JPH0686708U - Optical sensor probe - Google Patents

Optical sensor probe

Info

Publication number
JPH0686708U
JPH0686708U JP2873693U JP2873693U JPH0686708U JP H0686708 U JPH0686708 U JP H0686708U JP 2873693 U JP2873693 U JP 2873693U JP 2873693 U JP2873693 U JP 2873693U JP H0686708 U JPH0686708 U JP H0686708U
Authority
JP
Japan
Prior art keywords
wiring pattern
opening
cover film
optical sensor
terminal board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2873693U
Other languages
Japanese (ja)
Inventor
重弘 西脇
秀夫 小沢
靖史 松野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Kohden Corp
Original Assignee
Nihon Kohden Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Kohden Corp filed Critical Nihon Kohden Corp
Priority to JP2873693U priority Critical patent/JPH0686708U/en
Publication of JPH0686708U publication Critical patent/JPH0686708U/en
Pending legal-status Critical Current

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  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

(57)【要約】 【目的】FPCの端子板に形成された配線パターンの外
力による断線を防止する。 【構成】FPC1の端子板5上に形成された配線パター
ン2をカバーフィルム8で被覆し、カバーフィルム8に
配線パターン2を露出する開口部9を設け、開口部9の
周縁を配線パターン2の軸方向に対して傾斜させる。
(57) [Abstract] [Purpose] To prevent disconnection of the wiring pattern formed on the terminal board of the FPC due to external force. A wiring pattern 2 formed on a terminal board 5 of an FPC 1 is covered with a cover film 8, an opening 9 for exposing the wiring pattern 2 is provided in the cover film 8, and the periphery of the opening 9 is covered with the wiring pattern 2. Tilt with respect to the axial direction.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、被検者の指などに巻回装着して、血管中の血液の酸素飽和度などを 測定する光センサ用プローブに係り、特に着脱時における印刷配線板の端子部に 形成された配線パターンの断線を防ぐことのできる光センサ用プローブに関する 。 The present invention relates to a probe for an optical sensor, which is wound around a subject's finger or the like to measure the oxygen saturation of blood in a blood vessel, and is formed especially on the terminal portion of a printed wiring board at the time of attachment / detachment. The present invention relates to an optical sensor probe capable of preventing disconnection of a wiring pattern.

【0002】[0002]

【従来の技術】[Prior art]

上記のような光センサプローブは、従来は図5及び図6に示すように構成され ていた。すなわち、帯状の可撓性印刷配線板(以下FPCと称する)1の両端は ほぼ円板状に形成されており、FPC1の片面には配線パターン2が印刷などに より所定の形状に形成されている。そして配線パターン2の両端にはそれぞれ発 光素子3と受光素子4とが実装されている。またFPC1の長手方向の中央部に は、直角の方向に端子板5が突出して一体に設けられており、端子板5には配線 パターン2が導出され、各配線パターン2の端部にそれぞれ端子6が設けられて いる。 The optical sensor probe as described above has conventionally been constructed as shown in FIGS. 5 and 6. That is, both ends of a strip-shaped flexible printed wiring board (hereinafter referred to as FPC) 1 are formed in a substantially disk shape, and a wiring pattern 2 is formed on one surface of the FPC 1 in a predetermined shape by printing or the like. There is. A light emitting element 3 and a light receiving element 4 are mounted on both ends of the wiring pattern 2, respectively. A terminal plate 5 is integrally provided so as to project at a right angle in the central portion of the FPC 1 in the longitudinal direction. The wiring pattern 2 is led out to the terminal plate 5 and terminals are respectively provided at the end portions of each wiring pattern 2. 6 is provided.

【0003】 発光素子3及び受光素子4はそれぞれ透明な樹脂でモールドされ保護されてい る。このモールド樹脂7で被覆された部分以外のFPC1の上面及び端子板5の 上面は、それぞれカバーフィルム8で連続して被覆されており、端子板5を被覆 するカバーフィルム8には配線パターン2を露出させる開口部9が形成されてい る。The light emitting element 3 and the light receiving element 4 are molded and protected by a transparent resin. The upper surface of the FPC 1 and the upper surface of the terminal board 5 other than the portion covered with the mold resin 7 are continuously covered with a cover film 8, respectively, and the cover film 8 covering the terminal board 5 is provided with the wiring pattern 2. An opening 9 to be exposed is formed.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記端子板5を被覆するカバーフィルム8に形成された開口部9は、従来は図 7及び図8に示すように配線パターン2の軸方向に対して直角の方向の2辺によ って形成されていた。このため被検者の指などに巻装されたプローブ11を指な どから離脱するとき、端子板5を持って引き剥がそうとすると、カバーフィルム 11の開口部9の平行2辺の部分に曲げ応力が集中し、図9に示すようにこの部 分2aの配線パターン2が断線しやすいという問題があった。 The opening 9 formed in the cover film 8 for covering the terminal board 5 is conventionally formed by two sides perpendicular to the axial direction of the wiring pattern 2 as shown in FIGS. 7 and 8. It had been. For this reason, when the probe 11 wound around the finger of the subject is detached from the finger or the like, if the terminal plate 5 is to be peeled off, the cover film 11 will be exposed at the two parallel sides of the opening 9. There is a problem that the bending stress is concentrated and the wiring pattern 2 of this portion 2a is easily broken as shown in FIG.

