JPH05190589A - Method of cleaning coated wire bonding tool - Google Patents
Method of cleaning coated wire bonding toolInfo
- Publication number
- JPH05190589A JPH05190589A JP4003477A JP347792A JPH05190589A JP H05190589 A JPH05190589 A JP H05190589A JP 4003477 A JP4003477 A JP 4003477A JP 347792 A JP347792 A JP 347792A JP H05190589 A JPH05190589 A JP H05190589A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- coated wire
- wire bonding
- tool tip
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8501—Cleaning, e.g. oxide removal step, desmearing
- H01L2224/85014—Thermal cleaning, e.g. decomposition, sublimation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、被覆付ワイヤボンディ
ングツールの清浄方法に関する。近年は回路基板の設計
変更による改造や修復に、被覆付ワイヤボンディングツ
ールを用いて、被覆付ワイヤで所定の接続部間を接続し
ている。FIELD OF THE INVENTION This invention relates to a method of cleaning a coated wire bonding tool. In recent years, in order to modify or repair a circuit board by changing its design, a coated wire bonding tool is used to connect predetermined connecting portions with a coated wire.
【０００２】図４は、被覆付ワイヤボンディングツール
の側面図である。図４において、５は、芯線６の外周を
ポリウレタン樹脂等の熱昇華性被覆７で被覆した被覆付
ワイヤであって、この熱昇華性被覆７の被覆厚は約10μ
m であり430 ℃前後に加熱すると昇華する。FIG. 4 is a side view of a coated wire bonding tool. In FIG. 4, 5 is a coated wire in which the outer circumference of the core wire 6 is coated with a heat sublimation coating 7 such as polyurethane resin, and the thickness of the heat sublimation coating 7 is about 10 μm.
It is m and sublimes when heated to around 430 ℃.
【０００３】一方、回路基板１には、半導体部品等の回
路部品が表面実装され、半導体部品のリード等がリフロ
ー半田付けされたパッド（図示省略) を有する。リード
が半田付けされたこのパッドは、被覆付ワイヤ５の一方
の端末を接続する接合部である。On the other hand, the circuit board 1 has pads (not shown) on which circuit components such as semiconductor components are surface-mounted, and leads of the semiconductor components are reflow-soldered. This pad, to which the leads are soldered, is a joint that connects one end of the coated wire 5.
【０００４】また、回路基板１には所望の個所に他のパ
ッド２を有し、このパッド２の表面に半田３を被着させ
ている。このパッド２は被覆付ワイヤ５の他方の端部を
接続する接合部である。Further, the circuit board 1 has another pad 2 at a desired position, and the solder 3 is attached to the surface of the pad 2. The pad 2 is a joint that connects the other end of the covered wire 5.
【０００５】被覆付ワイヤボンディングツールのボンデ
ィングヘッド10は、ヘッドの中心部に鉛直に下方に突出
し、ツール先端部11A にステンレス鋼，超硬質合金等の
チップを装着したツール本体11と、被覆付ワイヤ５をツ
ール先端部11A に供給するワイヤガイド12と、ボンディ
ング後に被覆付ワイヤ５を切断するカッター13とで構成
されている。The bonding head 10 of the coated wire bonding tool comprises a tool body 11 which vertically protrudes downward in the central portion of the head and has a tool tip 11A on which a tip made of stainless steel, super hard alloy or the like is mounted, and a coated wire. It is composed of a wire guide 12 for supplying 5 to the tool tip portion 11A and a cutter 13 for cutting the coated wire 5 after bonding.
【０００６】そして、ツール本体11に数秒間電流を通ず
ることで、ツール先端部11A を所望の温度に加熱するこ
とができるようになっている。なお、ワイヤガイド12か
ら引き出された被覆付ワイヤ５の側面の上半体は、ツー
ル先端部11A の先端面に設けた弧形の凹部に挿入され
る。By passing an electric current through the tool body 11 for several seconds, the tool tip portion 11A can be heated to a desired temperature. The upper half of the side surface of the coated wire 5 pulled out from the wire guide 12 is inserted into an arc-shaped recess provided on the tip surface of the tool tip portion 11A.
