル素子のコイル引出線を前記金
属端子板の先端側所定位置に形成した端子部に接続し、
かつ、前記コイル素子並びに少なくとも前記端子部を含
む前記金属端子板の一部を外装成形体で囲繞してなるチ
ップインダクタにであって、前記外装成形体をフィラー
またはガラスファイバーの少なくとも一方からなる充填
材を配合した耐熱性の良好な液晶ポリマーで構成した。
In order to achieve the above-mentioned object, in a chip inductor according to the present invention, a coil element is mounted on the upper surfaces of opposing ends of a pair of metal terminal plates facing each other, and the coil of the coil element is mounted. Connect the lead wire to the terminal portion formed at a predetermined position on the tip side of the metal terminal plate,
A chip inductor formed by surrounding a part of the metal terminal plate including the coil element and at least the terminal portion with an exterior molded body, wherein the exterior molded body is filled with at least one of filler and glass fiber. It is composed of a liquid crystal polymer having a good heat resistance in which a material is mixed.

【0010】[0010]

【作用】耐熱性良好な液晶ポリマーに所定の充填材を混
入すると、耐熱性(熱変形温度)を低下させることなく
成形性(充填)が良好となる。よって、金型内に短時間
で充填し、成形することができ、しかも、液晶ポリマー
は成形時にバリ等が生じない。上記液晶ポリマーは、エ
ポキシ樹脂等に比し、線膨脹係数が低いため、温度変化
により外装成形体の体積の変動量が少ない。よって、温
度変化があったとしてもコイル引出線と端子部との接続
部位に強い力が加わらず、接続が剥がれることがない。
When a predetermined filler is mixed with a liquid crystal polymer having good heat resistance, moldability (filling) is improved without lowering heat resistance (heat distortion temperature). Therefore, it can be filled in the mold in a short time and molded, and the liquid crystal polymer is free from burrs and the like during molding. Since the liquid crystal polymer has a lower coefficient of linear expansion than epoxy resin and the like, the volume variation of the exterior molded body due to temperature change is small. Therefore, even if there is a temperature change, a strong force is not applied to the connecting portion between the coil lead wire and the terminal portion, and the connection is not peeled off.

【0011】[0011]

【実施例】以下、本発明に係る好適な実施例を添付図面
を参照にして詳述する。図1に示すように、略一直線線
上に、一対の第1,第2の金属端子板10,11の先端
同士を対向配置する。この第1,第2の金属端子板1
0,11の先端は、平面略T字状に成形されており、そ
の先端中央部分は平面円弧状の凹所10a,11aが形
成されている。そして、それら両凹所10a,11a
は、ともに対向面側(先端部)が開口されており、さら
に両凹所10a,11aの円弧は、略同一半径で中心点
を同一としている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. As shown in FIG. 1, the tips of the pair of first and second metal terminal plates 10 and 11 are arranged to face each other on a substantially straight line. This first and second metal terminal board 1
The tip ends of 0 and 11 are formed in a substantially T-shape in a plane, and the central portion of the tip is formed with plane arcuate recesses 10a and 11a. And both of these recesses 10a, 11a
Both have opposing surfaces (tips) open, and the arcs of both recesses 10a and 11a have substantially the same radius and the same center point.

【0012】また、両金属端子板10,11のT字状の
両端部は、それぞれ第1の端子部10b,11b並びに
第2の端子部10c,11cとされている。さらに、両
金属端子板10,11の基端側10d,11dは略コ字
状に折曲されている。
Further, the T-shaped ends of both metal terminal plates 10 and 11 serve as first terminal portions 10b and 11b and second terminal portions 10c and 11c, respectively. Further, the base end sides 10d and 11d of both metal terminal plates 10 and 11 are bent in a substantially U-shape.

【0013】そして、上記両金属端子板10,11の対
向する先端上面に跨がるようにしてコイル素子12を装
着している。具体的には、このコイル素子12は、フェ
ライト等からなるドラムコア13に巻線14を巻回する
ことにより構成されており、そのドラムコア13の円板
状のフランジ13aを、上記両凹所10a,11a内に
略符合させることにより安定状態で装着している。そし
て、図2に示すように、装着後そのフランジ13aと両
金属端子板10,11(凹所10a,11a)とを、接
着剤15で接着一体化する。
Then, the coil element 12 is mounted so as to straddle the upper surfaces of the tips of the metal terminal plates 10 and 11 which face each other. Specifically, the coil element 12 is configured by winding a winding wire 14 around a drum core 13 made of ferrite or the like. It is mounted in a stable state by being roughly matched in 11a. Then, as shown in FIG. 2, after mounting, the flange 13 a and both metal terminal plates 10 and 11 (recesses 10 a and 11 a) are bonded and integrated with an adhesive 15.

