JPH0518166B2 - - Google Patents
Info
- Publication number
- JPH0518166B2 JPH0518166B2 JP58243174A JP24317483A JPH0518166B2 JP H0518166 B2 JPH0518166 B2 JP H0518166B2 JP 58243174 A JP58243174 A JP 58243174A JP 24317483 A JP24317483 A JP 24317483A JP H0518166 B2 JPH0518166 B2 JP H0518166B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- magnetic
- thin film
- magnetic layer
- upper magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 33
- 239000010408 film Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 4
- 229910020641 Co Zr Inorganic materials 0.000 description 3
- 229910020520 Co—Zr Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910017082 Fe-Si Inorganic materials 0.000 description 2
- 229910017133 Fe—Si Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は薄膜磁気ヘツドの製造方法に係り、特
に薄膜磁気ヘツドの磁極の形状を薄膜コイルの近
傍で厚く、先端部を所定に薄く形成して磁気記
録・再生効率を向上させる製造方法に関するもの
である。[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a method for manufacturing a thin-film magnetic head, and in particular to a method for manufacturing a thin-film magnetic head, in which the shape of the magnetic pole of the thin-film magnetic head is formed to be thick near the thin-film coil and thin at a predetermined tip. The present invention relates to a manufacturing method that improves magnetic recording/reproducing efficiency.
(b) 技術の背景
磁気デイスクに対する磁気ヘツドの高記録密度
化、高速転送化の為に、その形状は益々小型化さ
れると共に、高精度化の傾向にあり、記録に寄与
する磁極先端の磁気ギヤツプ部でのヘツド磁界分
布が急峻で、高密度な記録が出来る小型な薄膜磁
気ヘツドが実用化されつつあり、既に種々のタイ
プのものが提案されている。(b) Background of the technology In order to increase the recording density and high-speed transfer of magnetic heads to magnetic disks, their shapes are becoming smaller and smaller, and there is a trend toward higher precision. Compact thin-film magnetic heads, which have a steep head magnetic field distribution in the gap region and are capable of high-density recording, are being put into practical use, and various types have already been proposed.
(c) 従来技術と問題点
ところで上記した薄膜磁気ヘツドを形成するに
は、従来、第１図の上面図及び第１図の−′
切断線に沿つた第２図の要部断面図に示すよう
に、例えばパイレツクスガラスとも呼ばれる硼珪
酸ガラス等から成るガラス基板１上に、まずCo
−Zrアモルフアス等からなる下部磁性層２をス
パツタリング法などにより被着し、フオトリソ技
法を用いて所定パターンに形成する。次いでその
下部磁性層２上にSiO2等のギヤツプ形成層３及
び第１の絶縁層４を被着形成し、更に該第１の絶
縁層４の表面にCu等から成る導体層をスパツタ
リング法等により被着した後、該導体層をフオト
リソ技法によつて薄膜コイル５にパターニングす
る。そして該薄膜コイル５を含む第１の絶縁層４
上に第２の絶縁層６を被着し、更にかかる基板１
上の全面にCo−Zr合金等からなる上部磁性層７
を被着形成する。次ぎにこの上部磁性層７をフオ
トリソ技法によつて所定パターン形状にパターニ
ングすることにより、前記下部磁性層２と上部磁
性層７が後部で接続され、磁気回路的にギヤツプ
形成層３を介してＵ字形に形成されている。(c) Prior art and problems By the way, in order to form the above-mentioned thin film magnetic head, conventionally, the top view of FIG.
As shown in the cross-sectional view of the main part of FIG. 2 along the cutting line, first Co
A lower magnetic layer 2 made of -Zr amorphous or the like is deposited by sputtering or the like, and formed into a predetermined pattern by photolithography. Next, a gap forming layer 3 such as SiO 2 and a first insulating layer 4 are deposited on the lower magnetic layer 2, and a conductive layer made of Cu or the like is further formed on the surface of the first insulating layer 4 by sputtering or the like. After deposition, the conductor layer is patterned into a thin film coil 5 by photolithography. and a first insulating layer 4 including the thin film coil 5.
A second insulating layer 6 is deposited on top of the substrate 1.
An upper magnetic layer 7 made of Co-Zr alloy etc. is formed on the entire upper surface.