【０００７】上述のボンディングヘッド10を用いて被覆
付ワイヤ５をパッド２に接続するには、被覆付ワイヤ５
をパッド２に載せ、次にツール先端部11A の凹部を被覆
付ワイヤ５にあてがい、ツール本体11を降下して、約15
0gの押圧力で被覆付ワイヤ５をパッド２に押し付けると
同時に、ツール先端部11A を約430 ℃に加熱し、その状
態を数秒間保持して、被覆付ワイヤ５の熱昇華性被覆７
を昇華させ芯線６を裸出させる。To connect the coated wire 5 to the pad 2 using the bonding head 10 described above, the coated wire 5
On the pad 2, then apply the concave part of the tool tip 11A to the covered wire 5 and lower the tool body 11 to about 15
The coated wire 5 is pressed against the pad 2 with a pressing force of 0 g, and at the same time, the tool tip portion 11A is heated to about 430 ° C., and the state is held for several seconds.
Is sublimated and the core wire 6 is exposed.
【０００８】つづいて、約150gの押圧力で被覆付ワイヤ
５をパッド２に押し付けたままで、ツール先端部11A の
温度を約260 ℃に下げてその状態を数秒間保持して、半
田３をリフローさせ、裸出して芯線６部分をパッド２に
半田付け接続させている。Subsequently, while keeping the coated wire 5 pressed against the pad 2 with a pressing force of about 150 g, the temperature of the tool tip 11A is lowered to about 260 ° C. and kept in that state for several seconds, and the solder 3 is reflowed. Then, the core wire 6 is left bare and soldered to the pad 2.
【０００９】そして、リフロー半田付け後に回路基板１
を僅かにカッター13方向に移動し、カッター13を降下さ
せて、被覆付ワイヤ５をワイヤガイド12の先端部分で切
断する。After the reflow soldering, the circuit board 1
Is slightly moved toward the cutter 13 and the cutter 13 is lowered to cut the coated wire 5 at the tip of the wire guide 12.
【００１０】[0010]
【従来の技術】ところで、被覆付ワイヤボンディングツ
ールのツール先端部11A は、通電することで殆ど瞬間的
に所望の高温度に上昇し、通電を断にすると急激に温度
降下するものである。2. Description of the Related Art A tool tip portion 11A of a coated wire bonding tool almost instantly rises to a desired high temperature when energized, and sharply drops when energized.
【００１１】したがって、上述のように被覆付ワイヤボ
ンディングツールを用いて、被覆付ワイヤを加熱して熱
昇華性被覆を昇華して芯線を裸出させ、裸出した芯線を
リフロー半田付けすると、昇華した熱昇華性被覆の一部
が冷却後のツール先端部11Aに触れて低温となり、ツー
ル先端部11A に被着する。そしてこのようなワイヤボン
ディングを数回繰り返すことで、この被着が進行し堆積
して比較的大きい付着物８となる。Therefore, when the coated wire is heated by using the coated wire bonding tool as described above, the thermally sublimable coating is sublimated to bare the core wire, and the bare core wire is reflow-soldered to sublimate. A part of the heat-sublimable coating thus formed comes into contact with the tool tip 11A after cooling to become a low temperature and adheres to the tool tip 11A. By repeating such wire bonding several times, this deposition progresses and accumulates to form a relatively large deposit 8.
【００１２】このような付着物８がツール先端部11A 特
に弧形の凹部に発生すると、ツール本体11を押下した時
に、ツール先端部11A の端面が被覆付ワイヤ５の外周面
に緊密に密接することが阻害される。したがって、被覆
付ワイヤ５が所定の高温度に上昇しなくなり、熱昇華性
被覆７の昇華が不十分となるので、ワイヤボンディング
の接続強度が低下する。When such a deposit 8 is generated in the tool tip 11A, especially in the arcuate recess, the end surface of the tool tip 11A comes into close contact with the outer peripheral surface of the coated wire 5 when the tool body 11 is pushed down. Is hindered. Therefore, the coated wire 5 does not rise to a predetermined high temperature, and the sublimation of the thermally sublimable coating 7 becomes insufficient, so that the connection strength of wire bonding decreases.
【００１３】したがって従来は、ボンディングを数回実
施すると、溶剤を浸透させた布等でツール先端部を擦
り、ツール先端部に堆積した付着物を除去していた。Therefore, conventionally, when the bonding is carried out several times, the tool tip is rubbed with a solvent-permeated cloth or the like to remove the deposits deposited on the tool tip.