【0014】さらに、巻線14の巻き初め側と巻き終わ
り側の両コイル引出線14a,14bは、それぞれ第
1,第2の金属端子板10,11に形成された一方の端
子部、本例では、ともに第1の端子部10b,11bに
対して溶接により電気・機械的に接続されている。
Further, the coil lead-out wires 14a and 14b on the winding start side and the winding end side of the winding wire 14 respectively have one terminal portion formed on the first and second metal terminal plates 10 and 11, respectively. Then, both are electrically and mechanically connected to the first terminal portions 10b and 11b by welding.

【0015】なお、使用する端子部の組み合わせは、任
意であり、上記組み合わせ以外に第1の金属端子板10
の第1の端子部10bと第2の金属端子板11の第2の
端子部11c,第1の金属端子板10の第2の端子部1
0cと第2の金属端子板11の第1の端子部11b(特
性的には前者と同等となる)並びに第1の金属端子板1
0の第2の端子部10cと第2の金属端子板11の第2
の端子部11cの組み合わせがあり、巻数の調整が行な
え所望のインダクタンスが得られる所定の組み合わせが
適宜選択される。
The combination of the terminal portions to be used is arbitrary, and in addition to the above combination, the first metal terminal board 10 can be used.
The first terminal portion 10b, the second terminal portion 11c of the second metal terminal plate 11, and the second terminal portion 1 of the first metal terminal plate 10.
0c and the first terminal portion 11b of the second metal terminal board 11 (characteristically equivalent to the former) and the first metal terminal board 1
0 second terminal portion 10c and second metal terminal plate 11 second
There is a combination of the terminal portions 11c, and a predetermined combination that can adjust the number of turns and obtain a desired inductance is appropriately selected.

【0016】そして、上記の両金属端子板10,11の
基端側10d,11dを除く部位並びにコイル素子12
を矩形状の外装成形体16で囲繞する。これによりチッ
プインダクタが構成され、外装成形体16の外側に露出
した前記基端側10d,11dがチップインダクタのコ
イル端子となる。
The portions of the metal terminal plates 10 and 11 other than the base end sides 10d and 11d and the coil element 12 are also described.
Is surrounded by a rectangular exterior molded body 16. Thus, the chip inductor is formed, and the base ends 10d and 11d exposed to the outside of the exterior molded body 16 serve as the coil terminals of the chip inductor.

【0017】ここで、本発明では、上記外装成形体16
をフィラーまたはガラスファイバーの少なくとも一方か
らなる充填材を混入した耐熱性の良好な液晶ポリマーで
形成している。この液晶ポリマーとしては、熱変形温度
が高く、かつ、立体形に成形できなければならないこと
から、例えば、サーモトロピック液晶ポリエステルのう
ち、ベンゼン環が直鎖状に連なった剛直な分子鎖をも
つ、I型の液晶ポリマーと称されるものが好ましい。こ
のI型の液晶ポリマーは、熱変形温度が250〜350
℃であり、最も優れた耐熱性をもっている。このように
耐熱性が良好なことから、製造されたチップインダクタ
を実装基板上へ装着するに際し、従来使用できなかった
高温半田による半田付けが可能となる。
Here, in the present invention, the exterior molded body 16 is formed.
Is formed of a liquid crystal polymer having good heat resistance mixed with a filler made of at least one of filler and glass fiber. The liquid crystal polymer has a high heat distortion temperature and must be able to be molded into a three-dimensional shape. Therefore, for example, among thermotropic liquid crystal polyesters, a benzene ring has a rigid molecular chain in a linear chain, What is called an I-type liquid crystal polymer is preferable. This type I liquid crystal polymer has a heat distortion temperature of 250 to 350.
It is ℃ and has the best heat resistance. Since the heat resistance is good as described above, when mounting the manufactured chip inductor on the mounting substrate, it is possible to perform soldering with high-temperature solder which cannot be used conventionally.

