JPH0520246U - Hiuse board - Google Patents

Hiuse board

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Publication number
JPH0520246U
JPH0520246U JP6939591U JP6939591U JPH0520246U JP H0520246 U JPH0520246 U JP H0520246U JP 6939591 U JP6939591 U JP 6939591U JP 6939591 U JP6939591 U JP 6939591U JP H0520246 U JPH0520246 U JP H0520246U
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JP
Japan
Prior art keywords
fusing
fusing member
opening
individual
peripheral circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6939591U
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Japanese (ja)
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JP2580929Y2 (en
Inventor
収一 金川
博文 西脇
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Priority to JP1991069395U priority Critical patent/JP2580929Y2/en
Publication of JPH0520246U publication Critical patent/JPH0520246U/en
Application granted granted Critical
Publication of JP2580929Y2 publication Critical patent/JP2580929Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

(57)【要約】 【目的】基板の発煙、熱損傷を防止し、一つの金型等か
ら複数手種のヒューズ配列を可能とする。 【構成】絶縁性基板上に共通電極及び該共通電極と接続
する複数の個別電極を備えた周辺回路を設ける。個別電
極を並設した部分に上記開口部を設け、該開口部に過電
流が流れると溶断する溶断部材を架設する。溶断部材の
端部は個別電極の端部の上面に配置される。個別電極の
両側には挿通孔を設けている。接続部材の平坦状の押圧
部を溶断部材の両端部の上面に配置すると共に、該平坦
部の両側に設けた腕部を上記挿通孔から挿入して、上記
腕部及び押圧部により上記溶断部材と個別電極の端部を
挟持して押圧し、溶断部材と個別電極を接続する。
(57) [Summary] [Purpose] To prevent smoke generation and heat damage on the substrate and enable fuse arrangements of multiple types from a single mold. A peripheral circuit having a common electrode and a plurality of individual electrodes connected to the common electrode is provided on an insulating substrate. The opening is provided at a portion where the individual electrodes are arranged in parallel, and a fusing member that fuses when an overcurrent flows through the opening is provided. The end of the fusing member is arranged on the upper surface of the end of the individual electrode. Insertion holes are provided on both sides of the individual electrode. The flat pressing portion of the connecting member is arranged on the upper surfaces of both ends of the fusing member, and the arm portions provided on both sides of the flat portion are inserted from the insertion holes, and the fusing member is pressed by the arm portion and the pressing portion. And the ends of the individual electrodes are clamped and pressed to connect the fusing member and the individual electrodes.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial application]

本考案は、絶縁基板上に形成する回路の一部において、その幅又は厚さを適切 に設定して断面積を小さくして溶断回路の働きを持たせるヒューズ板に関し、詳 しくは、溶断回路を高い寸法精度でかつ正確に断面積を制御できるようにすると 共に、過電流による発熱よる損傷をなくすものであって、特に、ヒューズを集積 化及び小型化して用いる場合、例えば、産業用機器、自動車等のワイヤハーネス におけるヒューズを集積した集積カードヒューズや、民生用電子機器における小 型ヒューズとして好適に用いられるものである。 The present invention relates to a fuse plate that has a function of a fusing circuit by appropriately setting the width or thickness of a part of the circuit formed on an insulating substrate to reduce the cross-sectional area. Is to control the cross-sectional area with high dimensional accuracy and accurately, and also to prevent damage due to heat generation due to overcurrent.In particular, when fuses are integrated and miniaturized, for example, industrial equipment, It is suitable for use as an integrated card fuse that integrates fuses in wire harnesses for automobiles, and as a small fuse in consumer electronic devices.

【0002】[0002]

【従来の技術】[Prior Art]

図12に示すように、従来より、1枚の絶縁性基板の上に複数のヒューズパタ ーン (以下、溶断回路と称する。)を並列した集積カードヒューズが提供されて いる。 As shown in FIG. 12, conventionally, there has been provided an integrated card fuse in which a plurality of fuse patterns (hereinafter referred to as fusing circuits) are arranged in parallel on one insulating substrate.

【0003】 この集積カードヒューズでは、絶縁基板1上に共通電極3を形成しており、各 溶断回路2の一端側を共通電極3に連続させる一方、各溶断回路2の他端側をコ ネクタ端子接触部となる個別電極4に連続させる構成としている。In this integrated card fuse, a common electrode 3 is formed on an insulating substrate 1, one end side of each fusing circuit 2 is connected to the common electrode 3, and the other end side of each fusing circuit 2 is a connector. It is configured to be continuous with the individual electrode 4 that serves as a terminal contact portion.

【0004】 上記集積カードヒューズは、ガラスエポキシ、ポリイミド、PET等の樹脂基 板上に板材の打ち抜き又は上記樹脂基板に貼付した金属箔のエッチング等により 回路を形成していた。In the integrated card fuse, a circuit is formed by punching a plate material on a resin base plate such as glass epoxy, polyimide, PET or etching a metal foil attached to the resin substrate.

【0005】 絶縁樹脂基板上に貼付した金属箔をエッチングして形成する場合は、金属箔 (主として銅箔)を貼付した基板を洗浄後、金属箔の表面にレジストを塗布し、 次いで、露光・現像を行い、エッチングして、上記図12に示すように、溶断回 路2、共通電極3、個別電極4を備えた周辺回路を形成している。When the metal foil attached on the insulating resin substrate is formed by etching, the substrate on which the metal foil (mainly copper foil) is attached is washed, a resist is applied to the surface of the metal foil, and then exposure / exposure is performed. After development and etching, as shown in FIG. 12, a peripheral circuit including the fusing circuit 2, the common electrode 3, and the individual electrode 4 is formed.