Form the adhesion. Next, by patterning this upper magnetic layer 7 into a predetermined pattern shape by photolithography, the lower magnetic layer 2 and the upper magnetic layer 7 are connected at the rear, and the upper magnetic layer 7 is connected through the gap forming layer 3 in a magnetic circuit. It is formed into a letter shape.
ところが上記のように成膜時のステツプカバレ
イジ（step coverage）が良くないスパツタリン
グ法等によつて薄膜磁気ヘツドを形成すると、形
成された薄膜磁気ヘツドにおける上部磁性層７の
図中Ａ及びＢで示した傾斜部分の膜厚が他の部
分、特に磁気記録媒体対向面部分Ｃの膜厚よりも
必然的に薄くなる不都合が生じ、記録時に前記下
部磁性層２と上部磁性層７とがギヤツプ形成層３
を介して構成されたギヤツプ先端部に、急峻な磁
界が十分に発生する迄に、上部磁性層７の膜厚の
薄い傾斜部分Ａ及びＢで磁界が飽和してしまい、
磁気抵抗が増大する。その結果、記録効率が低下
するといつた欠点があつた。 However, when a thin film magnetic head is formed by a sputtering method or the like which does not have good step coverage during film formation as described above, the upper magnetic layer 7 in the formed thin film magnetic head has problems at A and B in the figure. A disadvantage arises in that the thickness of the inclined portion shown is inevitably thinner than the thickness of other portions, especially the portion C of the surface facing the magnetic recording medium, and a gap is formed between the lower magnetic layer 2 and the upper magnetic layer 7 during recording. layer 3
By the time a sufficiently steep magnetic field is generated at the tip of the gap formed by
Magnetic resistance increases. As a result, there was a drawback that recording efficiency decreased.
(d) 発明の目的
本発明は上記従来の欠点を除去するため、薄膜
コイル構成部上に配設する上部磁性層の薄厚を、
ギヤツプ先端部の所定膜厚に対して傾斜部分の膜
厚を少なくとも同等の膜厚とすると共に、その他
の部分の膜厚を厚く形成して、前記傾斜部分での
磁気的飽和を防止し、以てギヤツプ先端部に急峻
な磁界を十分に発生し得るようにした新規な薄膜
磁気ヘツドの製造方法を提供することを目的とす
るものである。(d) Purpose of the Invention In order to eliminate the above-mentioned conventional drawbacks, the present invention aims to reduce the thickness of the upper magnetic layer disposed on the thin film coil component.
The thickness of the sloped portion is at least equal to the predetermined thickness of the tip of the gap, and the thickness of the other portions is made thicker to prevent magnetic saturation at the sloped portion. It is an object of the present invention to provide a method for manufacturing a new thin film magnetic head that can generate a sufficiently steep magnetic field at the tip of the gap.
(e) 発明の構成
そしてこの目的は本発明によれば、基板上に下
部磁性層を所定パターンに形成し、該下部磁極層
上にギヤツプ形成層２３及び第１絶縁層を介して
薄膜コイル、第２絶縁層及び上部磁性層を順に積
層形成し、更に該上部磁性層を所定パターン形状
にパターニングする薄膜磁気ヘツドの製造方法に
おいて、前記上部磁性層は、ギヤツプ形成層と第
１、第２絶縁層で被包された薄膜コイルからなる
コイル構成部上に、該コイル構成部の傾斜部上で
の膜厚を少なくとも前記下部磁性層の膜厚と同等
の膜厚となるよう被着し、その上部磁性層上の磁
気ギヤツプ部構成予定領域を除く領域にマスク材
層を選択的に形成した後、該マスク材層を介して
前記上部磁性層上の磁気ギヤツプ部構成予定領域
をエツチングして、当該上部磁性層の磁気ギヤツ
プ部での厚さを所要厚さに形成するようにしたこ
とを特徴とする薄膜磁気ヘツドの製造方法を提供
することによつて達成される。(e) Structure of the Invention According to the present invention, a lower magnetic layer is formed on a substrate in a predetermined pattern, and a thin film coil is formed on the lower magnetic pole layer via a gap forming layer 23 and a first insulating layer. In a method for manufacturing a thin film magnetic head, in which a second insulating layer and an upper magnetic layer are laminated in order, and the upper magnetic layer is further patterned into a predetermined pattern, the upper magnetic layer has a gap forming layer and a first and second insulating layer. A coil component consisting of a thin film coil encapsulated with a layer is coated so that the film thickness on the sloped portion of the coil component is at least equivalent to the thickness of the lower magnetic layer, and After selectively forming a mask material layer on the upper magnetic layer in an area other than the area where the magnetic gap part is planned to be formed, etching the area where the magnetic gap part is planned to be formed on the upper magnetic layer through the mask material layer, This is achieved by providing a method for manufacturing a thin film magnetic head, characterized in that the thickness of the upper magnetic layer at the magnetic gap portion is formed to a required thickness.