【００１４】[0014]
【発明が解決しようとする課題】しかしながら、溶剤を
浸透させた布等でツール先端部を擦り付着物を除去する
という従来の清浄方法は、ツール先端部の弧形の凹部
に、布を指で押し込み擦るのであるから、時間がかかる
ばかりでなく、付着物の取り残しがあるという問題点が
あった。However, the conventional cleaning method in which the tool tip is rubbed with a cloth or the like which has been impregnated with a solvent to remove extraneous matter is to put the cloth in the arc-shaped recess of the tool tip with a finger. Since the rubbing is performed by pushing in, there is a problem that not only it takes time, but also there is a residue of adhered matter.
【００１５】本発明はこのような点に鑑みて創作された
もので、付着物の除去が完全に行われ、且つ短時間で終
了する被覆付ワイヤボンディングツールの清浄方法を提
供することを目的としている。The present invention was created in view of the above circumstances, and an object thereof is to provide a method for cleaning a coated wire bonding tool in which deposits are completely removed and which is completed in a short time. There is.
【００１６】[0016]
【課題を解決するための手段】上記の目的を達成するた
めに本発明は、図１に図示したように、被覆付ワイヤボ
ンディングツールのツール本体11のツール先端部11A
に、火炎20を投射して、ツール先端部11A に被着した付
着物８を除去するものとする。In order to achieve the above object, the present invention, as shown in FIG. 1, includes a tool tip portion 11A of a tool body 11 of a coated wire bonding tool.
A flame 20 is projected onto the tool to remove the adhering matter 8 adhered to the tool tip portion 11A.
【００１７】或いは、図２に図示したように、被覆付ワ
イヤボンディングツールのワイヤガイド12及びカッター
13を上昇させ、ツール本体11を突出させた状態で、ツー
ル先端部11A に火炎20を投射して、ツール先端部11A に
被着した付着物８を除去するものとする。Alternatively, as shown in FIG. 2, the wire guide 12 and the cutter of the coated wire bonding tool.
With the tool 13 raised and the tool body 11 protruding, the flame 20 is projected onto the tool tip 11A to remove the deposit 8 adhered to the tool tip 11A.
【００１８】或いはまた、図３に図示したように、被覆
付ワイヤボンディングツールのツール本体11のツール先
端部11A に、被覆付ワイヤ５の熱昇華性被覆の昇華温度
よりも十分に高い温度の高温風30を吹きつけて、ツール
先端部11A に被着した付着物８を除去するものである。Alternatively, as shown in FIG. 3, the tool tip portion 11A of the tool body 11 of the coated wire bonding tool has a high temperature which is sufficiently higher than the sublimation temperature of the thermally sublimable coating of the coated wire 5. The air 30 is blown to remove the deposit 8 adhered to the tool tip 11A.
【００１９】[0019]
【作用】本発明によれば、熱昇華性被覆の昇華温度より
も十分に高い温度の火炎または高温風を、ツール先端部
に投射或いは吹きつけるので、熱昇華性被覆が堆積して
構成された付着物は、瞬時の間にツール先端部が昇華温
度以上に加熱され、付着物が昇華する。According to the present invention, a flame or high temperature air having a temperature sufficiently higher than the sublimation temperature of the heat sublimable coating is projected or blown onto the tool tip, so that the heat sublimable coating is deposited. The tip of the attached matter is heated to a temperature equal to or higher than the sublimation temperature in an instant, and the attached matter sublimes.
【００２０】そして昇華した被覆材の蒸気は、火炎の風
力或いは高温風の風力によりツール先端部より十分に離
れた空間に飛散する。したがって、ツール先端部が冷却
しても熱昇華性被覆材がツール先端部に被着しない。The steam of the sublimed coating material is scattered by the wind force of the flame or the wind force of the high temperature wind into a space sufficiently separated from the tip of the tool. Therefore, the thermal sublimable coating material does not adhere to the tool tip even when the tool tip is cooled.
【００２１】一方、火炎または高温風を投射するのであ
るから、火炎または高温風がツール先端部の凹部の隅々
まで十分に行き渡る。よって付着物の取り残しがない。On the other hand, since the flame or high-temperature air is projected, the flame or high-temperature air is sufficiently spread to every corner of the concave portion of the tool tip. Therefore, there is no leftover of the deposit.