【0006】[0006]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記したヒューズ板においては、樹脂絶縁基板上に容量の大きな溶断回路を形 成した場合、過電流による発熱で基板から発煙、更には焼損が発生する危険性が あった。 In the fuse plate described above, when a large-capacity fusing circuit is formed on the resin insulating substrate, there is a risk that overheating will cause smoke to be emitted from the substrate and further burnout.

【0007】 この問題を解決するため、基板として耐熱性に優れたアルミナセラミックを用 いることができるが、アルミナセラミックは非常に高価であるため、コストアッ プの問題が生じると共に、溶断回路の熱も拡散しやすくなるため、溶断特性が安 定しにくい。In order to solve this problem, an alumina ceramic having excellent heat resistance can be used as a substrate. However, since alumina ceramic is very expensive, there is a problem of cost increase and heat of a fusing circuit is also generated. The fusing characteristics are difficult to stabilize because they diffuse easily.

【0008】 また、上記のように一つの樹脂基板に板材の打ち抜き又はエッチングにより溶 断回路を形成するため、溶断回路と周辺回路を同時成形することとなり、一つの 金型あるいはマスクでは、一つのパターンのヒューズ配列しか作成することがで きなかった。即ち、溶断回路の幅を変えて容量を変えるには、金型又はマスクが 別途必要となる。Further, as described above, since the fusing circuit is formed on one resin substrate by punching or etching the plate material, the fusing circuit and the peripheral circuit are simultaneously molded, and one die or mask has one Only the fuse array of the pattern could be created. That is, in order to change the width of the fusing circuit to change the capacity, a mold or mask is required separately.

【0009】 更に、板材の打ち抜きによる方法では、寸法精度が悪く、小容量のヒューズで は溶断回路の幅を細かくしなければならないので、溶断回路の作成が極めて困難 であった。Further, in the method of punching the plate material, the dimensional accuracy is poor, and the width of the fusing circuit has to be made small in the case of a fuse having a small capacity, so that it is extremely difficult to make the fusing circuit.

【0010】 また、エッチングによる方法では、金属箔の厚さは一定で、共通電極及び個別 電極の膜厚と溶断回路の厚さとが同一になるため、溶断特性の制御はパターン幅 のみで行わなければならないが、この金属箔をエッチングする方法では高い寸法 精度で微細なパターンを作成することは困難であった。Further, in the method using etching, the thickness of the metal foil is constant, and the film thicknesses of the common electrode and the individual electrode are the same as the thickness of the fusing circuit. Therefore, the fusing property must be controlled only by the pattern width. However, it was difficult to create a fine pattern with high dimensional accuracy by the method of etching this metal foil.

【0011】 上記のように、溶断回路の幅を小さくすると、寸法精度を高く保つことが困難 となり、溶断特性が低下する。そのため、同様な小容量の溶断回路を形成するに は、金属箔の厚さを薄くすると溶断回路の幅を広くとることができることから、 金属箔は薄い方が好ましい。一方、共通電極及び個別電極では電気抵抗を小さく するため厚さが大きい方が望ましい。しかしながら、上記のように溶断回路、共 通電極及び個別電極の全てにおいて均一であるため、溶断回路のみを薄く、電力 供給回路を厚くすることはできない問題があった。As described above, if the width of the fusing circuit is made small, it becomes difficult to keep the dimensional accuracy high, and the fusing characteristic deteriorates. Therefore, in order to form a similar small-capacity fusing circuit, it is preferable that the metal foil is thin because the width of the fusing circuit can be widened by reducing the thickness of the metal foil. On the other hand, it is preferable that the common electrode and the individual electrode have a large thickness in order to reduce electric resistance. However, since the fusing circuit, the common electrode, and the individual electrode are all uniform as described above, there is a problem that the fusing circuit alone cannot be thin and the power supply circuit cannot be thick.

【0012】 本考案は、上記した従来のヒューズ板における問題を鑑みてなされたもので、 大容量のヒューズを作り込んだ場合に生じる基板からの発煙、焼損を防止し、ま た、一つの金型又はマスクを用いた場合にも複数種のヒューズ配列を可能とする と共に、高い寸法精度が要求される溶断回路の膜厚は薄く、共通電極及び個別電 極の膜厚は大きくできるようにして、従来の問題を全て解決することを目的とし てなされたものである。The present invention has been made in view of the problems in the above-described conventional fuse plate, and prevents smoke and burnout from the substrate that occur when a large-capacity fuse is built in, and also provides a single gold fuse. Even if a mold or mask is used, multiple fuse arrangements are possible, and the film thickness of the fusing circuit, which requires high dimensional accuracy, is thin and the film thickness of the common electrode and individual electrodes can be made large. , It was made with the purpose of solving all the problems of the past.

【0013】[0013]

【課題を解決するための手段】[Means for Solving the Problems]

従って、本考案は、絶縁基板上に周辺回路を設けた回路基板に開口部を設け、 該開口部に過電流が流れると溶断する溶断部材を架設し、該溶断部材の両端部を 上記周辺回路に接続していることを特徴とするヒューズ板を提供するものである 。 Therefore, according to the present invention, an opening is provided in a circuit board having a peripheral circuit provided on an insulating substrate, and a fusing member that fuses when an overcurrent flows through the opening is installed, and both ends of the fusing member are connected to the peripheral circuit. The fuse plate is characterized by being connected to the.