(f) 発明の実施例
以下図面を用いて本発明の実施例について詳細
に説明する。(f) Embodiments of the invention Examples of the invention will be described in detail below with reference to the drawings.
第３図乃至第７図は本発明に係る薄膜磁気ヘツ
ドの製造方法の一実施例を工程順に示す要部断面
図である。 FIGS. 3 to 7 are sectional views showing essential parts of an embodiment of the method for manufacturing a thin film magnetic head according to the present invention in the order of steps.
まず第３図に示すようにパイレツクスガラスと
も呼ばれる硼珪酸ガラス、或いはセラミツク等か
らなる非磁性基板２１上に、高飽和磁束密度の軟
磁性材料であるFe−Si、又はCo−Zr等のアモル
フアスからなる下部磁性層２２をスパツタリング
法、蒸着法、或いはイオンプレーテイング法等に
より例えば3μｍの膜厚に被着した後、所定パタ
ーンにフオトリソ技法を用いて形成する。次にそ
の下部磁性層２２上に、SiO3、Al2O3等からなる
ギヤツプ形成層２３を、同じくスパツタリング法
等により例えば0.6〜1μｍの厚さに被着すると共
に、所定パターンにパターニングする。引続きそ
の表面にレジスト（AZ−1350）等の絶縁性樹脂
からなる第１絶縁層２４を所定パターンに被着形
成する。次にその第１絶縁層２４の表面に、Cu
等の導体膜を2μｍ程度の厚さにメツキ法等によ
つて積層した後、該導体膜を所定パターンにパタ
ーニングして薄膜コイル２５を形成する。更に該
薄膜コイル２５を含む第１絶縁層２４上に、再び
レジスト（AZ−1350）等の絶縁性樹脂からなる
第２絶縁層２６を所定パターンに被着形成する。 First, as shown in FIG. 3, amorphous amorphous material such as Fe-Si or Co-Zr, which is a soft magnetic material with a high saturation magnetic flux density, is placed on a nonmagnetic substrate 21 made of borosilicate glass, also called Pyrex glass, or ceramic. The lower magnetic layer 22 is deposited to a thickness of, for example, 3 μm by sputtering, vapor deposition, or ion plating, and then formed into a predetermined pattern using photolithography. Next, a gap forming layer 23 made of SiO 3 , Al 2 O 3 or the like is deposited on the lower magnetic layer 22 to a thickness of, for example, 0.6 to 1 μm by sputtering or the like, and is patterned into a predetermined pattern. Subsequently, a first insulating layer 24 made of an insulating resin such as resist (AZ-1350) is formed on the surface in a predetermined pattern. Next, Cu is applied to the surface of the first insulating layer 24.
After laminating conductor films such as the above to a thickness of about 2 μm by a plating method or the like, the conductor films are patterned into a predetermined pattern to form a thin film coil 25. Further, on the first insulating layer 24 including the thin film coil 25, a second insulating layer 26 made of an insulating resin such as resist (AZ-1350) is again formed in a predetermined pattern.
しかる後、このように下部磁性層２２乃至第２
絶縁層２６が形成された基板２１上に、第４図に
示すようにFe−Si、又はCo−Zr等のアモルフア
スからなる上部磁性層２７をスパツタリング法、
蒸着法、或いはイオンプレーテイング法等により
被着形成する。この場合、上部磁性層２７の膜厚
は、前記第１、第２絶縁層２４，２６で被包され
た薄膜コイル２５からなるコイル構成部の傾斜部
Ａ上では下部磁性層２２の膜厚と同等の厚さとな
るように被着する。従つて、該傾斜部Ａ以外の部
分に被着された上部磁性層２７部分の膜厚は、そ
の傾斜部Ａの傾斜角度を45度とすると、該傾斜部
Ａ上の上部磁性層２７部分の膜厚よりも40％程度
厚くなる。 After that, the lower magnetic layer 22 to the second
As shown in FIG. 4, an upper magnetic layer 27 made of amorphous material such as Fe-Si or Co-Zr is formed by sputtering on the substrate 21 on which the insulating layer 26 is formed.
