JPH0520250B2 - - Google Patents
Info
- Publication number
- JPH0520250B2 JPH0520250B2 JP58147682A JP14768283A JPH0520250B2 JP H0520250 B2 JPH0520250 B2 JP H0520250B2 JP 58147682 A JP58147682 A JP 58147682A JP 14768283 A JP14768283 A JP 14768283A JP H0520250 B2 JPH0520250 B2 JP H0520250B2
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- movable mold
- mold
- resin material
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 48
- 238000000465 moulding Methods 0.000 claims description 47
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 229920001187 thermosetting polymer Polymers 0.000 claims description 32
- 238000006073 displacement reaction Methods 0.000 claims description 28
- 230000007246 mechanism Effects 0.000 claims description 23
- 238000001514 detection method Methods 0.000 claims description 19
- 238000001879 gelation Methods 0.000 claims description 7
- 230000008602 contraction Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 13
- 238000001816 cooling Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000004069 differentiation Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、熱硬化性樹脂材料の成形進行状態の
検知方法及び熱硬化性樹脂材料用の成形装置に関
するものであつて、特に、成形過程の進行状態に
即応して常に最適条件のもとに成形作業を遂行す
ることのできる技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for detecting the progress of molding of a thermosetting resin material and a molding apparatus for thermosetting resin material, and in particular to a method for detecting the progress of molding of a thermosetting resin material. The present invention relates to a technology that allows molding operations to be carried out under optimal conditions at all times in response to the progress of molding.
従来、熱硬化性樹脂材料の成形方法は、予め定
めた標準の成形温度及び成形時間に基づいて成形
していた。ところが、実際に熱硬化性樹脂材料を
成形する場合には、熱硬化性樹脂材料を構成する
各構成物質の混合比率のバラツキ及び外気温度変
化に伴う熱硬化性樹脂材料の粘度変化等に起因し
て、最適成形温度と予め設定した標準の成形温度
とが一致しないときがあつた。その結果として、
標準の成形時間では成形時間過多又は成形時間不
足となることがしばしば生じた。そこで、従来
は、成形時間過多又は不足を修正するため、得ら
れた成形品を分析して成形温度あるいは成形時間
の設定値を修正していた。しかし、得られた成形
品の分析のみでは、ゲル化時間及び硬化時間が的
確に把握できないため、最適成形温度あるいは最
適成形時間の修正を迅速にすることができず、歩
留が低くなる欠点があつた。
Conventionally, thermosetting resin materials have been molded based on predetermined standard molding temperatures and molding times. However, when actually molding a thermosetting resin material, there are problems such as variations in the mixing ratio of the constituent substances that make up the thermosetting resin material and changes in the viscosity of the thermosetting resin material due to changes in outside temperature. Therefore, there were times when the optimum molding temperature did not match the preset standard molding temperature. As a result,
The standard molding time often resulted in too much molding time or not enough molding time. Therefore, conventionally, in order to correct excessive or insufficient molding time, the molded product obtained was analyzed and the set value of the molding temperature or molding time was corrected. However, simply by analyzing the molded product, it is not possible to accurately determine the gelation time and curing time, so the optimum molding temperature or time cannot be quickly corrected, resulting in a low yield. It was hot.
本発明者は、前記従来技術の欠点を解消するた
めに、幾多の実験を繰返した結果、熱硬化性樹脂
材料のゲル化時における熱膨脹現象及び硬化時に
おける収縮現象を可動金型の変位現象として捉え
得ることを知見し、かかる知見に基づいて本発明
を完成するに至つた。
In order to eliminate the drawbacks of the prior art, the present inventor has repeatedly conducted numerous experiments and has determined that the thermal expansion phenomenon during gelling and the contraction phenomenon during curing of a thermosetting resin material can be interpreted as a displacement phenomenon of a movable mold. The present invention was completed based on this knowledge.
そして、本発明が採用した第１の解決手段は、
固定金型と可動金型とよりなるキヤビテイ内に充
填された熱硬化性樹脂材料を加圧加熱して型締め
し、前記熱硬化性樹脂材料のゲル化期における熱
膨脹及び硬化期における収縮に起因するキヤビテ
イ内圧力の変動により前記可動金型が移動変位す
るのを硬化完了に至るまで検出しつつ成形を行う
ところにある。 The first solution adopted by the present invention is
A thermosetting resin material filled in a cavity consisting of a fixed mold and a movable mold is pressurized and heated to clamp the mold. Molding is performed while detecting the movement and displacement of the movable mold due to fluctuations in the pressure inside the cavity until curing is completed.