【0014】 具体的には、例えば、上記周辺回路は絶縁性基板上に共通電極及び該共通電極 と接続する複数の個別電極を備え、該個別電極を並設した部分に上記開口部を設 け、該開口部を挟んで対向する個別電極の一対の端部を溶断部材により接続し、 集積カードヒューズとする構成としてもよい。Specifically, for example, the peripheral circuit includes a common electrode on the insulating substrate and a plurality of individual electrodes connected to the common electrode, and the opening is provided at a portion where the individual electrodes are arranged in parallel. The integrated card fuse may be configured by connecting a pair of end portions of the individual electrodes facing each other across the opening by a fusing member.

【0015】 上記開口部を挟んで対向する個別電極の一対の端部と溶断部材の端部は、接続 部材により挟持して接続する構成としている。The pair of end portions of the individual electrode and the end portion of the fusing member which face each other across the opening are configured to be sandwiched and connected by a connecting member.

【0016】 更に具体的には、上記開口部を挟んで対向する個別電極の一対の端部の両側に それぞれ挿通孔を設け、上記溶断部材の端部をそれぞれ上記個別電極の端部の上 面に配置し、接続部材の平坦状の押圧部を上記溶断部材の両端部の上面に配置す ると共に、該平坦部の両側に設けた腕部を上記挿通孔から挿入し、上記腕部及び 押圧部により上記溶断部材と個別電極の端部を挟持して、溶断部材と個別電極を 接続する構成としている。More specifically, insertion holes are provided on both sides of a pair of end portions of the individual electrodes that face each other with the opening interposed therebetween, and the end portions of the fusing member are respectively provided on the upper surface of the end portions of the individual electrodes. And the flat pressing portions of the connecting member are arranged on the upper surfaces of both ends of the fusing member, and the arm portions provided on both sides of the flat portion are inserted through the insertion holes, and the arm portion and the pressing portion are pressed. The end portion of the fusing member and the individual electrode is sandwiched between the parts to connect the fusing member and the individual electrode.

【0017】 上記接続部材の押圧部には、エンボス部、舌状部、くぼみ部等の凹凸部を設け ることが好ましい。It is preferable that the pressing portion of the connecting member is provided with an uneven portion such as an embossed portion, a tongue-shaped portion, and a recessed portion.

【0018】[0018]

【作用】[Action]

本考案に係るヒューズ板は、上記のように溶断部材と周辺回路とを別個に形成 しているため、溶断部材の幅及び厚さは周辺回路の厚さに関係なく設定すること ができる一方、周辺回路の厚さも溶断部材の幅等に関係なく設定することができ る。 Since the fuse plate according to the present invention has the fusing member and the peripheral circuit formed separately as described above, the width and thickness of the fusing member can be set independently of the thickness of the peripheral circuit. The thickness of the peripheral circuit can be set regardless of the width of the fusing member.

【0019】 絶縁基板上に、共通電極と複数の個別電極を備える周辺回路を設け、開口部を 個別回路を並設する部分に設けた場合には、同一基板により各種の容量、配列パ ターンの溶断回路を設けることができる。When a peripheral circuit having a common electrode and a plurality of individual electrodes is provided on an insulating substrate and an opening is provided in a portion where the individual circuits are arranged in parallel, various capacitors and array patterns of the same substrate can be formed. A fusing circuit can be provided.

【0020】 また、溶断部材を基板上に取付けず、単独で用いているため、溶断部材の発熱 により基板が発煙、焼損するのを防止することができる。Further, since the fusing member is used alone without being attached on the substrate, it is possible to prevent the substrate from smoking or burning due to heat generation of the fusing member.

【0021】 溶断部材と個別電極の端部を接続部材により挟持して押圧し、よって、溶断部 材と個別電極を接続しているため、他の接続手段、例えば、半田、超音波溶接等 を用いて溶着する場合と比較して熱の影響による問題が少ない。即ち、常温で、 かつ、機械的に溶断部材と個別電極を接続しているため、接続の際に熱の影響に より損傷するのを防止することができる。Since the fusing member and the individual electrode are sandwiched and pressed by the connecting member and the fusing member and the individual electrode are connected to each other, other connecting means, for example, solder, ultrasonic welding, etc. There are less problems due to the effect of heat than when using and welding. That is, since the fusing member and the individual electrode are mechanically connected to each other at room temperature, it is possible to prevent damage due to the influence of heat upon connection.

【0022】 更に、導電性接着剤を使用した場合過電流が流れると接着剤の層が炭化してし まい、所望の溶断特性が得られないことがあるが、本考案では、上記のように接 続部材により機械的に溶断部材と周辺回路を接続しているため、所定の過電流で 溶断部材は確実に溶断する。Further, when a conductive adhesive is used, when the overcurrent flows, the adhesive layer may be carbonized and the desired fusing property may not be obtained. In the present invention, however, as described above, Since the fusing member and the peripheral circuit are mechanically connected by the connecting member, the fusing member is surely blown by a predetermined overcurrent.

【0023】[0023]

【実施例】【Example】

次に、図面に示す実施例に基づき本考案について詳細に説明する。 図1から図6は、集積カードヒューズを構成する本考案のヒューズ板の第1実 施例を示し、上記ヒューズ板は、周辺回路11を設けた回路基板12に開口部 20を設け、接続部材14により溶断部材13を開口部20に架設した構成とし ている。 Next, the present invention will be described in detail based on the embodiments shown in the drawings. 1 to 6 show a first embodiment of a fuse plate of the present invention which constitutes an integrated card fuse. In the fuse plate, an opening 20 is provided in a circuit board 12 having a peripheral circuit 11, and a connecting member is provided. The fusing member 13 is provided over the opening 20 by means of 14.