【００２２】[0022]
【実施例】以下図を参照しながら、本発明を具体的に説
明する。なお、全図を通じて同一符号は同一対象物を示
す。The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.
【００２３】図１は本発明の実施例の側面図、図２は本
発明の他の実施例の側面図、図３は本発明のさらに他の
実施例の側面図である。図１において、被覆付ワイヤボ
ンディングツールのボンディングヘッド10は、ヘッドの
中心部に鉛直に下方に突出し、ツール先端部11A にステ
ンレス鋼，超硬質合金等のチップを装着したツール本体
11と、被覆付ワイヤ５をツール先端部11A に供給するワ
イヤガイド12と、ボンディング後に被覆付ワイヤ５を切
断するカッター13とで構成されている。FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a side view of another embodiment of the present invention, and FIG. 3 is a side view of yet another embodiment of the present invention. In FIG. 1, a bonding head 10 of a coated wire bonding tool has a tool body that vertically protrudes downward in the center of the head and has a tool tip 11A with a tip made of stainless steel, super hard alloy, or the like.
11, a wire guide 12 for supplying the coated wire 5 to the tool tip portion 11A, and a cutter 13 for cutting the coated wire 5 after bonding.
【００２４】そしてツール先端部11A には、被覆付ワイ
ヤ５の熱昇華性被覆７が、昇華して被着し堆積して構成
された付着物８が散在している。20は、ガス溶接に使用
する例えば酸素アセチレン炎等の火炎である。図示省略
した発生器から燃焼ガス（例えば酸素とアセチレンガ
ス) をパイプを介して吹管21に供給し、吹管21の開口部
で点火すると、勢いが強い噴流状態で火炎20をツール先
端部11A に投射することができる。On the tool tip portion 11A, the heat sublimable coating 7 of the coated wire 5 is scattered with deposits 8 formed by sublimation, deposition and deposition. 20 is a flame used for gas welding, such as an oxyacetylene flame. When a combustion gas (for example, oxygen and acetylene gas) is supplied from a generator (not shown) to the blow pipe 21 through a pipe and ignited at the opening of the blow pipe 21, the flame 20 is projected onto the tool tip 11A in a jet state with strong force. can do.
【００２５】なお、酸素アセチレン炎の場合、火炎20の
先端部分の温度は約1000℃である。点火手段としては、
手動による火花点火手段でも良いが、火口に一対の電極
を設け電極間の放電による点火が好ましい。In the case of an oxyacetylene flame, the temperature at the tip of the flame 20 is about 1000 ° C. As the ignition means,
Manual spark ignition means may be used, but ignition is preferably performed by providing a pair of electrodes at the crater and discharging between the electrodes.
【００２６】上述のような火炎20を数秒ツール先端部11
A に投射すると、ツール先端部11Aが瞬時の間に約1000
℃に加熱されるので、付着物８が忽ち昇華する。そして
昇華した被覆材の蒸気は、火炎20の風力によりツール先
端部より十分に離れた空間に飛散する。A flame 20 as described above is applied to the tool tip 11 for a few seconds.
When projecting onto A, the tool tip 11A will
Since it is heated to ℃, the attached matter 8 is sublimated. Then, the steam of the sublimated coating material scatters into a space sufficiently distant from the tool tip portion by the wind force of the flame 20.
【００２７】図２において、被覆付ワイヤボンディング
ツールのワイヤガイド12及びカッター13を上昇させ、ツ
ール本体11を突出させた状態で、ツール先端部11A に吹
管21からガス溶接に使用する高温度の火炎（酸素アセチ
レン炎)20 を投射している。In FIG. 2, with the wire guide 12 and the cutter 13 of the coated wire bonding tool raised, and the tool body 11 protruding, a high temperature flame used for gas welding from the blow pipe 21 to the tool tip 11A. (Oxyacetylene flame) 20 is projected.