It is formed by a vapor deposition method, an ion plating method, or the like. In this case, the thickness of the upper magnetic layer 27 is equal to the thickness of the lower magnetic layer 22 on the inclined portion A of the coil component consisting of the thin film coil 25 covered with the first and second insulating layers 24 and 26. Apply the same thickness. Therefore, if the angle of inclination of the inclined part A is 45 degrees, the film thickness of the part of the upper magnetic layer 27 deposited on the part other than the inclined part A is as follows. It will be about 40% thicker than the film thickness.
次に第５図に示すように、上記のように形成さ
れた上部磁性膜２７上にイオンミリング用のマス
ク材を塗着した後、該マスク材層２８を前記傾斜
部分Ａの基部からギヤツプ形成部Ｄの領域の上部
磁性膜２７部分が露出するようにパターニングす
る。引続き第６図に示すように前記マスク材層２
８をマスクにして、露出した上部磁性層２７部分
をイオンミリング法（スパツタエツチング法、ケ
ミカルエツチング法等を用いても良い）によりエ
ツチングする。これによつて、該上部磁性膜２７
部分の膜厚は、前記下部磁性層２２の膜厚と同等
の厚さとなる。しかる後、前記マスク材層２８を
除去することにより、第７図に示すように上部磁
性膜２７の膜厚は、ギヤツプ形成部Ｄにおいて前
記下部磁性層２２の膜厚と同等となる。この結
果、従来の如き上部磁性膜２７の傾斜部分Ａでの
磁気的飽和現象が解消、防止され、磁気記録・再
生効率のよい薄膜磁気ヘツドを得ることが可能と
なる。 Next, as shown in FIG. 5, after applying a mask material for ion milling on the upper magnetic film 27 formed as described above, the mask material layer 28 is formed into a gap from the base of the inclined portion A. Patterning is performed so that a portion of the upper magnetic film 27 in the region D is exposed. Subsequently, as shown in FIG.
8 as a mask, the exposed portion of the upper magnetic layer 27 is etched by ion milling (sputter etching, chemical etching, etc. may also be used). As a result, the upper magnetic film 27
The film thickness of this portion is equivalent to the film thickness of the lower magnetic layer 22. Thereafter, by removing the mask material layer 28, the thickness of the upper magnetic film 27 becomes equal to the thickness of the lower magnetic layer 22 in the gap forming portion D, as shown in FIG. As a result, the conventional magnetic saturation phenomenon at the inclined portion A of the upper magnetic film 27 is eliminated or prevented, and it becomes possible to obtain a thin film magnetic head with good magnetic recording and reproducing efficiency.
(g) 発明の効果
以上の説明から明らかなように、本発明に係る
薄膜磁気ヘツドの製造方法によれば、上部磁性層
の磁気ギヤツプ部の厚さを、所定厚さに形成する
ことは勿論のこと、該磁気ギヤツプ部の所定膜厚
に対して他の部分の膜厚、特に傾斜部分の膜厚を
同等、或いはより厚く形成することが出来るの
で、従来の如き上部磁性膜の傾斜部分での磁気的
飽和現象が防止され、磁気記録・再生効率の優れ
た薄膜磁気ヘツドを得ることが可能となる。従つ
て段差を有する各種薄膜磁気ヘツドの製造に適用
して極めて有利である。(g) Effects of the Invention As is clear from the above explanation, according to the method for manufacturing a thin film magnetic head according to the present invention, it is possible to form the magnetic gap portion of the upper magnetic layer to a predetermined thickness. This is because the film thickness of other parts, especially the sloped part, can be made equal to or thicker than the predetermined film thickness of the magnetic gap part. This prevents the magnetic saturation phenomenon and makes it possible to obtain a thin film magnetic head with excellent magnetic recording and reproducing efficiency. Therefore, it is extremely advantageous to apply it to manufacturing various thin film magnetic heads having steps.