また、第２の解決手段は、固定金型と可動金型
とよりなるキヤビテイ内に充填された熱硬化性樹
脂材料を加圧加熱して成形する成形装置におい
て、前記可動金型の押圧力と前記熱硬化性樹脂材
料のゲル化期における熱膨脹及び硬化期における
収縮に起因して変動するキヤビテイ内圧力とがバ
ランスしながら前記可動金型を進退移動させ得る
如くなされた可動金型操作機構と、前記固定金型
と可動金型との間に直接的に介設させて相互間距
離の変動を電気信号に変換する検出部を有した変
位検出機構とを備えているところにある。 A second solution is a molding device that pressurizes and heats a thermosetting resin material filled in a cavity consisting of a fixed mold and a movable mold to mold it, in which the pressing force of the movable mold is a movable mold operating mechanism configured to move the movable mold forward and backward while balancing the internal pressure in the cavity that fluctuates due to thermal expansion during the gelling stage and contraction during the curing stage of the thermosetting resin material; The present invention further includes a displacement detection mechanism having a detection section that is directly interposed between the fixed mold and the movable mold and converts a change in the distance between them into an electric signal.
本発明が採用した上記の解決手段によれば、圧
縮成形中に、金型のキヤビテイ内にある熱硬化性
樹脂材料が如何なる成形進行状態にあるかを、即
時且つ連続的に検知することが出来る。故に、成
形時の工程管理と成形品の品質管理が容易となる
と共に、歩留りの顕著な向上に資すること大であ
る。
According to the above solution adopted by the present invention, it is possible to immediately and continuously detect the state of molding progress of the thermosetting resin material in the cavity of the mold during compression molding. . Therefore, process control during molding and quality control of molded products are facilitated, and it greatly contributes to a marked improvement in yield.
以下、本発明を図面に示す実施例に基づいて説
明する。第１図Ａ，Ｂは、本発明に係る熱硬化性
樹脂材料用の成形装置の実施例を示す要部断面図
である。成形装置１は、加圧成形方式の成形装置
であつて、固定盤２に雄型の固定金型３が取付け
られていると共に、上下移動自在の可動盤４に雌
型の可動金型５が固定してある。該可動盤４は、
油圧シリンダー等からなる可動金型操作機構６の
出力端６ａに接続されており、該可動金型用操作
機構６の出力を受けて上下移動するように構成さ
れている。該可動金型用操作機構６は、油圧シリ
ンダーを定圧制御する等して、前記可動金型５を
固定金型３へ所定圧力で型締めし、且つ金型キヤ
ビテイ内にある熱硬化性樹脂材料８の膨脹・収縮
に起因してキヤビテイ内圧力が変動し、その圧力
変動を可動金型５へ作用せしめて該可動金型５を
固定金型３に対して前進又は後退させ得るように
構成されている。なお、該可動金型５には成形厚
み調節用のスペーサー７，７が配設されている。
Hereinafter, the present invention will be explained based on embodiments shown in the drawings. FIGS. 1A and 1B are sectional views of essential parts showing an embodiment of a molding apparatus for thermosetting resin material according to the present invention. The molding apparatus 1 is a pressure molding type molding apparatus, in which a male fixed mold 3 is attached to a fixed platen 2, and a female movable mold 5 is mounted on a vertically movable movable plate 4. It is fixed. The movable plate 4 is
It is connected to an output end 6a of a movable mold operating mechanism 6 consisting of a hydraulic cylinder or the like, and is configured to move up and down in response to the output of the movable mold operating mechanism 6. The movable mold operating mechanism 6 clamps the movable mold 5 to the fixed mold 3 at a predetermined pressure by, for example, controlling a hydraulic cylinder at a constant pressure, and also controls the thermosetting resin material in the mold cavity. The pressure within the cavity fluctuates due to the expansion and contraction of the mold 8, and the pressure fluctuation is applied to the movable mold 5 to move the movable mold 5 forward or backward relative to the fixed mold 3. ing. Note that the movable mold 5 is provided with spacers 7, 7 for adjusting the molding thickness.