【0018】そして、上記の液晶ポリマーに対して、無
機フィラーまたはガラスファイバーのうち少なくとも一
方からなる充填材を配合するのであるが、この配合量と
しては、充填材を30〜50重量%程度とするのが好ま
しい。すなわち、その範囲より少ないと、成形時に金型
内に充填する際に、流れ方向に強く配向するという異方
性が強くあらわれ、成形時の充填圧力が高くなるからで
ある。逆に、上記の範囲より大きくすると、液晶ポリマ
ーのもつ耐熱性が劣化するからである。
Then, a filler made of at least one of an inorganic filler and a glass fiber is blended with the above liquid crystal polymer. The blending amount is about 30 to 50% by weight of the filler. Is preferred. That is, when the amount is less than the range, anisotropy of being strongly oriented in the flow direction is strongly exhibited when filling in the mold during molding, and the filling pressure during molding becomes high. On the other hand, if it is larger than the above range, the heat resistance of the liquid crystal polymer is deteriorated.

【0019】また、使用する液晶ポリマーとしては、実
験の結果、上記I型のものの中でも特に280〜320
℃とするのが好ましいことが判った。すなわち、これは
上記範囲を超えると無機フィラー等の充填材を所定量混
入することが困難となり、結果的に流動性が悪くなり充
填厚が高くなるからと考えられる。逆に上記範囲より低
いと耐熱性等に影響を生じるおそれが考えられ、また、
成形性も若干低下かることがあった。
As a liquid crystal polymer to be used, as a result of experiments, 280 to 320 are particularly preferable among the above-mentioned type I polymers.
It has been found that it is preferable to set the temperature to ° C. That is, it is considered that when the content exceeds the above range, it becomes difficult to mix a predetermined amount of a filler such as an inorganic filler, resulting in poor fluidity and a high filling thickness. On the contrary, if it is lower than the above range, heat resistance and the like may be affected.
Moldability was sometimes slightly reduced.

【0020】また上述したように、本例では所定の液晶
ポリマーを用いたため、外装成形体16を製造する際の
処理温度が高くなる。従って、その処理時における熱に
より各構成部品の劣化を生じないようにするため、本例
では、まず、巻線14の被膜を、耐熱性の高いポリエス
テルイミドまたはポリアミドイミドを用いて形成してい
る。また、コイル素子12と第1,第2の金属端子板1
0,11との接続を行う接着剤15として、ガラス転移
点の高い(110℃以上)エポキシ系の接着剤15を用
いている。
Further, as described above, since the predetermined liquid crystal polymer is used in this example, the processing temperature at the time of manufacturing the exterior molded body 16 becomes high. Therefore, in order to prevent the deterioration of each component due to heat during the treatment, in this example, first, the coating film of the winding wire 14 is formed by using polyesterimide or polyamideimide having high heat resistance. .. In addition, the coil element 12 and the first and second metal terminal plates 1
An epoxy adhesive 15 having a high glass transition point (110 ° C. or higher) is used as the adhesive 15 for connection with 0 and 11.

【0021】コイル引出線14a,14bと端子部10
b,10c,11b,11cとの接続は、上述したごと
く溶接(スポット溶接)にて行うようにしているが、さ
らに、接合強度を強くするために、端子部10b,10
c,11b,11cすなわち、両金属端子板10,11
を銅系の合金、例えばリン青銅で形成するとともに、そ
の表面にスズの比率が90%以上の半田メッキを施して
おくのが望ましい。かかる構成にすることにより、巻線
14(コイル引出線14a,14b)を構成する銅線
と、端子部10b,10c,11b,11cとが融合一
体化する。よって、溶接後、接続部位が剥がれたりする
ことがなくなる。
Coil lead wires 14a, 14b and terminal portion 10
The connection with b, 10c, 11b, 11c is performed by welding (spot welding) as described above, but in order to further increase the bonding strength, the terminal portions 10b, 10
c, 11b, 11c, that is, both metal terminal boards 10, 11
Is preferably formed of a copper alloy such as phosphor bronze, and the surface thereof is preferably plated with solder having a tin ratio of 90% or more. With such a configuration, the copper wire forming the winding 14 (coil lead-out wires 14a, 14b) and the terminal portions 10b, 10c, 11b, 11c are fused and integrated. Therefore, after welding, the connection portion is not peeled off.

【0022】さらにまた、得られるチップインダクタの
特性、すなわち、インダクタンスのばらつきを少なくす
べく、ドラムコア13を加圧特性(加圧に対するインダ
クタンスの変動量)の良好な材質で製造している。
Furthermore, in order to reduce the characteristics of the obtained chip inductor, that is, the variation in the inductance, the drum core 13 is manufactured from a material having a good pressurizing property (the amount of variation of the inductance with respect to pressurization).