【0024】 回路基板12は、ガラスエポキシ樹脂からなる絶縁性基板15の上面に銅箔を 用いたガラスエッチングにより周辺回路11を設けており、この周辺回路11は 、図中左側から図中上方に延在する共通電極17と、この共通電極17の図中上 方の部分で並列に接続して図中下方に延在する個別電極18を備えている。The circuit board 12 is provided with a peripheral circuit 11 on the upper surface of an insulating substrate 15 made of glass epoxy resin by glass etching using copper foil. The peripheral circuit 11 is arranged from the left side in the figure to the upper side in the figure. The common electrode 17 extends and an individual electrode 18 connected in parallel at the upper part of the common electrode 17 and extending downward in the drawing.

【0025】 上記個別電極18を並設した部分の中央部には開口部20を設けており、各個 別電極18の切断された一対の端部18a,18bが開口部20の端縁まで延在し 、開口部20を挟んで対向するようにしている。An opening 20 is provided in the center of the portion where the individual electrodes 18 are arranged side by side, and the pair of cut ends 18 a and 18 b of each individual electrode 18 extend to the edge of the opening 20. However, the openings 20 are opposed to each other.

【0026】 また、絶縁性基板15の上記個別電極18の端部18a,18bの左右両側の部 位には、後述する接続部材14の腕部14b,14bを挿入する断面略矩形状の挿 入孔15a,15aを上面から下面まで貫通して設けている。In addition, at the left and right sides of the end portions 18a and 18b of the individual electrode 18 of the insulating substrate 15, insertion of arms 14b and 14b of the connecting member 14 which will be described later has a substantially rectangular cross section. The holes 15a, 15a are provided so as to penetrate from the upper surface to the lower surface.

【0027】 溶断部材13は、銅箔からなり、図6に示すように、所定の過電流により溶断 する溶断部13aと、該溶断部13aの両側に設けた幅広状の端部13b,13bを 備えている。 本実施例では、上記溶断部13a,13aは、1A〜5Aの電流で切断するよう に、その断面積を設定している。即ち、本実施例では溶断部13a,13aの厚さ Tを35μm、幅Wを50μmに設定している。The fusing member 13 is made of copper foil, and as shown in FIG. 6, has a fusing portion 13a that is fused by a predetermined overcurrent and wide ends 13b and 13b provided on both sides of the fusing portion 13a. I have it. In this embodiment, the fusing parts 13a, 13a are set so that their cross-sectional areas are cut by a current of 1A to 5A. That is, in this embodiment, the thickness T of the fusing parts 13a, 13a is set to 35 μm and the width W is set to 50 μm.

【0028】 溶断部材13は溶断部13aが開口部20上に位置すると共に、端部13b, 13bがそれぞれ上記したように開口部20を挟んで対向する各個別電極18の 一対の端部18a,18bの上面に重ねるように配置しており、接続部材14によ り締め付けて挟持し、よって、個別電極18の端部18a,18bと溶断部材13 の端部13b,13bを接合導通させている。In the fusing member 13, the fusing part 13 a is located on the opening 20, and the ends 13 b and 13 b respectively face the pair of ends 18 a, 18 a of the individual electrodes 18 facing each other with the opening 20 therebetween. It is arranged so as to overlap with the upper surface of 18b, and is clamped and clamped by the connecting member 14, so that the ends 18a, 18b of the individual electrode 18 and the ends 13b, 13b of the fusing member 13 are joined and conducted. .

【0029】 上記接続部材14は、詳しくは、導電性及び弾性を有する材料からなる。また 、接続部材14は断面略倒コ字状であって、溶断部材13の端部13b,13bを 上記個別電極18の端部18a,18bに押圧する平板状の上面部を形成する押圧 部14aと、この押圧部14aの両側から図中下方に延在して、上記した絶縁性基 板15に設けた挿通孔15a,15aに挿通する一対の腕部14b,14bからなる。 これら腕部14b,14bは挿通孔15a,15aを挿通後、絶縁性回路基板15か ら突出した部分を、後述する方法により、図示のように絶縁性回路基板の裏面側 に当接するように押し曲げている。よって、押し曲げられた円弧状の湾曲部14 c,14cの先端が、絶縁性基板15の裏面側に当接する。Specifically, the connecting member 14 is made of a material having conductivity and elasticity. Further, the connecting member 14 has a substantially inverted U-shaped cross section, and forms a flat plate-shaped upper surface portion that presses the end portions 13b and 13b of the fusing member 13 against the end portions 18a and 18b of the individual electrode 18 described above. The pair of arm portions 14b and 14b extend downward from both sides of the pressing portion 14a and are inserted into the insertion holes 15a and 15a provided in the insulating base plate 15 described above. After inserting the arm portions 14b, 14b through the insertion holes 15a, 15a, the portions protruding from the insulating circuit board 15 are pushed by the method described later so as to come into contact with the back surface side of the insulating circuit board as shown in the figure. Bent. Therefore, the tips of the bent and curved arcuate portions 14 c, 14 c come into contact with the back surface side of the insulating substrate 15.

【0030】 接続部材14は、上記のような形状としているため、湾曲部14c,14cの先 端部と上記した押圧部14aの間に、絶縁性基板15、個別電極18の端部18a ,18b及び溶断部材13の端部13bを弾性的に締め付けて押圧し、よって、個 別電極18と端部13bを接続、導通させている。Since the connecting member 14 has the above-described shape, the insulating substrate 15 and the end portions 18a, 18b of the individual electrode 18 are provided between the front end portions of the curved portions 14c, 14c and the pressing portion 14a. Also, the end portion 13b of the fusing member 13 is elastically tightened and pressed, so that the individual electrode 18 and the end portion 13b are connected and electrically connected.

