JPH05185396A - Method and device for cutting printed circuit board with parts mounted - Google Patents

Abstract

PURPOSE:To cut a printed circuit board with parts mounted along a V-groove provided previously in the board without applying unreasonable force to the board or parts, wherein splashing of chips is prevented which might cause poor insulating performance, etc. CONSTITUTION:An operation lever 2 is grasped and a sink lever 6 is pulled sink a cutter head 1, and one of the cutting edges 3a of the cutter element 3 is put in pressure contact with a V-groove provided previously in a circuit board with parts mounted and is slid in several reversals in the cutting direction. Thus the board is cut, off. When the cutting edges 3a are worn, they are replaced by changing the cogs of a gear 7 with which a stopper pin 10 is in engagement.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting method for dividing a printed circuit board (hereinafter referred to as a mounting board) on which electronic parts are mounted, and a device therefor.

[0002]

2. Description of the Related Art When mounting electronic components on a printed circuit board, it is more workable to mount and solder the components in a state in which a plurality of substrates are combined and have as large an area as possible, and then divide the substrates into a plurality of substrates. Is good.

Therefore, in order to divide the mounting board, there is a method in which a V-groove is made in advance by a printed circuit board maker, and the board is bent along the V-groove for manual division. In addition, as a method of forming the V groove, the groove is formed by a disc-shaped rotary cutter blade.

[0004]

However, the method of manually dividing the mounting board along the V-groove tends to cause chipping or delamination at the divided ends of the board due to bending stress applied to the board.
Alternatively, defects such as breakage of mounted components are likely to occur.

Further, when cutting the substrate with a rotary cutter blade similar to the case where the V groove is formed, the cutting powder is scattered by the rotation of the cutter blade and enters the mounted parts, for example, the inside of the connector. , Is one of the major causes of poor electrical insulation.

The present invention solves the problems of the prior art as described above, and cuts along a V groove formed in advance on a mounting substrate without applying excessive stress to the substrate and mounting components. It is also an object of the present invention to provide a method for cutting a mounted printed circuit board and a cutting device for the same, which prevent scattering of cutting chips that cause insulation failure and the like.

[0007]

In order to achieve this object, according to the present invention, first, one of the sawtooth-shaped cutting blades having a plurality on the circumferential portion of the cutter blade is provided in advance on a mounting printed circuit board. A method is employed in which the V groove is pressed and moved in the cutting direction a plurality of times to deepen the V groove and cut.

Further, the cutting device has a cutter head having an operating lever, a cutter blade fixed to the cutter head and having a plurality of serrated cutting blades on its circumference, and the cutter head with respect to the base member. It consists of a spring for urging and a lowering lever that lowers the cutter head to a required position against the urging force of the spring.It holds the operating lever and pulls the lowering lever to lower the cutter head, One cutting blade is brought into pressure contact with a V groove provided in advance on the mounting substrate.

Further, the cutting device having the above-mentioned structure is provided with a gear abutting on the cutter blade and a stopper pin for engaging one of the teeth of the gear and fixing one of the sawtooth-shaped cutting blades at the cutting position. Then, the teeth of the gear with which the stopper pin engages are changed to replace the cutting blade.

[0010]

By adopting the above method and apparatus configuration, the substrate and the mounted components are not subjected to excessive stress, and the cutting chips are not scattered. Therefore, the occurrence of insulation failure due to the scattering of cutting chips is prevented. You can

[0011]

Embodiments will be described in detail below with reference to the drawings. FIG. 1 shows a mounting board cutting apparatus according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view thereof. In FIGS. 1 and 2, 1 is a cutter head having an operating lever 2, 3 is a cutter blade fixed to the cutter head 1 and having a plurality of sawtooth-shaped cutting blades 3 a on its circumference, 4 is a base member 5. On the other hand, a spring 6 urges the cutter head 1 upward, and a lowering lever 6 lowers the cutter head 1 to a required position against the urging force of the spring 4.

A gear 7 is attached to the cutter blade 3, and a key 8 is attached.
Is fixed to the cutter head 1 with a screw 9 through a washer or the like. 10 is a stopper pin,
By engaging the tooth of the gear 7 with its tip, one of the saw-tooth cutting blades 3a is fixed at the cutting position.

