JPH05206681A - Mounting apparatus for electronic component - Google Patents

Abstract

PURPOSE:To provide an electronic component mounting apparatus which has a recognizing means which facilitates detection of the position discrepancy of a large size electronic component by a camera. CONSTITUTION:A recognizing means 9 which recognizes an electronic component P attracted by the nozzle 4 of a transfer head 3 is composed of a camera 13 which observes the attracted electronic component P from below, a light source 11 which applies light from below, a light diffusing plate 14 and a means 17-21 which brings the light diffusing plate 14 to and from a position above the electronic components P attracted by the nozzle 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to a structure of an optical system for recognizing a positional deviation of a large electronic component by a camera.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus for mounting an electronic component such as an IC or an LSI (hereinafter also referred to as a chip) on a substrate, a transfer head is moved in an XY direction by an XY table while transferring a chip of a parts feeder. It is widely practiced to pick up by picking up by picking up the liquid from a nozzle of a head, recognizing the positional deviation of the lead of this chip by a recognition unit such as a camera, and then correcting the positional deviation and transferring and mounting it on a substrate. ..

FIG. 5 is a perspective view of a conventional electronic component mounting apparatus. Reference numeral 101 is a tray feeder, and 102 is a transfer head provided on the XY table 103. The nozzle 104 is moved up and down on the tray feeder 101 to pick up the chip P, and the chip P is moved to the recognition unit 105 to lead L of the chip P. After detecting the positional deviation in the XYθ directions, the positional deviation is corrected and transferred and mounted on the substrate S positioned by the positioning unit 106.

Next, the recognition unit 105 will be described. Reference numeral 107 denotes a case, which is provided with a camera 108 for observing the chip P adsorbed by the nozzle 104. A transparent stage 109 is provided in the case, and a ring-shaped light source 110 is provided around the transparent stage. 111 is a light source 110
It is a milky white disc-shaped light diffusing plate that scatters the illumination light emitted from, and is attached to the nozzle 104. When the transfer head 102 reaches above the stage 109, the light source 1
The illumination light emitted from 10 is scattered above the chip P by the light diffusion plate 111, whereby the silhouette of the chip P is clearly observed by the camera 108, and the chip P
The misalignment of the lead L is detected.

[0005]

However, in the conventional means, when the chip P is larger than the light diffusion plate 111, the lead L of the chip P protrudes from the light diffusion plate 111, so that the lead L is clearly observed. There was a problem that I could not. As such a large chip, for example, QF
There are P and connectors. As a means for solving such a problem, it is conceivable to enlarge the light diffusion plate 111, but there is a limit to the enlargement of the light diffusion plate 111 due to the layout design of the transfer head 102. ..

Therefore, an object of the present invention is to provide an electronic component mounting apparatus provided with a recognition means capable of recognizing a positional deviation of a large electronic component by a camera.

[0007]

To this end, the present invention provides, as means for recognizing an electronic component, a camera for observing the electronic component adsorbed by a nozzle from below, a light source for irradiating light from below, and a light diffusion plate. And a means for putting in and taking out the light diffusing plate above and below the electronic component sucked by the nozzle.

[0008]

In the above structure, when the transfer head in which the electronic component is sucked by the nozzle moves to the observation position of the camera, the light diffusing plate is made to project above one side of the electronic component by the take-in / out means, and The light source is turned on to detect the positional deviation of the leads extended from this side. Then XY
The table is driven to move the electronic component in the X direction or the Y direction, the other side is positioned directly below the light diffusion plate, and the positional deviation of the lead on the side is detected. Similarly, the positional deviation of the leads on other sides is detected in the same manner. In this case, when the light diffusing plate interferes with the movement of the electronic component, the loading / unloading means is driven to retract the light diffusing plate. When the positional deviation of the leads is detected in this manner, the positional deviation is corrected and then the chip is mounted on the substrate. In this way, the present means can detect the positional deviation of the leads on each side while moving the electronic component in the X direction and the Y direction with respect to the light diffusion plate, and thus extends from each side of the large electronic component. Positional deviation of leads can be detected.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus. 1
Is an X table, 2 is a Y table, and the transfer head 3 is attached to the table. Reference numeral 4 denotes a nozzle mounted on the transfer head 3. A substrate S is clamped and positioned by a positioning unit 6 provided on the transport path 5. 7
Is a supply unit for the chips P, and is a tray feeder 8 in which large-sized chips P with leads such as QFP and SOP are stored.
Has been deployed. The nozzles 4 are moved up and down on the tray feeder 8 to pick up the chips P, and the XY table 1,
2 is driven and transferred and mounted on the substrate S.

In FIGS. 1 and 2, reference numeral 9 denotes a recognition means, which is provided so as to surround the case 10 and the transparent stage 16 on the upper surface of the case 10, and which is a ring-shaped light source 11 for radiating light upward. A CCD camera 13 is provided on the side of the case 10 for observing the chip P adsorbed by the nozzle 4 from below. Case 1
A long plate-shaped light diffusion plate 14 that scatters the illumination light emitted from the light source 11 is provided on the upper surface of the side portion of 0. As the light diffusion plate 14, for example, a milky white acrylic plate or the like is used.

