JPS6028647Y2 - Ceramic substrate dividing device - Google Patents

Ceramic substrate dividing device

Info

Publication number
JPS6028647Y2
JPS6028647Y2 JP9556480U JP9556480U JPS6028647Y2 JP S6028647 Y2 JPS6028647 Y2 JP S6028647Y2 JP 9556480 U JP9556480 U JP 9556480U JP 9556480 U JP9556480 U JP 9556480U JP S6028647 Y2 JPS6028647 Y2 JP S6028647Y2
Authority
JP
Japan
Prior art keywords
ceramic substrate
base
dividing
pusher
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9556480U
Other languages
Japanese (ja)
Other versions
JPS5721643U (en
Inventor
暁彦 谷山
Original Assignee
日本カーバイド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本カーバイド工業株式会社 filed Critical 日本カーバイド工業株式会社
Priority to JP9556480U priority Critical patent/JPS6028647Y2/en
Publication of JPS5721643U publication Critical patent/JPS5721643U/ja
Application granted granted Critical
Publication of JPS6028647Y2 publication Critical patent/JPS6028647Y2/en
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は、表面に分割溝をはS゛基盤目状に設けたセラ
ミック基板を、分割溝から折断して分割するための分割
装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dividing device for dividing a ceramic substrate having dividing grooves formed on the surface in the form of an S-shaped grid by breaking the ceramic substrate from the dividing grooves.

ICあるいは電気部品の絶縁基板として使用されるセラ
ミック基板は、通常、ドクタブレード法、或いはローリ
ング法によって成形したセラミックグリーン板の表面に
縦横の分割溝を基盤目状に刻設し、然る後、懲戒して得
られたセラミック基板を、分割溝に沿って折曲げ所定の
単位片に分割することによって作られている。
Ceramic substrates used as insulating substrates for ICs or electrical components are usually formed by forming vertical and horizontal dividing grooves on the surface of a ceramic green plate using the doctor blade method or rolling method, and then forming It is made by bending the resulting ceramic substrate along dividing grooves and dividing it into predetermined unit pieces.

然し乍ら、このような分割には、直接手で折断するか、
又はバンドパンチ等で分割するか等しているが、何れの
場合でも良好な分割がなされず、相当な割合で欠損を生
じ、製品として使用できなくなり、歩留りが非常に低い
のが実情で、このための専用の分割具が望まれていると
ころである。
However, such division can be done by cutting directly by hand,
Or, it is divided by band punching, etc., but in either case, good division is not achieved, a considerable proportion of defects occur, the product cannot be used, and the yield is extremely low. There is a need for a dedicated dividing tool for this purpose.

本考案は叙上の点に鑑みてなされたもので、以下、実施
例図に基いて説明する。
The present invention has been made in view of the above points, and will be explained below based on the drawings of the embodiments.

1は、基台2の前端上縁に突設された低い細幅の突条で
あって、該突条1を有する前後方向に長い基台2の前端
部−側17上に、前後方向をなす押え片3を、基台2の
上面との間に所要の間隙4を有するように水平設置する
Reference numeral 1 denotes a low narrow protrusion protruding from the upper edge of the front end of the base 2, and on the front end side 17 of the base 2 which has the protrusion 1 and is long in the front-rear direction, The holding piece 3 is horizontally installed so as to have a required gap 4 between it and the upper surface of the base 2.

5は、基台2の前端部他側18に基台2よりも高く突設
された取付台であって、該取付台5上に、下向アングル
状をなすストッパ6の上片7を、該上片7に穿孔した前
後方向の長孔8を介し螺子9を取付台5に螺締すること
によって、前後動調整可能なように固定する。
Reference numeral 5 denotes a mounting base that projects higher than the base 2 on the other side 18 of the front end of the base 2, and on the mounting base 5, an upper piece 7 of a stopper 6 having a downwardly angled shape is mounted. A screw 9 is screwed onto the mounting base 5 through an elongated hole 8 in the longitudinal direction drilled in the upper piece 7, thereby fixing the upper piece 7 so as to be adjustable in longitudinal movement.

而して、基台2の前端部−側17に、内側部に押子(図
示例ではローラ)10を有するバンドル11の下端部を
、押子(ローラ)10の周面が基台2前端上縁の突条1
を上を通るように枢軸12を介し枢着する。
Thus, the lower end of the bundle 11 having the pusher (roller in the illustrated example) 10 is placed on the front end side 17 of the base 2, and the peripheral surface of the pusher (roller) 10 is placed on the front end of the base 2. Upper edge ridge 1
is pivotally connected via a pivot shaft 12 so as to pass above.

