JPH0520486U - Speaker device - Google Patents

Abstract

(57) [Summary] [Structure] In a speaker device, a heat-generating element or a heat-radiating element thermally coupled to the heat-generating element is exposed outside the enclosure, and the open end of the bass reproduction duct outside the enclosure generates heat. It is characterized in that it is arranged in the vicinity of the body or the radiator. [Effect] The heat generated in the enclosure having the heating element can be radiated very efficiently.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a speaker device used for various audio equipment and the like.

[0002]

[Prior Art]

 A conventional speaker device is generally configured as shown in FIG. That is, it consists of a speaker unit 3 attached to the front baffle plate 2 of the enclosure 1, a bass reproduction duct 4 having both ends opened inside and outside the enclosure 1 and attached to the front baffle plate 2, a power IC, a network, and the like. It is composed of a heating element 5.

Further, another conventional speaker device is configured as shown in FIG. That is, the speaker unit 3 attached to the front baffle plate 2 of the enclosure 1, the above-mentioned heating element 5, both open ends are opened inside and outside the enclosure 1, and the inside opening end is located above and above the heating element 5. It is composed of a bass reproduction duct 4'disposed so as to be positioned.

In both of the speaker devices shown in FIGS. 4 and 5, the heat generating element 5 may be the speaker unit itself, and a heat radiating element is attached to the heat generating element 5 as necessary.

[0005]

[Problems to be solved by the device]

 In the configuration of the speaker device shown in FIG. 4, the heat is dissipated by natural air cooling. However, natural air cooling is extremely inefficient, and the temperature rise of the heat generating element becomes too large. It is necessary to set it lower or install a large radiator.

In the configuration of the speaker device shown in FIG. 5, since heat is radiated by forced air cooling, the heat transfer performance from the heat generating element (heat radiating element when a heat radiating element is attached) to the air is improved, but from the heat generating element. Since most of the transferred heat stays in the enclosure, if the volume of the enclosure is small for the amount of heat generation, the temperature rise of the air will increase over time and the heat from the radiator will increase. Transmission performance deteriorates. This problem is also common to the speaker device of FIG.

[0007]

[Means for Solving the Problems]

 According to the present invention, in an enclosure, a speaker unit and a low-pitched sound reproduction duct whose both open ends are opened inside and outside the enclosure, and a speaker device having a heating element inside the enclosure are provided with a heating element or a heating element and a heating element. Characterized in that the heat-dissipating body connected electrically is exposed outside the enclosure, and the open end of the bass reproduction duct outside the enclosure is arranged near the heat-generating body or heat-dissipating body. Is.

[0008]

[Action]

 In the speaker device according to the present invention, a boundary layer for preventing low-frequency sound reproduction is provided by a boundary layer that blocks heat transfer from a heating element exposed outside the enclosure or a radiator that is thermally connected to the heating element to the surrounding air. Since it is destroyed by the air flowing in and out of the duct, the heat transfer performance from the radiator to the air is improved, and the temperature rise of the air around the radiator is extremely small.

[0009]

【Example】

 An embodiment of the speaker device of the present invention will be described below with reference to FIGS. The speaker unit 3 is attached to the front baffle plate 2 of the enclosure 1, and the through hole 7 provided in the back plate 6 of the enclosure 1 is fitted with a screw 5 so that the heating element 5 mounted on the metal plate 8 having high heat conduction is penetrated. Screw with 9 and 9. The metal plate 8 may be provided with projecting fins if necessary in order to improve heat dissipation.

The heating element 5 is a power IC and is electrically connected to the printed wiring board 10. The printed wiring board 10 is screwed between the heating element 5 and the back plate 6 with screws 11 and 11.

Further, both opening ends 12 and 13 are opened inside and outside the enclosure 1, and the outside opening end 12 is located near the lower part of the heat radiating body 8 so as to be directed upward. The reproduction duct 14 is fixed to the back plate 6. Further, the heat radiator 8 is not always necessary, and the heat radiator 5 may be directly exposed to the outside of the enclosure 1 and attached without the heat radiator depending on the amount of heat generation.

Therefore, the boundary layer that impedes the heat transfer from the heat radiator to the surrounding air is destroyed by the air flowing in and out of the bass reproduction duct.

[0013]

[Effect of the device]

 As described above, the speaker device according to the present invention has a simple structure, but can dissipate the heat generated in the enclosure very efficiently regardless of the inner volume of the enclosure. Compared to, the internal volume of the enclosure can be made smaller, and if the same amount of heat is generated, the heat radiator can be made smaller.

According to the experiment, the present speaker device has about 2. The heat dissipation capacity was 8 times, which was about 1.6 times that of the speaker device shown in FIG.

[Brief description of drawings]

FIG. 1 is a side sectional view of a speaker device of the present invention.

FIG. 2 is a rear view of the speaker device of the present invention.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is a side sectional view of a conventional speaker device.

FIG. 5 is a side sectional view of another conventional speaker device.

[Explanation of symbols]

 1 Speaker device enclosure 4, 4 ', 14 Low-pitched sound reproduction duct 5 Heating element 8 Radiating element 10 Printed wiring board

Claims (1)

[Scope of utility model registration request] 1. A speaker unit in an enclosure,
In a speaker device having a low-pitched sound reproduction duct whose both open ends are opened inside and outside the enclosure, and in a speaker device having a heating element inside the enclosure, a heating element or a heat-radiating element thermally connected to the heating element is provided outside the enclosure. A speaker device characterized in that the open end of the bass reproduction duct outside the enclosure is arranged in the vicinity of a heat generating element or a heat radiating element.