【0031】 本実施例では、上記押圧部14aに、断面略台形の長尺状の凹みからなる下面 側に突出したエンボス部23を溶断部材13の幅方向に連続して設け、該エンボ ス部23を上記溶断部材13の端部13b,13bの上面部に押し込んでいる。そ のため、上記押圧部14aにより、確実かつ強固に溶断部材13の端部13bと個 別電極18を押圧保持することができる。In the present embodiment, the pressing portion 14a is provided with an embossed portion 23, which is a long recess having a substantially trapezoidal cross section and which protrudes to the lower surface side, is continuously provided in the width direction of the fusing member 13. 23 is pushed into the upper surfaces of the end portions 13b and 13b of the fusing member 13. Therefore, the pressing portion 14a can reliably and firmly press and hold the end portion 13b of the fusing member 13 and the individual electrode 18.

【0032】 上記のような構造の溶断部材13の端部13bと個別電極18の接合は、図7 のようにして行う。 尚、接続部材14は、下記の操作を行って端部13bと端部18a,18bを接続 する前の状態では、腕部14bの先端には湾曲部14cは形成されておらず、また 、押圧部14aにエンボス部23は形成させていない。The end portion 13b of the fusing member 13 having the above structure and the individual electrode 18 are joined as shown in FIG. The connecting member 14 does not have the curved portion 14c formed at the tip of the arm portion 14b before the end portion 13b is connected to the end portions 18a, 18b by performing the following operation, and the connecting member 14 is not pressed. The embossed portion 23 is not formed on the portion 14a.

【0033】 絶縁性基板15の周辺回路11を設けた面と反対側の面に、断面半円状の一対 の凹部25a,25aを設けた下型25を、それら凹部25a,25aが挿通孔15a, 15aと対向する位置となるように配置する。次に、先端に湾曲部14c,14cが 形成されていない状態の接続部材14の腕部14b,14bをそれぞれ上記挿入孔 15a,15aに挿入する。The lower die 25 having a pair of recesses 25a, 25a having a semicircular cross section is formed on the surface of the insulating substrate 15 opposite to the surface on which the peripheral circuit 11 is provided. The recesses 25a, 25a are inserted into the insertion holes 15a. , 15a. Next, the arm portions 14b, 14b of the connecting member 14 in which the curved portions 14c, 14c are not formed at the tips are inserted into the insertion holes 15a, 15a, respectively.

【0034】 一方、上記したエンボス部23が形成されていない状態の押圧部14a側を上 型26の孔部26a内に挿入配置する。この孔部26aには、押圧部14aに所望 のエンボス部23を形成するために、エンボス部23に対応した形状の突起部 26bを設けている。On the other hand, the pressing portion 14a side where the above-mentioned embossed portion 23 is not formed is inserted and arranged in the hole portion 26a of the upper die 26. The hole 26a is provided with a protrusion 26b having a shape corresponding to the embossed portion 23 in order to form a desired embossed portion 23 on the pressing portion 14a.

【0035】 そのため、上記したように腕部14b,14bを挿入孔15a,15aに配置した状 態で上記上型26を下型25の方へ移動すると、腕部14b,14bの先端部は凹 部25a,25aの周面に沿って移動して該凹部25a,25aのアールに適合した湾 曲部14c,14cを形成していく。更に上型26を移動すると、押圧部14a、溶 断部材13の端部13b、個別電極18及び絶縁性基板15が上型26の孔部 26aの下面と、下型25の上面との間に押圧される。そのため、上記突起部 26bが押圧部14aを溶断部材13の端部13bの上面に押し込み、エンボス部 23が形成される。Therefore, when the upper mold 26 is moved toward the lower mold 25 with the arms 14b, 14b being arranged in the insertion holes 15a, 15a as described above, the tips of the arms 14b, 14b are recessed. The curved portions 14c, 14c are formed by moving along the peripheral surfaces of the portions 25a, 25a to match the radiuses of the recesses 25a, 25a. When the upper die 26 is further moved, the pressing portion 14a, the end portion 13b of the fusing member 13, the individual electrode 18 and the insulating substrate 15 are moved between the lower surface of the hole portion 26a of the upper die 26 and the upper surface of the lower die 25. Is pressed. Therefore, the projecting portion 26b pushes the pressing portion 14a onto the upper surface of the end portion 13b of the fusing member 13 to form the embossed portion 23.

【0036】 尚、上記のように、第1実施例では、接続部材14により溶断部材13と個別 電極18の端部を挟持、押圧して接続しているが、接続部材14はいわばホッチ キスの針のようにして、溶断部材13と個別電極18を挟持、押圧しており、腕 部14bの先端部分に必ずしも湾曲部14cが形成されている必要はなく、腕部 14bの絶縁性回路基板15から突出した部分が該絶縁性回路基板15側に折れ 曲がり、よって、押圧部14aと腕部14b,14cとにより溶断部材13と個別電 極18の端部を挟持する構成とすれば良い。As described above, in the first embodiment, the fusing member 13 and the individual electrode 18 are clamped and pressed by the connecting member 14 to connect them, but the connecting member 14 is a stapler. The fusing member 13 and the individual electrode 18 are sandwiched and pressed like a needle, and the curved portion 14c does not necessarily have to be formed at the tip portion of the arm portion 14b, and the insulating circuit board 15 of the arm portion 14b is not necessarily formed. The portion projecting from is bent toward the side of the insulating circuit board 15, so that the pressing portion 14a and the arm portions 14b and 14c sandwich the end portions of the fusing member 13 and the individual electrode 18.

