JPH0518053U - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0518053U JPH0518053U JP7217291U JP7217291U JPH0518053U JP H0518053 U JPH0518053 U JP H0518053U JP 7217291 U JP7217291 U JP 7217291U JP 7217291 U JP7217291 U JP 7217291U JP H0518053 U JPH0518053 U JP H0518053U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- wiring board
- printed wiring
- printed
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】カバーレイの端部にある配線パターンを切れに
くくすることのできる印刷配線板を提供する。
【構成】可撓性板材からなる基板1の面に配線パターン
2が印刷され、配線パターン2の一部がカバーレイ4で
被覆されてなる印刷配線板において、カバーレイ4の端
部6,7に位置する配線パターン2の幅を、他部分の幅
より広くした。
(57) [Abstract] [Purpose] To provide a printed wiring board capable of making a wiring pattern at an end portion of a coverlay hard to be cut. In a printed wiring board in which a wiring pattern 2 is printed on a surface of a substrate 1 made of a flexible plate material and a part of the wiring pattern 2 is covered with a cover lay 4, end portions 6, 7 of the cover lay 4 are formed. The width of the wiring pattern 2 located at is wider than the width of other portions.
Description
【0001】[0001]
この考案は可撓性板材で構成されたフレキシブル印刷配線板(以下FPCと称 する)に関する。 The present invention relates to a flexible printed wiring board (hereinafter referred to as FPC) composed of a flexible plate material.
【0002】[0002]
表面と裏面の両面に配線パターンが印刷されたFPCは、従来は図2及び図3 に示すように構成されていた。図において、可撓性板材からなる基板1の表面及 び裏面には、それぞれ配線パターン2,3が印刷により形成されている。配線パ ターン2,3はそれぞれ被膜(以下カバーレイと称する)4,5によって被覆さ れており、配線パターン2,3の保護と外部との絶縁を図っている。 Conventionally, an FPC in which wiring patterns are printed on both the front surface and the back surface has been constructed as shown in FIGS. 2 and 3. In the figure, wiring patterns 2 and 3 are formed by printing on the front surface and the back surface of a substrate 1 made of a flexible plate material, respectively. The wiring patterns 2 and 3 are covered with coatings (hereinafter referred to as coverlays) 4 and 5, respectively, to protect the wiring patterns 2 and 3 and to insulate them from the outside.
【0003】 しかしながらFPCを折り曲げる場合、両面にカバーレイ4,5が設けられて いると剛性が増大して折り曲げにくくなるため、折り曲げ部の谷の部分となる位 置にはカバーレイ4を設けない構造とする場合がある。この場合、従来は配線パ ターン2が一様の太さであったため、配線パターン2が細い場合に、カバーレイ 4が設けられている部分と設けられていない部分との境界部6,7にある配線パ ターン2が切れるおそれがあった。However, when the FPC is bent, if the cover lays 4 and 5 are provided on both sides, the rigidity increases and it becomes difficult to fold. Therefore, the cover lay 4 is not provided at the position of the valley of the bent portion. It may be structured. In this case, since the wiring pattern 2 has a uniform thickness in the past, when the wiring pattern 2 is thin, the boundary portions 6 and 7 between the portion where the coverlay 4 is provided and the portion where the coverlay 4 is not provided are provided. There was a risk that a certain wiring pattern 2 would break.
【0004】[0004]
上述したように、従来のFPCではカバーレイが設けられている部分と設けら れていない部分との境界部にある配線パターンが切れやすいという問題があった 。 As described above, the conventional FPC has a problem that the wiring pattern at the boundary between the portion where the coverlay is provided and the portion where the coverlay is not provided is easily cut.
【0005】 この考案はこのような点に鑑みてなされたもので、カバーレイの端部にある配 線パターンが切れにくい印刷配線板を提供することを目的とする。The present invention has been made in view of the above circumstances, and an object thereof is to provide a printed wiring board in which the wiring pattern at the end portion of the coverlay is not easily cut.
【0006】[0006]
【課題を解決するための手段】 上記目的を達成するために、この考案は、可撓性板材の面に配線パターンが印 刷され、前記配線パターンの一部が被膜で被覆されてなる印刷配線板において、 前記被膜の端部に位置する前記配線パターンの幅を、他の部分の幅より広くした ものである。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a printed wiring in which a wiring pattern is printed on a surface of a flexible plate material and a part of the wiring pattern is covered with a film. In the plate, the width of the wiring pattern located at the end of the coating film is made wider than the width of other portions.