【0005】 本考案は、このような状況に鑑みてなされたものでFPCの端子板に外界から の応力が作用しても、端子板に形成された配線パターンの断線を防止することの できる光センサ用プローブを提供することを目的とする。The present invention has been made in view of the above circumstances, and it is possible to prevent disconnection of a wiring pattern formed on a terminal plate even when external stress is applied to the terminal plate of the FPC. An object is to provide a sensor probe.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

上記目的を達成するために、本考案は、可撓性印刷配線板に一体に接続され、 前記印刷配線板上に形成された配線パターンを引き出す端子板と、前記印刷配線 板及び前記端子板上にそれぞれ形成された前記配線パターンを被覆するカバーフ ィルムとを備える光センサ用プローブにおいて、前記端子板を被覆する前記カバ ーフィルムに前記配線パターンを露出する開口部を設けるとともに、該開口部の 周縁を前記配線パターンの軸方向に対して傾斜させたことを特徴としている。 To achieve the above object, the present invention provides a terminal board that is integrally connected to a flexible printed wiring board and draws out a wiring pattern formed on the printed wiring board, the printed wiring board and the terminal board. In a probe for an optical sensor having a cover film covering each of the wiring patterns formed in the above, an opening for exposing the wiring pattern is formed in the cover film covering the terminal plate, and a peripheral edge of the opening is formed. It is characterized in that it is inclined with respect to the axial direction of the wiring pattern.

【0007】[0007]

【作用】[Action]

上記の構成によると、端子板を持って被検者の装着部から引き剥がそうとする とき、配線パターンの軸方向に対して直角の方向において、配線パターンの少く とも一部はカバーフィルムによって被覆されている。この結果開口部9において 、配線パターンの軸方向に対して直角な方向の位置においてすべての配線パター ンが露出されている場合に比べて、配線パターンの断線の発生を非常に少くする ことができる。 According to the above structure, when the terminal board is to be peeled off from the mounting part of the subject, at least a part of the wiring pattern is covered with the cover film in the direction perpendicular to the axial direction of the wiring pattern. Has been done. As a result, in the opening 9, the occurrence of disconnection of the wiring pattern can be significantly reduced as compared with the case where all the wiring patterns are exposed at the position perpendicular to the axial direction of the wiring pattern. .

【0008】[0008]

【実施例】【Example】

以下、本考案の光センサ用プローブの一実施例を図面を参照して説明する。 An embodiment of the optical sensor probe of the present invention will be described below with reference to the drawings.

【0009】 図1乃至図3に本考案の一実施例の端子板5の構成を示す。これらの図におい て、図7及び図8に示す従来例の部分と対応する部分には同一の符号を付してあ り、その説明は適宜省略する。本実施例の特徴は端子板5を被覆するカバーフィ ルム8に形成された開口部9の形状にあり、光センサ用プローブ11の構成は図 5及び図6に示す従来例とほぼ同様である。1 to 3 show the structure of a terminal board 5 according to an embodiment of the present invention. In these figures, portions corresponding to those of the conventional example shown in FIGS. 7 and 8 are designated by the same reference numerals, and the description thereof will be omitted as appropriate. The feature of this embodiment is the shape of the opening 9 formed in the cover film 8 that covers the terminal plate 5, and the configuration of the optical sensor probe 11 is almost the same as the conventional example shown in FIGS.

【0010】 端子板5を被覆するカバーフィルム8には、図1に示すように扇形の開口部9 が形成されており、開口部9の対向する二辺は端子板5の幅方向の中心に中心を 有する半円状に形成されている。また図2及び図3に示すように、開口部9にお いて露出される配線パターン2が端子6となり、端子6にはリード線12の先端 の被覆が剥離され芯線12aが半田13で半田付けされている。As shown in FIG. 1, a fan-shaped opening 9 is formed in the cover film 8 that covers the terminal plate 5, and the two opposite sides of the opening 9 are located at the center of the terminal plate 5 in the width direction. It is formed in a semicircular shape having a center. Further, as shown in FIGS. 2 and 3, the wiring pattern 2 exposed in the opening 9 serves as the terminal 6, the coating of the tip of the lead wire 12 is peeled off from the terminal 6, and the core wire 12 a is soldered with the solder 13. Has been done.