【００２８】したがって、付着物８が数秒の間に昇華し
飛散する。なおこのように、ワイヤガイド12及びカッタ
ー13を上昇させて、火炎20を投射すると、ワイヤガイド
12及びカッター13が火炎20により加熱されることがない
ので、ワイヤガイド, カッターが損傷することがない。Therefore, the deposit 8 sublimes and scatters within a few seconds. In this way, when the wire guide 12 and the cutter 13 are raised and the flame 20 is projected, the wire guide 12
Since the flame 12 and the cutter 13 are not heated by the flame 20, the wire guide and the cutter are not damaged.
【００２９】図３に図示した方法は、ノズル31から被覆
付ワイヤ５の熱昇華性被覆の昇華温度よりも十分に高い
温度（例えば約500 ℃) 高温風30を噴出させて、ツール
先端部11A に吹きつける方法である。In the method shown in FIG. 3, a high temperature air 30 is ejected from the nozzle 31 at a temperature sufficiently higher than the sublimation temperature of the thermally sublimable coating of the coated wire 5 (for example, about 500 ° C.), and the tool tip portion 11A. It is a method of spraying on.
【００３０】このように高温風30を吹きつけると、数秒
の間にツール先端部11A が熱昇華性被覆の昇華温度より
も十分に高い温度に加熱されるので、付着物８が昇華
し、昇華した被覆材の蒸気が高温風30の風力によりツー
ル先端部より十分に離れた空間に飛散する。When the hot air 30 is blown in this way, the tool tip 11A is heated to a temperature sufficiently higher than the sublimation temperature of the heat sublimable coating within a few seconds, so that the deposit 8 is sublimated and sublimated. The steam of the covering material is scattered by the wind force of the high-temperature wind 30 into the space sufficiently distant from the tool tip.
【００３１】上述のように高温風を吹きつける方法は、
電気的ヒーターと送風機とで、簡単に高温風を発生させ
ることができ、火炎を投射する方法に較べて、設備費が
低コストで、且つ完全性が高いという利点がある。As described above, the method of blowing hot air is
With the electric heater and the blower, high-temperature air can be easily generated, and compared with the method of projecting a flame, there are advantages that the equipment cost is low and the integrity is high.
【００３２】また前述のいずれの方法も、吹管またはノ
ズルをボンディングヘッドに添設することが容易であ
る。また、ワイヤボンディンを所定回数（例えば10回)
行うと、自動的に火炎または高温風を噴出するようにす
ることも、極めて容易なことである。Further, in any of the above-mentioned methods, it is easy to attach the blow pipe or the nozzle to the bonding head. In addition, the wire bondin is performed a predetermined number of times (for example, 10 times)
If this is done, it is also extremely easy to automatically eject a flame or hot air.
【００３３】したがって、このような自動化装置とする
ことで、被覆付ワイヤボンディングツールの清浄を自動
化すること容易であるという利点がある。Therefore, by using such an automatic device, there is an advantage that the cleaning of the coated wire bonding tool can be easily automated.
【００３４】[0034]
【発明の効果】以上説明したように本発明は、ツール先
端部に堆積した熱昇華性被覆の付着物を、昇華し吹き飛
ばすという被覆付ワイヤボンディングツールの清浄方法
であって、付着物の除去が完全に行われ、且つ短時間で
終了するという実用上で優れた効果がある。As described above, the present invention is a method for cleaning a coated wire bonding tool in which the deposit of the thermally sublimable coating deposited on the tip of the tool is sublimated and blown off. It has a practically excellent effect of being completely performed and completed in a short time.
【００３５】また、自動化装置とするできるので、清浄
の自動化が推進されるという利点がある。Further, since it can be an automatic device, there is an advantage that automation of cleaning is promoted.
【図１】 本発明の実施例の側面図FIG. 1 is a side view of an embodiment of the present invention.
【図２】 本発明の他の実施例の側面図FIG. 2 is a side view of another embodiment of the present invention.
【図３】 本発明のさらに他の実施例の側面図FIG. 3 is a side view of still another embodiment of the present invention.
【図４】 被覆付ワイヤボンディングツールの側面図FIG. 4 is a side view of the coated wire bonding tool.