【0023】そして、上記実施例におけるチップインダ
クタの温度変化に対するインダクタンスの変化率ΔL/
Lの一例を示すと、図3に実施線で示すようにその変動
率は破線で示した従来のものに比し、非常に小さくなっ
ていることがわかる。
Then, the rate of change of inductance ΔL / with respect to the temperature change of the chip inductor in the above embodiment.
When an example of L is shown, it can be seen that the variation rate is much smaller than that of the conventional one shown by the broken line as shown by the execution line in FIG.

【0024】*実験結果 上記した形状の金属端子板10,11上に、巻線(47
ターン)14を巻回したドラムコア13を装着し、その
周囲を無機フィラーを25%,ガラスファイバーを25
%混入した液晶ポリマーを用いて形成した外装成形体1
6で覆うことによりチップインダクタを製造した(サン
プル数96個)。この時のインダクタンスの目標値は1
8μHである。
* Experimental results On the metal terminal plates 10 and 11 having the above-mentioned shapes, the winding (47
Turn) 14 is mounted on the drum core 13, and 25% of inorganic filler and 25% of glass fiber are attached around the drum core 13.
Exterior molded body 1 formed by using liquid crystal polymer mixed with 1%
A chip inductor was manufactured by covering with 6 (96 samples). The target value of the inductance at this time is 1
It is 8 μH.

【0025】そして、実際に製造された素子のインダク
タンスは、図4に示すように17.640〜18.38
0μHとなり、平均値は18.053μHであった。ま
た、誤差は+2.1%,−2.0%となった。なお、従
来のジアリルフタレートを用いたものは±5%程度であ
る。一方、液晶ポリマーの混合量を替えた場合は、温度
特性、インダクタンスのバラツキに大差は無く、耐熱性
に変化が表れる程度であった。
The inductance of the actually manufactured element is 17.640 to 18.38 as shown in FIG.
It was 0 μH, and the average value was 18.053 μH. The errors were + 2.1% and -2.0%. In the case of using the conventional diallyl phthalate, it is about ± 5%. On the other hand, when the mixing amount of the liquid crystal polymer was changed, there was no great difference in the temperature characteristics and the variations in the inductance, and the heat resistance was changed.

【0026】なお、上記した実施例では、金属端子板1
0,11の先端をT字状にし、それぞれ2つの端子部1
0b,10c,11b,11cを設けたものについて説
明したが、本発明はこれに限ることなく、上記した従来
例に示したものの他、種々の構成のチップインダクタに
適用することができる。
In the above embodiment, the metal terminal plate 1
The ends of 0 and 11 are T-shaped, and each has two terminal parts 1
Although the devices provided with 0b, 10c, 11b and 11c have been described, the present invention is not limited to this, and can be applied to chip inductors of various configurations other than those shown in the above-mentioned conventional example.

【0027】[0027]

【発明の効果】以上のように、本発明に係るチップイン
ダクタでは、所定の液晶ポリマーを用いて外装成形体を
構成したため、その成形時間(金型の型締め,型開き時
間を含む)は10sec弱となり、短くなるため、飛躍
的に量産性が向上する。そして、成形時間が短くなるこ
とから一回に製造する個数を減らすことができ、場所に
よる成形圧力のばらつきが少なくなり、品質の安定化が
図れる。さらに、熱的に安定で、耐熱性も良好で、しか
も、コイル引出線と端子部との断線のおそれが可及的に
減少する。
As described above, in the chip inductor according to the present invention, since the exterior molding is made of a predetermined liquid crystal polymer, the molding time (including mold clamping and mold opening time) is 10 seconds. Since it becomes weaker and shorter, mass productivity is dramatically improved. Further, since the molding time is shortened, the number of products manufactured at one time can be reduced, the variation of the molding pressure depending on the place is reduced, and the quality can be stabilized. Furthermore, it is thermally stable and has good heat resistance, and the risk of disconnection between the coil lead wire and the terminal portion is reduced as much as possible.

【図面の簡単な説明】[Brief description of drawings]

【図1】(A)は本発明に係るチップインダクタの好適
な一実施例を示す斜視図である。(B)は金属端子板の
先端部分を示す平面図である。
FIG. 1A is a perspective view showing a preferred embodiment of a chip inductor according to the present invention. FIG. 3B is a plan view showing a tip portion of the metal terminal plate.