【0011】 本実施例によれば、端子板5に形成された配線パターン2は、位置によって軸 方向にずれたカバーフィルム8で被覆されているので、端子板5を持ってプロー ブ11を装着部位から引き剥がそうとするとき、配線パターン2の軸方向に対し て直角の方向では少くとも一部がカバーフィルム8で被覆され、パターン断線を 防ぐことができる。According to the present embodiment, the wiring pattern 2 formed on the terminal board 5 is covered with the cover film 8 which is axially displaced depending on the position, so that the probe 11 is mounted while holding the terminal board 5. When peeling from the part, at least a part of the wiring pattern 2 is covered with the cover film 8 in a direction perpendicular to the axial direction of the wiring pattern 2 to prevent pattern disconnection.

【0012】 上記実施例では端子板5のカバーフィルム8の開口部9の周縁の形状が半円状 である場合について説明したが、この形状は図4に示すように波形であってもよ い。In the above-described embodiment, the case where the shape of the peripheral edge of the opening 9 of the cover film 8 of the terminal board 5 is a semi-circle is described, but this shape may be corrugated as shown in FIG. .

【0013】[0013]

【考案の効果】[Effect of device]

以上説明したように、本考案の光センサ用プローブによれば、FPCの端子板 を被覆するカバーフィルムに配線パターンを露出する開口部を設け、開口部の周 縁を配線パターンの軸方向に対して傾斜させたので、端子板に外力が作用しても 配線パターンの断線の発生を防止することができる。 As described above, according to the optical sensor probe of the present invention, the cover film covering the terminal plate of the FPC is provided with the opening for exposing the wiring pattern, and the periphery of the opening is arranged in the axial direction of the wiring pattern. Since the terminals are inclined, the disconnection of the wiring pattern can be prevented even if an external force is applied to the terminal board.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の光センサ用プローブの一実施例の端子
板の構成を示す平面図。
FIG. 1 is a plan view showing a configuration of a terminal plate of an embodiment of a probe for an optical sensor of the present invention.

【図2】図1の端子板の端子にリード線を接続した状態
を示す平面図である。
FIG. 2 is a plan view showing a state in which lead wires are connected to the terminals of the terminal board of FIG.

【図3】図2のA−A線断面図。3 is a sectional view taken along the line AA of FIG.

【図4】本考案の他の実施例による端子板の構成を示す
平面図。
FIG. 4 is a plan view showing the structure of a terminal board according to another embodiment of the present invention.

【図5】従来の光センサ用プローブの一例の構成を示す
縦断面図。
FIG. 5 is a vertical cross-sectional view showing the configuration of an example of a conventional optical sensor probe.

【図6】図5の平面図。FIG. 6 is a plan view of FIG.

【図7】図6の端子板の拡大平面図。7 is an enlarged plan view of the terminal plate of FIG.

【図8】図7のB−B線断面図。8 is a cross-sectional view taken along line BB of FIG.

【図9】図8に示す配線パターンの断線状態を示す縦断
面図。
9 is a vertical cross-sectional view showing a broken state of the wiring pattern shown in FIG.

【符号の説明】[Explanation of symbols]

1 FPC(可撓性印刷配線板) 2 配線パタ
ーン 5 端子板 8 カバーフ
ィルム 9 開口部
1 FPC (flexible printed wiring board) 2 wiring pattern 5 terminal board 8 cover film 9 opening

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 可撓性印刷配線板に一体に接続され、前
記印刷配線板上に形成された配線パターンを引き出す端
子板と、前記印刷配線板及び前記端子板上にそれぞれ形
成された前記配線パターンを被覆するカバーフィルムと
を備える光センサ用プローブにおいて、前記端子板を被
覆する前記カバーフィルムに前記配線パターンを露出す
る開口部を設けるとともに、該開口部の周縁を前記配線
パターンの軸方向に対して傾斜させたことを特徴とする
光センサ用プローブ。
1. A terminal board which is integrally connected to a flexible printed wiring board and draws out a wiring pattern formed on the printed wiring board, and the printed wiring board and the wiring formed on the terminal board, respectively. In a probe for an optical sensor including a cover film that covers a pattern, an opening that exposes the wiring pattern is provided in the cover film that covers the terminal board, and a peripheral edge of the opening is arranged in an axial direction of the wiring pattern. A probe for an optical sensor, which is tilted with respect to.
JP2873693U 1993-05-31 1993-05-31 Optical sensor probe Pending JPH0686708U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2873693U JPH0686708U (en) 1993-05-31 1993-05-31 Optical sensor probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2873693U JPH0686708U (en) 1993-05-31 1993-05-31 Optical sensor probe

Publications (1)

Publication Number Publication Date
JPH0686708U true JPH0686708U (en) 1994-12-20

Family

ID=12256718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2873693U Pending JPH0686708U (en) 1993-05-31 1993-05-31 Optical sensor probe

Country Status (1)

Country Link
JP (1) JPH0686708U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311106A (en) * 2004-04-22 2005-11-04 Nitto Denko Corp Wiring circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311106A (en) * 2004-04-22 2005-11-04 Nitto Denko Corp Wiring circuit board

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Effective date: 19990112