前記可動盤４には、変位検出機構９の具有する
検出部９ａが直接設置されている。該検出部９ａ
には、作動トランス等の電気信号変換方式等が採
用され、可動金型５と連動して比例状態に移動す
る可動盤４の変位を検出して、固定金型３に対す
る可動金型５の変位が直接的に検出し得るように
構成されている。なお、図示省略したが、固定金
型３に対する可動金型５の変位を直接検出する構
造とすることも勿論可能である。該検出部９ａの
検出信号ａは、第２図に示す如く、変位計器９ｂ
で処理され可動金型５の変位が適宜方式で表示出
力される。該変位計器９ｂからの出力信号ｂは、
レコーダー１０及び演算装置１１へ入力される。 A detection section 9a included in the displacement detection mechanism 9 is directly installed on the movable platen 4. The detection section 9a
An electric signal conversion system such as an actuating transformer is used to detect the displacement of the movable platen 4, which moves proportionally in conjunction with the movable mold 5, and detect the displacement of the movable mold 5 with respect to the fixed mold 3. is configured so that it can be directly detected. Although not shown, it is of course possible to adopt a structure in which the displacement of the movable mold 5 with respect to the fixed mold 3 is directly detected. As shown in FIG. 2, the detection signal a of the detection section 9a
The displacement of the movable mold 5 is displayed and output in an appropriate manner. The output signal b from the displacement meter 9b is
It is input to the recorder 10 and the arithmetic device 11.
演算装置１１は、マイクロコンピユーター等か
らなり、入力された信号ｂを微分する演算処理回
路を備え、微分処理して可動金型５の変位速度を
得ると共に、該変位速度と変位量とによる演算に
よつて変位時期の経過時間を得る。このようにす
れば、後述する（第３図参照）熱硬化性樹脂材料
８の流出停止時期○イ、硬化開始時期○ハ及び硬化終
了時期○ニにより、ゲル化時間GT（○イから○ハまで
の経過時間）及び硬化時間CT（○イから○ニまでの経
過時間）を知得することができる。熱硬化性樹脂
材料８の硬化終了時期○ニを知らせる演算装置１１
からの信号ｃは、昇降制御装置１２に入力され
る。そして昇降制御装置１２は、信号ｃを適宜処
理した後、可動金型用操作機構６である油圧シリ
ンダーを降下させる信号ｄとして油圧ユニツト１
３へ出力するように構成してある。 The arithmetic device 11 is composed of a microcomputer, etc., and is equipped with an arithmetic processing circuit that differentiates the input signal b, performs differentiation processing to obtain the displacement speed of the movable mold 5, and performs calculations based on the displacement speed and the amount of displacement. Thus, the elapsed time of the displacement period is obtained. In this way, the gelation time GT (from ○I to ○H curing time CT (elapsed time from ○A to ○D) can be obtained. Arithmetic device 11 that notifies the completion time of curing of thermosetting resin material 8
The signal c from is input to the elevation control device 12. After processing the signal c appropriately, the lift control device 12 outputs a signal d to the hydraulic unit 1 as a signal d for lowering the hydraulic cylinder, which is the operating mechanism 6 for the movable mold.
It is configured to output to 3.