Reference numeral 17 denotes a mounting bracket for the light diffusing plate 14, and a slider 19 which slides on a guide rail 18 extending in the Y direction is provided below the mounting bracket. A cylinder 20 is provided on the side of the guide rail 18, and
The tip portion of 1 is connected to the mounting bracket 17. When the rod 21 of the cylinder 20 is projected and retracted, the guide rail 1
The slider 19 slides along the line 8, and the light diffusion plate 14 is put in and taken out on the transparent stage 16. That is, the above-mentioned components 17 to 21 compose a loading / unloading means for loading / unloading the light diffusion plate 14 onto / from the transparent stage 16.

This apparatus has the above-mentioned structure, and its operation will be described below. In FIG. 1, the chip P picked up by the nozzle 4 is transferred onto the transparent stage 16 by driving the XY tables 1 and 2, and stops at a position (see FIG. 3) immediately above the transparent stage 16. In FIG. 3, when the cylinder 20 is driven, the light diffusion plate 14 projects from the chain line position to the solid line position and covers one side of the chip P. Here, the lead L1 at the side end of the one side is connected to the camera 1
The observation is made by No. 3 and the positional deviation in the XYθ directions is detected (see also FIG. 4).

Next, with the light diffusion plate 14 protruding,
The chip P is moved in the Y1 direction and stopped at the position b, and the lead L2 at the other end of this side is observed. Then chip P
Are moved in the X1 direction and stopped at the position c, the upper side of the other side of the chip P is covered with the light diffusion plate 14, and the lead L3 at the side end portion of the other side is observed. If the light diffusion plate 14 interferes with the movement of the nozzle 4 when the chip P is moved in the X1 direction, the cylinder 20 is driven to temporarily retract the light diffusion plate 14 to the chain line position. Next, the chip P is transferred in the Y2 direction and stopped at the d position, and the lead L at the other end of this side is
Observe 4. In this way, the chip P is attached to the transparent stage 1
6 is moved in the XY direction above 6, the light diffusion plate 14 is positioned above the leads L extending from the four sides of the chip P, and the leads L1 to L4 are clearly observed, and the positional deviation is detected. Can be detected accurately. Particularly, in this embodiment, all the leads L1 to L4 are observed in the narrow area A (see FIG. 3) near the optical center of the camera 13 while moving the chip P in the XY directions as described above. It is possible to minimize an optical error caused by lens distortion or the like.

When the detection of the positional deviation of the lead L is completed as described above, the positional deviation of the chip P is corrected, and then the chip P is transferred and mounted on the substrate S by driving the XY tables 1 and 2. The substrate S on which the chips P have been mounted is sent to the post-processing step by the conveyor 5. The positional deviation in the XY directions is corrected by correcting the moving strokes of the XY tables 1 and 2, and the positional deviation in the θ directions is corrected by rotating the nozzle 4.

The present invention is not limited to the above embodiment. For example, by providing the nozzle with a disk-shaped light diffusing plate of the conventional means, a small chip can be observed by the light diffusing plate of the conventional means, and a large chip can be used. The shaped chip is the light diffusing plate 14 of this means.
You may observe by.

Further, in the above embodiment, the leads L1 to L4 at the side end portions of each side were observed, but it is arbitrary which lead L is observed to detect the positional deviation. It is also possible to observe a large number of leads L and detect the respective positional deviations, and obtain the average value thereof.

[0017]

As described above, according to the present invention, the camera for recognizing the electronic component is a camera for observing the electronic component sucked by the nozzle from below, and the electronic component is irradiated with light from below. Since it is composed of a light source, a light diffusing plate, and a loading / unloading means for loading / unloading the light diffusing plate above and below the electronic component attracted to the nozzle, the light diffusing is performed above the leads extending from each side of the electronic component. It is possible to position the plate clearly and observe the leads clearly, and to accurately detect the positional deviation.Therefore, it is not necessary to provide a large light diffusing plate on the transfer head side, especially for large electronic parts. It is advantageous as an observation means.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a perspective view of an electronic component mounting apparatus according to the present invention.

FIG. 3 is a plan view of an electronic component lead observed by the same camera.

FIG. 4 is a side view during observation of leads of electronic components by the camera.

FIG. 5 is a perspective view during observation of leads of an electronic component by a camera according to a conventional means.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 X table 2 Y table 3 Transfer head 4 Nozzle 6 Positioning part 7 Electronic component supply part 9 Recognition means 11 Light source 13 Camera 14 Light diffuser 20 Ejecting / removing means P Electronic component S Substrate

Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H05K 13/08 B 8315-4E

Claims (1)

[Claims] 1. A substrate positioning unit, an electronic component supply unit, a recognition unit for observing an electronic component sucked by a nozzle of a transfer head, and an XY table for moving the transfer head in XY directions. In the electronic component mounting apparatus provided with, the recognition means, a camera for observing the electronic component attracted to the nozzle from below, a light source for irradiating light from below,
An electronic component mounting apparatus comprising: a light diffusing plate; and a loading / unloading means for loading / unloading the light diffusing plate above and above the electronic component sucked by the nozzle.