【0037】 上記の構成としたヒューズ板では、溶断部材13を、絶縁性基板15に設けた 周辺回路11とは別体としているため、下記に列挙する作用効果を有する。 まず、溶断部13aを絶縁性基板15に設けず別体としているため、溶断部 13aに過大な電流が流れる場合にも、基板が発煙、焼損するのを防止すること ができる。In the fuse plate having the above-mentioned configuration, the fusing member 13 is provided separately from the peripheral circuit 11 provided on the insulating substrate 15, and thus has the following effects. First, since the fusing part 13a is not provided on the insulating substrate 15 but is a separate body, it is possible to prevent the substrate from smoking or burning even when an excessive current flows through the fusing part 13a.

【0038】 また、絶縁性基板15の周辺回路11を厚さ等を変更することなく、溶断部材 13のみを適宜に変更することにより、各種のパターンのヒューズ配列とするこ とが可能であると共に、溶断部材の容量も溶断部材13を取り替えることにより 、簡単に変更することができる。In addition, the peripheral circuit 11 of the insulating substrate 15 can be formed into a fuse array of various patterns by appropriately changing only the fusing member 13 without changing the thickness and the like. The capacity of the fusing member can also be easily changed by replacing the fusing member 13.

【0039】 一方、周辺回路の膜厚も、上記溶断部材に関係なく設定することができるため 、電気抵抗を大きくするために膜厚を大きくすることができ、容量の大きなヒュ ーズを集積しても電力供給に支障をきたさない。また、個別電極をコネクタ端子 接触部とする場合には、摩耗性、接触特性の点からある程度以上の膜厚が必要で あり、この点からも周辺回路の膜厚を溶断部材に関係なく大きくできることは大 きな利点となる。On the other hand, the film thickness of the peripheral circuit can be set regardless of the fusing member. Therefore, the film thickness can be increased in order to increase the electric resistance, and a fuse having a large capacity can be integrated. However, it does not hinder the power supply. In addition, when the individual electrodes are used as the contact parts of the connector terminals, a certain thickness or more is required in terms of wear resistance and contact characteristics, and from this point also the thickness of the peripheral circuit can be increased regardless of the fusing member. Is a great advantage.

【0040】 更に、上記のような構成としたヒューズ板では、、個別電極と溶断部材を接続 部材により機械的に接続しており、接続は常温の状態(低温プロセス)で行なわれ るため、半田、超音波溶接等の熱融解を伴う高温状態(高温プロセス)でそれらを 接続した場合に溶断部材に生じる熱の影響による損失を防止することができる。Further, in the fuse plate configured as described above, the individual electrodes and the fusing member are mechanically connected by the connecting member, and since the connection is performed at room temperature (low temperature process), soldering is performed. It is possible to prevent loss due to the influence of heat generated in the fusing member when connecting them in a high temperature state (high temperature process) involving heat melting such as ultrasonic welding.

【0041】 本発明において、接続部材14の凹凸部は上記第1実施例におけるエンボス部 に限定されるものではなく、種々の変形が可能である。In the present invention, the concavo-convex portion of the connecting member 14 is not limited to the embossed portion in the first embodiment, and various modifications are possible.

【0042】 図8及び図9は、本考案の第2実施例を示している。 この第2実施例では、接続部材14の押圧部14aに溶断部材13の幅方向に 対向するように、切り込んで三角形状の舌状部28,28を設けている。 この舌状部28の先端は、溶断部材13の端部13bに食い込んで貫通して、 個別端子18の端部18a,18bまで挿入している。8 and 9 show a second embodiment of the present invention. In the second embodiment, triangular tongue portions 28, 28 are formed by cutting so as to face the pressing portion 14a of the connecting member 14 in the width direction of the fusing member 13. The tip of this tongue-shaped portion 28 bites into the end portion 13b of the fusing member 13 and penetrates it, and is inserted up to the end portions 18a and 18b of the individual terminal 18.

【0043】 第2実施例では、上記のように舌状部28,28が端部13b,13b及び端部 18a,18bに食い込んでいるため、接続部14は、一層強固に溶断部材13と 個別回路18を接続することができる。 また、接続部材14は導電性を有する材料から形成しているため、舌状部28 が溶断部材13の端部13bと個別端子18の端部18a,18bの間の導電性を向 上することができる。 第2実施例のその他の構成及び作用は上記した第1実施例と同様であるので、 同様の部材には、同様の符号付して説明を省略する。In the second embodiment, since the tongue-shaped portions 28, 28 bite into the end portions 13b, 13b and the end portions 18a, 18b as described above, the connecting portion 14 is more strongly separated from the fusing member 13 and the melting member 13. The circuit 18 can be connected. Further, since the connecting member 14 is made of a conductive material, the tongue 28 should improve the conductivity between the end 13b of the fusing member 13 and the ends 18a, 18b of the individual terminals 18. You can Since the other structure and operation of the second embodiment are the same as those of the above-mentioned first embodiment, the same members are designated by the same reference numerals and the description thereof will be omitted.

【0044】 図10及び図11は、本考案の第3実施例を示している。 この第3実施例では、押圧部14aに円形状のくぼみ部29を複数個設けてい る。 このくぼみ部29は、上記エンボス部23と同様に、溶断部材13の端部13 bに押し込まれており、よって、押圧部14aにより溶断部材13の端部13bを 個別端子の端部18a,18bに強固に接続することができる。10 and 11 show a third embodiment of the present invention. In the third embodiment, the pressing portion 14a is provided with a plurality of circular recesses 29. Like the embossed portion 23, the recess 29 is pushed into the end portion 13b of the fusing member 13, so that the pressing portion 14a causes the end portion 13b of the fusing member 13 to move to the end portions 18a, 18b of the individual terminals. Can be firmly connected to.