演算装置１１はまた、次回以降の成形時におけ
る金型温度を最適条件に設定するためにも機能す
る。即ち微分により知得したゲル化時間GT及び
硬化時間CTと予め設定された標準のゲル化時間
GT及び硬化時間CTと比較しつつ、知得したゲ
ル化時間GT及び硬化時間CTが対応する標準の
時間よりも短いときには前記金型３，５を適宜温
度降温せしめる降温信号ｅを金型用の加熱冷却制
御装置１４へ出力し、逆に知得したゲル化時間
GT及び硬化時間CTが対応する標準の時間より
も長いときには前記金型３，５を適宜温度昇温せ
しめる昇温信号ｆを加熱冷却制御装置１４へ出力
する比較回路を備えている。前記演算装置１１か
ら加熱冷却装置１４へ出力する信号ｅ，ｆの出力
頻度は、熱硬化性樹脂材料８を成形する毎に行な
うことに限定することなく、成形回数の数回（例
えば、５回）に対して１回の割合で出力すること
もある。前記加熱冷却用制御装置１４は、前記降
温信号ｅ又は昇温信号ｆを受けて、金型３，５の
熱源（例えば、電気、熱媒体油等）等を適宜調節
して金型温度を適正加熱温度に調節するようにな
されている。要するに、時宜に応じて、ゲル化時
間GT及び硬化時間CTがそれらの各標準時間に
適合しているか否かをチエツクし、もし偏差が生
じている場合には、次回以降の成形時における金
型温度を適正なものに修正するものである。 The arithmetic unit 11 also functions to set the mold temperature to the optimum condition during subsequent molding. In other words, the gelation time GT and curing time CT obtained by differentiation and the preset standard gelation time
While comparing the gelling time GT and curing time CT, if the acquired gelling time GT and curing time CT are shorter than the corresponding standard times, a temperature decreasing signal e is sent to the mold to lower the temperature of the molds 3 and 5 appropriately. The gelation time is output to the heating/cooling control device 14 and conversely learned.
A comparison circuit is provided which outputs a temperature increase signal f for appropriately increasing the temperature of the molds 3 and 5 to the heating/cooling control device 14 when GT and curing time CT are longer than the corresponding standard times. The output frequency of the signals e and f outputted from the arithmetic unit 11 to the heating and cooling device 14 is not limited to every time the thermosetting resin material 8 is molded, but may be several times the number of moldings (for example, 5 times). ) may be output at a rate of once. The heating/cooling control device 14 receives the temperature drop signal e or the temperature increase signal f, and adjusts the heat source (for example, electricity, heat medium oil, etc.) of the molds 3 and 5 as appropriate to maintain the mold temperature at an appropriate temperature. It is designed to adjust the heating temperature. In short, check from time to time whether the gelation time GT and curing time CT conform to their respective standard times, and if a deviation occurs, use the mold for subsequent molding. This is to correct the temperature to an appropriate value.
なお、本発明に係る熱硬化性樹脂材料用の成形
装置は、前記第１図Ａ，Ｂに示す圧縮成形方式に
限定するものでなく、図示省略したが、トランス
フアー成形方式又は射出成形方式であつてもよ
く、前述の如き可動金型用操作機構と変位検出機
構９とを備えた成形装置であれば、成形方式を問
わない。 Note that the molding apparatus for thermosetting resin materials according to the present invention is not limited to the compression molding method shown in FIGS. Any molding method may be used as long as the molding apparatus is equipped with the movable mold operating mechanism and the displacement detection mechanism 9 as described above.
次に、本発明に係る熱硬化性樹脂材料の成形進
行状態の検知方法を、第１図Ａ，Ｂ及び第２図に
示す成形装置１によつて実施する場合の例を説明
する。先ず、降下状態の可動金型５の凹部５ａへ
所定量の熱硬化性樹脂材料８（以下、材料８とい
う）を載置する。次いで、可動金型用操作機構６
を作動させて可動金型５を上昇させ前記材料８を
加圧する。材料８が第１図Ｂに示す如くキヤビテ
イ１５内で加圧されると、キヤビテイ１５内の空
気及び余分な材料８が0.5〜0.1mm程度のクリアラ
ンスからなるピンチオフ部１６から外部へ流出す
る。ピンチオフ部１６で材料８が硬化するとピン
チオフ部１６からの材料８の流出が停止し、金型
３，５の加熱によりキヤビテイ１５内の材料８が
熱膨脹する。所定圧力で型締めしている可動金型
５は、材料８の熱膨脹による圧力増加が作用し、
可動金型５の加圧力と材料８充填のキヤビテイ内
圧力とがバランスする位置まで降下する。該降下
に伴なう可動金型５の変位量は、変位検出機構９
により逐次検出される。材料８の熱膨脹がなくな
り、ゲル化した後に材料８の硬化が開始される。
すると、可動金型５は材料８の硬化収縮に伴い位
置上昇する。該上昇に伴う可動金型５の変位量
は、変位検出機構９により逐次検出される。変位
検出機構９により逐次検出された可動金型５の変
位量はレコーダー１０に出力されると、例えば第
３図に示す如き変位−時間の曲線Ａとして得られ
る。図中○イはキヤビテイ１５内からの材料８の流
出停止時期、○ロは材料８の熱膨脹終了時期、○ハは
硬化開始時期及び○ニは硬化終了時期に夫々相当す