１ 回路基板 ２ パッド ３ 半田 ５ 被覆付ワイ
ヤ ６ 芯線 ７ 熱昇華性被
覆 ８ 付着物 10 ボンディン
グヘッド 11 ツール本体 11A ツール先端
部 12 ワイヤガイド 13 カッター 20 火炎 21 吹管 30 高温風 31 ノズル1 circuit board 2 pad 3 solder 5 coated wire 6 core wire 7 thermal sublimation coating 8 deposit 10 bonding head 11 tool body 11A tool tip 12 wire guide 13 cutter 20 flame 21 blowpipe 30 hot air 31 nozzle
Claims (3)
ル本体(11)のツール先端部(11A) に、火炎(20)を投射し
て、該ツール先端部(11A) に被着した付着物(8) を除去
することを特徴とする被覆付ワイヤボンディングツール
の清浄方法。1. A deposit (8) adhered to the tool tip (11A) by projecting a flame (20) onto the tool tip (11A) of the tool body (11) of the coated wire bonding tool. A method for cleaning a coated wire bonding tool, which comprises removing
ヤガイド(12)及びカッター(13)を上昇させ、ツール先端
部(11A) を突出させた状態で、該ツール先端部(11A) に
火炎(20)を投射して、該ツール先端部(11A) に被着した
付着物(8) を除去することを特徴とする被覆付ワイヤボ
ンディングツールの清浄方法。2. A flame (20) on the tool tip (11A) with the wire guide (12) and the cutter (13) of the coated wire bonding tool raised, and the tool tip (11A) protruding. A method for cleaning a coated wire bonding tool, characterized in that the adhered matter (8) adhered to the tool tip portion (11A) is removed by projecting.
ル本体(11)のツール先端部(11A) に、被覆付ワイヤ(5)
の熱昇華性被覆の昇華温度よりも十分に高い温度の高温
風(30)を吹きつけて、該ツール先端部(11A) に被着した
付着物(8) を除去することを特徴とする被覆付ワイヤボ
ンディングツールの清浄方法。3. The coated wire (5) is attached to the tool tip (11A) of the tool body (11) of the coated wire bonding tool.
A coating characterized in that a hot air (30) having a temperature sufficiently higher than the sublimation temperature of the heat sublimation coating of (1) is blown to remove the deposit (8) adhered to the tool tip (11A). For cleaning attached wire bonding tools.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4003477A JPH05190589A (en) | 1992-01-13 | 1992-01-13 | Method of cleaning coated wire bonding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4003477A JPH05190589A (en) | 1992-01-13 | 1992-01-13 | Method of cleaning coated wire bonding tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05190589A true JPH05190589A (en) | 1993-07-30 |
Family
ID=11558420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4003477A Withdrawn JPH05190589A (en) | 1992-01-13 | 1992-01-13 | Method of cleaning coated wire bonding tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05190589A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5816480A (en) * | 1995-11-24 | 1998-10-06 | Kabushiki Kaisha Shinkawa | Method for cleaning a bonding tool used on covered bonding wires |
| US8016180B2 (en) * | 2009-11-26 | 2011-09-13 | Ats Automation Tooling Systems Inc. | Thermode cleaning method |
| US20190237427A1 (en) * | 2018-01-30 | 2019-08-01 | Kulicke And Soffa Industries, Inc. | Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods |
-
1992
- 1992-01-13 JP JP4003477A patent/JPH05190589A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5816480A (en) * | 1995-11-24 | 1998-10-06 | Kabushiki Kaisha Shinkawa | Method for cleaning a bonding tool used on covered bonding wires |
| US8016180B2 (en) * | 2009-11-26 | 2011-09-13 | Ats Automation Tooling Systems Inc. | Thermode cleaning method |
| US20190237427A1 (en) * | 2018-01-30 | 2019-08-01 | Kulicke And Soffa Industries, Inc. | Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods |
| WO2019152561A1 (en) * | 2018-01-30 | 2019-08-08 | Kulicke And Soffa Industries, Inc. | Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods |
| CN111656513A (en) * | 2018-01-30 | 2020-09-11 | 库利克和索夫工业公司 | Cleaning system for wire bonding tool, wire bonding machine including such system, and related methods |
| JP2021511664A (en) * | 2018-01-30 | 2021-05-06 | クリック アンド ソッファ インダストリーズ、インク． | A cleaning system for wire bonding tools, wire bonding equipment that includes that system, and related methods. |
| CN111656513B (en) * | 2018-01-30 | 2024-03-26 | 库利克和索夫工业公司 | Cleaning system for wire bonding tool, wire bonding machine including such system, and related methods |
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