JPH05198321A - Grounding resistance reducing material - Google Patents

Grounding resistance reducing material

Info

Publication number
JPH05198321A
JPH05198321A JP10406191A JP10406191A JPH05198321A JP H05198321 A JPH05198321 A JP H05198321A JP 10406191 A JP10406191 A JP 10406191A JP 10406191 A JP10406191 A JP 10406191A JP H05198321 A JPH05198321 A JP H05198321A
Authority
JP
Japan
Prior art keywords
reduction agent
resistance
grounding
grounding electrode
reducing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10406191A
Other languages
Japanese (ja)
Other versions
JP3056276B2 (en
Inventor
Hideaki Kikuchi
秀昭 菊地
Yasuo Hiruma
靖男 蛭間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASAHI DENKI KK
Asahi Electronics Co Ltd
Original Assignee
ASAHI DENKI KK
Asahi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASAHI DENKI KK, Asahi Electronics Co Ltd filed Critical ASAHI DENKI KK
Priority to JP3104061A priority Critical patent/JP3056276B2/en
Publication of JPH05198321A publication Critical patent/JPH05198321A/en
Application granted granted Critical
Publication of JP3056276B2 publication Critical patent/JP3056276B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To enlarge the contact area with the soil to enlarge the reducing effect of the grounding resistance by scattering only small pieces of the reduction agent in the surrounding of a grounding electrode or mixing the resistance reduction agent for scattering. CONSTITUTION:A grounding electrode 3 is buried under the ground horizontally, and the reduction materials A are distributed in the surrounding of the grounding electrode 3. The reduction agent 4 is a conventional one, and the new reduction agent A made of an excellent conductor is scattered thereon, and the grounding electrode 3 is placed thereon, and furthermore, the soil is heaped thereon. The grounding area is effective within the periphery of the area, where the reduction agent is distributed, independently from the shape of the grounding electrode 3 by scattering only the pieces of the reduction agent in the surrounding of the grounding electrode or mixing the resistance reduction agent for scattering. As a result, since the contact area with the soil is enlarged, the reducing effect of the grounding resistance is enlarged. This reduction agent A is made of a hollow fragments piece, which is made of copper plate or stainless steel plate having the excellent conductivity and the corrosion resistance and which consists of a hollow part 1 and a flange part 2 in the edge thereof.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は接地抵抗低減材に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ground resistance reducing material.

【0002】[0002]

【従来の技術】接地抵抗低減材として、従来硅酸ソーダ
を主体とする反応物質,ベントナイト,食塩等の無反応
鉱物類,炭素粉,木炭等の加工物質及びこれ等の混合物
が用いられている。これ等の物質は金属体に比べ何れも
固有抵抗が著しく高く、土壌中での水分の吸着によって
湿潤状態を保つことによる等価的な接地面積の増加効果
しかなく、金属体と同等の低減効果は期待できなかっ
た。
2. Description of the Related Art Conventionally, as a ground resistance reducing material, a reaction material mainly composed of sodium silicate, non-reacting minerals such as bentonite and salt, processed materials such as carbon powder and charcoal, and a mixture thereof are used. . All of these substances have significantly higher specific resistance than the metal body, and only have the equivalent effect of increasing the ground contact area by keeping the wet state by adsorbing moisture in the soil, and have the same reducing effect as the metal body. I couldn't expect it.

【0003】[0003]

【発明が解決しようとする課題】従来の低減剤は、上述
したように絶縁体または高抵抗材を使用し、地中での吸
湿性を利用して接地極周辺を湿潤な状態に保つことによ
り抵抗を低減させようとするものであるのに対し、それ
自体を良好な導電体として接地面積を積極的に増大さ
せ、接地抵抗の低減可能な接地抵抗低減材を提供する。
The conventional reducing agent uses an insulator or a high resistance material as described above, and utilizes the hygroscopicity in the ground to keep the periphery of the ground electrode in a wet state. The present invention aims to reduce the resistance, while providing a ground resistance reducing material capable of reducing the ground resistance by positively increasing the ground area by using itself as a good conductor.

【0004】[0004]

【課題を解決するための手段】導電率の良好な金属を素
材とし、これを中空状に成形して見掛け比重を小さくし
たものゝ集合体よりなり、これを接地極の周囲に撒いて
抵抗を小さくした。あるいは又さらに抵抗低減剤を混ぜ
て抵抗低減効果を増大ならしめた。
[Means for Solving the Problems] A metal, which has good conductivity, is formed into a hollow shape to reduce its apparent specific gravity. It is composed of an aggregate, which is scattered around the ground electrode to reduce the resistance. I made it smaller. Alternatively, a resistance reducing agent was further mixed to enhance the resistance reducing effect.