第１図は従来の薄膜磁気ヘツドの製造方法を説
明する上面図、第２図は第１図に示す−′切
断線に沿つた要部断面図、第３図乃至第７図は本
発明に係る薄膜磁気ヘツドの製造方法の一実施例
を工程順に示す要部断面図である。
図面において、２１は非磁性基板、２２は下部
磁性層、２３はギヤツプ形成層、２４は第１絶縁
層、２５は薄膜コイル、２６は第２絶縁層、２７
は上部磁性層、２８はイオンミリング用のマスク
材層を示す。
FIG. 1 is a top view illustrating a conventional method for manufacturing a thin film magnetic head, FIG. 2 is a cross-sectional view of the main part along the -' cutting line shown in FIG. 1, and FIGS. FIG. 2 is a cross-sectional view of a main part showing an embodiment of a method for manufacturing such a thin film magnetic head in order of steps. In the drawing, 21 is a non-magnetic substrate, 22 is a lower magnetic layer, 23 is a gap forming layer, 24 is a first insulating layer, 25 is a thin film coil, 26 is a second insulating layer, 27
2 is an upper magnetic layer, and 28 is a mask material layer for ion milling.
Claims (1)
に形成し、該下部磁極層２２上にギヤツプ形成層
２３及び第１絶縁層２４を介して薄膜コイル２
５、第２絶縁層２６及び上部磁性層２７を順に積
層形成し、更に該上部磁性層２７を所定パターン
形状にパターニングする薄膜磁気ヘツドの製造方
法において、 前記上部磁性層２７は、ギヤツプ形成層２３と
第１、第２絶縁層２４，２６で被包された薄膜コ
イル２５からなる薄膜コイル構成部上に、該薄膜
コイル構成部の傾斜部上での膜厚を少なくとも前
記下部磁性層２２の膜厚と同等の膜厚となるよう
被着し、その上部磁性層２７上の磁気ギヤツプ部
構成予定領域を除く領域にマスク材層２８を選択
的に形成した後、該マスク材層２８を介して前記
上部磁性層２７上の磁気ギヤツプ部構成予定領域
をエツチングして、当該上部磁性層２７の磁気ギ
ヤツプ部での厚さを所要厚さに形成するようにし
たことを特徴とする薄膜磁気ヘツドの製造方法。[Claims] 1. A lower magnetic layer 22 is formed in a predetermined pattern on a substrate 21, and a thin film coil 2 is formed on the lower magnetic pole layer 22 via a gap forming layer 23 and a first insulating layer 24.
5. A method for manufacturing a thin film magnetic head in which a second insulating layer 26 and an upper magnetic layer 27 are laminated in order, and the upper magnetic layer 27 is further patterned into a predetermined pattern shape, in which the upper magnetic layer 27 is formed by forming a layer on the gap forming layer 23. On a thin film coil component consisting of a thin film coil 25 covered with first and second insulating layers 24 and 26, the film thickness on the sloped portion of the thin film coil component is at least as large as that of the lower magnetic layer 22. After selectively forming a mask material layer 28 on the upper magnetic layer 27 in an area other than the area where the magnetic gap portion is planned to be formed, A thin film magnetic head characterized in that a region on the upper magnetic layer 27 where the magnetic gap portion is to be formed is etched so that the upper magnetic layer 27 has a required thickness at the magnetic gap portion. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24317483A JPS60136012A (en) | 1983-12-22 | 1983-12-22 | Manufacture of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24317483A JPS60136012A (en) | 1983-12-22 | 1983-12-22 | Manufacture of thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60136012A JPS60136012A (en) | 1985-07-19 |
| JPH0518166B2 true JPH0518166B2 (en) | 1993-03-11 |
Family
ID=17099913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24317483A Granted JPS60136012A (en) | 1983-12-22 | 1983-12-22 | Manufacture of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60136012A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5233512A (en) * | 1975-09-10 | 1977-03-14 | Hitachi Ltd | Film magnetic head |
-
1983
- 1983-12-22 JP JP24317483A patent/JPS60136012A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5233512A (en) * | 1975-09-10 | 1977-03-14 | Hitachi Ltd | Film magnetic head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60136012A (en) | 1985-07-19 |
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