本考案は上述のような構成体よりなり、これにより表面
に縦横の分割溝を有するセラミック基板を折断して分割
するには、まず、取付台5に螺締した螺子9を緩めて、
下向アングル状をなすストッパ6の垂下片13の背面と
基板2の前端との間隔が、折断すべきセラミック基板1
4における縦横の分割溝15・・・16・・・中の横の
分割溝16,16の間隔と同一となるような位置にして
から、ストッパ金具6の上片7を螺子9によって取付台
5に固定する。
The present invention consists of the above-mentioned structure, and in order to break and divide a ceramic substrate having vertical and horizontal dividing grooves on its surface, first, loosen the screws 9 screwed into the mounting base 5.
The distance between the back surface of the downwardly angled hanging piece 13 of the stopper 6 and the front end of the substrate 2 corresponds to the ceramic substrate 1 to be broken.
After setting the upper piece 7 of the stopper fitting 6 to the same position as the spacing between the horizontal dividing grooves 15, 16, and 16 in the vertical and horizontal dividing grooves 15, 16, and 16 in the mounting base 5 with the screw 9, Fixed to.

しかる後、基台2の幅と同一の幅としたセラミック基板
14を、基台2の前端部−側17上の押え片3との間隙
4に挿入しつつ、該セラミック基板14の前端をストッ
パ金具6の垂下片13の背面に当着してから、起立状態
としたバンドル11を枢軸12まわりに前方へ倒すと、
バンドル11内側部の押子(ローラ)10が基台2前端
上縁の突条1直上を通るとき、基台2の前端より突出し
たセラミック基板14の上面を下方へ押圧して、該セラ
ミック基板14を横方向の分割溝16より折断すること
になる。
After that, while inserting the ceramic substrate 14 having the same width as the width of the base 2 into the gap 4 between the presser piece 3 on the front end side 17 of the base 2, the front end of the ceramic substrate 14 is pressed against the stopper. After contacting the back side of the hanging piece 13 of the metal fitting 6, when the bundle 11 in the upright state is tilted forward around the pivot 12,
When the pusher (roller) 10 on the inside of the bundle 11 passes directly above the protrusion 1 on the upper edge of the front end of the base 2, it presses downward the upper surface of the ceramic substrate 14 protruding from the front end of the base 2, and presses the ceramic substrate 14 downward. 14 is cut from the horizontal dividing groove 16.

しかも、この折断されるべきセラミック基板14におけ
る横方向の分割溝16の直下には、基台2前端上縁の低
い細幅の突条1が位置して、セラミック基板14が横方
向の分割溝16から押子(ローラ)10によって折断さ
れるときには、梃子の作用をして、この分割溝16に応
力が集中することになるから、セラミック基板14は、
この横方向の分割溝16から確実に折断され、欠損を生
じることはない。
Moreover, the low narrow protrusion 1 on the upper edge of the front end of the base 2 is located directly below the horizontal dividing groove 16 in the ceramic substrate 14 to be broken, so that the ceramic substrate 14 is cut in the horizontal dividing groove 16. When the ceramic substrate 14 is broken off by the pusher (roller) 10, stress is concentrated on the dividing groove 16 due to the action of a lever.
It is reliably broken from this horizontal dividing groove 16 and no damage occurs.

この横方向の分割溝16から折断された細長いセラミッ
ク基板14の分割片は、この後、手指によって縦方向の
分割溝15・・・から単位片に折断すれば、必要な大き
さのセラミック基板を得ることができる。
The divided pieces of the elongated ceramic substrate 14 that have been cut from the horizontal dividing grooves 16 are then broken into unit pieces from the vertical dividing grooves 15 with your fingers to obtain a ceramic substrate of the required size. Obtainable.

このように本考案は簡単な構成で、セラミック基板を分
割溝から欠損することなく簡単かつ確実に、所定幅に折
断することができる優秀な実用性を有するものである。
As described above, the present invention has a simple structure and has excellent practicality in that a ceramic substrate can be easily and reliably broken into a predetermined width without chipping from the dividing groove.

前記押子(ローラ)10によるセラミックの基片14へ
の折断力が該セラミック基片14の当該分割溝16の片
方の末端附近の個所のみに集中して加えられるように、
押子(ローラ)10(7)位tを規定するものとする。
so that the breaking force applied to the ceramic base piece 14 by the pusher (roller) 10 is concentrated only in the vicinity of one end of the dividing groove 16 of the ceramic base piece 14;
It is assumed that the pusher (roller) has a length of about 10 (7) t.

即ち、第3図、第4図に図示のように、押子(ローラ)
10は、基台2の押え片3のある方の一側17附近に配
設されて、該押子(ローラ)10による折断力はセラミ
ック基片14の分割溝16の片方の末端附近の個所にの
み集中して加えられ、このようにすることによりセラミ
ック基片14の分割溝16に沿っての切断が最も適確に
行はれるのである。
That is, as shown in FIGS. 3 and 4, the pusher (roller)
10 is arranged near one side 17 of the base 2 where the presser piece 3 is located, and the breaking force by the pusher (roller) 10 is applied to a point near one end of the dividing groove 16 of the ceramic base piece 14. By doing so, cutting of the ceramic base piece 14 along the dividing grooves 16 can be performed most accurately.