【0045】 本発明は上記した実施例に限定されるものではなく種々の変形が可能である。 まず、上記絶縁性基板の材質は、上記したガラスエポキシ樹脂に限定されるも のではなく、例えば、カミフェノール、ポリイミド、PET(ポリエチレンテレ フタノール)等を使用してもよい。The present invention is not limited to the above-mentioned embodiments, and various modifications can be made. First, the material of the insulating substrate is not limited to the glass epoxy resin described above, but may be, for example, camiphenol, polyimide, PET (polyethylene terephthalanol) or the like.

【0046】 周辺回路を構成する材料は、銅の他に鈴、鉛、半田等を使用することができる 。 また、周辺回路の成形方法としては、上記金属箔を用いてエッチングする方法 の他に、スクリーン印刷、薄膜プロセス等を使用することができる。 更に、上記溶断部材の材質も上記した銅に限定されるものではなく、上記周辺 回路の材質と同様に鈴、鉛、半田等の種々の材料を使用することができる。また 、溶断部は必ずしも金属箔により構成する必要はなく、接続部により挟持するこ とが可能であれば、線材により構成してもよい。As the material forming the peripheral circuit, bell, lead, solder or the like can be used in addition to copper. Further, as a method of forming the peripheral circuit, in addition to the method of etching using the metal foil, screen printing, a thin film process and the like can be used. Further, the material of the fusing member is not limited to the above-mentioned copper, and various materials such as bell, lead and solder can be used like the material of the peripheral circuit. Further, the fusing part does not necessarily have to be made of a metal foil, and may be made of a wire material as long as it can be held by the connecting part.

【0047】 上記実施例では、接続部材の押圧部にエンボス部、舌状部、くぼみ部等の凹凸 部を設けて接続部材と溶断部材の端部を強固に接合するようにしているが凹凸部 の形状は上記のものに限定されるものではなく、押圧部と端部の接触面積を増加 させるものであれば、その他の適宜な形状のものであってもよい。 また、押圧部に凹凸部を設けず、平滑板状としてもよい。 更に、接続部材の材質も上記のように導電性のものに限定されるものではなく 、非導電性のものを使用してもよい。In the above-described embodiment, the pressing portion of the connecting member is provided with uneven portions such as embossed portions, tongue-shaped portions, and recessed portions to firmly join the end portions of the connecting member and the fusing member. The shape of is not limited to the above, and may be any other suitable shape as long as it increases the contact area between the pressing portion and the end portion. Further, the pressing portion may have a smooth plate shape without providing the uneven portion. Further, the material of the connecting member is not limited to the conductive material as described above, and a non-conductive material may be used.

【0048】[0048]

【考案の効果】[Effect of the device]

以上の説明から明らかなように、本考案に係るヒューズ板では、溶断部材を絶 縁性基板に設けた周辺回路と別個に設け、溶断部を絶縁性基板上に設けず別体と しているため、容量の大きい溶断部材に過電流が流れて発熱する場合にも、絶縁 性基板が発煙、焼損するのを防止することができる。 As is clear from the above description, in the fuse plate according to the present invention, the fusing member is provided separately from the peripheral circuit provided on the insulating substrate, and the fusing portion is not provided on the insulating substrate but is a separate body. Therefore, even when an overcurrent flows through a large-capacity fusing member to generate heat, it is possible to prevent the insulating substrate from smoking or burning.

【0049】 上記のように溶断部材と周辺回路を別体とすることにより、周辺回路では電気 抵抗を小さくするために厚さを大きく設定したままで、小さい容量の溶断部材を 取付けることも可能であり、一つの回路基板に種々の容量、配列のパターンの溶 断部材を設けることが可能である。By making the fusing member and the peripheral circuit separate from each other as described above, it is possible to attach a fusing member having a small capacity while keeping the thickness of the peripheral circuit large in order to reduce the electric resistance. Therefore, it is possible to provide the fusing members having various capacities and arrangement patterns on one circuit board.

【0050】 また、本考案では、溶断部材と周辺回路を接続部材により締め付けて接続して おり、溶断部材と周辺回路の接続は、常温の状態で、かつ、機械的に行っている ため、溶断部材が周辺回路への取付けの際に熱の影響で損傷することがなく、設 計通りの容量が得られ、安全性を確保することができる。Further, in the present invention, the fusing member and the peripheral circuit are fastened and connected by the connecting member. Since the fusing member and the peripheral circuit are mechanically connected at room temperature, the fusing The member is not damaged by the heat when it is attached to the peripheral circuit, the designed capacity is obtained, and safety can be secured.

【0051】 更に、本考案では、接続部材の押圧部にエンボス部、舌状部等の凹凸部を設け ることより溶断部材の端部と周辺回路を構成する周辺回路の個別電極の端部を更 に強固に押圧接続することができる等の種々の利点を有するものである。Further, according to the present invention, the pressing portion of the connecting member is provided with an uneven portion such as an embossed portion or a tongue portion so that the end portion of the fusing member and the end portion of the individual electrode of the peripheral circuit constituting the peripheral circuit are connected. It has various advantages such as a more firmly press-fitted connection.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本考案の第1実施例を示す平面図である。FIG. 1 is a plan view showing a first embodiment of the present invention.

【図2】 図1の底面図である。FIG. 2 is a bottom view of FIG.

【図3】 図1のIII部の拡大斜視図である。FIG. 3 is an enlarged perspective view of a part III in FIG.

【図4】 図3のIV−IV線での断面図である。FIG. 4 is a sectional view taken along line IV-IV in FIG.

【図5】 回路基板を示す平面図である。FIG. 5 is a plan view showing a circuit board.