【0005】[0005]

【実施例】図に基いて説明する。図1は第1実施例であ
る。この接地抵抗低減材Aは導電性及び耐食性に優れた
銅板又はステンレス鋼板を素材として成形し、中空部1
とその端縁フランジ部2とからなる中空状の細片であ
る。
Embodiments will be described with reference to the drawings. FIG. 1 shows a first embodiment. The ground resistance reducing material A is formed by using a copper plate or a stainless steel plate having excellent conductivity and corrosion resistance as a material, and
It is a hollow strip made up of and its edge flange portion 2.

【0006】このような接地抵抗低減材を地中に埋設す
る条,板,棒等の接地極の周囲に所要厚さになるよう撒
き散らすことにより、接地極と低減材及び低減材相互間
が電気的に金属間接合状態となり、電流は最外部の低減
材部迄抵抗なく流れる。
By scattering such a grounding resistance reducing material to a required thickness around the grounding electrode such as a strip, plate or rod buried in the ground, the grounding electrode and the reducing material and the reducing material are separated from each other. The metal is electrically joined to the metal, and the current flows without resistance to the outermost reducing material portion.

【0007】図7と図8は接地極3を地中に水平に埋設
した例を示し、接地極3の周囲に低減材Aが撒布されて
いる。4は従来型の低減材で、図7の例ではこの上に本
発明の低減材を撒き、接地極3を載置し、さらにその上
に土壌を盛り上げている。又図9の場合は接地極3を垂
直に埋設した例で、この場合には接地極3の縦方向周囲
に低減材Aが充填されている。なお、この場合本発明の
低減材Aに加え従来型の低減材を混合しても勿論よい。
7 and 8 show an example in which the ground electrode 3 is horizontally embedded in the ground, and the reducing material A is sprinkled around the ground electrode 3. Reference numeral 4 is a conventional reducing material, and in the example of FIG. 7, the reducing material of the present invention is sprinkled on this, the grounding electrode 3 is placed, and the soil is further heaped thereon. Further, in the case of FIG. 9, the ground electrode 3 is vertically embedded, and in this case, the reducing material A is filled around the vertical direction of the ground electrode 3. In this case, of course, in addition to the reducing material A of the present invention, a conventional reducing material may be mixed.

【0008】図2〜図6は低減材の他の例を示し、図2
の場合は円筒状細片、図3及び図4に示すものは図2の
円筒状細片の中央部はそのまゝに残し、両端部を偏平に
圧縮した細片である。
2 to 6 show another example of the reducing material, and FIG.
In the case of No. 2, the strips shown in FIGS. 3 and 4 are strips of which both ends are flatly compressed while leaving the center of the strip of FIG. 2 as it is.

【0009】図5の場合には薄板を円筒状に巻いたも
の、図6は紙製の牛乳パックの如く中空の4面体で構成
し、開口部を圧着したものである。
In the case of FIG. 5, a thin plate is rolled into a cylindrical shape, and in FIG. 6, a hollow tetrahedron like a milk pack made of paper is used and the opening is crimped.

【0010】[0010]

【効果】以上のような低減材の細片を接地極の周囲に細
片のみ、又は抵抗低減剤を混ぜて撒くことにより接地面
積は電極形状の如何にかかわらず、低減材の撒布された
外周迄有効になり、その結果土壌との接触面積が大きく
なるため、接地抵抗の低減効果は大となる。
[Effect] By spreading the above-mentioned strip of reducing material only around the grounding electrode or by mixing with a resistance-reducing agent, the grounding area can be spread regardless of the electrode shape. It will be effective until then, and as a result, the contact area with soil will be large, and the effect of reducing ground resistance will be great.

【0011】中空形状であるから体積に占める見掛け上
の比重が小さく、運搬・荷役が楽である。又形状によっ
ては素材比重の1/10以下にすることも可能である。
さらに多数個を埋設することにより微小な突起が多数形
成され、雷撃電流を速やかに土中に逃がすことができ
る。即ちサージインピーダンスの低減効果が大となる。
Since it has a hollow shape, it has a small apparent specific gravity in the volume and is easy to carry and load. Depending on the shape, it is possible to make the specific gravity of the material 1/10 or less.
By embedding a large number of them, a large number of minute protrusions are formed, and the lightning current can be quickly released into the soil. That is, the effect of reducing the surge impedance becomes great.

【図面の簡単な説明】[Brief description of drawings]

【図1】低減材の第1実施例斜視図。FIG. 1 is a perspective view of a first embodiment of a reducing material.

【図2】低減材の第2実施例斜視図。FIG. 2 is a perspective view of a second embodiment of a reducing material.

【図3】低減材の第3実施例斜視図。FIG. 3 is a perspective view of a reducing material according to a third embodiment.

【図4】III−III断面図。FIG. 4 is a sectional view taken along line III-III.

【図5】第4実施例斜視図。FIG. 5 is a perspective view of a fourth embodiment.

【図6】第5実施例斜視図。FIG. 6 is a perspective view of a fifth embodiment.

【図7】低減材を用いて接地極を埋設した状態の断面
図。
FIG. 7 is a cross-sectional view showing a state in which a grounding electrode is buried using a reducing material.