このことは、本考案者の行った実験結果により確認され
た。
This was confirmed by the results of experiments conducted by the present inventor.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案に係るセラミック基板の分割装置の実施例
を示すもので、第1図は折断されるべきセラミック基板
を示す平面図、第2図は同じく要部の拡大正面図、第3
図は平面図、第4図は正面図、第5図は第4図A−A線
断面図、第6図は同B−B線断面図である。 1は突条、2は基台、3は押え片、4は間隙、5は取付
台、6はストッパ金具、7は上片、8は長孔、9は螺子
、10は押子(ローラ)、11はバンドル、12は枢軸
、13は垂下片、14はセラミック基片、15.16は
分割溝、17は一側、18は他側。
The drawings show an embodiment of the ceramic substrate dividing apparatus according to the present invention, in which FIG. 1 is a plan view showing a ceramic substrate to be cut, FIG. 2 is an enlarged front view of the main parts, and FIG.
4 is a front view, FIG. 5 is a sectional view taken along the line AA in FIG. 4, and FIG. 6 is a sectional view taken along the line BB in FIG. 4. 1 is a projection, 2 is a base, 3 is a presser piece, 4 is a gap, 5 is a mounting base, 6 is a stopper fitting, 7 is an upper piece, 8 is a long hole, 9 is a screw, 10 is a pusher (roller) , 11 is a bundle, 12 is a pivot, 13 is a hanging piece, 14 is a ceramic base piece, 15 and 16 are dividing grooves, 17 is one side, and 18 is the other side.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)(イ)セラミック基板を支持する基台と、(ロ)
基台の前端上縁の低い細幅の突条と、(ハ)セラミック
基板を該突条より折断幅だけ突出した位置に保たしめる
ストッパーと、 に)セラミック基板を基台に押さえる押え片と、 (ホ)セラミック基板の先端部分を押圧するために突条
の直上を通る押子。 とを有するセラミック基板の分割装置。
(1) (a) A base that supports the ceramic substrate, and (b)
(c) a low narrow protrusion on the upper edge of the front end of the base; (c) a stopper that holds the ceramic substrate in a position protruding from the protrusion by the width of the fold; and (d) a presser piece that presses the ceramic substrate against the base. (e) A pusher that passes directly above the protrusion to press the tip of the ceramic substrate. A ceramic substrate dividing device comprising:
(2)実用新案登録請求の範囲第1項に記載のセラミッ
ク基板の分割装置に於いて、前記基台の前端部−側に内
側部に前記押子を有するバンドルの下端部を、押子の周
面が基台前端上縁の突条直上を通るように枢軸を介して
枢着されていることを特徴とするセラミック基板の分割
装置。
(2) Utility model registration In the ceramic substrate dividing apparatus according to claim 1, the lower end of the bundle having the pusher on the inner side of the front end of the base is connected to the pusher. A device for dividing a ceramic substrate, characterized in that the peripheral surface is pivotally mounted via a pivot such that the peripheral surface passes directly above the protrusion on the upper edge of the front end of the base.
(3)実用新案登録請求の範囲第1項に記載のセラミッ
ク基板の分割装置に於いて、前記基台の前端部他側に基
台よりも高い取付台を設け、該取付台に、ストッパ金具
の上片を、該上片に突設した前後方向の長孔を介し螺子
にて取付台に螺締することによって、前後動調整可能な
ように固定したことを特徴とするセラミック基板の分割
装置。
(3) Utility Model Registration Scope In the ceramic substrate dividing apparatus according to claim 1, a mounting base higher than the base is provided on the other side of the front end of the base, and a stopper metal fitting is provided on the mounting base. A device for dividing a ceramic substrate, characterized in that the upper piece is fixed so as to be adjustable back and forth by screwing the upper piece to a mounting base through an elongated hole protruding from the upper piece in the front-rear direction. .
(4)実用新案登録請求の範囲第1項記載のセラミック
基板の分割装置に於いて、 前記押子10によるセラミック基片14への折断力が該
セラミック基片14の当該分割溝16の片方の末端附近
の個所のみに集中して加えられるように、押子10の位
置を規定したことを特徴とするセラミック基板の分割装
置。
(4) Utility model registration In the ceramic substrate dividing apparatus according to claim 1, the breaking force applied to the ceramic base piece 14 by the pusher 10 is applied to one side of the dividing groove 16 of the ceramic base piece 14. A device for dividing a ceramic substrate, characterized in that the position of the pusher 10 is determined so that the application is concentrated only in the vicinity of the end.
JP9556480U 1980-07-09 1980-07-09 Ceramic substrate dividing device Expired JPS6028647Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9556480U JPS6028647Y2 (en) 1980-07-09 1980-07-09 Ceramic substrate dividing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9556480U JPS6028647Y2 (en) 1980-07-09 1980-07-09 Ceramic substrate dividing device

Publications (2)

Publication Number Publication Date
JPS5721643U JPS5721643U (en) 1982-02-04
JPS6028647Y2 true JPS6028647Y2 (en) 1985-08-30

Family

ID=29457441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9556480U Expired JPS6028647Y2 (en) 1980-07-09 1980-07-09 Ceramic substrate dividing device

Country Status (1)

Country Link
JP (1) JPS6028647Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2788020B2 (en) * 1993-04-06 1998-08-20 綾子 波多野 Ingot folding machine

Also Published As

Publication number Publication date
JPS5721643U (en) 1982-02-04

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