【図6】 溶断部材を示す概略斜視図である。FIG. 6 is a schematic perspective view showing a fusing member.

【図7】 溶断部材の取付方法を示す概略断面図であ
る。
FIG. 7 is a schematic cross-sectional view showing a method of attaching the fusing member.

【図8】 第2実施例を示す拡大斜視図である。FIG. 8 is an enlarged perspective view showing a second embodiment.

【図9】 図8のIX−IX線での断面図である。9 is a sectional view taken along line IX-IX in FIG.

【図10】 第3実施例を示す拡大斜視図である。FIG. 10 is an enlarged perspective view showing a third embodiment.

【図11】 図11のXI−XI線での断面図である。11 is a sectional view taken along line XI-XI of FIG.

【図12】 従来のヒューズ板を示す平面図である。FIG. 12 is a plan view showing a conventional fuse plate.

【符号の説明】[Explanation of symbols]

11 周辺回路 12 回路基板 13 溶断部材 13a 溶断部 13b 端部 14 接続部材 15 絶縁性基板 17 共通電極 18 個別電極 18a,18b 端部 20 開口部 11 peripheral circuit 12 circuit board 13 fusing member 13a fusing part 13b end part 14 connecting member 15 insulating substrate 17 common electrode 18 individual electrode 18a, 18b end part 20 opening part

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 絶縁基板上に周辺回路を設けた回路基板
に開口部を設け、該開口部に過電流が流れると溶断する
溶断部材を架設し、該溶断部材の両端部を上記周辺回路
に接続していることを特徴とするヒューズ板。
1. An opening is provided in a circuit board having a peripheral circuit provided on an insulating substrate, and a fusing member that fuses when an overcurrent flows through the opening is provided, and both ends of the fusing member are connected to the peripheral circuit. A fuse plate characterized by being connected.
【請求項2】 上記周辺回路は絶縁性基板上に共通電極
及び該共通電極と接続する複数の個別電極を備え、該個
別電極を並設した部分に上記開口部を設け、該開口部を
挟んで対向する個別電極の一対の端部を溶断部材により
接続し、集積カードヒューズとしていることを特徴とす
る請求項1記載のヒューズ板。
2. The peripheral circuit includes a common electrode on an insulating substrate and a plurality of individual electrodes connected to the common electrode, the opening is provided at a portion where the individual electrodes are arranged in parallel, and the opening is sandwiched. The fuse plate according to claim 1, wherein a pair of ends of the individual electrodes facing each other are connected by a fusing member to form an integrated card fuse.
【請求項3】 上記開口部を挟んで対向する個別電極の
一対の端部と溶断部材の端部を接続部材により挟持して
接続していることを特徴とする請求項2記載のヒューズ
板。
3. The fuse plate according to claim 2, wherein a pair of end portions of the individual electrodes facing each other with the opening therebetween and an end portion of the fusing member are sandwiched and connected by a connecting member.
【請求項4】 上記開口部を挟んで対向する個別電極の
一対の端部の両側にそれぞれ挿通孔を設け、上記溶断部
材の端部をそれぞれ上記個別電極の端部の上面に配置
し、 接続部材の平坦状の押圧部を上記溶断部材の両端部の上
面に配置すると共に、該平坦部の両側に設けた腕部を上
記挿通孔から挿入し、上記腕部及び押圧部により上記溶
断部材と個別電極の端部を挟持して、溶断部材と個別電
極を接続していることを特徴とする請求項3記載のヒュ
ーズ板。
4. An insertion hole is provided on each side of a pair of end portions of the individual electrode facing each other across the opening, and the end portions of the fusing member are arranged on the upper surface of the end portion of the individual electrode, respectively, and connected. The flat pressing portion of the member is arranged on the upper surfaces of both ends of the fusing member, and the arm portions provided on both sides of the flat portion are inserted through the insertion holes, and the arm portion and the pressing portion serve as the fusing member. The fuse plate according to claim 3, wherein the fusing member and the individual electrode are connected to each other by sandwiching the end portion of the individual electrode.
JP1991069395U 1991-08-30 1991-08-30 Fuse plate Expired - Fee Related JP2580929Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991069395U JP2580929Y2 (en) 1991-08-30 1991-08-30 Fuse plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991069395U JP2580929Y2 (en) 1991-08-30 1991-08-30 Fuse plate

Publications (2)

Publication Number Publication Date
JPH0520246U true JPH0520246U (en) 1993-03-12
JP2580929Y2 JP2580929Y2 (en) 1998-09-17

Family

ID=13401377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991069395U Expired - Fee Related JP2580929Y2 (en) 1991-08-30 1991-08-30 Fuse plate

Country Status (1)

Country Link
JP (1) JP2580929Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022745A1 (en) * 2013-08-15 2015-02-19 松尾電機株式会社 Chip-type fuse

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286148A (en) * 1976-01-13 1977-07-18 Shinagawa Jidosha Densen Fuse board
JPS52152232U (en) * 1976-05-14 1977-11-18
JPS5571574U (en) * 1978-11-09 1980-05-16
JPS63123038U (en) * 1987-02-02 1988-08-10

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286148A (en) * 1976-01-13 1977-07-18 Shinagawa Jidosha Densen Fuse board
JPS52152232U (en) * 1976-05-14 1977-11-18
JPS5571574U (en) * 1978-11-09 1980-05-16
JPS63123038U (en) * 1987-02-02 1988-08-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022745A1 (en) * 2013-08-15 2015-02-19 松尾電機株式会社 Chip-type fuse

Also Published As

Publication number Publication date
JP2580929Y2 (en) 1998-09-17

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