【図8】図7の平面図。FIG. 8 is a plan view of FIG.

【図9】接地極を垂直に埋設した状態の断面図。FIG. 9 is a cross-sectional view showing a state in which a ground electrode is vertically embedded.

【符号の説明】[Explanation of symbols]

A 接地抵抗低減材 1 中空部 2 フランジ部 3 接地極 4 (従来の)低減材 A Ground resistance reduction material 1 Hollow part 2 Flange part 3 Ground electrode 4 (Conventional) reduction material

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 導電率の良好な金属を素材とし、これを
中空状に形成して見掛け比重を小さくしたものゝ集合体
よりなる接地抵抗低減材。
1. A ground resistance reducing material comprising an aggregate made of a metal having a good conductivity and formed in a hollow shape to have a small apparent specific gravity.
【請求項2】 接地抵抗低減剤を混合した請求項1の接
地抵抗低減材。
2. The ground resistance reducing material according to claim 1, wherein a ground resistance reducing agent is mixed.
JP3104061A 1991-02-13 1991-02-13 Grounding resistance reducing material Expired - Fee Related JP3056276B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3104061A JP3056276B2 (en) 1991-02-13 1991-02-13 Grounding resistance reducing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3104061A JP3056276B2 (en) 1991-02-13 1991-02-13 Grounding resistance reducing material

Publications (2)

Publication Number Publication Date
JPH05198321A true JPH05198321A (en) 1993-08-06
JP3056276B2 JP3056276B2 (en) 2000-06-26

Family

ID=14370668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3104061A Expired - Fee Related JP3056276B2 (en) 1991-02-13 1991-02-13 Grounding resistance reducing material

Country Status (1)

Country Link
JP (1) JP3056276B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280726A (en) * 2011-05-18 2011-12-14 湖南省电力公司科学研究院 Method for reducing grounding resistance of grounding network with non-uniform soil resistivity
CN102856671A (en) * 2012-04-25 2013-01-02 辽宁省电力有限公司丹东供电公司 Environment-friendly leak-proof moisturizing grounding device and construction method
KR101335008B1 (en) * 2013-06-17 2013-11-29 우리해양 주식회사 Grounding apparatus for seashore facilities
CN104409874A (en) * 2014-11-18 2015-03-11 句容华源电器设备有限公司 Transformer substation grounding grid resistance reduction method
US10262773B2 (en) 2013-08-16 2019-04-16 Shore Acres Enterprises Inc. Corrosion protection of buried metallic conductors
US10333234B2 (en) * 2017-08-14 2019-06-25 Shore Acres Enterprises Inc. Corrosion-protective jacket for electrode
US11121482B2 (en) 2017-10-04 2021-09-14 Shore Acres Enterprises Inc. Electrically-conductive corrosion-protective covering
US11421392B2 (en) 2019-12-18 2022-08-23 Shore Acres Enterprises Inc. Metallic structure with water impermeable and electrically conductive cementitous surround

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6087640B2 (en) * 2013-01-24 2017-03-01 株式会社ティラド Laminate heat exchanger

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280726A (en) * 2011-05-18 2011-12-14 湖南省电力公司科学研究院 Method for reducing grounding resistance of grounding network with non-uniform soil resistivity
CN102856671A (en) * 2012-04-25 2013-01-02 辽宁省电力有限公司丹东供电公司 Environment-friendly leak-proof moisturizing grounding device and construction method
KR101335008B1 (en) * 2013-06-17 2013-11-29 우리해양 주식회사 Grounding apparatus for seashore facilities
US10262773B2 (en) 2013-08-16 2019-04-16 Shore Acres Enterprises Inc. Corrosion protection of buried metallic conductors
US10665364B2 (en) 2013-08-16 2020-05-26 Shore Acres Enterprises Inc. Corrosion protection of buried metallic conductors
CN104409874A (en) * 2014-11-18 2015-03-11 句容华源电器设备有限公司 Transformer substation grounding grid resistance reduction method
US10333234B2 (en) * 2017-08-14 2019-06-25 Shore Acres Enterprises Inc. Corrosion-protective jacket for electrode
US11349228B2 (en) 2017-08-14 2022-05-31 Shore Acres Enterprises Inc. Corrosion-protective jacket for electrode
US11757211B2 (en) 2017-08-14 2023-09-12 Shore Acres Enterprises Inc. Electrical grounding assembly
US11121482B2 (en) 2017-10-04 2021-09-14 Shore Acres Enterprises Inc. Electrically-conductive corrosion-protective covering
US11894647B2 (en) 2017-10-04 2024-02-06 Shore Acres Enterprises Inc. Electrically-conductive corrosion-protective covering
US11421392B2 (en) 2019-12-18 2022-08-23 Shore Acres Enterprises Inc. Metallic structure with water impermeable and electrically conductive cementitous surround

Also Published As

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