【0007】[0007]
上記の構成によると、印刷配線板を被膜で被覆されていない部分で折り曲げた ときに、その部分の配線パターンの幅が広くなっているので切れにくくなる。 According to the above configuration, when the printed wiring board is bent at the portion not covered with the coating film, the width of the wiring pattern at that portion is wide, so that it is difficult to cut.
【0008】[0008]
以下、この考案の一実施例を図面を参照して説明する。 An embodiment of the present invention will be described below with reference to the drawings.
【0009】 図1にこの考案の一実施例を示す。図1において、図2に示す従来例の部分と 対応する部分には同一符号を付して示し、その説明を適宜省略する。この実施例 の特徴は配線パターン2の形状にある。すなわち、配線パターン2をカバーレイ 4が設けられている部分とカバーレイ4が設けられていない部分にかけて配線す る場合、その境界部6,7に位置する配線パターン2の幅を広くしてある。FIG. 1 shows an embodiment of the present invention. In FIG. 1, parts corresponding to those of the conventional example shown in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted as appropriate. The feature of this embodiment is the shape of the wiring pattern 2. That is, when the wiring pattern 2 is wired between the portion where the coverlay 4 is provided and the portion where the coverlay 4 is not provided, the width of the wiring pattern 2 located at the boundary portions 6 and 7 is widened. .
【0010】 この実施例によれば、FPCをカバーレイ4が設けられていない部分を谷とし て折り曲げるとき、境界部6,7に位置する配線パターン2の幅が広くなってい るので、その部分の配線パターン2が切れにくくなる。According to this embodiment, when the FPC is bent with a portion where the coverlay 4 is not provided as a valley, the width of the wiring pattern 2 located at the boundary portions 6 and 7 is wide, and therefore, that portion is widened. The wiring pattern 2 is difficult to cut.
【0011】[0011]
以上説明したように、この考案によれば、フレキシブル印刷配線の被膜端部に 位置する配線パターンの幅を広くしたので、印刷配線板を被膜のない部分で折り 曲げたときの配線パターンの切断の発生を防止することができ、印刷配線板の歩 留まりを向上させることができる。 As described above, according to the present invention, since the width of the wiring pattern located at the coating end portion of the flexible printed wiring is widened, it is possible to prevent the wiring pattern from being cut when the printed wiring board is bent at the uncoated portion. It can be prevented from occurring and the yield of the printed wiring board can be improved.
【図1】この考案の印刷配線板の一実施例の構成を示す
平面図。FIG. 1 is a plan view showing the configuration of an embodiment of a printed wiring board according to the present invention.
【図2】従来の印刷配線板の一例の構成を示す平面図。FIG. 2 is a plan view showing the configuration of an example of a conventional printed wiring board.
【図3】図2のA−A線断面図。3 is a sectional view taken along line AA of FIG.
1 基板(可撓性板材) 2,3 配線パターン 4,5 カバーレイ(被膜) 6,7 境界部(端部) 1 substrate (flexible plate material) 2,3 wiring pattern 4,5 coverlay (coating) 6,7 boundary (end)
Claims (1)
れ、前記配線パターンの一部が被膜で被覆されてなる印
刷配線板において、前記被膜の端部に位置する前記配線
パターンの幅を他の部分の幅より広くしたことを特徴と
する印刷配線板。1. In a printed wiring board in which a wiring pattern is printed on the surface of a flexible plate material and a part of the wiring pattern is covered with a coating, the width of the wiring pattern located at the end of the coating is set. A printed wiring board characterized by being made wider than the width of other portions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7217291U JPH0518053U (en) | 1991-08-15 | 1991-08-15 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7217291U JPH0518053U (en) | 1991-08-15 | 1991-08-15 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0518053U true JPH0518053U (en) | 1993-03-05 |
Family
ID=13481547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7217291U Withdrawn JPH0518053U (en) | 1991-08-15 | 1991-08-15 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0518053U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9286951B2 (en) | 2012-04-30 | 2016-03-15 | Kabushiki Kaisha Toshiba | Memory card and SD card |
-
1991
- 1991-08-15 JP JP7217291U patent/JPH0518053U/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9286951B2 (en) | 2012-04-30 | 2016-03-15 | Kabushiki Kaisha Toshiba | Memory card and SD card |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19951102 |