る。このように、変位検出機構９により可動金型
５の変位を検出することにより、材料８の成形進
行状態を検知することができる。 Next, an example will be described in which the method for detecting the progress of molding of a thermosetting resin material according to the present invention is carried out using the molding apparatus 1 shown in FIGS. 1A and 1B and FIG. 2. First, a predetermined amount of thermosetting resin material 8 (hereinafter referred to as material 8) is placed in the recess 5a of the movable mold 5 in the lowered state. Next, the movable mold operating mechanism 6
is activated to raise the movable mold 5 and pressurize the material 8. When the material 8 is pressurized within the cavity 15 as shown in FIG. 1B, the air within the cavity 15 and the excess material 8 flow out from the pinch-off portion 16 having a clearance of about 0.5 to 0.1 mm. When the material 8 is hardened in the pinch-off section 16, the outflow of the material 8 from the pinch-off section 16 is stopped, and the material 8 inside the cavity 15 is thermally expanded by the heating of the molds 3 and 5. The movable mold 5, which is clamped at a predetermined pressure, is affected by an increase in pressure due to thermal expansion of the material 8.
The pressurizing force of the movable mold 5 and the pressure inside the cavity filled with the material 8 are lowered to a position where they are balanced. The amount of displacement of the movable mold 5 due to the lowering is determined by a displacement detection mechanism 9.
are detected sequentially. After the material 8 no longer thermally expands and gels, the material 8 begins to harden.
Then, the position of the movable mold 5 rises as the material 8 hardens and contracts. The amount of displacement of the movable mold 5 due to the rise is sequentially detected by the displacement detection mechanism 9. When the displacement amount of the movable mold 5 successively detected by the displacement detection mechanism 9 is outputted to the recorder 10, it is obtained as a displacement-time curve A as shown in FIG. 3, for example. In the figure, ○A corresponds to the time when the material 8 stops flowing out from inside the cavity 15, ○B corresponds to the time when the thermal expansion of the material 8 ends, ○C corresponds to the hardening start time, and ○D corresponds to the hardening end time. In this way, by detecting the displacement of the movable mold 5 using the displacement detection mechanism 9, the progress state of molding of the material 8 can be detected.
前記硬化終了時期○ニを知らせる演算装置１１か
らの信号ｃは、昇降制御装置１２において、必要
な光沢増加時間等の後処理時間HTが付加処理さ
れた後、可動金型用操作機構６を降下させる信号
ｄとして油圧ユニツト１３へ出力され、可動金型
用操作機構６を作動させて可動金型５を降下させ
る。型を開いたならば、適宜手段にて成形品を取
出す。前記光沢増加時間とは、第３図の曲線Ｂに
示す如く、材料８がSMC（Sheet Mold
Compound）等の場合、硬化成形品の表面の光沢
が所定の光沢（図中の場合はGloss90）に達する
に必要な硬化終了時期○ニ後の加熱保持時間を言
う。 The signal c from the arithmetic unit 11 that informs the curing end time ○2 is subjected to additional post-processing time HT such as the necessary gloss increase time in the elevation control device 12, and then the movable mold operating mechanism 6 is lowered. The signal d is output to the hydraulic unit 13 to operate the movable mold operating mechanism 6 to lower the movable mold 5. Once the mold is opened, the molded product is removed by appropriate means. The gloss increase time is defined as the gloss increase time when the material 8 is SMC (Sheet Mold
Compound), etc., it refers to the heating holding time after curing completion time ○2 required for the surface gloss of the cured molded product to reach the specified gloss (Gloss 90 in the case in the figure).