The cutter head 1 is mounted on a mounting member 11 and is slidably mounted on a base member 5 via a guide member 12. Normally, the cutter head 1 is urged by the spring 4 and stands by above, but when the lowering lever 6 is pulled toward the operation lever 2 side during the cutting operation, the lowering lever 6 rotates about the fulcrum 13. Since the cutter head 1 is pushed down against the biasing force of the spring 4, the cutting blade 3a can be lowered to a predetermined position.

Reference numeral 14 is a micrometer head, which sets the lower limit of the cutter blade. That is, the cutter head 1 is lowered by pulling the lowering lever 6 and hits the stopper at a predetermined position, but the position of the stopper is set. Further, 15 is a roller that corrects the warp of the substrate when the substrate is cut.

Next, the operation of this embodiment will be described. When cutting the board, the mounting board P to be cut is positioned below the cutter blade 3, the operation lever 2 is gripped, the lowering lever 6 is pulled to lower the cutter head 1, and one of the cutting blades 3 is cut. The cutting blade 3a is slid in the cutting direction so that the blade 3a is brought into pressure contact with a V groove provided in the substrate in advance.
On the return path, the lowering lever 6 is released and the cutter head 1 is raised by the spring 4 to separate the cutting blade 3a from the V groove. By repeating such an operation a plurality of times, as shown in FIG.
As shown in (a), (b) and (c), the V groove is sequentially deepened and cut. The reciprocating motion of the cutter head 1 is performed by sliding a base member on a guide rail (not shown).

If the cutting blade 3a used is worn, the stopper pin 10 is pulled to release the engagement with the gear 7, and the cutter blade 3 is rotated by one blade to stop the stopper pin.
Reengage 10 with gear 7. For example, 48 cutting blades 3a can be formed on the circumferential portion of the cutter blade 3, so that one cutting blade can replace the cutting blades 48 times.

[0017]

As described above, according to the present invention,
Since the cutting is repeated by pressing the sliding contact of the fixed blade and deepening the V groove in sequence without cutting the mounting board, the board and the electronic components mounted thereon are not destroyed. Further, since it is not a rotary blade, cutting chips are not scattered, so that it is possible to prevent occurrence of insulation failure due to scattering of cutting chips.

Further, since the cutting depth of the cutting blade can be adjusted, it is possible to perform a comfortable cutting by repeating a plurality of times.

[Brief description of drawings]

FIG. 1 is a front view of a cutter head portion according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the same.

FIG. 3 is a diagram showing a cutting operation of a substrate.

[Explanation of symbols]

1 ... Cutter head, 2 ... Operating lever, 3 ...
Cutter blade, 3a ... serrated cutting blade, 4 ... Spring, 5 ... Base member, 6 ... Down lever, 7
… Gear, 10… Stopper pin.

Claims (3)

[Claims] 1. One of saw-tooth cutting blades having a plurality of circumferential edges of the cutter blade is pressed against a V groove provided in advance on a mounting printed circuit board to move a plurality of times in the cutting direction to form a V groove. A method for cutting a mounted printed circuit board, which comprises cutting deeply. 2. Cutter head with operating lever (2)
(1), a cutter blade (3) fixed to the cutter head and having a plurality of sawtooth cutting blades (3a) in the circumferential portion, and urging the cutter head upward with respect to the base member (5) Spring (4) and a lowering lever for lowering the cutter head to a required position against the biasing force of the spring.
(6), which holds the operating lever (2) and pulls the lowering lever (6) to lower the cutter head (1), and one cutting blade (3a) of the cutter blades (3) The mounting printed circuit board cutting device is characterized in that it is pressed against a V groove provided in advance on the mounting printed circuit board. 3. A gear (7) abutting on a cutter blade (3) having a plurality of sawtooth cutting blades (3a) and said sawtooth cutting blades (3a) engaged with the teeth of the gear. 3. The mounting according to claim 2, further comprising a stopper pin (10) for fixing one of the above) to a cutting position, and changing the tooth of the gear with which the stopper pin engages to replace the cutting blade. Printed circuit board cutting device.