【図2】図1(B)に示された部分の縦断面図である。FIG. 2 is a vertical cross-sectional view of the portion shown in FIG.

【図3】本発明並びに従来のチップインダクタの温度特
性を示すグラフである。
FIG. 3 is a graph showing temperature characteristics of the present invention and the conventional chip inductor.

【図4】実験結果の一例を示すグラフである。FIG. 4 is a graph showing an example of experimental results.

【図5】従来のチップインダクタの一例を示す斜視図で
ある。
FIG. 5 is a perspective view showing an example of a conventional chip inductor.

【符号の説明】[Explanation of symbols]

10 第1の金属端子板 11 第2の金属端子板 12 コイル素子 14 巻 線 14a 巻き初め側のコイル引出線 14b 巻き終わり側のコイル引出線 16 外装成形体 10 1st metal terminal board 11 2nd metal terminal board 12 Coil element 14 Winding wire 14a Winding side coil lead-out wire 14b Winding end side coiling wire lead 16 Exterior molding

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 相対した一対の金属端子板の対向する先
端上面にコイル素子を装着するとともに、そのコイル素
子のコイル引出線を前記金属端子板の先端側所定位置に
形成した端子部に接続し、かつ、前記コイル素子並びに
少なくとも前記端子部を含む前記金属端子板の一部を外
装成形体で囲繞してなるチップインダクタにおいて、 前記外装成形体をフィラーまたはガラスファイバーの少
なくとも一方からなる充填材を配合した耐熱性の良好な
液晶ポリマーで構成したことを特徴とするチップインダ
クタ。
1. A coil element is mounted on the upper surfaces of opposing ends of a pair of metal terminal plates facing each other, and a coil lead wire of the coil element is connected to a terminal portion formed at a predetermined position on the tip side of the metal terminal plate. And a chip inductor formed by surrounding a part of the metal terminal plate including the coil element and at least the terminal portion with an exterior molded body, wherein the exterior molded body is filled with at least one of filler and glass fiber. A chip inductor characterized by being composed of a blended liquid crystal polymer having good heat resistance.
【請求項2】 前記充填材の配合比率が30〜50重量
%であることを特徴とする請求項1に記載のチップイン
ダクタ。
2. The chip inductor according to claim 1, wherein the compounding ratio of the filler is 30 to 50% by weight.
JP5612992A 1992-02-07 1992-02-07 Chip inductor Pending JPH05217750A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5612992A JPH05217750A (en) 1992-02-07 1992-02-07 Chip inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5612992A JPH05217750A (en) 1992-02-07 1992-02-07 Chip inductor

Publications (1)

Publication Number Publication Date
JPH05217750A true JPH05217750A (en) 1993-08-27

Family

ID=13018468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5612992A Pending JPH05217750A (en) 1992-02-07 1992-02-07 Chip inductor

Country Status (1)

Country Link
JP (1) JPH05217750A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345714A (en) * 1998-03-30 1999-12-14 Toshiba Corp Noise reducing element and semiconductor circuit element using the noise reducing element
US6529109B1 (en) * 1998-06-23 2003-03-04 Murata Manufacturing Co., Ltd. Bead inductor
JP2005056934A (en) * 2003-08-07 2005-03-03 Tdk Corp Common mode filter and its manufacturing method
JP2006108226A (en) * 2004-10-01 2006-04-20 Alps Electric Co Ltd Rotary electric component
JP2009111111A (en) * 2007-10-30 2009-05-21 Tdk Corp Coil component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370406A (en) * 1986-09-11 1988-03-30 Kyocera Corp Chip type coil element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370406A (en) * 1986-09-11 1988-03-30 Kyocera Corp Chip type coil element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345714A (en) * 1998-03-30 1999-12-14 Toshiba Corp Noise reducing element and semiconductor circuit element using the noise reducing element
US6529109B1 (en) * 1998-06-23 2003-03-04 Murata Manufacturing Co., Ltd. Bead inductor
JP2005056934A (en) * 2003-08-07 2005-03-03 Tdk Corp Common mode filter and its manufacturing method
JP2006108226A (en) * 2004-10-01 2006-04-20 Alps Electric Co Ltd Rotary electric component
JP2009111111A (en) * 2007-10-30 2009-05-21 Tdk Corp Coil component

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