なお演算装置１１で知得したゲル化時間GT及
び硬化時間CTが対応する標準の時間より短いと
きには、次回以降の成形時における前記金型３，
５を適宜温度せしめる信号ｅを加熱冷却制御装置
１４へ出力し、金型３，５が最適加熱温度になる
ように修正調節する。逆に、知得したゲル化時間
GT及び硬化時間CTが対応する標準の時間より
長いときには、前記金型３，５を適宜温度昇温せ
しめる信号ｆを加熱冷却制御装置１４へ出力し、
金型３，５が最適加熱温度になるように修正調節
する。このようにして、成形時の金型温度が不用
意に最適条件から逸脱するのを防止する。 Note that when the gelling time GT and curing time CT acquired by the calculation device 11 are shorter than the corresponding standard times, the mold 3,
A signal e for appropriately heating the molds 3 and 5 is output to the heating/cooling control device 14, and the molds 3 and 5 are corrected and adjusted to the optimum heating temperature. Conversely, the learned gel time
When GT and curing time CT are longer than the corresponding standard time, output a signal f to the heating/cooling control device 14 to appropriately raise the temperature of the molds 3 and 5;
The molds 3 and 5 are corrected and adjusted so that they reach the optimum heating temperature. In this way, the mold temperature during molding is prevented from inadvertently deviating from the optimum conditions.
本発明者は、下記の条件により実験し第３図に
示す如き結果を得た。 The inventor conducted an experiment under the following conditions and obtained the results shown in FIG.
(1) 熱硬化性樹脂材料
種 類 SMC
構 成
不飽和ポリエステル樹脂 80部
低収縮剤 20部
炭酸カルシユウム 100部
硬化剤 １部
離型剤 ３部
増粘剤 １部
ガラス繊維 80部
(2) 成形条件
金型温度
固定金型 135℃
可動金型 145℃
SMCチヤージ量 350ｇ
成形品の形状 200×200×4.5mm
加圧力 50Kgｆ／cm2
(3) 光沢測定方法
測定機 Gloss Meter GM−26
受光面積 12×20mm 60゜
〔発明の効果〕
以上詳述の如くであるから、本発明は、変位検
出機構により熱硬化性樹脂材料の成形進行状態を
瞬時に且つ連続的に検知することが出来るので、
各成形品の品質管理を容易に行なうことが可能と
なると共に、金型の温度管理及び成形時間管理を
簡単に行うことが可能となり歩留の向上を図るこ
とが出来る優れた効果を有する。(1) Thermosetting resin material Type SMC Composition Unsaturated polyester resin 80 parts Low shrinkage agent 20 parts Calcium carbonate 100 parts Curing agent 1 part Mold release agent 3 parts Thickener 1 part Glass fiber 80 parts (2) Molding Conditions Mold temperature Fixed mold 135℃ Movable mold 145℃ SMC charge amount 350g Shape of molded product 200×200×4.5mm Pressure force 50Kgf/cm 2 (3) Gloss measurement method Measuring device Gloss Meter GM−26 Light receiving area 12 ×20mm 60゜ [Effects of the Invention] As detailed above, the present invention can instantly and continuously detect the molding progress of the thermosetting resin material using the displacement detection mechanism.
This has the excellent effect of making it possible to easily control the quality of each molded product, and also to easily control mold temperature and molding time, thereby improving yield.
第１図Ａ，Ｂは本発明に係る熱硬化性樹脂材料
用の成形装置の実施例を示す要部断面図、第２図
は本発明に係る熱硬化性樹脂材料の成形装置の実
施例を示す回路図、第３図は熱硬化性樹脂材料の
成形進行状態を示すグラフである。
３……固定金型、５……可動金型、６……可動
金型用操作機構、８……熱硬化性樹脂材料、９…
…変位検出機構、１１……演算装置、１２……昇
降制御装置、１４……加熱冷却制御装置。
1A and 1B are cross-sectional views of essential parts showing an embodiment of a molding apparatus for thermosetting resin materials according to the present invention, and FIG. 2 shows an embodiment of the molding apparatus for thermosetting resin materials according to the present invention. The circuit diagram shown in FIG. 3 is a graph showing the progress of molding the thermosetting resin material. 3... Fixed mold, 5... Movable mold, 6... Operating mechanism for movable mold, 8... Thermosetting resin material, 9...
... Displacement detection mechanism, 11 ... Arithmetic device, 12 ... Elevation control device, 14 ... Heating and cooling control device.
Claims (1)
に充填された熱硬化性樹脂材料を加圧加熱して型
締めし、前記熱硬化性樹脂材料のゲル化期におけ
る熱膨脹及び硬化期における収縮に起因するキヤ
ビテイ内圧力の変動により前記可動金型が移動変
位するのを硬化完了に至るまで検出しつつ成形を
行うことを特徴とする熱硬化性樹脂材料の成形進
行状態の検知方法。 ２ 固定金型と可動金型とよりなるキヤビテイ内
に充填された熱硬化性樹脂材料を加圧加熱して成
形する成形装置において、前記可動金型の押圧力
と前記熱硬化性樹脂材料のゲル化期における熱膨
脹及び硬化期における収縮に起因して変動するキ
ヤビテイ内圧力とがバランスしながら前記可動金
型を進退移動させ得る如くなされた可動金型操作
機構と、前記固定金型と可動金型との間に直接的
に介設させて相互間距離の変動を電気信号に変換
する検出部を有した変位検出機構とを備えている
ことを特徴とする熱硬化性樹脂材料の成形装置。 ３ 前記変位検出機構は、該変位検出機構が発す
る電気信号で作動する検出値用のレコーダーと接
続されていることを特徴とする特許請求の範囲第
２項記載の熱硬化性樹脂材料の成形装置。[Claims] 1. A thermosetting resin material filled in a cavity consisting of a fixed mold and a movable mold is pressurized and heated to clamp the mold, and thermal expansion of the thermosetting resin material during the gelation stage is achieved. and a molding progress state of a thermosetting resin material, characterized in that the molding is performed while detecting the movement and displacement of the movable mold due to fluctuations in cavity internal pressure caused by contraction during the curing period until the curing is completed. Detection method. 2. In a molding device that presses and heats a thermosetting resin material filled in a cavity consisting of a fixed mold and a movable mold to mold it, the pressing force of the movable mold and the gel of the thermosetting resin material A movable mold operating mechanism configured to move the movable mold forward and backward while balancing the internal pressure in the cavity that fluctuates due to thermal expansion during the curing period and contraction during the curing period, and the fixed mold and the movable mold. 1. A molding apparatus for a thermosetting resin material, comprising: a displacement detection mechanism having a detection section that is directly interposed between the two and converts a variation in the mutual distance into an electrical signal. 3. The thermosetting resin material molding apparatus according to claim 2, wherein the displacement detection mechanism is connected to a detected value recorder that is operated by an electric signal generated by the displacement detection mechanism. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14768283A JPS6038117A (en) | 1983-08-11 | 1983-08-11 | Immediate and continuous monitoring of a molding process for thermosetting resin and molding control and molding apparatus using this detection means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14768283A JPS6038117A (en) | 1983-08-11 | 1983-08-11 | Immediate and continuous monitoring of a molding process for thermosetting resin and molding control and molding apparatus using this detection means |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6038117A JPS6038117A (en) | 1985-02-27 |
| JPH0520250B2 true JPH0520250B2 (en) | 1993-03-19 |
Family
ID=15435895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14768283A Granted JPS6038117A (en) | 1983-08-11 | 1983-08-11 | Immediate and continuous monitoring of a molding process for thermosetting resin and molding control and molding apparatus using this detection means |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6038117A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI474914B (en) * | 2012-11-09 | 2015-03-01 | Sharp Kk | Apparatus and method for producing molding |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02117394A (en) * | 1988-10-27 | 1990-05-01 | Daiso Co Ltd | Decomposition of alginic acid with microorganism |
| TWI260263B (en) * | 2004-04-29 | 2006-08-21 | Masonite Corp | Compression molding method and apparatus suitable for making door facings |
| CN104015284A (en) * | 2014-06-20 | 2014-09-03 | 陈良 | Production device of rubber track |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58221653A (en) * | 1982-06-16 | 1983-12-23 | Toshiba Mach Co Ltd | Automatic setting method of clamping force for die opening/closing installation |
-
1983
- 1983-08-11 JP JP14768283A patent/JPS6038117A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58221653A (en) * | 1982-06-16 | 1983-12-23 | Toshiba Mach Co Ltd | Automatic setting method of clamping force for die opening/closing installation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI474914B (en) * | 2012-11-09 | 2015-03-01 | Sharp Kk | Apparatus and method for producing molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6038117A (en) | 1985-02-27 |
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